Sputtering Targets for Microelectronics. Sputtering Targets for Semiconductor Applications
|
|
|
- Gabriel Willis
- 7 years ago
- Views:
Transcription
1 Sputtering Targets for Microelectronics Sputtering Targets for Semiconductor Applications
2
3 Umicore Thin Film Products Umicore Thin Film Products, a globally active business unit within the Umicore Group, is one of the leading producers of coating materials for physical vapor deposition with more than 50 years experience in this field. Its Semiconductors portfolio covers a wide range of highly effective sputtering targets and evaporation materials. Contents About Sputtering Targets for Semiconductors 4 Sputtering Targets suitable for OC Oerlikon, Unaxis, and Balzers Sputtering Systems ARQ151-6, ARQ ARQ300 7 AKQ515 8 Sputtering Targets suitable for Balzers Sputtering Systems AK510, AK517, AK618 9 Mounting methods 10 Other Targets
4 Sputtering Targets for Semiconductor Applications About Sputtering Targets for Semiconductors Semiconductors and electronics play a major role in our world. Just about everything from consumer goods, transportation, housing and manufacturing infrastructure, to large area information systems is based on such technologies. Umicore Thin Film Products (TFP) successfully develops, manufactures, sells and recycles high quality coating materials for thin film applications in the advanced packaging, compounds, microsystems, and silicon front end segments. Due to our longstanding experience and strong cooperation with OC Oerlikon (formerly Unaxis and Balzers), our targets and evaporation materials are optimized for maximum performance in OC Oerlikon coating systems. As an industry leader, Umicore Thin Film Products also provides sputtering targets and evaporation materials to a wide selection of other coating systems. Target size and microstructure are designed to serve the latest sputtering equipment for 300 mm wafer technology. Our international sales network ensures close co-operation to ensure efficient customer specific solutions and on-time delivery of our products. Umicore A world leader in material technology Umicore is a materials technology group. Its activities are centred on four business areas: Advanced Materials, Precious Metals Products and Catalysts, Precious Metals Services and Zinc Specialties. Each business area is divided into market-focused business units. Umicore focuses on application areas where it knows its expertise in materials science, chemistry and metallurgy can make a real difference, be it in products that are essential to everyday life or those at the cutting edge of new technological developments. Umicore s overriding goal of sustainable value creation is based on this ambition to develop, produce and recycle materials in a way that fulfils its mission: materials for a better life. The Umicore Group has industrial operations on all continents and serves a global customer base. Advanced Packaging WTi10, Au, NiV7, Ni, Ti, Cu, Cr, Al Compounds Al, Al-alloys, Ni-alloys, Pt, Au-alloys, Cr, Cu, Ti, W, TCO s, and more Microsystems Ta, Ni-alloys, SiO 2, Al, Zn, and more Silicon Front End Al, Al-alloys, Cr, Cu, Ni-alloys, Ta, Ti, WTi, Au, Pt, Ag, and more
5 04 05
6 Sputtering Targets for Semiconductor Applications Sputtering Targets suitable for OC Oerlikon, Unaxis, and Balzers Sputtering Systems Sputtering Targets ARQ151-6 Description Symbol Purity Form Part Number Aluminum Al 5N5 ( %) 18 mm compound AlSi1 AlSi1 5N5 ( %) 18 mm compound AlCu0.5 AlCu0.5 5N5 ( %) 18 mm compound AlSi1Cu0.5 AlSi1Cu0.5 5N5 ( %) 18 mm compound Copper Cu 4N5 (99.995%) 15 mm monoblock Chromium Cr 3N5 (99.95%) 15 mm monoblock Gold (4100 g) Au 4N (99.99%) 10 mm compound Nickel Ni 3N5 (99.95%) 9 mm compound NiCr20 NiCr20 3N (99.9%) 15 mm monoblock NiV7 NiV7 3N5 (99.95%) 15 mm monoblock Platinum (4550 g) Pt 4N (99.99%) 15 mm compound Silver (5020 g) Ag 4N (99.99%) 15 mm compound Tantalum Ta 4N (99.99%) 15 mm compound Titanium Ti 3N (99.9%) 15 mm monoblock Titanium Ti 4N5 (99.995%) 15 mm monoblock Tungsten W 3N5 (99.95%) 15 mm compound WTi10 WTi10 4N5 (99.995%) 15 mm compound Sputtering Targets ARQ151-8 Description Symbol Purity Form Part Number Aluminum Al 5N5 ( %) 18 mm compound AlSi1 AlSi1 5N5 ( %) 18 mm compound