AOZ1334DI-02. Single Channel Smart Load Switch. Features. General Description. Applications. Typical Application AOZ1334DI-02

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Single Channel Smart Load Switch General Description The AOZ1334DI-02 is a single channel load switch with very low on-resistance in a small package. It contains an n-channel MOSFET for up to 5.5V input voltage operation and 10A current channel with 5V bias supply. The load switch is controlled by a low voltage control signal through ON pin. The AOZ1334DI-02 integrates an internal 220Ω load resistor for quick output discharge when load switch is off. The AOZ1334DI-02 is available in a 3mm x 3mm DFN-8L package with bottom thermal pad and is rated over a -40 C to +85 C ambient temperature range. Features 0.8V to 5.5V input voltage range 10A continuous current Low R DS(ON) internal NFETs 3.6mΩ at V BIAS = 5V, V = 1.05V 60µA low quiescent current 0.5ms turn on rise time at V BIAS = 5V and V = 1.05V V to 5.5V bias voltage Integrated quick output discharge resistor Thermally enhanced 3mm x 3mm DFN-8L package Applications Portable computers Ultrabooks Tablet PCs Set top boxes LCD TVs Telecom/Networking/Datacom equipment SSD Consumer electronics Typical Application V C CL V VBIAS CBIAS OFF ON AOZ1334DI-02 VBIAS ON GND Rev. 1.1 January 2016 www.aosmd.com Page 1 of 12

Ordering Information Part Number Temperature Range Package Environmental AOZ1334DI-02-40 C to +85 C 3mm x 3mm DFN-8L Green All AOS products are offered in packages with Pb-free plating and compliant to RoHS standards. Please visit www.aosmd.com/media/aosgreenpolicy.pdf for additional information. Pin Configuration 1 8 8 1 2 7 7 2 VBIAS 3 6 6 3 VBIAS ON 4 EPAD 5 GND GND 5 EPAD 4 ON 3mm x 3mm DFN-8 (Top View) 3mm x 3mm DFN-8 (Bottom View) Pin Description Pin Number Pin Name Pin Function 1, 2, EPAD Load Switch Input. Bypass capacitor is recommended to minimize input voltage dip. Recommended voltage range of this pin is 0.8V to 5.5V to obtain optimal R ON. 3 VBIAS Bias Voltage. Power supply input for the device. Recommended voltage range is V to 5.5V. 4 ON Active High Switch Control Input. Do not leave floating. 5 GND Ground. 6, 7, 8 Load switch output. Rev. 1.1 January 2016 www.aosmd.com Page 2 of 12

Functional Block Diagram VBIAS Charge Pump ON Control Logic GND Absolute Maximum Ratings Exceeding the Absolute Maximum ratings may damage the device. Parameter, ON, VBIAS, to GND Junction Temperature (T J ) Storage Temperature (T S ) ESD Rating HBM/CDM Rating -0.3V to 6V +150 C -65 C to +150 C 2kV/1kV Recommend Operating Ratings The device is not guaranteed to operate beyond the Maximum Operating Ratings. Parameter Rating Supply Voltage (V ) 5.5V Ambient Temperature (T A ) -40 C to +85 C Package Thermal Resistance 3x3 DFN-8 (Θ JC ) 3x3 DFN-8 (Θ JA ) 8 C/W 60 C/W Electrical Characteristics T A = 25 C, V BIAS = 5V, V = 1.05V, unless otherwise specified. Specifications in BOLD indicate a temperature range of -40 C to +85 C. Symbol Parameter Conditions Min. Typ. Max. Units V Supply Voltage = 5V 0.8 1.05 5.5 V V BIAS VBIAS Supply Voltage 5 5.5 V I D Maximum Continuous Current = 5V 10 A I PLS Maximum Pulsed Switch Current V = = 5V 12 A Pulse < 300µs, 2% Duty Cycle I q Quiescent Supply Current of V BIAS I = 0V, = 5V 60 µa I OFF VBIAS Shutdown Supply Current = 0V, V = 0V 2 µa I OFF Shutdown Supply Current = 0V, V = 0V 2 µa I ON ON Leakage Current = 5V 1 µa H ON High Level Voltage 1.2 V L ON Low Level Voltage 0.5 V Switching ON Resistance I = -6A, = 5V, V BIAS = 5V 5 mω R ON Switch ON-State Resistance I = -6A, = 5V, V BIAS = 3.3V 5 mω R PD Output Pull-Down Resistance I = 15mA, = 0V 220 300 Ω Rev. 1.1 January 2016 www.aosmd.com Page 3 of 12

