DC Film Capacitor MKT Radial Potted Type
|
|
|
- Richard Dalton
- 9 years ago
- Views:
Transcription
1 MKT 370 l w FEATURES Available taped and loose in box RoHS compliant h ENCAPSULATION Flame retardant plastic case and epoxy resin (UL-class 94 V-0) P ± 0.3 Dimensions in mm l t Ø d t CLIMATIC TESTING CLASS ACC. TO IEC /100/56 APPLICATIONS Blocking and coupling, bypass and energy reservoir, telecom, industrial, consumer REFERENCE STANDARDS IEC MARKING C-value; tolerance; rated voltage; manufacturer s symbol; year and week of manufacturer; manufacturer s type DIELECTRIC Polyester film ELECTRODES Metallized CONSTRUCTION Mono construction Series construction for 630 V µf ~ µf CAPACITANCE RANGE (E12 SERIES) µf to 1.5 µf CAPACITANCE TOLERANCE ± 10 %, ± 5 % LEADS Tinned wire RATED TEMPERATURE 85 C MAXIMUM APPLICATION TEMPERATURE 100 C PERFORMANCE GRADE Grade 1 (long life) DETAIL SPECIFICATION For more detailed data and test requirements contact: [email protected] RATED (DC) VOLTAGE Standard size: 63 V, 100 V, 250 V, 400 V Compact size: 100 V, 250 V, 400 V, 630 V RATED (AC) VOLTAGE Standard size: 40 V, 63 V, 160 V, 220 V Compact size: 40 V, 63 V, 160 V, 220 V Document Number: For technical questions, contact: [email protected] Revision: 08-Dec-08 77
2 MKT 370 COMPOSITION OF CATALOG NUMBER TYPE AND PITCHES mm BFC2 370 YY Y 2222 (*) 370 YY Y (*) Old ordering number CAPACITANCE (numerically) Example: 104 = 10 x 10 = 100 nf MULTIPLIER (nf) TYPE PACKAGING LEAD CONFIGURATION 370 (standard size) Loose in box Taped on reel (1) Ammopack (1) Lead length /- 0.5 mm Lead length 26.0 ± 2.0 mm H = 18.5 mm; P 0 = 12.7 mm; Reel diameter = 356 mm H = 18.5 mm; P 0 = 12.7 mm PREFERRED TYPES C-TOL. 63 V 100 V 250 V 400 V ± 10 % ± 5 % ± 10 % ± 5 % ± 10 % ± 5 % ± 10 % ± 5 % TYPE PACKAGING LEAD CONFIGURATION 370 (compact size) Loose in box Taped on reel (1) Ammopack (1) Lead length /- 0.5 mm Lead length 26.0 ± 2.0 mm H = 18.5 mm; P 0 = 12.7 mm; Reel diameter = 356 mm H = 18.5 mm; P 0 = 12.7 mm PREFERRED TYPES C-TOL. 100 V 250 V 400 V 630 V ± 10 % CE EE FE GE ± 5 % CF EF FF GF ± 10 % CH EH FH GH ± 5 % CI EI FI GI ± 10 % CL EL FL GL ± 5 % CM EM FM GM ± 10 % CB EB FB GB ± 5 % CC EC FC GC Notes (1) For detailed tape specifications refer to packaging information: or end of catalog (2) SPQ = Standard Packing Quantity SPECIFIC REFERENCE DATA (STANDARD SIZE) DESCRIPTION VALUE Tangent of loss angle: at 1 khz at 10 khz at 100 khz C 0.1 µf 75 x x x µf < C 0.47 µf 75 x x x µf < C 1.5 µf 75 x x Rated voltage pulse slope (du/dt) R at 63 Vdc 100 Vdc 250 Vdc 400 Vdc 60 V/µs 110 V/µs 330 V/µs 630 V/µs R between leads, for C 0.33 µf at 10 V; 1 min > MΩ at 100 V; 1 min > MΩ > MΩ > MΩ RC between leads 0.33 µf < C 1.0 µf at 10 V; 1 min > 5000 s C > 1.0 µf at 10 V; 1 min > 1000 s C > 0.33 µf at 100 V; 1 min > 5000 s R between interconnecting leads and case (foil method) > MΩ > MΩ > MΩ > MΩ Withstanding (DC) voltage (cut off current 10 ma); 100 V; 1 min 160 V; 1 min 400 V; 1 min 640 V; 1 min Withstanding (DC) voltage between leads and case 200 V; 1 min 200 V; 1 min 500 V; 1 min 800 V; 1 min Maximum application temperature 100 C For technical questions, contact: [email protected] Document Number: Revision: 08-Dec-08