AlCu0.5 AlCu0.5 5N5 ( %) 18 mm compound AlSi1Cu0.5 AlSi1Cu0.5 5N5 ( %) 18 mm compound Chromium Cr 3N5 (99.95%) 15 mm monoblock Copper Cu 4N5 (99.995%) 15 mm monoblock Gold (5460 g) Au 4N (99.99%) 10 mm compound Molybdenum Mo 3N5 (99.95%) 15 mm compound Nickel Ni 3N5 (99.95%) 9 mm compound NiCr20 NiCr20 3N (99.9%) 15 mm monoblock NiV7 NiV7 3N5 (99.95%) 15 mm monoblock Palladium (3400 g) Pd 3N5 (99.95%) 10 mm compound Platinum (6050 g) Pt 4N (99.99%) 15 mm compound Silver (6680 g) Ag 4N (99.99%) 15 mm compound Tantalum Ta 4N (99.99%) 15 mm compound Titanium Ti 3N (99.9%) 15 mm monoblock Titanium Ti 4N5 (99.995%) 15 mm monoblock Tungsten W 3N5 (99.95%) 15 mm compound WTi10 WTi10 4N5 (99.995%) 15 mm compound
7 Sputtering Targets ARQ300 Description Symbol Purity Cooling Plate Form Part Number Aluminum Al 5N5 ( %) mm bonded on cooling plate AlCu0.5 AlCu0.5 5N5 ( %) mm bonded on cooling plate AlSi1Cu0.5 AlSi1Cu0.5 5N5 ( %) mm bonded on cooling plate Copper Cu 4N5 (99.995%) mm bonded on cooling plate Chromium Cr 3N5 (99.95%) mm bonded on cooling plate Gold (9710 g) Au 4N (99.99%) mm bonded on cooling plate Nickel Ni 3N5 (99.95%) mm bonded on cooling plate NiV7 NiV7 3N5 (99.95%) mm bonded on cooling plate Tantalum Ta 4N (99.99%) mm bonded on cooling plate Titanium Ti 4N5 (99.995%) mm bonded on cooling plate Tungsten W 3N5 (99.95%) mm bonded on cooling plate WTi10 WTi10 4N5 (99.995%) mm bonded on cooling plate Cooling plate for 12 mm target with transportation box Cooling plate for 6 mm target with transportation box Cooling plate for 4 mm target with transportation box Transportation box Other materials available upon request
8 Sputtering Targets for Semiconductor Applications Sputtering Targets suitable for OC Oerlikon, Unaxis, and Balzers Sputtering Systems Sputtering Targets AKQ515 Description Symbol Purity Form Suitable for cathode Mounting method Part Number Regular High energy High energy, central fixation C D Aluminum Al 5N5 ( %) 12 mm monoblock Aluminum Al 5N5 ( %) 12 mm monoblock V03 Aluminum Al 5N5 ( %) 12 mm compound AlSi1 AlSi1 5N5 ( %) 12 mm monoblock AlSi1 AlSi1 5N5 ( %) 12 mm monoblock V03 AlCu4 AlCu4 5N5 ( %) 12 mm monoblock AlCu4 AlCu4 5N5 ( %) 12 mm monoblock V03 AlSi1Cu0.5 AlSi1Cu0.5 5N5 ( %) 12 mm monoblock AlSi1Cu0.5 AlSi1Cu0.5 5N5 ( %) 12 mm monoblock V03 AlSi1Cu0.5 AlSi1Cu0.5 5N5 ( %) 12 mm compound Chromium Cr 3N5 (99.95%) 12 mm compound Chromium Cr 3N5 (99.95%) 12 mm monoblock Copper Cu 4N5 (99.995%) 12 mm monoblock Gold (2805 g) Au 4N (99.99%) 6 mm compound Gold (5605 g) Au 4N (99.99%) 12 mm compound Molybdenum Mo 3N5 (99.95%) 12 mm compound Molybdenum Mo 3N5 (99.95%) 12 mm monoblock Nickel Ni 3N5 (99.95%) 8.5 mm monoblock NiCr20 NiCr20 3N (99.9%) 12 mm compound NiCr20 NiCr20 3N (99.9%) 12 mm monoblock NiFe17 NiFe17 3N (99.9%) 6 mm compound NiFe19 NiFe19 3N (99.9%) 6 mm compound NiFe55 NiFe55 3N (99.9%) 5.5 mm compound NiV7 NiV7 3N5 (99.95%) 12 mm monoblock Niobium Nb 2N6 (99.6%) 12 mm compound Palladium (1745 g) Pd 3N5 (99.95%) 6 mm compound Palladium (3490 g) Pd 3N5 (99.95%) 12 mm compound Platinum (3200 g) Pt 3N5 (99.95%) 6 mm compound Platinum (3200 g) Pt 4N (99.99%) 6 mm compound Quarz SiO2 4N (99.99%) 10 mm compound Silicon Si 5N (99.999%) 12 mm compound Silver Ag 4N (99.99%) 12 mm compound Tantalum Ta 4N (99.99%) 12 mm compound Titanium Ti 3N (99.9%) 12 mm compound Titanium Ti 3N (99.9%) 12 mm monoblock Titanium Ti 4N5 (99.995%) 12 mm compound Titanium Ti 4N5 (99.995%) 12 mm monoblock Tungsten W 3N5 (99.95%) 12 mm compound WTi10 WTi10 4N (99.99%) 12 mm compound WTi10 WTi10 4N5 (99.995%) 12 mm compound WTi10 WTi10 4N5 (99.995%) 12 mm compound