Switching Characteristics 50% 50% t OFF t ON V t D-ON 1% 10% 50% t R 90% 90% 10% t F 50% Test conditions: T A = 25 C, C = 1µF, C L = 0.1µF (unless otherwise specified). Symbol Parameter Min. Typ. Max. Units V = 1.05V, VBIAS = VON = 5V, RL = 10Ω t ON Turn-ON Time 800 t D-ON Turn-ON Delay time 350 500 650 t R Turn-ON Rise Time 350 500 650 t OFF Turn-OFF Time 2.8 t F Turn-OFF Fall Time V = 1.5V, VBIAS = VON = 5V, RL = 10Ω t ON Turn-ON Time 830 t D-ON Turn-ON Delay time 336 480 624 t R Turn-ON Rise Time 420 600 780 t OFF Turn-OFF Time t F Turn-OFF Fall Time V = 1.05V, VBIAS = VON = 5V, I = -6A t ON Turn-ON Time 1140 t D-ON Turn-ON Delay time 660 t R Turn-ON Rise Time 700 t OFF Turn-OFF Time 2.3 t F Turn-OFF Fall Time 0.5 V = 1.5V, VBIAS = VON = 5V, I = -6A t ON Turn-ON Time 1120 t D-ON Turn-ON Delay time 630 t R Turn-ON Rise Time 770 t OFF Turn-OFF Time t F Turn-OFF Fall Time 0.5 µs µs µs µs Rev. 1.1 January 2016 www.aosmd.com Page 4 of 12

Typical Characteristics 90 Quiescent Current vs. VBIAS (V=VBIAS=VON=5V) 5.0 RON vs. V (VBIAS=5.5V, I=-6A) 80 IBIAS (μa) 70 60 RSDON (mω) 3.5 50 3.0 40 30 3.0 3.3 3.5 3.8 4.3 4.8 5.0 5.3 5.5 VBIAS (V) 0.8 1.3 1.8 2.3 2.8 3.3 3.8 4.3 4.8 5.3 5.8 5.5 RON vs. V (VBIAS=V, I=-6A) V vs. VON (TA=, V=2V) 5.0 RDSON (mω) 3.5 V (V) 1.5 1.0 3.0 0.8 1.1 1.4 1.7 2.3 2.6 0.5 VBIAS = V VBIAS = 3.3V VBIAS = 5.0V VBIAS = 5.5V 0 0.5 0.7 0.9 1.1 1.3 VON (V) Rev. 1.1 January 2016 www.aosmd.com Page 5 of 12

Typical Characteristics (Continued) 1900 ton vs. V (VBIAS=V) 700 td-on vs. V (VBIAS=5.5V) 1800 1700 600 1600 500 ton (μs) 1500 1400 1300 td-on (μs) 400 300 1200 1100 1000 0.8 1.0 1.2 1.4 1.6 1.8 2.2 2.4 2.6 200 100 0.8 1.2 1.6 2.4 2.8 3.2 3.6 4.4 4.8 5.2 5.6 1100 ton vs. V (VBIAS=5.5V) 2500 tr vs. V (VBIAS=V) 1050 1000 2000 950 ton (μs) 900 850 800 750 700 650 600 0.8 tr (μs) 500 0 1.2 1.6 2.4 2.8 3.2 3.6 4.4 4.8 5.2 5.6 0.8 1.0 1.2 1.4 1.6 1.8 2.2 2.4 2.6 1500 1000 1200 td-on vs. V (VBIAS=V) 1200 tr vs. V (VBIAS=5.5V) td-on (μs) 1000 800 600 400 200 0 0.8 1.0 1.2 1.4 1.6 1.8 2.2 2.4 2.6 tr (μs) 1100 1000 900 800 700 600 500 400 0.8 1.2 1.6 2.4 2.8 3.2 3.6 4.4 4.8 5.2 5.6 Rev. 1.1 January 2016 www.aosmd.com Page 6 of 12

