DS12885, DS12885Q, DS12885T. Real Time Clock FEATURES PIN ASSIGNMENT

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DS12885, DS12885Q, DS12885T Real Time Clock FEATURES Drop in replacement for IBM AT computer clock/calendar Pin configuration closely matches MC146818B and DS1285 Counts seconds, minutes, hours, days, day of the week, date, month, and year with leap year compensation valid up to 2100 Binary or BCD representation of time, calendar, and alarm 12 or 24 hour clock with AM and PM in 12 hour mode Daylight Savings Time option Selectable between Motorola and Intel bus timing Multiplex bus for pin efficiency Interfaced with software as 128 RAM locations - 14 bytes of clock and control registers - 114 bytes of general purpose RAM Programmable square wave output signal Bus compatible interrupt signals (IRQ) Three interrupts are separately software maskable and testable - Time of day alarm once/second to once/day - Periodic rates from 122 µs to 500 ms - End of clock update cycle Optional 28 pin PLCC surface mount package or 32 pin TQFP Optional industrial temperature range available PIN ASSIGNMENT MOT X1 X2 AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 AD0 AD1 AD2 AD3 AD4 AD5 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 DS12885 24 PIN DIP DS12885S 24 PIN SOIC X2 X1 MOT AD6 AD7 VCC SQW CS AS 4 3 2 1 28 27 26 5 25 6 24 7 23 8 DS12885Q 28 PIN PLCC 22 9 21 10 20 11 19 12 13 14 1516 17 18 V CC SQW RCLR V BAT IRQ RESET DS R/W AS CS RCLR V BAT IRQ RESET DS R/W DESCRIPTION The DS12885 Real Time Clock plus RAM is designed to be a direct replacement for the DS1285. The DS12885 is identical in form, fit, and function to the DS1285, and has an additional 64 bytes of general purpose RAM. Access to this additional RAM space is determined by the logic level presented on AD6 during the address portion of an access cycle. An external crystal and battery are the only components required to maintain time of day and memory status in the absence of power. For a complete description of operating conditions, electrical characteristics, bus timing, and pin descriptions other than X1, X2, V BAT, and RCLR, see the DS12887 data sheet. AD0 AD1 AD2 AD3 AD4 AD5 X2 X1 MOT VCC SQW 32 31 30 29 28 27 26 25 1 2 3 4 5 6 7 8 DS12885T 32 PIN TQFP 24 23 22 21 20 19 18 17 9 1011 12131415 16 AD6 AD7 CS AS R/W RCLR V BAT IRQ RESET DS Copyright 1995 by Dallas Semiconductor Corporation. All Rights Reserved. For important information regarding patents and other intellectual property rights, please refer to Dallas Semiconductor data books. 041697 1/6

PIN DESCRIPTION AD0 AD7 Multiplexed Address/Data Bus No Connection MOT Bus Type Selection CS Chip Select AS Address Strobe R/W Read/Write Input DS Data Strobe RESET Reset Input IRQ Interrupt Request Output (open drain) SQW Square Wave Output V cc +5 Volt Supply Ground X1,X2 32.768 khz Crystal Connections V BAT +3 volt Battery Input RCLR RAM Clear PIN DESCRIPTION X1, X2 Connections for a standard 32.768 khz quartz crystal. The internal oscillator circuitry is designed for operation with a crystal having a specified load capacitance (CL) of 6 pf. The crystal is connected directly to the X1 and X2 pins. There is no need for external capacitors or resistors. Note: X1 and X2 are very high impedance nodes. It is recommended that they and the crystal be guard ringed with ground and that high frequency signals be kept away from the crystal area. For more information on crystal selection and crystal layout considerations, please consult Application Note 58, Crystal Considerations with Dallas Real Time Clocks. V BAT Battery input for any standard 3 volt lithium cell or other energy source. Battery voltage must be held between 2.5 and 4 volts for proper operation. A maximum load of 0.5 µa at 25 C in the absence of power should be used to size the external energy source. The battery should be connected directly to the V BAT pin. A diode must not be placed in series with the battery to the V BAT pin. Furthermore, a diode is not necessary because reverse charging current protection circuitry is provided internal to the device and has passed the requirements of Underwriters Laboratories for UL listing. RCLR The RCLR pin is used to clear (set to logic 1) all 114 bytes of general purpose RAM but does not affect the RAM associated with the real time clock. In order to clear the RAM, RCLR must be forced to an input logic 0 ( 0.3 to +0.8 volts) during battery back up mode when V CC is not applied. The RCLR function is designed to be used via human interface (shorting to ground manually or by switch) and not to be driven with external buffers. This pin is internally pulled up. Do not use an external pull up resistor on this pin. 041697 2/6

DS12885 24 PIN DIP PKG 24 PIN B D DIM MIN MAX A IN. 1.245 1.270 31.62 32.25 B IN. 0.530 0.550 13.46 13.97 1 C IN. 0.145 0.165 3.68 4.19 A K G E C F D IN. 0.600 0.625 15.24 15.88 E IN. 0.015 0.050 0.380 1.27 F IN. 0.120 0.145 3.05 3.68 G IN. 0.090 0.110 2.29 2.79 H IN. 0.625 0.675 15.88 17.15 J IN. 0.008 0.012 0.20 0.30 K IN. 0.015 0.022 0.38 0.559 J H 041697 3/6

DS12885 24 PIN SOIC K G PKG 24 PIN E A C B H DIM MIN MAX A IN. 0.602 0.612 15.29 15.54 B IN. 0.290 0.300 7.37 7.65 C IN. 0.089 0.095 2.26 2.41 E IN. 0.004 0.012 0.102 0.30 F IN. 0.094 0.105 2.38 2.68 G IN. 0.050 BSC 1.27 BSC H IN. 0.398 0.416 10.11 10.57 J IN. 0.009 0.013 0.229 0.33 K IN. 0.013 0.019 0.33 0.48 L IN. 0.016 0.040 0.406 1.02 phi 0 8 F phi J L 041697 4/6

DS12885Q 28 PIN PLCC 0.010 R (3X) 45 DEG. H B1 PKG 28 PIN DIM MIN MAX A IN. 0.300 REF 7.62 B IN. B1 IN. C IN. D IN. E IN. F IN. G IN. H IN. 0.442 17.68 0.013 0.33 0.027 0.68 0.480 12.2 0.090 2.29 0.020 0.51 0.390 9.91 0.165 4.19 0.462 11.73 0.021 0.53 0.033 0.84 0.500 12.7 0.120 3.05 MIN MIN 0.430 10.92 0.180 4.57 041697 5/6

DS12885T 32 PIN TQFP 041697 6/6