9 Sputtering Targets suitable for Balzers Sputtering Systems Sputtering Targets AK510 Description Symbol Purity Form Cooling type Mounting method Part Number Indirect cooling Direct cooling A B C Aluminum Al 5N5 ( %) 12 mm monoblock AlSi1 AlSi1 5N5 ( %) 12 mm monoblock Chromium Cr 3N5 (99.95%) 12 mm compound Copper Cu 4N5 (99.995%) 12 mm monoblock Molybdenum Mo 3N5 (99.95%) 12 mm compound Nickel Ni 3N5 (99.95%) 8 mm compound Silicon Si 5N (99.999%) 12 mm compound Tantalum Ta 3N5 (99.95%) 12 mm compound Titanium Ti 3N (99.9%) 12 mm compound Tungsten W 3N5 (99.95%) 12 mm compound WTi10 WTi10 4N5 (99.995%) 12 mm compound Sputtering Targets AK517 Aluminum Al 5N5 ( %) 12 mm monoblock AlSi1 AlSi1 5N5 ( %) 12 mm monoblock Chromium Cr 3N5 (99.95%) 9 mm compound Copper Cu 4N5 (99.995%) 12 mm monoblock Molybdenum Mo 3N5 (99.95%) 9 mm compound Nickel Ni 3N5 (99.95%) 8 mm compound Silicon Si 5N (99.999%) 9 mm compound Tantalum Ta 4N (99.99%) 9 mm compound Titanium Ti 3N (99.9%) 12 mm compound Tungsten W 3N5 (99.95%) 9 mm compound WTi10 WTi10 4N5 (99.995%) 12 mm compound Sputtering Targets AK618 Aluminum Al 5N5 ( %) 12 mm monoblock Aluminum Al 5N5 ( %) 12 mm monoblock AlSi1 AlSi1 5N5 ( %) 12 mm monoblock Chromium Cr 3N5 (99.95%) 12 mm compound Copper Cu 4N5 (99.995%) 12 mm monoblock Molybdenum Mo 3N5 (99.95%) 12 mm compound Silicon Si 5N (99.999%) 12 mm compound Tantalum Ta 4N (99.99%) 12 mm compound Titanium Ti 3N (99.9%) 12 mm compound Tungsten W 3N5 (99.95%) 12 mm compound WTi10 WTi10 4N5 (99.995%) 12 mm compound Ag, Au, Pd, Pt, SiO2 and other materials available on request
10 Sputtering Targets for Semiconductor Applications Mounting methods Target Target A Backing plate C Backing plate Target Target B Backing plate D
11 Other targets in accordance with customers specifications are available on request
12 BV868958/8/2011/1000 Please find your local sales partner at: Manufacturing sites of Umicore Thin Film Products Umicore Thin Film Products AG Alte Landstrasse 8 P.O. Box 364 LI-9496 Balzers Tel Fax sales.materials@umicore.com Umicore JuBo Thin Film Products (Beijing) Co., Ltd. No. 5 Xingguang the 4th Street Tongzhou Park, Zhong Guan Cun Science Park, Tongzhou District Beijing P.R. China Tel Fax sales.materials.bj@ap.umicore.com Umicore Thin Film Products Taiwan Co., Ltd. No. 22, Aly. 4, Ln. 711, Bo ai St., Zhubei City, Hsinchu County 302 Taiwan (R.O.C.) Tel Fax sales.materials.hc@umicore.com Umicore Thin Film Products 50 Sims Ave Providence, RI USA Tel Fax sales.materials.pr@umicore.com Due to our continuing program of product improvements, specifications are subject to change without notice.
Sputtering Targets and Evaporation Materials for Wear Protection
Sputtering Targets and Evaporation Materials for Wear Protection Contents About Materials for Wear Protection 3 Overview Sputtering Targets 4 Sputtering Targets 5 Evaporation Materials 7 Nickel Target
High Density Ceramic TCO Sputtering Targets. Indium Tin Oxide (ITO) for deposition of transparent conductive oxide layers
High Density Ceramic TCO Sputtering Targets Indium Tin Oxide (ITO) for deposition of transparent conductive oxide layers High Density Ceramic TCO Sputtering Targets: Indium Tin Oxide (ITO) Rotary ceramic
Special materials. for Precision Optics & Laser Coatings. Oxides for Evaporation
Special materials for Precision Optics & Laser Coatings Oxides for Evaporation Titanium oxides Highest refractive index of oxides in visible range AR and multilayer coatings on glass and polymers Best
Special materials for Precision Optics & Laser Coatings. Fluorides and Special Materials for IR coatings
Special materials for Precision Optics & Laser Coatings Fluorides and Special Materials for IR coatings Umicore Thin Film Products Umicore Thin Film Products, a globally active business unit within the
Forward-Looking Statements
Forward-Looking Statements Except for historical information, this presentation may contain certain forward-looking statements. These statements may involve a number of known and unknown risks and uncertainties
For Touch Panel and LCD Sputtering/PECVD/ Wet Processing
production Systems For Touch Panel and LCD Sputtering/PECVD/ Wet Processing Pilot and Production Systems Process Solutions with over 20 Years of Know-how Process Technology at a Glance for Touch Panel,
2015 Investor Day Summary Investor Presentation June 25, 2015
The Critical Materials Company 2015 Investor Day Summary Investor Presentation June 25, 2015 Table of Contents About AMG 4 Global Trends 5 Critical Raw Materials 6 Critical Materials Price Trends 7 Critical
Anodes and Misc Equipment
Anodes and Misc Equipment Application: Platinised Titanium Anodes Platinised titanium anodes are recommended for use in the following electrolytic processes:- Precious metal electroplating - e.g. Au, Pt,
All answers must use the correct number of significant figures, and must show units!