Typical Characteristics (Continued) 5.5 toff vs. V (VBIAS=V) toff vs. V (VBIAS=5.5V) 5.0 3.5 80ºC toff (μs) 3.5 toff (μs) 3.0 3.0 0.8 1.5 1.0 1.2 1.4 1.6 1.8 2.2 2.4 2.6 0.8 1.2 1.6 2.4 2.8 3.2 3.6 4.4 4.8 5.2 5.6 5.0 tf vs. V (VBIAS=V) 5.0 tf vs. V (VBIAS=5.5V) tf (μs) 3.5 3.0 tf (μs) 3.5 3.0 1.5 1.5 1.0 1.0 0.5 0 0.8 0 1.0 1.2 1.4 1.6 1.8 2.2 2.4 2.6 0.8 1.2 1.6 2.4 2.8 3.2 3.6 4.4 4.8 5.2 5.6 Rev. 1.1 January 2016 www.aosmd.com Page 7 of 12

Functional Characteristics Turn-ON & Turn-ON Rise Times (V X =1.05V, V BIAS =5V, C =1μF, C L =0.1μF, R L =10Ω) Turn-ON & Turn-ON Rise Times (V X =1.5V, V BIAS =5V, C =1μF, C L =0.1μF, R L =10Ω) (5V/div) (5V/div) V (200mV/div) V (200mV/div) Turn-OFF & Turn-OFF Fall Times (V X =1.05V, V BIAS =5V, C =1μF, C L =0.1μF, R L =10Ω) Turn-OFF & Turn-OFF Fall Times (V X =1.5V, V BIAS =5V, C =1μF, C L =0.1μF, R L =10Ω) (5V/div) (5V/div) V (200mV/div) V (200mV/div) Turn-ON & Turn-OFF at I =-6A (V X =1.05V, V BIAS =5V, C =1μF, C L =0.1μF) Turn-ON & Turn-OFF at I =-6A (V X =1.5V, V BIAS =5V, C =1μF, C L =0.1μF) (5V/div) (5V/div) V (500mV/div) V (500mV/div) I (2A/div) I (2A/div) Rev. 1.1 January 2016 www.aosmd.com Page 8 of 12

Detailed Description ON/OFF Control The AOZ1334DI-02 is enabled when the ON pin is on active high with 1.2V or above voltage. The device is disabled when the ON pin voltage is 0.5V or lower. The EN input is compatible with both TTL and CMOS logic. VBIAS Voltage Range For optimal on-resistance of load switch, make sure the voltage is within V to 5.5V. On-resistance of load switch will be higher if the condition is not satisfied. Resistance curves of a typical sample device at V BIAS = V and at different output currents are shown as below. RDSON (mω) RDSON (mω) 4.3 4.2 4.1 3.9 3.8 3.7 3.6 5.3 5.2 5.2 5.0 4.9 4.8 4.7 4.6 VBIAS = V VBIAS = 3.3V VBIAS = 5.0V VBIAS = 5.5V TA = 1 2 3 4 5 6 7 8 9 10 I (A) VBIAS = V VBIAS = 3.3V VBIAS = 5.0V VBIAS = 5.5V TA = Applications Information The basic AOZ1334DI-02 application circuit is shown in the first page. Component selection is explained below. Input Capacitor A capacitor of 10μF or higher value is recommended to be place close to the pins of AOZ1334DI-02. This capacitor can reduce the voltage drop caused by the in-rush current during the turn-on transient of the load switch. A higher value capacitor can be used to further reduce the voltage drop during high-current application. Output Capacitor A capacitor of 10μF or higher value is recommended to be place between the pins and GND. The capacitance does not affect the turn-on slew rate. However, a larger capacitor makes the initial turn-on transient smoother. Thermal Considerations To ensure proper operation, the maximum junction temperature of the AOZ1334DI-02 should not exceed 150 C. Several factors attribute to the junction temperate rise: load current, MOSFET on-resistance, junction-toambient thermal resistance, and ambient temperature. The maximum load current can be determined by: T I JMAX ( ) T C LOAD( MAX) = --------------------------------------- Θ JC R DS( ON) It is noted that the maximum continuous load current is 10A. Exceeding the maximum continuous load current may cause permanent damage to the device. Layout Guidelines Good PCB is important for improving the thermal performance of AOZ1334DI-02. Place the input and output bypass capacitors close to the and pins. The input and output PCB traces should be as wide as possible for the given PCB space. Use a ground plane to enhance the power dissipation capability of the device. 4.4 4.3 1 2 3 4 5 6 7 8 9 10 I (A) Rev. 1.1 January 2016 www.aosmd.com Page 9 of 12