3 MKT 370 SPECIFIC REFERENCE DATA (COMPACT SIZE) DESCRIPTION VALUE Tangent of loss angle: at 1 khz at 10 khz at 100 khz C 0.1 µf 75 x x x µf < C 0.47 µf 75 x x x 10-4 C > 0.47 µf 75 x x Rated voltage pulse slope (du/dt) R at 100 Vdc 250 Vdc 400 Vdc 630 Vdc 37 V/µs 44 V/µs 200 V/µs 540 V/µs R between leads, for C 0.33 µf at 100 V; 1 min > MΩ > MΩ > MΩ > MΩ RC between leads C > 0.33 µf at 100 V; 1 min > 5000 s R between interconnecting leads and case (foil method) > MΩ > MΩ > MΩ > MΩ Withstanding (DC) voltage (cut off current 10 ma); 160 V; 1 min 400 V; 1 min 640 V; 1 min 1008 V; 1 min Withstanding (DC) voltage between leads and case 200 V; 1 min 500 V; 1 min 800 V; 1 min 1260 V; 1 min Maximum application temperature 100 C U Rdc = 63 V; U Rac = 40 V C (µf) DIMENSIONS w x h x l (mm) Note (1) Weight for short lead products only MASS (g) (1) CATALOG NUMBER BFC2 370 YYY AND PACKAGING AMMOPACK LOOSE IN BOX REEL H = 18.5 mm; P 0 = 12.7 mm ± 10 % ± 5 % Short leads ± 10 % ± 5 % Long leads ± 10 % ± 5 % ± 10 % ± 5 % C-VALUE Pitch = 5.08 ± 0.30 mm; d t = 0.50 ± 0.05 mm x 6.5 x (2000) (2000) (2000) (2000) (1000) (1000) (2000) (2000) x 8.0 x (1500) (1500) (2000) (2000) (1000) (1000) (1500) (1500) x 9.0 x (1000) (1000) (2000) (2000) (1000) (1000) (1000) (1000) x 11.0 x (750) (750) (2000) (2000) (1000) (1000) (1000) (1000) 105..YYY Document Number: For technical questions, contact: [email protected] Revision: 08-Dec-08 79
4 MKT 370 U Rdc = 100 V; U Rac = 63 V (standard size) C (µf) DIMENSIONS w x h x l (mm) Note (1) Weight for short lead products only MASS (g) (1) CATALOG NUMBER BFC2 370 YYY AND PACKAGING AMMOPACK LOOSE IN BOX REEL H = 18.5 mm; P 0 = 12.7 mm ± 10 % ± 5 % Short leads ± 10 % ± 5 % Long leads ± 10 % ± 5 % ± 10 % ± 5 % C-VALUE Pitch = 5.08 ± 0.30 mm; d t = 0.50 ± 0.05 mm x 6.5 x (2000) (2000) (2000) (2000) (1000) (1000) (2000) (2000) x 8.0 x (1500) (1500) (2000) (2000) (1000) (1000) (1500) (1500) x 9.0 x (1000) (1000) (2000) (2000) (1000) (1000) (1000) (1000) x 11.0 x (750) (750) (2000) (2000) (1000) (1000) (1000) (1000) 474..YYY For technical questions, contact: [email protected] Document Number: Revision: 08-Dec-08
5 MKT 370 U Rdc = 100 V; U Rac = 40 V (compact size) C (µf) DIMENSIONS w x h x l (mm) Note (1) Weight for short lead products only U Rdc = 250 V; U Rac = 160 V (standard size) Note (1) Weight for short lead products only MASS (g) (1) CATALOG NUMBER BFC2 370 YYY AND PACKAGING AMMOPACK LOOSE IN BOX REEL H = 18.5 mm; P 0 = 12.7 mm Short leads Long leads ± 10 % ± 5 % ± 10 % ± 5 % ± 10 % ± 5 % ± 10 % ± 5 % C-VALUE..YYY Pitch = 5.08 ± 0.30 mm; d t = 0.50 ± 0.05 mm x 8.0 x CB... CC... CE... CF... CH... CI... CL... CM (1500) (1500) (2000) (2000) (1000) (1000) (1500) (1500) CB... CC... CE... CF... CH... CI... CL... CM x 9.0 x (1000) (1000) (2000) (2000) (1000) (1000) (1000) (1000) 474 CB... CC... CE... CF... CH... CI... CL... CM x 11.0 x (750) (750) (2000) (2000) (1000) (1000) (1000) (1000) 564 C (µf) DIMENSIONS w x h x l (mm) MASS (g) (1) CATALOG NUMBER BFC2 370 YYY AND PACKAGING AMMOPACK LOOSE IN BOX REEL H = 18.5 mm; P 0 = 12.7 mm Short leads Long leads ± 10 % ± 5 % ± 10 % ± 5 % ± 10 % ± 5 % ± 10 % ± 5 % C-VALUE..YYY Pitch = 5.08 ± 0.30 mm; d t = 0.50 ± 0.05 mm x 6.5 x (2000) (2000) (2000) (2000) (1000) (1000) (2000) (2000) x 8.0 x (1500) (1500) (2000) (2000) (1000) (1000) (1500) (1500) x 9.0 x (1000) (1000) (2000) (2000) (1000) (1000) (1000) (1000) x 11.0 x (750) (750) (2000) (2000) (1000) (1000) (1000) (1000) 0.04 Document Number: For technical questions, contact: [email protected] Revision: 08-Dec-08 81
