ORIENTATION CHARACTERISTICS OF THE MICROSTRUCTURE OF MATERIALS

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1 ORIENTATION CHARACTERISTICS OF THE MICROSTRUCTURE OF MATERIALS K. Sztwiertnia Polish Academy of Sciences, Institute of Metallurgy and Materials Science, 25 Reymonta St., Krakow, Poland MMN 2009

2 Contents Introduction to SEM and TEM-base orientation imaging microscopy (OIM) techniques. Quantitative microstructure image in the nano scale (Transmission Electron Microscope TEM). Example I: Investigation of recrystallization processes. Example II: OIM applied to gradient materials. Quantitative microstructure image in the micro scale (Scanning Electron Microscope SEM). Example III: OIM applied to composites. Example IV: Image Quality Maps.

3 OIM or COM; what is it? OIM = Orientation Imaging Microscopy COM = Crystal Orientation Mapping COM=OIM Orientation map Techniques exist in SEM, TEM and XRD. Electron BackScatter Diffraction= EBSD

4 Crystallographic orientation Polycrystalline material an aggregate of single crystal grains.

5 Crystallographic orientation y b z B x B y A z A x A

6 The geometry of interfaces R ω Geometry of the grain boundary: The rotation between two misooriented crystal lattices (misorientation), The orientation of the boundary plane. Crystallite A

7 Orientation and Misorientation Orientation Misorientation Orientation Distribution (Texture) Misorientation Distribution (Grain Boundaries Characteristics)

8 The relationship between the microstructure, diffraction pattern and crystal orientation. The microstructure of a stainless steel.

9 Orientation mapping in SEM and TEM y A z A x A Functions of misorientations (characteristics of grain boundaries) Orientation Phase Diffraction quality factor Thin foil (TEM) or surface of the bulk sample (SEM) Functions of orientations (e.g. Texture)

10 Orientation Microscopy Spatial resolution ~ 100 nm (FEG) Angular resolution > 0.5 SEM Spatial resolution ~ 10 nm TEM Angular resolution ~ 0.1

11 Example I: Recrystallization of 6013 aluminium alloy Alloy 6013, chemical composition (% by weight). Mg Si Cu Mn Fe Others Al Remainder The investigations: Analysis of microstructure in a state after deformation. Measurement of local crystallographic orientations (TEM). Calorimetric measurements of recrystallization (non-isothermal method, differential calorimeter). Analysis of microstructures and local orientation distributions in samples annealed in a calorimeter to the various recrystallization stages. K. Sztwiertnia, J. Morgiel, E. Bouzy, Arch. Metall. Mater., 50 (2005) 119.

12 Example I:Recrystallization of 6013 aluminium alloy Microstructure of 75% cold-rolled 6013 alloy, longitudinal section, TEM. ND RD S={123}<634>, Copper={112}<111>, Brass={011}<211>.

13 Example I:Recrystallization of 6013 aluminium alloy Microstructure of 90% cold-rolled 6013 aluminum alloy, in-situ annealing, longitudinal section, TEM (spatial resolution ~ 10 nm).. Orientation topography in the area of the deformation zone after heating in-situ in TEM Orientation topography in the area of the deformation zone 1 µm, Step= 30 nm, Grid 100 x 100 M. Bieda, K. Sztwiertnia, A. Korneva, T. Czeppe, R. Orlicki, Orientation mapping study on the inhomogeneous microstructure evolution during annealing of 6013 aluminum alloy, Solid State Phenomena, 163 (2010)

14 Example I:Recrystallization of 6013 aluminium alloy Rodrigues representation r 1, r 2, r 3, cross-section r 3 =const., asymmetric domain (O, O). (High Angle Grain Boundaries only; ω > 15 ). Misorientation distribution between orientations of crystallites in deformation zones (before annealing) and new grains growing in the same places; 75% coldrolled 6013 aluminum alloy Misorientation distribution between orientations of crystallites in deformation zones (before annealing) and new grains growing in the same places; 90% coldrolled 6013 aluminum alloy M. Bieda, K. Sztwiertnia, A. Korneva, T. Czeppe, R. Orlicki, Orientation mapping study on the inhomogeneous microstructure evolution during annealing of 6013 aluminum alloy, Solid State Phenomena, 163 (2010)

15 Example I:Recrystallization of 6013 aluminium alloy Power difference, representing release of stored energy from 75% cold-rolled 6013 alloy, as a function of annealing temperature. K. Sztwiertnia, J. Morgiel, E. Bouzy, Arch. Metall. Mater., 50 (2005) 119.