CHEM 10113, Quiz 2 September 7, 2011 Name (please print) All answers must use the correct number of significant figures, and must show units! IA Periodic Table of the Elements VIIIA (1) (18) 1 2 1 H IIA
Chemistry CP Unit 2 Atomic Structure and Electron Configuration. Learning Targets (Your exam at the end of Unit 2 will assess the following:)
Chemistry CP Unit 2 Atomic Structure and Electron Learning Targets (Your exam at the end of Unit 2 will assess the following:) 2. Atomic Structure and Electron 2-1. Give the one main contribution to the
Sustainable energy products Simulation based design for recycling
Sustainable energy products Simulation based design for recycling Markus A. Reuter (Prof. Dr. Dr. hc) Director: Technology Management, Outotec Oyj Aalto University (Finland), Central South University (China),
histaris Inline Sputtering Systems
vistaris histaris Inline Sputtering Systems Inline Sputtering Systems with Vertical Substrate Transport Modular System for Different Applications VISTARIS Sputtering Systems The system with the brand name
How to read your Oil Analysis Report
How to read your Oil Analysis Report A better understanding Petroleum Technologies Group, LLC. 4665 Broadmoor S.E. Ste#15 Grand Rapids, MI 49512 Phone # 616/698 9399 Fax # 616/698 9395 www.oil lab.com
Balzers Sputter Coater SCD 050
Balzers Sputter Coater SCD 050 The SCD 050 is a bench top, sputter deposition system designed for thin films on substrates up to 6 inches. Morphology and thickness is user controlled using power, pressure,
EXTRACTION OF METALS
1 EXTRACTION OF METALS Occurrence ores of some metals are very common (iron, aluminium) others occur only in limited quantities in selected areas ores need to be purified before being reduced to the metal
Kingdom of Saudi Arabia. The National Commission for Academic Accreditation & Assessment
ATTACHMENT 2 (e) Course Specifications Kingdom of Saudi Arabia The National Commission for Academic Accreditation & Assessment Course Specifications (CS) Course Specifications Institution Dammam University
Periodic Table, Valency and Formula
Periodic Table, Valency and Formula Origins of the Periodic Table Mendelѐѐv in 1869 proposed that a relationship existed between the chemical properties of elements and their atomic masses. He noticed
Jefferies 2014 Global Industrials Conference Dr. Heinz Schimmelbusch CEO August 12, 2014
Jefferies 2014 Global Industrials Conference Dr. Heinz Schimmelbusch CEO August 12, 2014 Cautionary Note 2 THIS DOCUMENT IS STRICTLY CONFIDENTIAL AND IS BEING PROVIDED TO YOU SOLELY FOR YOUR INFORMATION
Ion Beam Sputtering: Practical Applications to Electron Microscopy
Ion Beam Sputtering: Practical Applications to Electron Microscopy Applications Laboratory Report Introduction Electron microscope specimens, both scanning (SEM) and transmission (TEM), often require a
TRADING UPDATE Q3 2009
Press Release Regulated information 28 October 2009-07:30 CET CP-2009-28-R TRADING UPDATE Q3 2009 Highlights Business performance in the 3 rd quarter improved, reflecting a combination of better than expected
Material Expansion Coefficients
17 Material Expansion Coefficients Linear Thermal Expansion Coefficients of Metals and Alloys Table 17-1 provides the linear thermal expansion coefficients of the most frequently used metals and allows.
47374_04_p25-32.qxd 2/9/07 7:50 AM Page 25. 4 Atoms and Elements
47374_04_p25-32.qxd 2/9/07 7:50 AM Page 25 4 Atoms and Elements 4.1 a. Cu b. Si c. K d. N e. Fe f. Ba g. Pb h. Sr 4.2 a. O b. Li c. S d. Al e. H f. Ne g. Sn h. Au 4.3 a. carbon b. chlorine c. iodine d.
Wipe Analysis to Determine Metal Contamination on Critical Surfaces
By Albert Dato, Ph.D., Warren York, Jennifer Jew, Laarni Huerta, Brice Norton, and Michael Coste On-wafer metallic contamination is detrimental to the fabrication and performance of semiconductor devices.
B I N G O B I N G O. Hf Cd Na Nb Lr. I Fl Fr Mo Si. Ho Bi Ce Eu Ac. Md Co P Pa Tc. Uut Rh K N. Sb At Md H. Bh Cm H Bi Es. Mo Uus Lu P F.
Hf Cd Na Nb Lr Ho Bi Ce u Ac I Fl Fr Mo i Md Co P Pa Tc Uut Rh K N Dy Cl N Am b At Md H Y Bh Cm H Bi s Mo Uus Lu P F Cu Ar Ag Mg K Thomas Jefferson National Accelerator Facility - Office of cience ducation
B) atomic number C) both the solid and the liquid phase D) Au C) Sn, Si, C A) metal C) O, S, Se C) In D) tin D) methane D) bismuth B) Group 2 metal
1. The elements on the Periodic Table are arranged in order of increasing A) atomic mass B) atomic number C) molar mass D) oxidation number 2. Which list of elements consists of a metal, a metalloid, and
Super Cool Sputter Coater
Leica EM SCD050 Super Cool Sputter Coater Precious and Non-Precious Metal Sputtering and Carbon Evaporation Sputter Coating The sputter coating of samples inhibits charging, reduces thermal damage and
Electroplating with Photoresist Masks
Electroplating with Photoresist Masks Revised: 2014-01-17 Source: www.microchemicals.com/downloads/application_notes.html Electroplating - Basic Requirements on the Photoresist Electroplating with photoresist
Chapter 8 Atomic Electronic Configurations and Periodicity
Chapter 8 Electron Configurations Page 1 Chapter 8 Atomic Electronic Configurations and Periodicity 8-1. Substances that are weakly attracted to a magnetic field but lose their magnetism when removed from
Results Overview Wafer Edge Film Removal using Laser
Results Overview Wafer Edge Film Removal using Laser LEC- 300: Laser Edge Cleaning Process Apex Beam Top Beam Exhaust Flow Top Beam Scanning Top & Top Bevel Apex Beam Scanning Top Bevel, Apex, & Bo+om
3D Sputtering System Fully automated
3D Sputtering System Fully automated S8+ Sputtering Technology by Tapematic Built on the ability to draw on the best that the world has to offer, and to develop innovative products with anticipation of
Sputtering Targets and Sputtered Films: Technology and Markets
A BCC Research Semiconductor Manufacturing Report and Sputtered Films: SMC037E Use this report to: Understand the most important advances in sputtering technology and target fabrication Identify the current
Chalcophile and Key Element Distribution in the Eastern Goldfields: seismic traverse EGF01. Aleks Kalinowski Geoscience Australia, pmdcrc Y2 project
pmd CR C Chalcophile and Key Element Distribution in the Eastern Goldfields: seismic traverse EGF01 predictive mineral discovery Aleks Kalinowski Geoscience Australia, pmdcrc Y2 project Aleks.Kalinowski@ga.gov.au
SUS. Company Profile. Ulrich Nell, Feldstr.23, D - 46149 Oberhausen, Tel. 0049(0)208/658535 Fax 0049(0)208/658536
SUS Ulrich Nell, Feldstr.23, D - 46149 Oberhausen, Tel. 0049(0208/658535 Fax 0049(0208/658536 Company Profile SUS was founded in 1986 in Oberhausen in the Ruhr area (close to Düsseldorf, in order to meet
100% ionic compounds do not exist but predominantly ionic compounds are formed when metals combine with non-metals.