6 MKT 370 U Rdc = 250 V; U Rac = 63 V (compact size) C (µf) DIMENSIONS w x h x l (mm) Note (1) Weight for short lead products only U Rdc = 400 V; U Rac = 220 V (standard size) Note (1) Weight for short lead products only MASS (g) (1) CATALOG NUMBER BFC2 370 YYY AND PACKAGING AMMOPACK LOOSE IN BOX REEL H = 18.5 mm; P 0 = 12.7 mm Short leads Long leads ± 10 % ± 5 % ± 10 % ± 5 % ± 10 % ± 5 % ± 10 % ± 5 % C-VALUE..YYY Pitch = 5.08 ± 0.30 mm; d t = 0.50 ± 0.05 mm EB... EC... EE... EF... EH... EI... EL... EM x 6.5 x (2000) (2000) (2000) (2000) (1000) (1000) (2000) (2000) EB... EC... EE... EF... EH... EI... EL... EM x 8.0 x (1500) (1500) (2000) (2000) (1000) (1000) (1500) (1500) x 9.0 x EB... EC... EE... EF... EH... EI... EL... EM (1000) (1000) (2000) (2000) (1000) (1000) (1000) (1000) x 11.0 x EB... EC... EE... EF... EH... EI... EL... EM (750) (750) (2000) (2000) (1000) (1000) (1000) (1000) C (µf) DIMENSIONS w x h x l (mm) MASS (g) (1) CATALOG NUMBER BFC2 370 YYY AND PACKAGING AMMOPACK LOOSE IN BOX REEL H = 18.5 mm; P 0 = 12.7 mm Short leads Long leads ± 10 % ± 5 % ± 10 % ± 5 % ± 10 % ± 5 % ± 10 % ± 5 % C-VALUE..YYY Pitch = 5.08 ± 0.30 mm; d t = 0.50 ± 0.05 mm x 6.5 x (2000) (2000) (2000) (2000) (1000) (1000) (2000) (2000) x 8.0 x (1500) (1500) (2000) (2000) (1000) (1000) (1500) (1500) x 9.0 x (1000) (1000) (2000) (2000) (1000) (1000) (1000) (1000) x 11.0 x (750) (750) (2000) (2000) (1000) (1000) (1000) (1000) For technical questions, contact: [email protected] Document Number: Revision: 08-Dec-08
7 MKT 370 U Rdc = 400 V; U Rac = 160 V (compact size) C (µf) DIMENSIONS w x h x l (mm) Note (1) Weight for short lead products only U Rdc = 630 V; U Rac = 220 V (compact size) Note (1) Weight for short lead products only MASS (g) (1) CATALOG NUMBER BFC2 370 YYY AND PACKAGING AMMOPACK LOOSE IN BOX REEL H = 18.5 mm; P 0 = 12.7 mm Short leads Long leads ± 10 % ± 5 % ± 10 % ± 5 % ± 10 % ± 5 % ± 10 % ± 5 % C-VALUE..YYY Pitch = 5.08 ± 0.30 mm; d t = 0.50 ± 0.05 mm FB... FC... FE... FF... FH... FI... FL... FM x 6.5 x (2000) (2000) (2000) (2000) (1000) (1000) (2000) (2000) FB... FC... FE... FF... FH... FI... FL... FM x 8.0 x (1500) (1500) (2000) (2000) (1000) (1000) (1500) (1500) FB... FC... FE... FF... FH... FI... FL... FM x 9.0 x (1000) (1000) (2000) (2000) (1000) (1000) (1000) (1000) x 11.0 x FB... FC... FE... FF... FH... FI... FL... FM (750) (750) (2000) (2000) (1000) (1000) (1000) (1000) 0.04 C (µf) DIMENSIONS w x h x l (mm) MASS (g) (1) CATALOG NUMBER BFC2 370 YYY AND PACKAGING AMMOPACK LOOSE IN BOX REEL H = 18.5 mm; P 0 = 12.7 mm Short leads Long leads ± 10 % ± 5 % ± 10 % ± 5 % ± 10 % ± 5 % ± 10 % ± 5 % C-VALUE..YYY Pitch = 5.08 ± 0.30 mm; d t = 0.50 ± 0.05 mm x 8.0 x GB... GC... GE... GF... GH... GI... GL... GM (1500) (1500) (2000) (2000) (1000) (1000) (1500) (1500) GB... GC... GE... GF... GH... GI... GL... GM x 9.0 x (1000) (1000) (2000) (2000) (1000) (1000) (1000) (1000) GB... GC... GE... GF... GH... GI... GL... GM x 11.0 x (750) (750) (2000) (2000) (1000) (1000) (1000) (1000) Document Number: For technical questions, contact: [email protected] Revision: 08-Dec-08 83