16 Example I:Recrystallization of 6013 aluminium alloy Microstructure of 75% cold-rolled 6013 alloy after heating in the calorimeter to 330 C, longitudinal section, TEM. A B A B 2 µm, step=100nm

17 Microstructure of 6013 alloy, 75% cold-rolled and subsequently heated in the calorimeter to C, EBSD/SEM, longitudinal section. KW 3.0 µ m. K. Sztwiertnia, J. Morgiel, E. Bouzy, Arch. Metall. Mater., 50 (2005) 119.

18 Microstructure of 6013 alloy, 75% cold-rolled and subsequently heated in the calorimeter to C, COM/FEG?SEM, longitudinal section.

19 Example II, Orientation mapping applied to gradient materials Hard magnetic Fe-Cr-Co alloy was subjected to severe plastic deformation by complex two-step loading. P = 10 kn 10 mm 10 mm Schema of deformation by upsetting and subsequent torsion. A. V. Korneva, M. Bieda, G.F. Korznikova and K. Sztwiertnia, Arch. Metall., 51 (2006) 69.

20 Example II, Orientation mapping applied to gradient materials The microstructure of the hard magnetic Fe-Cr-Co alloy after severe plastic deformation. The top part of the sample The middle part of the sample The bottom part of the sample A. V. Korneva, M. Bieda, G. F. Korznikova, K. Sztwiertnia: International Journal of Materials Research, in print.

21 Example II, Orientation mapping applied to gradient materials EBSD/SEM - α (bcc) - γ (fcc) - σ-( tetragonal) TEM =20 µm; Step=0.5 µm; Grid 200x150 The top part of the sample, deformed at 700 ºC, EBSD/SEM. A. V. Korneva, M. Bieda, G.F. Korznikova and K. Sztwiertnia, Arch. Metall., 51 (2006) 69.

22 Example II, Orientation mapping applied to gradient materials Fe Co Cr 1 µm А 2,2µm 1 µm 0,9 µm 1 µm Intensivity Fe Cr Co α phase σ phase Distance, µk The bottom part of the sample, deformed at 800 ºC and then annealed 30 min at 450 ºC, TEM. A. Korneva, M. Bieda, G. Korznikova, T. Czeppe, A. Korznikov, K. Sztwiertnia, International Journal of Materials Research, in print

23 Example III: Orientation mapping applied to composites. Misorientation characteristic of interphase boundaries in Al 2 O 3 / WC composites, SEM.

24 Example III: Microstructure of Al 2 O 3 / WC composite (ESEM/EBSD phase map) Al 2 O 3 grains red, WC grains blue, white regions not indexed; thick lines Al 2 O 3 /WC interphase boundaries, thin lines grain boundaries. K. Sztwiertnia, M. Faryna, G. Sawina, Journal of the European Ceramic Society, 26 (2006) 2973.

25 Example III: Microstructure of Al 2 O 3 / WC composite (ESEM/EBSD orientation map) Al O 2 3 WC Stereographic projections of directions <0001> in Al 2 O 3 grains and WC grains, respectively. K. Sztwiertnia, M. Faryna, G. Sawina, Journal of the European Ceramic Society, 26 (2006) 2973.

26 Example III: Misorientation Distribution Function (Al 2 O 3 / WC) (0111) WC [1123] WC (0111) WC [2110] WC (1105) Al O 2 [2311] Al O 2 (1011) Al O 2 [0111] Al O (0 0 01) WC (0 0 01) Al [11 2 0] WC [1 010] Al 2 2 O O 3 3 r 2 r 1 MDF between Al 2 O 3 and WC grains; Rodrigues representation r 1, r 2, r 3, cross-section r 3 =const., asymmetric domain (D 6, D 3 ). K. Sztwiertnia, M. Faryna, G. Sawina, Journal of the European Ceramic Society, 26 (2006) 2973.