2.21 Ionic Bonding 100% ionic compounds do not exist but predominantly ionic compounds are formed when metals combine with non-metals. Forming ions Metal atoms lose electrons to form +ve ions. Non-metal
Leica EM SCD500. High Vacuum Sputter Coater For Highest Resolution FE-SEM Analysis
Leica EM SCD500 High Vacuum Sputter Coater For Highest Resolution FE-SEM Analysis High Vacuum Sputter Coating The Leica EM SCD500 is a versatile high vacuum film deposition system designed to produce very
1332 CHAPTER 18 Sample Questions
1332 CHAPTER 18 Sample Questions Couple E 0 Couple E 0 Br 2 (l) + 2e 2Br (aq) +1.06 V AuCl 4 + 3e Au + 4Cl +1.00 V Ag + + e Ag +0.80 V Hg 2+ 2 + 2e 2 Hg +0.79 V Fe 3+ (aq) + e Fe 2+ (aq) +0.77 V Cu 2+
Package Material Declaration
Code Atmel Corporation Material Declaration Datasheet ASE Shanghai REACH Compliant Yes Material Declaration Leadframe Copper (Cu) 7440 50 8 19.730 97.4 974000 26.21 262111 Iron (Fe) 7439 89 6 0.486 2.4
Finland s Minerals Strategy
Pekka Nurmi Geological Survey of Finland Finland s Minerals Strategy Efficiently managed and sustainable utilisation of our mineral resources secures the long-term supply of raw materials at a national
ELECTRON CONFIGURATION (SHORT FORM) # of electrons in the subshell. valence electrons Valence electrons have the largest value for "n"!
179 ELECTRON CONFIGURATION (SHORT FORM) - We can represent the electron configuration without drawing a diagram or writing down pages of quantum numbers every time. We write the "electron configuration".
Technology Metals Advanced Ceramics. High Performance Solutions for the LED Industry
Technology Metals Advanced Ceramics High Performance Solutions for the LED Industry 2 Our Commitment to Engineering Excellence H.C. Starck delivers superior quality with material consistency and product
CHM 1311: General Chemistry 1, Fall 2004 Exam #1, September 8, 2004. Name (print) SSN
CHM 1311: General Chemistry 1, Fall 2004 Exam #1, September 8, 2004 Name (print) SSN Pledge: I have neither given nor received aid on this exam: Signature For ALL problems: SHOW ALL WORK TO GET FULL CREDIT
SEMI Equipment and Materials Outlook. Daniel Tracy Senior Director Industry Research & Statistics Group at SEMI in San Jose, California
SEMI Equipment and Materials Outlook Daniel Tracy Senior Director Industry Research & Statistics Group at SEMI in San Jose, California Wednesday March 18, 2015 Outline o Fab Investments and Equipment Spending
3. What would you predict for the intensity and binding energy for the 3p orbital for that of sulfur?
PSI AP Chemistry Periodic Trends MC Review Name Periodic Law and the Quantum Model Use the PES spectrum of Phosphorus below to answer questions 1-3. 1. Which peak corresponds to the 1s orbital? (A) 1.06
Nanoparticle Deposition on Packaging Materials by the Liquid Flame Spray
Nanoparticle Deposition on Packaging Materials by the Liquid Flame Spray Hannu Teisala a, Mikko Tuominen a, Mikko Aromaa b, Jyrki M. Mäkelä b, Milena Stepien c, Jarkko J. Saarinen c, Martti Toivakka c
CLASS TEST GRADE 11. PHYSICAL SCIENCES: CHEMISTRY Test 6: Chemical change
CLASS TEST GRADE PHYSICAL SCIENCES: CHEMISTRY Test 6: Chemical change MARKS: 45 TIME: hour INSTRUCTIONS AND INFORMATION. Answer ALL the questions. 2. You may use non-programmable calculators. 3. You may
Chapter Outline. 3 Elements and Compounds. Elements and Atoms. Elements. Elements. Elements 9/4/2013
3 Elements and Compounds Chapter Outline 3.1 Elements A. Distribution of Elements Foundations of College Chemistry, 14 th Ed. Morris Hein and Susan Arena Copyright This reclining Buddha in Thailand is
Influence of Solder Reaction Across Solder Joints
Influence of Solder Reaction Across Solder Joints Kejun Zeng FC BGA Packaging Development Semiconductor Packaging Development Texas Instruments, Inc. 6 th TRC Oct. 27-28, 2003 Austin, TX 1 Outline Introduction
Electronegativity and Polarity
and Polarity N Goalby Chemrevise.org Definition: is the relative tendency of an atom in a molecule to attract electrons in a covalent bond to itself. is measured on the Pauling scale (ranges from 0 to
Chem 115 POGIL Worksheet - Week 4 Moles & Stoichiometry
Chem 115 POGIL Worksheet - Week 4 Moles & Stoichiometry Why? Chemists are concerned with mass relationships in chemical reactions, usually run on a macroscopic scale (grams, kilograms, etc.). To deal with
APPLYING DATA MINING METHODS TO PREDICT DEFECTS ON STEEL SURFACE
APPLYING DATA MINING METHODS TO PREDICT DEFECTS ON STEEL SURFACE 1 SAYED MEHRAN SHARAFI, 2 HAMID REZA ESMAEILY 1 Computer Engineering Department, Islamic Azad University, Najaf Abad Branch, Esfahan, Iran