8 MKT 370 MOUNTING Normal Use The capacitors are designed for mounting on printed-circuit boards. The capacitors packed in bandoliers are designed for mounting in printed-circuit boards by means of automatic insertion machines. For detailed tape specifications refer to packaging information: or end of catalog. Specific Method of Mounting to Withstand Vibration and Shock In order to withstand vibration and shock tests, it must be ensured that stand-off pips are in good contact with the printed-circuit board: For pitches 15 mm capacitors shall be mechanically fixed by the leads For larger pitches the capacitors shall be mounted in the same way and the body clamped Space Requirements On Printed-Circuit Board The maximum length and width of film capacitors is shown in the drawing: Eccentricity as in drawing. The maximum eccentricity is smaller than or equal to the lead diameter of the product concerned. Product height with seating plane as given by IEC as reference: h max. h mm Eccentricity b max. = b mm l max. = l mm Storage Temperature Storage temperature: T stg = - 25 C to + 40 C with RH maximum 80 % without condensation Ratings and Characteristics Reference Conditions Unless otherwise specified, all electrical values apply to an ambient temperature of 23 ± 1 C, an atmospheric pressure of 86 kpa to 106 kpa and a relative humidity of 50 ± 2 %. For reference testing, a conditioning period shall be applied over 96 ± 4 h by heating the products in a circulating air oven at the rated temperature and a relative humidity not exceeding 20 %. For technical questions, contact: [email protected] Document Number: Revision: 08-Dec-08
9 2(%) MKT 370 CHARACTERISTICS Capacitance as a function of frequency (typical curve) Capacitance as a function of temperature (typical curve) C/C 1 6 C/C (%) khz a. 63 V series b. 100 V series c. 250 V series d. 400 V series d 0 0 max. c typical b a min T amb ( C) 100 Max. DC and AC voltage as a function of temperature Impedance as a function of frequency factor Impedance (Ω) 63 V; 100 nf 250 V; 10 nf V; 1 µf T amb ( C) f (Hz) nf 100 nf 220 nf 1000 nf 56 nf T amb = 85 C, 63 Vdc T amb 105 C, 63 Vdc 100 nf 220 nf 1000 nf Document Number: For technical questions, contact: [email protected] Revision: 08-Dec-08 85
10 12 nf 22 nf 12 nf 22 nf 100 nf 220 nf MKT nf 100 nf 330 nf f (Hz) T amb 85 C, 100 VDC nf 100 nf 330 nf 85 C < T amb 105 C, 100 VDC 10 0 Compact size Compact size 100 nf 220 nf T amb 85 C, 100 VDC C < T amb 105 C, 100 VDC nf 10 nf 22 nf 47 nf 100 nf 4.7 nf 10 nf 22 nf 47 nf 100 nf T amb 85 C, 250 VDC C < T amb 105 C, 250 VDC For technical questions, contact: [email protected] Document Number: Revision: 08-Dec-08
11 10 nf 33 nf 10 nf 1.0 nf MKT 370 Compact size Compact size T amb 85 C, 250 Vdc 85 C < T amb 105 C, 250 Vdc nf 2.2 nf 4.7 nf 2.2 nf 4.7 nf 10 nf 33 nf T amb 85 C, 400 Vdc C < T amb 105 C, 400 Vdc 10 0 Compact size Compact size 22 nf 47 nf 100 nf 1.0 nf 2.2 nf 4.7 nf 10 nf T amb 85 C, 400 Vdc C < T amb 105 C, 400 Vdc 10 0 Document Number: For technical questions, contact: [email protected] Revision: 08-Dec-08 87
