High-speed USB 2.0 switch with enable

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1 Rev. 4 9 June 03 Product data sheet. General description The is a high-bandwidth switch designed for the switching of high-speed UB.0 signals in handset and consumer applications. These applications could be cell phones, digital cameras, and notebooks with hubs or controllers with limited UB I/Os. The wide bandwidth ( GHz) of this switch allows signal to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a UB host device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed UB.0 (480 Mbps).. Features and benefits 3. Applications Wide supply voltage range from.3 V to 3.6 V witch voltage accepts signals up to 5.5 V.8 V control logic at V CC = 3.6 V Low-power mode when is HIGH ( A maximum) 6 (maximum) ON resistance 0. (typical) ON resistance mismatch between channels 6 pf (typical) ON-state capacitance High bandwidth (.0 GHz typical) Latch-up performance exceeds 00 ma per JED 78B Class II Level A ED protection: HBM JED-A4F Class 3A exceeds 8000 V CDM JED-C0E exceeds 000 V HBM exceeds 000 V for I/O to GND protection pecified from 40 C to +85 C Routes signals for UB.0,. and.0

2 4. Ordering information Table. Type number 5. Marking Ordering information Package Temperature range Name Description Version GM 40 C to +85 C XQFN0 plastic extremely thin quad flat package; no leads; 0 terminals; body mm TK 40 C to +85 C HVON0 plastic thermal enhanced very thin small outline package; no leads; 0 terminals; mm OT049-3 OT650- Table. Marking Type number Marking code [] GM x TK x [] The pin indicator is located on the lower left corner of the device, below the marking code. 6. Functional diagram D+ 8 D+ D- 7 D- 3 D+ V CC CHARGE PUMP 4 D- 6 9 CONTROLLOGIC 00aao078 Fig. Logic symbol All information provided in this document is subject to legal disclaimers. NXP B.V. 03. All rights reserved. Product data sheet Rev. 4 9 June 03 of 9

3 7. Pinning information 7. Pinning Fig. Pin configuration OT049-3 (XQFN0) Fig 3. Pin configuration OT650- (HVON0) 7. Pin description Table 3. Pin description ymbol Pin Description D+ independent input or output D independent input or output D+ 3 independent input or output D 4 independent input or output GND 5 ground (0 V) 6 output enable input (active LOW) D 7 common input or output D+ 8 common input or output 9 select input V CC 0 supply voltage 8. Functional description Table 4. Function table [] Input Channel L L D+ = D+; D = D H L D+ = D+; D = D X H switches off [] H = HIGH voltage level; L = LOW voltage level; X = don t care. All information provided in this document is subject to legal disclaimers. NXP B.V. 03. All rights reserved. Product data sheet Rev. 4 9 June 03 3 of 9

4 9. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating ystem (IEC 6034). Voltages are referenced to GND (ground = 0 V). ymbol Parameter Conditions Min Max Unit V CC supply voltage V V I input voltage, input [] V V W switch voltage [] V I IK input clamping current V I < 0.5 V 50 - ma I K switch clamping current V I < 0.5 V 50 - ma I W switch current - 0 ma I CC supply current ma I GND ground current 00 - ma T stg storage temperature C P tot total power dissipation T amb = 40 C to+5c - 50 mw [] The minimum input voltage rating may be exceeded if the input current rating is observed. [] The minimum and maximum switch voltage ratings may be exceeded if the switch clamping current rating is observed. 0. Recommended operating conditions Table 6. Recommended operating conditions ymbol Parameter Conditions Min Max Unit V CC supply voltage V V I input voltage, input 0 V CC V V W switch voltage V T amb ambient temperature C. tatic characteristics Table 7. tatic characteristics At recommended operating conditions; voltages are referenced to GND (ground 0 V). ymbol Parameter Conditions T amb = 5 C T amb =-40 C to +85 C Unit Min Typ Max Min Max HIGH-level V CC =.3 V to.7 V V CC - V input voltage V CC =.7 V to 3.6 V V CC - V LOW-level V CC =.3 V to.7 V V CC V input voltage V CC =.7 V to 3.6 V V CC V V IK input clamping voltage V CC =.7 V, 3.6 V; I I = 8 ma V I I input leakage current, input; V CC = 0 V,.7 V, 3.6; V I =GNDto3.6V A All information provided in this document is subject to legal disclaimers. NXP B.V. 03. All rights reserved. Product data sheet Rev. 4 9 June 03 4 of 9