Chapter 11 PVD and Metallization
Chapter 11 PVD and Metallization 2006/5/23 1 Metallization Processes that deposit metal thin film on wafer surface. 2006/5/23 2 1 Metallization Definition Applications PVD vs. CVD Methods Vacuum Metals
High-tech recycling of critical metals: Opportunities and challenges
High-tech recycling of critical metals: Opportunities and challenges Application know-how Metals Chemistry material Material science solutions Metallurgy Material solutions Recycling Christina Meskers
Demonstration of sub-4 nm nanoimprint lithography using a template fabricated by helium ion beam lithography
Demonstration of sub-4 nm nanoimprint lithography using a template fabricated by helium ion beam lithography Wen-Di Li*, Wei Wu** and R. Stanley Williams Hewlett-Packard Labs *Current address: University
Multicrystalline solar silicon production for development of photovoltaic industry
Multicrystalline solar silicon production for development of photovoltaic industry A.I. Nepomnyaschikh Institute of Geochemistry, Siberian Branch, Russian Academy of Sciences, E-mail: ainep@igc.irk.ru
Electrochemistry - ANSWERS
Electrochemistry - ANSWERS 1. Using a table of standard electrode potentials, predict if the following reactions will occur spontaneously as written. a) Al 3+ + Ni Ni 2+ + Al Al 3+ + 3e - Al E = -1.68
CATALOGUE REFERENCE MATERIALS
IPT Institute for Technological Research CATALOGUE REFERENCE MATERIALS 2014 Laboratory of Metrological References IPT s Reference Materials www.ipt.br/nmr.htm Av. Prof. Almeida Prado n0 532 Predio 31 Cidade
Quality Control on Aerospace Components Using Handheld X-ray Fluorescence (XRF)
International Workshop SMART MATERIALS, STRUCTURES & NDT in AEROSPACE Conference NDT in Canada 2011 2-4 November 2011, Montreal, Quebec, Canada Quality Control on Aerospace Components Using Handheld X-ray
MICROPOSIT LOL 1000 AND 2000 LIFTOFF LAYERS For Microlithography Applications
Technical Data Sheet MICROPOSIT LOL 1000 AND 2000 LIFTOFF LAYERS For Microlithography Applications Regional Product Availability Description Advantages North America Europe, Middle East and Africa Latin
WŝŽŶĞĞƌŝŶŐ > ĞdžƉĞƌŝĞŶĐĞ ƐŝŶĐĞ ϭϵϳϰ WŝĐŽƐƵŶ ^he > Ρ ZͲƐĞƌŝĞƐ > ƐLJƐƚĞŵƐ ƌŝěőŝŷő ƚśğ ŐĂƉ ďğƚǁğğŷ ƌğɛğăƌđś ĂŶĚ ƉƌŽĚƵĐƟŽŶ d, &hdhz K& d,/e &/>D /^, Z
The ALD Powerhouse Picosun Defining the future of ALD Picosun s history and background date back to the very beginning of the field of atomic layer deposition. ALD was invented in Finland in 1974 by Dr.
Determination of Metals in a 3% Sodium Chloride (NaCl) Matrix by Axially-Viewed ICP-OES
Determination of Metals in a 3% Sodium Chloride (NaCl) Matrix by Axially-Viewed ICP-OES Application Note Inductively Coupled Plasma-Optical Emission Spectrometers Author Deen Johnson Introduction The development
Plating on Aluminium
TALAT Lecture 5205 Plating on Aluminium 19 pages, 23 figures Level: Advanced I prepared by P. M ller, Dansk Technisca Hoogschol, Lyngby Objectives: to describe the processes of electroless, electrolytic,
Standard Specification for Chromium and Chromium-Nickel Stainless Steel Plate, Sheet, and Strip for Pressure Vessels and for General Applications 1
Designation: A 2/A 2M 04a e1 Standard Specification for Chromium and Chromium-Nickel Stainless Steel Plate, Sheet, and Strip for Pressure Vessels and for General Applications 1 This standard is issued
Hallmarking Guidance Notes
Hallmark guidance Leaflet 2010 (final artwork):- 20/8/10 14:37 Page 2 Hallmarking Guidance Notes Practical guidance in relation to the Hallmarking Act 1973 Information from the Assay Offices of Great Britain
NEMI RoHS Summit Component Supplier Issues with B2B Data Exchange update. Mark Frimann Texas Instruments 19 Oct 2004
NEMI RoHS Summit Component Supplier Issues with B2B Data Exchange update Mark Frimann Texas Instruments 19 Oct 2004 1 TI SPECS CUSTOMER SPECS PACKAGING PRODUCT CONTENT Pb-free Green E S H L E G A L 2 Skill
UNIT (2) ATOMS AND ELEMENTS
UNIT (2) ATOMS AND ELEMENTS 2.1 Elements An element is a fundamental substance that cannot be broken down by chemical means into simpler substances. Each element is represented by an abbreviation called
Investor Presentation May 2014
Investor Presentation May 2014 Cautionary Note 2 THIS DOCUMENT IS STRICTLY CONFIDENTIAL AND IS BEING PROVIDED TO YOU SOLELY FOR YOUR INFORMATION BY AMG ADVANCED METALLURGICAL GROUP N.V. (THE COMPANY )
In-line 3D Sputtering Coating System. Fully automated. pst line
In-line 3D Sputtering Coating System Fully automated pst line pst line In-line 3D Sputtering Coating System Fully in-line automated base coat, 3D sputtering and top coat system Ultra efficient varnishing