12 MKT 370 Max. AC voltage as fa unction of frequency 0.68 nf 0.68 nf 2.2 nf 2.2 nf 33 nf T amb 85 C, 630 Vdc 85 C < T amb 100 C, 630 Vdc 33 nf Maximum RMS current (sinewave) as a function of frequency The maximum RMS current is defined by I ac = ω x C x U ac. U ac is the maximum AC voltage depending on the ambient temperature in the curves Max. RMS voltage and AC current as a function of frequency. Dissipation factor (x 10-4 ) Tangent of loss angle as a function of frequency (typical curve) Insulation resistance as a function of the ambient temperature (typical curve) 10 5 RC (s) 10 4 Curve 1: C = 0.33 µf Curve 2: 0.33 µf, C = 1.2 µf Curve 3: 1.2 µf, C = 3.9 µf Curve 4: 3.9 µf, C = 6.8 µf Curve 5: C = 6.8 µf T amb ( C) 100 Maximum allowed component temperature rise (ΔT) as a function of the ambient temperature (T amb ) 16 ΔT ( C) T 100 amb ( C) For technical questions, contact: [email protected] Document Number: Revision: 08-Dec-08
13 MKT 370 HEAT CONDUCTIVITY (G) AS A FUNCTION OF (ORIGINAL) PITCH AND CAPACITOR BODY THICKNESS IN mw/ C W max. (mm) HEAT CONDUCTIVITY (mw/ C) PITCH 5 mm POWER DISSIPATION AND MAXIMUM COMPONENT TEMPERATURE RISE The power dissipation must be limited in order not to exceed the maximum allowed component temperature rise as a function of the free ambient temperature. The power dissipation can be calculated according type detail specification HQN /101: Technical Information Film Capacitors. The component temperature rise (ΔT) can be measured (see section Measuring the component temperature for more details) or calculated by ΔT = P/G: ΔT = Component temperature rise ( C) P = Power dissipation of the component (mw) G = Heat conductivity of the component (mw/ C) MEASURING THE COMPONENT TEMPERATURE A thermocouple must be attached to the capacitor body as in: Thermocouple The temperature is measured in unloaded (T amb ) and maximum loaded condition (T C ). The temperature rise is given by ΔT = T C - T amb. To avoid radiation or convection, the capacitor should be tested in a wind-free box. APPLICATION NOTE AND LIMITING CONDITIONS These capacitors are not suitable for mains applications as across-the-line capacitors without additional protection, as described hereunder. These mains applications are strictly regulated in safety standards and therefore electromagnetic interference suppression capacitors conforming the standards must be used. To select the capacitor for a certain application, the following conditions must be checked: 1. The peak voltage (U P ) shall not be greater than the rated DC voltage (U Rdc ) 2. The peak-to-peak voltage (U P-P ) shall not be greater than 2 2 x U Rac to avoid the ionisation inception level 3. The voltage peak slope (du/dt) shall not exceed the rated voltage pulse slope in an RC-circuit at rated voltage and without ringing. If the pulse voltage is lower than the rated DC voltage, the rated voltage pulse slope may be multiplied by U Rdc and divided by the applied voltage. T For all other pulses following equation must be fulfilled: 2 x du du x dt < U dt Rdc x dt rated 0 T is the pulse duration. 4. The maximum component surface temperature rise must be lower than the limits (see figure max. allowed component temperature rise). 