5 Table 7. tatic characteristics continued At recommended operating conditions; voltages are referenced to GND (ground 0 V). ymbol Parameter Conditions T amb = 5 C T amb =-40 C to +85 C Unit Min Typ Max Min Max I OFF power-off per pin; V CC =0V leakage current V W = 0 V to.7 V A V W = 0 V to 3.6 V A V W =0Vto5.5V A I (OFF) OFF-state leakage current nd+ and nd- ports; see Figure 4 V CC =.7 V, 3.6 V A I CC supply current V CC =.7 V, 3.6 V =GND A =V CC (low-power mode) A I CC C I C (OFF) C (ON) additional supply current input capacitance OFF-state capacitance ON-state capacitance, input; one input at.8 V; other inputs at GND or V CC V CC =.7 V A V CC = 3.6 V A V W = GND or V CC ; pf V CC =.5 V, 3.3 V V W = GND or V CC ; pf V CC =.5 V, 3.3 V V W = GND or V CC ; pf V CC =.5 V, 3.3 V. Test circuits V CC switch or Dn Dn Dn switch I GND VI VO 00aao080 Fig 4. V I =0V; V O = 0 V to 5.5 V Test circuit for measuring OFF-state leakage current All information provided in this document is subject to legal disclaimers. NXP B.V. 03. All rights reserved. Product data sheet Rev. 4 9 June 03 5 of 9

6 . ON resistance Table 8. ON resistance At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for graphs see Figure 6. ymbol Parameter Conditions T amb = 40 C to +85 C T amb = 40 C to +85 C Unit Min Typ [] Max Min Max R ON ON resistance V CC =.3 V, 3.0V see Figure 5 V I =0V; I I =30mA V I =.4V; I I = 5 ma R ON ON resistance V CC =.3 V, 3.0 V [] mismatch V I =0V; between channels I I =30mA V I =.7V; I I = 5 ma R ON(flat) ON resistance (flatness) [] Typical values are measured at T amb = 5 C. [] Measured at identical V CC, temperature and input voltage. V CC =.3 V, 3.0V; [3] V I = 0 V to V CC I I =30mA I I = 5 ma [3] Flatness is defined as the difference between the maximum and minimum value of ON resistance measured at identical V CC and temperature..3 ON resistance test circuit and waveforms or Dn V CC Dn Dn V VW switch switch GND VI IW 00aao08 Fig 5. R ON = V W / I W. Test circuit for measuring ON resistance All information provided in this document is subject to legal disclaimers. NXP B.V. 03. All rights reserved. Product data sheet Rev. 4 9 June 03 6 of 9

7 5.0 00aao08 R ON (Ω) V I (V) Fig 6. ON resistance as a function of input voltage. Dynamic characteristics Table 9. Dynamic characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for test circuit, see Figure 0. ymbol Parameter Conditions T amb = 5 C T amb = 40 C to +85 C Unit Min Typ [] Max Min Max t pd propagation delay Dn to ndn or ndn to Dn; [][3] see Figure 7 V CC =.3 V to.7 V ns V CC = 3.0 V to 3.6 V ns t en enable time to Dn, ndn; [3] see Figure 9 V CC =.3 V to.7 V ns V CC = 3.0 V to 3.6 V ns to Dn, ndn; [3] see Figure 9 V CC =.3 V to.7 V ns V CC = 3.0 V to 3.6 V ns t dis disable time to Dn, ndn; [3] see Figure 9 V CC =.3 V to.7 V ns V CC = 3.0 V to 3.6 V ns to Dn, ndn; [3] see Figure 9 V CC =.3 V to.7 V ns V CC = 3.0 V to 3.6 V ns All information provided in this document is subject to legal disclaimers. NXP B.V. 03. All rights reserved. Product data sheet Rev. 4 9 June 03 7 of 9

8 Table 9. Dynamic characteristics continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for test circuit, see Figure 0. ymbol Parameter Conditions T amb = 5 C T amb = 40 C to +85 C Unit t sk(o) output skew time see Figure 8 [4] t sk(p) pulse skew time see Figure 7 [4] [] Typical values are measured at T amb = 5 C and V CC =.5 V and 3.3 V respectively. [] The propagation delay is the calculated RC time constant of the typical ON resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). [3] t pd is the same as t PLH and t PHL. [4] Guaranteed by design. V CC =.3 V to.7 V ns V CC = 3.0 V to 3.6 V ns V CC =.3 V to.7 V ns V CC = 3.0 V to 3.6 V ns. Waveforms, test circuit and graphs Min Typ [] Max Min Max 800 mv input 50% 400 mv t PLH t PHL V OH output 50% V OL 00aao083 Fig 7. Logic levels: V OL and V OH are typical output voltage levels that occur with the output load. t sk(p) = t PHL t PLH. The data input to output propagation delay times and pulse skew time All information provided in this document is subject to legal disclaimers. NXP B.V. 03. All rights reserved. Product data sheet Rev. 4 9 June 03 8 of 9