Package Dimensions, DFN3x3_8L, EP1_S b1 8 D 8x bbb b C A B e 8 L E aaa C 2x E1 1 TOP VIEW aaa C 2x L D1 BOTTOM VIEW 1 Pin1 Identification ddd C C ccc C A SIDE VIEW A1 Seating Plane RECOMMENDED LAND PATTERN 0.40 0.30 1.60 1.60 0.65 2.40 1.30 0.30 2.60 UNIT: mm Dimensions in millimeters Symbols Min. Nom. Max. A A1 b1 b c D D1 E E1 e L R aaa bbb ccc ddd 0.70 0.00 1.55 0.25 --- 2.90 2.35 2.90 1.50 0.35 0.75 0.02 1.60 0.30 0.203 3.00 2.40 3.00 1.60 0.65 BSC 0.40 0.20 0.15 0.10 0.10 0.08 0.80 0.05 1.65 0.35 --- 3.10 2.45 3.10 1.70 0.45 Dimensions in inches Symbols Min. Nom. Max. A A1 b1 b c D D1 E E1 e L R aaa bbb ccc ddd 0.028 0.000 0.061 0.010 --- 0.114 0.093 0.114 0.059 0.014 0.030 0.001 0.063 0.012 0.008 0.118 0.094 0.118 0.063 0.026 BSC 0.016 0.008 0.006 0.004 0.004 0.003 0.031 0.002 0.065 0.014 --- 0.122 0.096 0.122 0.067 0.018 Notes: 1. Dimensions and tolerances conform to ASME Y1M-1994. 2. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. 3. Dimension b applies to metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. If the terminal has the optional radius on the other end of the terminal, dimension b should not be measured in that radius area. 4. Coplanarity ddd applies to the terminals and all other bottom surface metallization. Rev. 1.1 January 2016 www.aosmd.com Page 10 of 12

Tape and Reel Dimensions, DFN3x3_8L, EP1_S Carrier Tape A A P1 D0 D1 A E1 B0 K0 E2 E UNIT: mm T P0 A0 A P2 Feeding Direction Package DFN 3x3_EP A0 3.40 B0 3.35 K0 1.10 D0 1.50 +0.10/-0.0 D1 1.50 +0.10/-0.0 E 10 ±0.30 E1 1.75 E2 5.50 ±0.05 P0 8.00 P1 0 P2 0 ±0.05 T 0.30 ±0.05 Reel W1 N S G M K V R H UNIT: mm W Tape Size 12mm Reel Size ø330 M ø330.00 ±0.50 N ø97.00 W W1 13.00 17.40 ± 0.30 ± 1.00 H K ø13.00 10.60 +0.5/-0.2 S 0 ±0.50 G N/A R N/A V N/A Leader / Trailer & Orientation Unit Per Reel: 5000pcs Trailer Tape 300mm Min. Components Tape Orientation in Pocket Leader Tape 500mm Min. Rev. 1.1 January 2016 www.aosmd.com Page 11 of 12

Package Marking AOZ1334DI-02 (DFN3x3-8) Part Number Code Extension Code Option Code 1334 XOAW LT Year & Week Code Assembly Lot Code Assembly Location Code LEGAL DISCLAIMER Alpha and Omega Semiconductor makes no representations or warranties with respect to the accuracy or completeness of the information provided herein and takes no liabilities for the consequences of use of such information or any product described herein. Alpha and Omega Semiconductor reserves the right to make changes to such information at any time without further notice. This document does not constitute the grant of any intellectual property rights or representation of non-infringement of any third party s intellectual property rights. LIFE SUPPORT POLICY ALPHA AND OMEGA SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS LIFE SUPPORT DEVICES OR SYSTEMS. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Rev. 1.1 January 2016 www.aosmd.com Page 12 of 12