5. Since in circuits used at voltages over 280 V peak-to-peak the risk for an intrinsically active flammability after a capacitor breakdown (short circuit) increases, it is recommended that the power to the component is limited to 100 times the values mentioned in the table: Heat conductivity 6. When using these capacitors as across-the-line capacitor in the input filter for mains applications or as series connected with an impedance to the mains the applicant must guarantee that the following conditions are fulfilled in any case (spikes and surge voltages from the mains included). Document Number: For technical questions, contact: [email protected] Revision: 08-Dec-08 89
14 MKT 370 Voltage Conditions for 6 Above ALLOWED VOLTAGES T amb 85 C 85 C < T amb 100 C Maximum continuous RMS voltage U Rac of temperature CBB952 per See Max. AC voltage as function characteristics Maximum temperature RMS-overvoltage (< 24 h) 1.25 x U Rac U Rac Maximum peak voltage (V O-P ) (< 2 s) 1.6 x U Rdc 1.3 x U Rdc EXAMPLE C = 330 nf - 63 V used for the voltage signal shown in next drawing. U P-P = 40 V; U P = 35 V; T 1 = 100 µs; T 2 = 200 µs The ambient temperature is 35 C Checking conditions: 1. The peak voltage U P = 35 V is lower than 63 Vdc 2. The peak-to-peak voltage 40 V is lower than 2 2 x 40 Vac = 113 U P-P 3. The voltage pulse slope (du/dt) = 40 V/100 µs = 0.4 V/µs This is lower than 60 V/µs (see specific reference data for each version) 4. The dissipated power is 16.2 mw as calculated with fourier terms The temperature rise for W max. = 3.5 mm and pitch = 5 mm will be 16.2 mw/3.0 mw/ C = 5.4 C This is lower than 15 C temperature rise at 35 C, according figure max. allowed component temperature rise 5. Not applicable 6. Not applicable Voltage Signal Voltage U P U P-P T 1 Time T 2 For technical questions, contact: [email protected] Document Number: Revision: 08-Dec-08
15 MKT 370 INSPECTION REQUIREMENTS General Notes: Sub-clause numbers of tests and performance requirements refer to the Sectional Specification, Publication IEC and Specific Reference Data. Group C Inspection Requirements SUB-CLAUSE NUMBER AND TEST CONDITIONS PERFORMANCE REQUIREMENTS SUB-GROUP C1A PART OF SAMPLE OF SUB-GROUP C1 4.1 Dimensions (detail) As specified in chapters MKT 370 General Data of this specification Initial measurements Capacitance Tangent of loss angle: For C 470 nf at 100 khz or for C > 470 nf at 10 khz 4.3 Robustness of terminations Tensile and bending No visible damage 4.4 Resistance to soldering heat Method: 1A Solder bath: 280 C ± 5 C Duration: 10 s 4.14 Component solvent resistance Isopropylalcohol at room temperature Method: 2 Immersion time: 5 ± 0.5 min Recovery time: Min. 1 h, max. 2 h Final measurements Visual examination No visible damage Legible marking Capacitance ΔC/C 2 % of the value measured initially Tangent of loss angle Increase of tan δ for: C 100 nf or for: 100 nf < C 220 nf or for: 220 nf < C 470 nf and for: C > 470 nf Compared to values measured in SUB-GROUP C1B PART OF SAMPLE OF SUB-GROUP C Initial measurements Capacitance Tangent of loss angle: For C 470 nf at 100 khz or for C > 470 nf at 10 khz 4.6 Rapid change of temperature θa = - 55 C θb = C 5 cycles Duration t = 30 min 4.7 Vibration Visual examination Mounting: See section Mounting of this specification Procedure B4 Frequency range: 10 Hz to 55 Hz Amplitude: 0.75 mm or Acceleration 98 m/s² (whichever is less severe) Total duration 6 h No visible damage Final inspection Visual examination No visible damage Document Number: For technical questions, contact: [email protected] Revision: 08-Dec-08 91