9 800 mv input 50% output 400 mv V OH t PLH () 50% t PHL () V OL output V OH t sk(o) 50% t sk(o) V OL t PLH () t PHL () 00aao084 Fig 8. Logic levels: V OL and V OH are typical output voltage levels that occur with the output load. t sk(o) = t PLH () t PLH () or t PHL () t PHL (). Output skew time V I, input V M V M GND t en t dis output OFF to HIGH HIGH to OFF V OH GND V X V X t dis t en output HIGH to OFF OFF to HIGH V OH GND V X V X 00aao085 Fig 9. Measurement points are given in Table 0. Logic levels: V OL and V OH are typical output voltage levels that occur with the output load. Enable and disable times Table 0. Measurement points upply voltage Input Output V CC V M V I V X.3 V to 3.6 V 0.5V I. 8 V 0.9V OH All information provided in this document is subject to legal disclaimers. NXP B.V. 03. All rights reserved. Product data sheet Rev. 4 9 June 03 9 of 9

10 V CC Dn Dn Dn G VI VEXT = VCC RL CL RL CL GND 00aao086 Fig 0. Test data is given in Table. Definitions test circuit: R L = Load resistance. C L = Load capacitance including jig and probe capacitance. V EXT = External voltage for measuring switching times. V I may be connected to or. Test circuit for switching times Table. Test data upply voltage Input Load V CC V I t r, t f C L R L.3 V to 3.6 V.8 V 5ns 50pF V -0.5 V Time scale (0.5 ns/div) 00aao087 Fig. Eye-pattern 480 Mbps UB signal with no switch. All information provided in this document is subject to legal disclaimers. NXP B.V. 03. All rights reserved. Product data sheet Rev. 4 9 June 03 0 of 9

11 + 0.5 V -0.5 V Time scale (0.5 ns/div) 00aao088 Fig. Eye-pattern 480 Mbps UB signal with switch (normally closed path) V -0.5 V Time scale (0.5 ns/div) 00aao089 Fig 3. Eye-pattern 480 Mbps UB signal with switch (normally open path) All information provided in this document is subject to legal disclaimers. NXP B.V. 03. All rights reserved. Product data sheet Rev. 4 9 June 03 of 9

12 . Additional dynamic characteristics Table. Additional dynamic characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V); V I = GND or V CC (unless otherwise specified); t r =t f 5 ns; T amb =5C. ymbol Parameter Conditions Min Typ Max Unit f (3dB) 3 db frequency R L =50; see Figure 4 [][] response V CC =.3 V to.7 V GHz V CC = 3.0 V to 3.6 V GHz iso isolation (OFF-state) f i = 50 MHz; R L =50; see Figure 5 [][] V CC =.3 V to.7 V db V CC = 3.0 V to 3.6 V db Xtalk crosstalk between switches; [][] f i = 50 MHz; R L =50; seefigure 6 V CC =.3 V to.7 V db V CC = 3.0 V to 3.6 V db [] f i is biased at 350 mv. [] V i = 63 mv (p-p)..3 Test circuits V CC 350 mv switch or Dn Dn Dn switch RL fi GND db 00aao090 Fig 4. To obtain 0 dbm level at output, adjust f i voltage. Increase f i frequency until db meter reads 3 db. Test circuit for measuring the frequency response when switch is in ON-state All information provided in this document is subject to legal disclaimers. NXP B.V. 03. All rights reserved. Product data sheet Rev. 4 9 June 03 of 9

13 350 mv V CC 350 mv switch RL RL or Dn Dn Dn switch fi GND db 00aao09 To obtain 0 dbm level at input, adjust f i voltage. Fig 5. Test circuit for measuring isolation (OFF-state) V CC 350 mv 350 mv or Dn Dn Dn RL RL 50 Ω fi db GND 00aao09 Fig 6. Test circuit for measuring crosstalk All information provided in this document is subject to legal disclaimers. NXP B.V. 03. All rights reserved. Product data sheet Rev. 4 9 June 03 3 of 9