ME 612 Metal Forming and Theory of Plasticity. 1. Introduction
Metal Forming and Theory of Plasticity Yrd.Doç. e mail: azsenalp@gyte.edu.tr Makine Mühendisliği Bölümü Gebze Yüksek Teknoloji Enstitüsü In general, it is possible to evaluate metal forming operations
DEVELOPMENTS & TRENDS IN FEOL MATERIALS FOR ADVANCED SEMICONDUCTOR DEVICES Michael Corbett mcorbett@linx-consulting.com Semicon Taiwan2015
DEVELOPMENTS & TRENDS IN FEOL MATERIALS FOR ADVANCED SEMICONDUCTOR DEVICES Michael Corbett mcorbett@linx-consulting.com Semicon Taiwan2015 LINX BACKGROUND Linx Consulting 1. We help our clients to succeed
OPTIMIZING OF THERMAL EVAPORATION PROCESS COMPARED TO MAGNETRON SPUTTERING FOR FABRICATION OF TITANIA QUANTUM DOTS
OPTIMIZING OF THERMAL EVAPORATION PROCESS COMPARED TO MAGNETRON SPUTTERING FOR FABRICATION OF TITANIA QUANTUM DOTS Vojtěch SVATOŠ 1, Jana DRBOHLAVOVÁ 1, Marian MÁRIK 1, Jan PEKÁREK 1, Jana CHOMOCKÁ 1,
Comp-AC. ENVIRONMENTAL INFORMATION Recycling instructions for drive of type ACS 200. ABB Oy Product Support 12.11.1998 TLC/Ari Niskanen
1 ABB Oy Product Support 12.11.1998 TLC/Ari Niskanen Comp-AC ENVIRONMENTAL INFORMATION Recycling instructions for drive of type ACS 200 Table of contents 1. Introduction 2. Product package 3. Product materials
Naming Compounds Handout Key
Naming Compounds Handout Key p. 2 Name each of the following monatomic cations: Li + = lithium ion Ag + = silver ion Cd +2 = cadmium ion Cu +2 = copper (II) ion Al +3 = aluminum ion Mg +2 = magnesium ion
Printed Circuit Board Recycling Methods
Printed Circuit Board Recycling Methods 1. Introduction to Printed Circuit Boards The Printed Circuit Board (PCB 1 ) manufacturing process is very complicated, involving many special chemicals and valuable
Chem 1101. Highlights of last lecture. This lecture. Australian Mining Sites. A/Prof Sébastien Perrier. Metallurgy: (Extracting metal from ore)
Chem 111 A/Prof Sébastien Perrier Room: 351 Phone: 9351-3366 Email: s.perrier@chem.usyd.edu.au Unless otherwise stated, all images in this file have been reproduced from: Blackman, Bottle, Schmid, Mocerino
MATERIAL SAFETY DATA SHEET SECTION 1 CHEMICAL PRODUCT AND COMPANY INFORMATION SECTION 2 COMPOSITION/INFORMATION ON INGREDIENTS
SECTION 1 CHEMICAL PRODUCT AND COMPANY INFORMATION Chemical Name: Stainless Steel Product Use: Manufacturer Information: OMNISOURCE CORPORATION Telephone: (260)422-5541 Safety Department 1610 North Calhoun
Wire Bonding A Closer Look
ISTFA'91: The 17th International Symposium for Testing & Failure Analysis, Los Angeles, California, USA / 11-15 November 1991 Wire Bonding A Closer Look G. E. Servais and S.D. Brandenburg Delco Electronics
TEPZZ 69 _ZA T EP 2 692 310 A2 (19) (11) EP 2 692 310 A2. (12) EUROPEAN PATENT APPLICATION published in accordance with Art.
(19) TEPZZ 69 _ZA T (11) EP 2 692 3 A2 (12) EUROPEAN PATENT APPLICATION published in accordance with Art. 13(4) EPC (43) Date of publication: 0.02.14 Bulletin 14/06 (21) Application number: 1276632.0 (22)
Untitled Document. 1. Which of the following best describes an atom? 4. Which statement best describes the density of an atom s nucleus?
Name: Date: 1. Which of the following best describes an atom? A. protons and electrons grouped together in a random pattern B. protons and electrons grouped together in an alternating pattern C. a core
Solutions without Boundaries. PCB Surface Finishes. Todd Henninger, C.I.D. Sr. Field Applications Engineer Midwest Region
Solutions without Boundaries PCB Surface Finishes Todd Henninger, C.I.D. Sr. Field Applications Engineer Midwest Region 1 Notice Notification of Proprietary Information: This document contains proprietary
Introduction to VLSI Fabrication Technologies. Emanuele Baravelli
Introduction to VLSI Fabrication Technologies Emanuele Baravelli 27/09/2005 Organization Materials Used in VLSI Fabrication VLSI Fabrication Technologies Overview of Fabrication Methods Device simulation
h e l p s y o u C O N T R O L
contamination analysis for compound semiconductors ANALYTICAL SERVICES B u r i e d d e f e c t s, E v a n s A n a l y t i c a l g r o u p h e l p s y o u C O N T R O L C O N T A M I N A T I O N Contamination
ATOMS A T O M S, I S O T O P E S, A N D I O N S. The Academic Support Center @ Daytona State College (Science 120, Page 1 of 39)
ATOMS A T O M S, I S O T O P E S, A N D I O N S The Academic Support Center @ Daytona State College (Science 120, Page 1 of 39) THE ATOM All elements listed on the periodic table are made up of atoms.