27 Example III: Misorientation Distribution Function (Al 2 O 3 / WC) % of the total interphase boundary length Serie1 The crystallographic relationships correspond respectively to: 12%, 5%, 2%, 7% and 4% of the total WC/ Al 2 O 3 interphase boundary length. (0 0 01) WC (0 0 01) Al [11 2 0] WC [101 0] Al (1 01 0) WC [0 0 01] WC (1 01 0) Al2O [13 2 2] Al O (1 010) WC (1 010) Al [0 0 01] WC [ ] Al2O 3 (2110) WC [0 0 01] WC (31 2 0) WC [0 1112] WC O O O (211 0) Al2O [011 0] Al2O (31 2 0) Al2O [19 81] Al O K. Sztwiertnia, M. Faryna, G. Sawina, Journal of the European Ceramic Society, 26 (2006) 2973.

28 Example IV: EBSD Image Quality Maps Diffraction patterns from places with various dislocation densities (Al 2 O 3 ). The additional data contained in the diffraction image can be used, e.g. for differentiation of material areas with different dislocation density.

29 Definition of different types of stresses at various spatial scales Scale of the first order stresses σ M ij (the macrostress is the mean value over volume) V A where: V g f = V g A A M 1 σ ij = ) V A A σ ij ( r dv = N - total number of grains σ ij (r) and g σ ij V A N g f g σ g ij - local stress at r position - the volume fraction and the mean stress for grain g having volume V g

30 Definition of different types of stresses at various spatial scales σ g ij Scale of the second order stresses V ( is the mean stress for the volume of the g th grain) g σ IIg ij = σ g ij σ I ij where σ = σ I ij M ij for single phase material

31 Definition of different types of stresses at various spatial scales Scale of the third order stresses (the local stress at r position is indicated) σ III ij ( r) = σ ( r) ij σ g ij

32 Effect of tensile elastic strain on Kikuchi band width Second order stresses

33 Effect of elastic strain gradient on Kikuchi band width. (The broadening of original sharpness of diffraction line is connected with the local strain (stress) associated with the local increasing of lattice defects concentration) Third order stresses L= Θhkl The originally sharp line edge associated with a single d-spacing broadens as numerous spacings contribute to the band.

34 EBSD measurements of surface local strains in alumina ceramic before shot peening (test sample). q map. coarse-grained ceramic Orientation map; grain boundaries with disorientation angle o blue, o black, o yellow, > 80 o

35 A EBSD measurements of surface local strains in Al 2 O 3 ceramic before shot peening A Map of Quality index (q) Changes of Quality index (q) along the A-A line Changes of misorientation angle along the A-A line

36 EBSD measurements of surface local strains in alumina ceramic after shot peening fine-grained ceramic first order stresses ~0.83 GPa Comparison of normalized q distributions for alumina sample surfaces before and after shot peening: 1 the test sample, 2 - (first order stresses ~0.35 GPa), 3 - (first order stresses ~0.083 GPa), 4 and 5 - (first order stresses 1.27 GPa).

37 Conclusions Microstructure refers to the assemblage of grains and other constituents such as pores and precipitates. COM is a technique which allows crystal orientations to be measured. Maps of crystal orientation can be collected using SEM/COM and TEM/COM. They remove any ambiguity regarding the recognition of grains and grain boundaries in the sample. The grains in polycrystalline material are usually not randomly oriented, and crystallographic texturing can confer special properties on materials. COM is as an important technique for texture analysis because it allows the relation between texture and microstructure to be studied. Grain boundaries are the interfaces between grains. Boundaries formed between grains with particular orientation relationships to one another can have desirable properties. COM can characterise these boundaries and measure the distribution of various boundary types in a sample. COM is a technique for microstructural analysis.

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