14 3. Package outline XQFN0: plastic, extremely thin quad flat package; no leads; 0 terminals; body.55 x.00 x 0.50 mm OT049-3 X terminal index area D B A E A A c detail X b 5 Æ v Æ w C C A B y C C y 4 6 e e b 9 terminal index area L 0 L Dimensions 0 mm scale Unit () A A b b c D E e e L L v w y y mm max nom min Note. Plastic or metal protrusions of mm maximum per side are not included. sot049-3_po Outline version References IEC JEDEC JEITA OT MO European projection Issue date Fig 7. Package outline OT049-3 (XQFN0) All information provided in this document is subject to legal disclaimers. NXP B.V. 03. All rights reserved. Product data sheet Rev. 4 9 June 03 4 of 9

15 HVON0: plastic thermal enhanced very thin small outline package; no leads; 0 terminals; 3 x 3 x 0.85 mm OT650- X D B A E A A c terminal index area terminal index area e e b 5 v w C C A B y C detail X C y L K E h Dimensions 0 6 D h 0 mm scale Unit A () A b c D () D h E () E h e e K L v w y y mm max nom min Note. Plastic or metal protrusions of mm maximum per side are not included sot650-_po Outline version References IEC JEDEC JEITA OT MO European projection Issue date Fig 8. Package outline OT650- (HVON0) All information provided in this document is subject to legal disclaimers. NXP B.V. 03. All rights reserved. Product data sheet Rev. 4 9 June 03 5 of 9

16 4. Abbreviations Table 3. Acronym CDM CMO ED HBM MM Abbreviations Description Charged Device Model Complementary Metal Oxide emiconductor Electrotatic Discharge Human Body Model Machine Model 5. Revision history Table 4. Revision history Document ID Release date Data sheet status Change notice upersedes v Product data sheet - v.3 Modifications: Type number TK added. Package outline drawing added (Figure 8). v Product data sheet - v. v. 009 Product data sheet - v. v. 004 Product data sheet - - All information provided in this document is subject to legal disclaimers. NXP B.V. 03. All rights reserved. Product data sheet Rev. 4 9 June 03 6 of 9

17 6. Legal information 6. Data sheet status Document status [][] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [] Please consult the most recently issued document before initiating or completing a design. [] The term short data sheet is explained in section Definitions. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL 6. Definitions Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP emiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. hort data sheet A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP emiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP emiconductors and its customer, unless NXP emiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP emiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 6.3 Disclaimers Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP emiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP emiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP emiconductors. In no event shall NXP emiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP emiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP emiconductors. Right to make changes NXP emiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. uitability for use NXP emiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP emiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP emiconductors and its suppliers accept no liability for inclusion and/or use of NXP emiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer s own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP emiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP emiconductors products, and NXP emiconductors accepts no liability for any assistance with applications or customer product design. It is customer s sole responsibility to determine whether the NXP emiconductors product is suitable and fit for the customer s applications and products planned, as well as for the planned application and use of customer s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP emiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer s applications or products, or the application or use by customer s third party customer(s). Customer is responsible for doing all necessary testing for the customer s applications and products using NXP emiconductors products in order to avoid a default of the applications and the products or of the application or use by customer s third party customer(s). NXP does not accept any liability in this respect. Limiting values tress above one or more limiting values (as defined in the Absolute Maximum Ratings ystem of IEC 6034) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale NXP emiconductors products are sold subject to the general terms and conditions of commercial sale, as published at unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP emiconductors hereby expressly objects to applying the customer s general terms and conditions with regard to the purchase of NXP emiconductors products by customer. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. NXP B.V. 03. All rights reserved. Product data sheet Rev. 4 9 June 03 7 of 9

18 Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products Unless this data sheet expressly states that this specific NXP emiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP emiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP emiconductors warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP emiconductors specifications such use shall be solely at customer s own risk, and (c) customer fully indemnifies NXP emiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP emiconductors standard warranty and NXP emiconductors product specifications. Translations A non-english (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 6.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 7. Contact information For more information, please visit: For sales office addresses, please send an to: All information provided in this document is subject to legal disclaimers. NXP B.V. 03. All rights reserved. Product data sheet Rev. 4 9 June 03 8 of 9

19 8. Contents General description Features and benefits Applications Ordering information Marking Functional diagram Pinning information Pinning Pin description Functional description Limiting values Recommended operating conditions tatic characteristics Test circuits ON resistance ON resistance test circuit and waveforms Dynamic characteristics Waveforms, test circuit and graphs Additional dynamic characteristics Test circuits Package outline Abbreviations Revision history Legal information Data sheet status Definitions Disclaimers Trademarks Contact information Contents Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information. NXP B.V. 03. All rights reserved. For more information, please visit: For sales office addresses, please send an to: Date of release: 9 June 03 Document identifier:

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