K + Cl - Metal M. Zinc 1.0 M M(NO
Redox and Electrochemistry This section should be fresh in your minds because we just did this section in the text. Closely related to electrochemistry is redox chemistry. Count on at least one question
Wafer Bumping & Wafer Level Packaging for 300mm Wafer
31 st International Conference on Electronics Manufacturing and Technology - IEMT 2006 8-10 November 2006 Sunway Resort Hotel, Petaling Jaya, Malaysia Wafer Bumping & Wafer Level Packaging for 300mm Wafer
AMG Advanced Metallurgical Group N.V.
AMG Advanced Metallurgical Group N.V. Investor Presentation October 2009 1 Disclaimer THIS DOCUMENT IS STRICTLY CONFIDENTIAL AND IS BEING PROVIDED TO YOU SOLELY FOR YOUR INFORMATION BY AMG ADVANCED METALLURGICAL
APPENDIX B: EXERCISES
BUILDING CHEMISTRY LABORATORY SESSIONS APPENDIX B: EXERCISES Molecular mass, the mole, and mass percent Relative atomic and molecular mass Relative atomic mass (A r ) is a constant that expresses the ratio
Metals and Non-metals. Comparison of physical properties of metals and non metals
Metals and Non-metals Comparison of physical properties of metals and non metals PHYSICAL PROPERTY METALS NON-METALS Physical State Metallic lustre (having a shining surface) Mostly solids (Liquid -mercury)
Chapter 2 Lecture Notes: Atoms
Educational Goals Chapter 2 Lecture Notes: Atoms 1. Describe the subatomic structure of an atom. 2. Define the terms element and atomic symbol. 3. Understand how elements are arranged in the periodic table
pst line Fully automated In-line 3D Sputtering Coating System The right choice
pst line In-line 3D Sputtering Coating System Fully automated The right choice a new standard in sputtering technology pst line In-line 3D Sputtering Coating System loading & off-loading substrate cleaning
Chapter 2 Atoms, Ions, and the Periodic Table
Chapter 2 Atoms, Ions, and the Periodic Table 2.1 (a) neutron; (b) law of conservation of mass; (c) proton; (d) main-group element; (e) relative atomic mass; (f) mass number; (g) isotope; (h) cation; (i)
Recovery of Gold, Silver, Copper and Niobium from Printed Circuit Boards Using Leaching Column Technique
Journal of Earth Science and Engineering 2 (2012) 590-595 D DAVID PUBLISHING Recovery of Gold, Silver, Copper and Niobium from Printed Circuit Boards Using Leaching Column Technique Ricardo Montero, Alicia
Find a pair of elements in the periodic table with atomic numbers less than 20 that are an exception to the original periodic law.
Example Exercise 6.1 Periodic Law Find the two elements in the fifth row of the periodic table that violate the original periodic law proposed by Mendeleev. Mendeleev proposed that elements be arranged
2014 Q1 trading update
2014 Q1 trading update 2014 Q1 highlights Revenues up by 1% Positive developments in most product businesses, offset by effects of lower metal prices and, to a lesser extent, currency headwinds Catalysis
CVD SILICON CARBIDE. CVD SILICON CARBIDE s attributes include:
CVD SILICON CARBIDE CVD SILICON CARBIDE is the ideal performance material for design engineers. It outperforms conventional forms of silicon carbide, as well as other ceramics, quartz, and metals in chemical
Chem 1721 Brief Notes: Chapter 19
Chem 1721 Brief Notes: Chapter 19 Chapter 19: Electrochemistry Consider the same redox reaction set up 2 different ways: Cu metal in a solution of AgNO 3 Cu Cu salt bridge electrically conducting wire
List of traded commodities - Wikipedia, the free encyclopedia
Page 1 of 5 List of traded commodities From Wikipedia, the free encyclopedia Contents 1 Agricultural (grains, and food and fiber) 2 Livestock and meat 3 Energy 4 Precious metals 5 Industrial metals 6 Rare
Chapter 21a Electrochemistry: The Electrolytic Cell
Electrochemistry Chapter 21a Electrochemistry: The Electrolytic Cell Electrochemical reactions are oxidation-reduction reactions. The two parts of the reaction are physically separated. The oxidation reaction
EARLY ATOMIC THEORY AND STRUCTURE
CHAPTER 5 EARLY ATOMIC THEORY AND STRUCTURE SOLUTIONS TO REVIEW QUESTIONS 1. Elements are composed of indivisable particles called atoms. Atoms of the same element have the same properties; atoms of different
Optical Disc and Solar Annual Press/Analyst Conference - March 26, 2010
SMART SOLUTIONS TO DRIVE THE FUTURE Optical Disc and Solar Annual Press/Analyst Conference - Dr. - Ing. Stefan Rinck AG Optical Disc & Solar - 2 - Optical Disc - Blu-ray Excellent starting position for
The Structure of the Atom
The Structure of the Atom Copyright Glencoe/McGraw-Hill, a division of the McGraw-Hill Companies, Inc. Section 4. Early Ideas About Matter pages 02 05 Section 4. Assessment page 05. Contrast the methods