Power MOSFET PRODUCT SUMMARY (V) 100 R DS(on) () = 0.54 Q g max. (nc) 8.3 Q gs (nc) 2.3 Q gd (nc) 3.8 Configuration Single D TO220AB G FEATURES Dynamic dv/dt rating Available Repetitive avalanche rated 175 C operating temperature Available Fast switching Ease of paralleling Simple drive requirements Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 Note * This datasheet provides information about parts that are RoHScompliant and / or parts that are nonrohscompliant. For example, parts with lead (Pb) terminations are not RoHScompliant. Please see the information / tables in this datasheet for details. G DS S NChannel MOSFET DESCRIPTION Third generation power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low onresistance and costeffectiveness. The TO220AB package is universally preferred for all commercialindustrial applications at power dissipation levels to approximately 50 W. The low thermal resistance and low package cost of the TO220AB contribute to its wide acceptance throughout the industry. ORDERING INFORMATION INFORMATION Package Lead (Pb)free SnPb TO220AB IRF510PbF SiHF510E3 IRF510 SiHF510 ABSOLUTE MAXIMUM RATINGS (T C = 25 C, unless otherwise noted) PARAMETER SYMBOL LIMIT UNIT DrainSource Voltage 100 V GateSource Voltage ± 20 Continuous Drain Current at T C = 25 C 5.6 I D T C = 100 C 4.0 A Pulsed Drain Current a I DM 20 Linear Derating Factor 0.29 W/ C Single Pulse Avalanche Energy b E AS 75 mj Repetitive Avalanche Current a I AR 5.6 A Repetitive Avalanche Energy a E AR 4.3 mj Maximum Power Dissipation T C = 25 C P D 43 W Peak Diode Recovery dv/dt c dv/dt 5.5 V/ns Operating Junction and Storage Temperature Range T J, T stg 55 to 175 Soldering Recommendations (Peak temperature) d for 10 s 300 C Mounting Torque 632 or M3 screw Notes a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. V DD = 25 V, starting T J = 25 C, L = 4.8 mh, R g = 25, I AS = 5.6 A (see fig. 12). c. I SD 5.6 A, di/dt 75 A/μs, V DD, T J 175 C. d. 1.6 mm from case. 10 lbf in 1.1 N m S152693Rev. C, 16Nov15 1 Document Number: 91015
THERMAL RESISTANCE RATINGS PARAMETER SYMBOL TYP. MAX. UNIT Maximum JunctiontoAmbient R thja 62 CasetoSink, Flat, Greased Surface R thcs 0.50 C/W Maximum JunctiontoCase (Drain) R thjc 3.5 SPECIFICATIONS (T J = 25 C, unless otherwise noted) PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT Static DrainSource Breakdown Voltage = 0 V, I D = 250 μa 100 V Temperature Coefficient /T J Reference to 25 C, I D = 1 ma 0.12 V/ C GateSource Threshold Voltage (th) =, I D = 250 μa 2.0 4.0 V GateSource Leakage I GSS = ± 20 V ± 100 na Zero Gate Voltage Drain Current I = 100 V, = 0 V 25 DSS = 80 V, = 0 V, T J = 150 C 250 μa DrainSource OnState Resistance R DS(on) = I D =3.4 A b 0.54 Forward Transconductance g fs = 50 V, I D = 3.4 A b 1.3 S Dynamic Input Capacitance C iss = 0 V, 180 Output Capacitance C oss = 25 V, 81 pf Reverse Transfer Capacitance C rss f = 1.0 MHz, see fig. 5 15 Total Gate Charge Q g I D = 5.6 A, = 80 V 8.3 GateSource Charge Q gs = =, 2.3 nc GateDrain Charge Q gd see fig. 6 and fig. 13 b 3.8 TurnOn Delay Time t d(on) 6.9 Rise Time t r V DD = 50 V, I D = 5.6 A 16 TurnOff Delay Time t d(off) R g = 24, R D = 8.4, see fig. 10 b 15 ns Fall Time t f 9.4 Between lead, D Internal Drain Inductance L D 4.5 6 mm (0.25") from G package and center of Internal Source Inductance L S die contact 7.5 S nh DrainSource Body Diode Characteristics D Continuous SourceDrain Diode Current I MOSFET symbol S 5.6 showing the integral reverse Pulsed Diode Forward Current a G I SM p n junction diode 20 S A Body Diode Voltage V SD T J = 25 C, I S = 5.6 A, = 0 V b 2.5 V Body Diode Reverse Recovery Time t rr T J = 25 C, I F = 5.6 A, di/dt = 100 A/μs b 100 200 ns Body Diode Reverse Recovery Charge Q rr 0.44 0.88 μc Forward TurnOn Time t on Intrinsic turnon time is negligible (turnon is dominated by L S and L D ) Notes a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. Pulse width 300 μs; duty cycle 2 %. S152693Rev. C, 16Nov15 2 Document Number: 91015
