DATA SHEET. KMZ10C Magnetic field sensor DISCRETE SEMICONDUCTORS Mar 24

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1 DISCRETE SEMICONDUCTORS DATA SHEET M3D329 Supersedes data of November 1994 File under Discrete Semiconductors, SC Mar 24

2 DESCRIPTION The is a magnetic field sensor, employing the magnetoresistive effect of thin-film permalloy. Its properties enable this sensor to be used in a wide range of applications for current and field measurement, revolution counters, angular or linear position measurement and proximity detectors, etc. Hx Hy PINNING PIN SYMBOL DESCRIPTION 1 +V O output voltage 2 GND ground 3 V O output voltage 4 V CC supply voltage MBA737 Fig.1 Simplified outline. QUICK REFERENCE DATA SYMBOL PARAMETER MIN. TYP. MAX. UNIT V CC DC supply voltage 5 V T bridge bridge operating temperature C H y magnetic field strength ka/m H x auxiliary field 3 ka/m S sensitivity 1.5 mv V ka m R bridge bridge resistance kω V offset offset voltage mv/v CIRCUIT DIAGRAM handbook, full pagewidth MLC V O GND V O V CC Fig.2 Simplified circuit diagram Mar 24 2

3 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT V CC DC supply voltage 1 V P tot total power dissipation up to T amb = 132 C 1 mw T stg storage temperature note C T bridge bridge operating temperature C Note 1. Maximum operating temperature of the thin-film permalloy. 15 MSA927 P tot (mw) T amb ( o C) Fig.3 Power derating curve Mar 24 3

4 THERMAL CHARACTERISTICS SYMBOL PARAMETER VALUE UNIT R th j-a thermal resistance from junction to ambient 18 K/W CHARACTERISTICS T amb =25 C; H x = 3 ka/m; note 1; V CC = 5 V unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT H y magnetic field strength ka/m S sensitivity notes 1 and mv V ka m TCV O temperature coefficient of V CC =5V;.5 %/K output voltage T amb = 25 to +125 C I CC = 3 ma;.15 %/K T amb = 25 to +125 C R bridge bridge resistance kω TCR bridge temperature coefficient of T bridge = 25 to +125 C.35 %/K bridge resistance V offset offset voltage mv/v TCV offset temperature coefficient of T bridge = 25 to +125 C 2 +2 (µv/v)/k offset voltage FL linearity deviation of output H y =to±3.75 ka/m.8 % FS voltage H y =to±6. ka/m 2.4 % FS H y =to±7.5 ka/m 2.7 % FS FH hysteresis of output voltage.5 % FS f operating frequency 1 MHz Notes 1. In applications with H x < 3 ka/m the sensor has to be reset before first operation by application of an auxiliary field H x = 3 ka/m. ( V 2. S O at H y = 6kA m) ( V O at H y = ) = V CC 1998 Mar 24 4

5 H x H y H d 2 H d (ka/m) 1 safe operating area MLC H x (ka/m) 2 S (H ) x S (3 ka/m) 1 MLC H x (ka/m) In applications with H x < 3 ka/m, the sensor has to be reset, after leaving the SOAR, by an auxiliary field of H x = 3 ka/m. In applications with H x 3 ka/m, the sensor has to be reset by an auxiliary field of H x = 3 ka/m before using. Fig.4 Safe Operating Area (permissible disturbing field H d as a component of auxiliary field H x ). Fig.5 Relative sensitivity (ratio of sensitivity at certain H x and sensitivity at H x = 3 ka/m). 16 V O (mv/v) 8 max typ min MLC H y (ka/m) H x = 3 ka/m; T amb =25 C; V offset =. Fig.6 Sensor output characteristics Mar 24 5

6 PACKAGE OUTLINE Plastic single-ended flat package; 4 in-line leads SOT195 E Q b 1 A D chip L 1 L e 1 e b p c 1 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b p b 1 c D E e e 1 mm L L 1 (1) max. 2 Q.8.7 Notes 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE SOT Mar 24 6

7 DEFINITIONS Data Sheet Status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale Mar 24 7

8 a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel , Fax Austria: Computerstr. 6, A-111 WIEN, P.O. Box 213, Tel , Fax Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 225 MINSK, Tel , Fax Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 147 SOFIA, Tel , Fax Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel China/Hong Kong: 51 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel , Fax Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 8, PB 1919, DK-23 COPENHAGEN S, Tel , Fax Finland: Sinikalliontie 3, FIN-263 ESPOO, Tel , Fax France: 51 Rue Carnot, BP317, SURESNES Cedex, Tel , Fax Germany: Hammerbrookstraße 69, D-297 HAMBURG, Tel , Fax Greece: No. 15, 25th March Street, GR TAVROS/ATHENS, Tel /239, Fax Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 4 25, Tel , Fax Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel , Fax Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 1853, TEL AVIV 6118, Tel , Fax Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 2124 MILANO, Tel , Fax Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 18, Tel , Fax Korea: Philips House, Itaewon-dong, Yongsan-ku, SEOUL, Tel , Fax Malaysia: No. 76 Jalan Universiti, 462 PETALING JAYA, SELANGOR, Tel , Fax Mexico: 59 Gateway East, Suite 2, EL PASO, TEXAS 7995, Tel Middle East: see Italy Netherlands: Postbus 95, 56 PB EINDHOVEN, Bldg. VB, Tel , Fax New Zealand: 2 Wagener Place, C.P.O. Box 141, AUCKLAND, Tel , Fax Norway: Box 1, Manglerud 612, OSLO, Tel , Fax Philippines: Philippines Inc., 16 Valero St. Salcedo Village, P.O. Box 218 MCC, MAKATI, Metro MANILA, Tel , Fax Poland: Ul. Lukiska 1, PL WARSZAWA, Tel , Fax Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, MOSCOW, Tel , Fax Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel , Fax Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., Main Road Martindale, 292 JOHANNESBURG, P.O. Box 743 Johannesburg 2, Tel , Fax South America: Al. Vicente Pinzon, 173, 6th floor, SÃO PAULO, SP, Brazil, Tel , Fax Spain: Balmes 22, 87 BARCELONA, Tel , Fax Sweden: Kottbygatan 7, Akalla, S STOCKHOLM, Tel , Fax Switzerland: Allmendstrasse 14, CH-827 ZÜRICH, Tel , Fax Taiwan:, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel , Fax Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 29/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 126, Tel , Fax Turkey: Talatpasa Cad. No. 5, 864 GÜLTEPE/ISTANBUL, Tel , Fax Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, KIEV, Tel , Fax United Kingdom: Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel , Fax United States: 811 East Arques Avenue, SUNNYVALE, CA , Tel Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11 BEOGRAD, Tel , Fax For all other countries apply to:, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 56 MD EINDHOVEN, The Netherlands, Fax Internet: Philips Electronics N.V SCA57 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 11516//2/pp8 Date of release: 1998 Mar 24 Document order number:

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