2015 Alighting Summit: LED Technology 10 June 2015 (09:30 12:00) & (13:30 16:30) (North), (South), Program highlights: LEDs & Emerging technologies Content: The LED market is undergoing a rapid transformation with evolution of Information-Exchange technologies: #Emerging technologies in LED industry increase reliability, performance and effectiveness of lighting #Prevailing market trends for integrated solution high quality light and efficient control systems The theme for summit is Evolution of LEDs & emerging technologies: The next big shift in internet epoch. The summit focuses on different aspects of technologies evolution for future lighting solutions with in-depth discussion. There are 4 technological forums in the summit: #Chips, LED packaging and LED modules #LED drivers & intelligent lighting control technology #LED standards & applications #New material & emerging technologies Agenda: Invite Industry associations, leading corporations & research institutes to host in-depth presentation and interactive discussion 21
Topic Organisation / Time Speaker AM Session Moderator: Prof. Yingping Zeng, Research and Development Center for Semiconductor Lighting Chinese Academy of Sciences, Institute of Semiconductors Chinese Academy of Sciences Theme: Lighting Technology Forum - Chips, packaging and modularization technology 09:30-09:35 Opening Speech 09:35-09:55 09:55-10:15 10:15-10:35 The latest development of blue LED chip Aluminum doped Zinc Oxide transparent electrode production technology The trend of refined products and outdoor lighting module of packaging companies The trend of LED multi angle application 10:35-10:45 Networking Break 10:45-11:05 11:05-11:25 11:25-11:45 InGaN-base LED As-A Revolutionary Lighting Source Towards High Density+High Power+High Reliability LED Package and its Application Recent Progress in GaN-on- Silicon based LED Technology Panel discussion Prof Ricky Lee Mr Lu Degang Sales Mr Liang Litian Research & Development Dr Wang Jianbo Assistant President &R&D Mr Donald Sun Director Mr Qian SUN Vice President of Engineering, GaN-on-Si LEDs HKUST LED-FPD Technology R&D Center at Foshan Shenzhen Lepower Opto Electronics Co Ltd Epistar Corporation HC SemiTek Corporation Lightning optoelectronic technology Co., Ltd. Lattice Power Corporation (South), 11:45-12:00 No package chips, silicon substrate, PSS, vertical chip, the localization of equipment, costs, MOCVD; Ceramic Package, Phosphor Free, Light Engine, Wafer Level Package, Flip, MCOB, COB; 22
Time Topic Speaker Organisation / PM Session Moderator: Dr. Bing Liang, Suzhou Institute of Nano-tech and Nano-bionics (SINANO), Chinese Academy of Sciences Theme: Technology Forum: LED advanced technology and application of new materials 13:30-13:35 Opening Speech 13:35-13:55 13:55-14:15 14:15-14:35 LED phosphors and color deviation High quality LED lighting - LED phosphors technology The solution to maximize the efficiency of LED packaging materials 14:35-14:45 Networking Break 14:45-15:05 15:05-15:25 15:25-15:45 15:45-16:30 LED Phosphor Total Solution For Improving Light Quality The latest advancement in optical measurement technology of semiconductor lighting products The influence of new Phosphor technology towards light source Panel discussion Mr Cui Yiping Vice Chairman Mr Calvin Yeh Global Strategic Marketing Mr Liang Chao Prof Tongsheng MOU Mr Lu Lu Deputy Chief Engineer CIE Merck Group Dow Corning Jiangsu Bree Optronics Co Ltd Department of Optical Engineering, Zhejiang University Beijing Nakamura-Yuji Science and Technology Co Ltd Shi Moxi, OLED, EMC, MOCVD, MO, remote phosphor source, ceramic substrate; (South), 23
Time Topic Speaker Organisation / AM Session Moderator:Prof Lin Yandan, Fudan University; Theme: Technology Forum Innovative and reliable LED technology 09:30-09:35 Opening Speech 09:35-09:55 The requirement of LED module 09:55-10:15 10:15-10:35 The development and prospect of LED optical engine technology Online detection technology enhancing the quality of LED products 10:35-10:45 Networking Break 10:45-11:05 11:05-11:25 11:25-11:45 11:45-12:00 Mr Mudao Zhu Photoelectric Element & System Application Group Mr Zhao Yong Dr Chen Cong Taiwan Industrial Technology Research Institute Zhongshan Rongda Electrical Co Ltd Everfine Corporation How to reduce cost of high quality LED products Mr Yucang Jian General ShenZhen Scholar Electronic Co.,Ltd The best solution of LED Intematix Photonics phosphor (ShenZhen) Co Ltd Trends in wireless connectivity Simon den Uijl TCLA The Connected for lighting in residential and Secretary General Lighting Alliance commercial buildings Light engine, Graphene, Reliability, Heat dissipation, Secondary optical, Modularization; (North), 24
Time Topic Speaker Organisation / PM Session Mederator: Prof. Hsiao, Horng-Ching, National Taiwan University of Science and Technology Theme: Techonology Forum LED driver and Smart control 13:30-13:35 Opening Speech 13:35-13:55 13:55-14:15 14:15-14:35 14:35-14:55 DALI 2 and standardisation of control devices The replacement and popularization of the traditional LED lighting LED Power technology Solid capacitor Scheme of LED driver The develop trend of LED intelligent lighting 14:55-15:05 Networking Break 15:05-15:25 15:25-15:45 15:45-16:05 16:05-16:30 How to product a reliable LED power source? The use of Drive power in Smart Lighting Leading innovative technology and open standards to accelerate the popularization and development of smart lighting Dr Scott Wade Mr Liao Yuzhu Mr Luo Wei Director of Centre Mr Ximin Wu Deputy General Mr Zhang Wentian Mr Zhu Jungao Director of Research & Development Mr Guan Zhenyuan IOT senior marketing manager DALI a working party of ZVEI Dong Guan Linkuan Electronics Technology Co Ltd ZhaoQing Beryl Electronic Co Ltd XiaMen GuangPu Electronics Co Ltd SELF Electronics Co Ltd Shenzhen Ledfriend Optoelectronics Co Ltd Marvell Technology Group Ltd Lightweight, Without-Power, Digitization, Electrolytic capacitor, Solid Cap, Stroboscopic, PWM, Wireless dimmer, Cloud Computing, the Internet of Things, Sensing, Numerical Control, Communication; (North), 25