TYPICAL CHARACTERISTICS (25 C, unless otherwise noted) 91015_01 10 1 10 0 Top 15 V 8.0 V 7.0 V 6.0 V 5.5 V 5.0 V Bottom 4.5 V 10 1 10 0 10 1 4.5 V 20 µs pulse width T C = 25 C, DraintoSource Voltage (V) Fig. 1 Typical Output Characteristics, T C = 25 C R DS(on), DraintoSource On Resistance (Normalized) 91015_04 3.0 2.5 2.0 1.5 1.0 0.5 I D = 5.6 A = 0.0 60 40 20 0 20 40 60 80 100 120 140160 180 T J, Junction Temperature ( C) Fig. 4 Normalized OnResistance vs. Temperature 91015_02 10 1 10 0 Top Bottom 15 V 8.0 V 7.0 V 6.0 V 5.5 V 5.0 V 4.5 V 4.5 V 20 µs pulse width T C = 175 C 10 1 10 0 10 1, DraintoSource Voltage (V) Fig. 2 Typical Output Characteristics, T C = 175 C Capacitance (pf) 91015_05 400 320 240 160 80 0 10 0 10 1 = 0 V, f = 1 MHz C iss = C gs C gd, C ds shorted C rss = C gd C oss = C ds C gd C iss C oss C rss, DraintoSource Voltage (V) Fig. 5 Typical Capacitance vs. DraintoSource Voltage 10 1 10 0 10 1 91015_03 4 25 C 175 C 20 µs pulse width = 50 V 5 6 7 8 9 10, GatetoSource Voltage (V), GatetoSource Voltage (V) 91015_06 20 16 12 8 4 0 I D = 5.6 A = 20 V = 80 V = 50 V 0 2 4 6 8 Q G, Total Gate Charge (nc) For test circuit see figure 13 10 Fig. 3 Typical Transfer Characteristics Fig. 6 Typical Gate Charge vs. GatetoSource Voltage S152693Rev. C, 16Nov15 3 Document Number: 91015
6.0 I SD, Reverse Drain Current (A) 91015_07 10 0 10 1 175 C 25 C = 0 V 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 V SD, SourcetoDrain Voltage (V) 91015_09 5.0 4.0 3.0 2.0 1.0 0.0 25 50 75 100 125 150 T C, Case Temperature ( C) 175 Fig. 7 Typical SourceDrain Diode Forward Voltage Fig. 9 Maximum Drain Current vs. Case Temperature 91015_08 10 2 5 2 10 5 2 1 5 2 0.1 2 5 1 10 Operation in this area limited by R DS(on) T C = 25 C T J = 175 C single pulse 2 5 100 µs 1 ms 10 ms 10 2 2 5, DraintoSource Voltage (V) Fig. 8 Maximum Safe Operating Area 10 3 R G Pulse width 1 µs Duty factor 0.1 % R D D.U.T. Fig. 10a Switching Time Test Circuit 90 % 10 % t d(on) t r t d(off) t f V DD Fig. 10b Switching Time Waveforms 10 Thermal Response (Z thjc ) 1 0.1 0 0.5 0.2 0.1 0.05 0.02 0.01 Single pulse (thermal response) 10 2 10 5 10 4 10 3 10 2 0.1 1 10 P DM t 1 t 2 Notes: 1. Duty factor, D = t 1 /t 2 2. Peak T j = P DM x Z thjc T C 91015_11 t 1, Rectangular Pulse Duration (s) Fig. 11 Maximum Effective Transient Thermal Impedance, JunctiontoCase S152693Rev. C, 16Nov15 4 Document Number: 91015
L Vary t p to obtain required I AS Q G R G t p I AS D.U.T 0.01 Ω V DD A V G Q GS Q GD Charge Fig. 12a Unclamped Inductive Test Circuit Fig. 13a Basic Gate Charge Waveform Current regulator Same type as D.U.T. 50 kω t p V DD 12 V 0.2 µf 0.3 µf D.U.T. V DS I AS 3 ma Fig. 12b Unclamped Inductive Waveforms Fig. 13b Gate Charge Test Circuit I G I D Current sampling resistors E AS, Single Pulse Energy (mj) 91015_12c 300 250 200 150 100 50 Top Bottom V DD = 25 V 0 25 50 75 100 125 150 I D 2.3 A 4.0 A 5.6 A Starting T J, Junction Temperature ( C) 175 Fig. 12c Maximum Avalanche Energy vs. Drain Current S152693Rev. C, 16Nov15 5 Document Number: 91015
Peak Diode Recovery dv/dt Test Circuit D.U.T. Circuit layout considerations Low stray inductance Ground plane Low leakage inductance current transformer R g dv/dt controlled by R g Driver same type as D.U.T. I SD controlled by duty factor D D.U.T. device under test V DD Driver gate drive P.W. Period D = P.W. Period = a D.U.T. l SD waveform Reverse recovery current Body diode forward current di/dt D.U.T. waveform Diode recovery dv/dt V DD Reapplied voltage Inductor current Body diode forward drop Ripple 5 % I SD Note a. = 5 V for logic level devices Fig. 14 For NChannel maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91015. S152693Rev. C, 16Nov15 6 Document Number: 91015
Package Information TO2201 D L H(1) Q L(1) 1 E 2 3 M * b(1) Ø P A F DIM. MILLIMETERS INCHES MIN. MAX. MIN. MAX. A 4.24 4.65 0.167 0.183 b 0.69 1.02 0.027 0.040 b(1) 1.14 1.78 0.045 0.070 c 0.36 0.61 0.014 0.024 D 14.33 15.85 0.564 0.624 E 9.96 10.52 0.392 0.414 e 2.41 2.67 0.095 0.105 e(1) 4.88 5.28 0.192 0.208 F 1.14 1.40 0.045 0.055 H(1) 6.10 6.71 0.240 0.264 J(1) 2.41 2.92 0.095 0.115 L 13.36 14.40 0.526 0.567 L(1) 3.33 4.04 0.131 0.159 Ø P 3.53 3.94 0.139 0.155 Q 2.54 3.00 0.100 0.118 ECN: X150364Rev. C, 14Dec15 DWG: 6031 Note M* = 0.052 inches to 0.064 inches (dimension including protrusion), heatsink hole for HVM e b C e(1) J(1) ASE Package Picture Xi an Revison: 14Dec15 1 Document Number: 66542
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