Analog Process Technologies

Transcription

1 Analog Process Technologies

2 Analog Process Technology Roadmap High-Precision Analog CMOS High-Speed BiCMOS Industry s only SiGe NPN and PNP Precision thin film and capacitor Low parasitic capacitance SOI & SiGe BiCom3 High Speed Broadest, Process Lowest 1/f noise in Industry Best thin film resistor and capacitor 3 / 5V CMOS Low parasitics HPA07 High Precision Leading edge power LDMOS Industry leading Cu technology Multi-voltage capability Voltage-scaled DECMOS LBC7 High Power Dense, low power CMOS Analog friendly CMOS Low Vt CMOS Passives DECMOS A0xx High Density deepest analog process technology portfolio differentiation is sustainable competitive advantage Advanced New High-Density Analog CMOS High-Power BiCMOS analog technologies use fully depreciated equipment product development programs across four different process platforms

3 Signal Conditioning & Data Converter Needs The Real World Temperature Pressure Position Speed Flow Humidity Sound Light Amplifier Amplifier Power Management Data Converter Data Converter Logic Digital Signal Processor Interface Clocks & Timers Customers Want Transistors Low-Noise Speed Process Needs Linearity High-Accuracy Noise Resistors High-Speed Temperature coefficient Low Linearity Power Matching Widely Capacitors Varying Voltage Ranges Linearity Matching Small Form Technology Factors BiCom3 BiCom3HV HPA07 Price Competitiveness C05

4 BiCom3: High Speed Fully Complementary Bipolar SiGe Process BiCom3 Silicon germanium (SiGe) Very fast transistors: 25GHz Ideal transistor characteristics Silicon-on-Insulator (SOI) Dramatically reduced transistor size Low-voltage coefficient capacitance Metal-metal capacitor 30-50% lower power operation Higher speeds / Excellent Dynamic Perf. Reduction in package size Lower distortion from reduced parasitics Extremely low distortion Improved accuracy Very low 1/f noise and transistor internal resistance Improved Signal-to-Noise Ratio (SNR) Precision thin-film resistors High accuracy Low temperature variation

5 BiCom3HV: High Speed & High Voltage 36V Bipolar SiGe Process BiCom3HV 40V transistors Higher voltage for industrial applications Silicon germanium (SiGe) Very fast transistors: 3GHz Ideal transistor characteristics Silicon-on-Insulator (SOI) Dramatically reduced transistor size Low-voltage coefficient capacitance Very low noise 30-50% lower power operation Higher speeds 70% reduction in package size Lower distortion Improved Signal-to-Noise Ratio (SNR) Precision thin-film resistors High accuracy

6 HPA07: High-Performance Analog CMOS HPA µm feature sizes 5V isolated CMOS transistors Higher speeds and accuracy Low CapEx requirements Improved Signal-to-Noise Ratio (SNR) Integration of analog and digital Very low noise Improved Signal-to-Noise Ratio (SNR) Metal-metal capacitor Precision thin-film resistors 4x increase in accuracy 40% area reduction Lower test costs 30% reduction in package size

7 HPA07: Better Capacitors Mean Better A/D Converters Capacitor Voltage Coefficient Comparison Error vs. Code Error vs Code Capacitor Ratio HPA07 Conventional Process Error Error (LSB) (LSB) HPA Voltage V (v) (V) Conventional Process Output Code The Most Important Component in Precision A/D Converters

8 C05: 0.18um Analog Enhanced CMOS C µm feature sizes High Digital Density Reduced Analog Circuit Parasitics Low voltage digital logic libraries Multiple voltage rating CMOS analog transistors (up to 6V) Isolated CMOS transistors Integrated resistors and capacitors optimized for analog design Low Power Integrated Digital Processing Support for 5V and Li-ion battery connections Optimized transistor vs voltage Improved Signal-to-Noise Ratio (SNR) and Total Harmonic Distortion (THD) Small die size Lower total solution cost Reduced package size

9 LBC7: High-Power BiCMOS Process LBC µm feature sizes 30V power transistors Thick copper power buss 70% increase in gate density Lower CapEx requirements Up to 70% reduction in die size Faster switching speeds Reduction in power transistor size Reduction in die size 3.3V isolated CMOS Rugged power transistors Integration of digital, analog and power functions 3x improvement in reliability Reduction in die size

10 A035: High-Density Analog CMOS A µm feature sizes 20V power transistors Copper metallization 5x increase in gate density Reduction in package size 50% reduction in transistor size Integration of power and dense logic Higher gate speed Higher gate density 1.5V isolated CMOS Lower power functions Integration of analog and digital Dense passives Reduction in die size

11 Summary Analog process technologies provide sustainable competitive advantage Multiple process platforms optimized individually for speed, precision, power and density Increasing commitment to analog process leadership