16 MKT 370 SUB-CLAUSE NUMBER AND TEST CONDITIONS PERFORMANCE REQUIREMENTS 4.9 Shock Mounting: See section Mounting of this specification Pulse shape: Half sine Acceleration: 490 m/s² Duration of pulse: 11 ms Final measurements Visual examination No visible damage Capacitance ΔC/C 3 % of the value measured in Tangent of loss angle Insulation resistance SUB-GROUP C1 COMBINED SAMPLE OF SPECIMENS OF SUB-GROUPS C1A AND C1B 4.10 Climatic sequence Dry heat Temperature: C Duration: 16 h Damp heat cyclic Test Db, first cycle Cold Temperature: - 55 C Duration: 2 h Damp heat cyclic Test Db, remaining cycles Final measurements Voltage proof = U Rdc for 1 min within 15 min after removal from testchamber Visual examination Capacitance Tangent of loss angle Insulation resistance SUB-GROUP C Damp heat steady state 56 days, 40 C, 90 % to 95 % RH Initial measurements Capacitance Tangent of loss angle at 1 khz Increase of tan δ for: C 220 nf or for: 220 nf < C 470 nf and for: C > 470 nf Compared to values measured in As specified in section Specific Reference Data 370 of this specification No breakdown of flash-over No visible damage Legible marking ΔC/C 5 % of the value measured in or Increase of tan δ for: C 220 nf or for: 220 nf < C 470 nf and for: C > 470 nf Compared to values measured in or % of values specified in section Specific Reference Data 370 of this specification For technical questions, contact: [email protected] Document Number: Revision: 08-Dec-08
17 MKT 370 SUB-CLAUSE NUMBER AND TEST CONDITIONS PERFORMANCE REQUIREMENTS Final measurements Voltage proof = U Rdc for 1 min within 15 min after removal from testchamber Visual examination No breakdown of flash-over No visible damage Legible marking Capacitance ΔC/C 5 % of the value measured in Tangent of loss angle Increase of tan δ Compared to values measured in Insulation resistance 50 % of values specified in section Specific Reference Data 370 of this specification SUB-GROUP C Endurance Duration: 2000 h 1.25 x U Rdc at 85 C 0.8 x 1.25 U Rdc at 100 C Initial measurements Capacitance Tangent of loss angle: For C 470 nf at 100 khz or for C > 470 nf at 10 khz Final measurements Visual examination No visible damage Legible marking Capacitance ΔC/C 5 % compared to values measured in Tangent of loss angle Increase of tan δ for at 85 C for at 100 C for: C 220 nf or for: 220 nf < C 470 nf and for: C > 470 nf Compared to values measured in Insulation resistance 50 % of values specified in section Specific Reference Data 370 of this specification SUB-GROUP C Charge and discharge cycles Charged to U Rdc Discharge resistance: U R = R C 2.5 ( du dt) R Initial measurements Capacitance Tangent of loss angle: For C 470 nf at 100 khz or for C > 470 nf at 10 khz Final measurements Capacitance ΔC/C 3 % compared to values measured in Tangent of loss angle Increase of tan δ for: C 100 nf or for: 100 nf < C 220 nf or for: 220 nf < C 470 nf and for: C > 470 nf Compared to values measured in Insulation resistance 50 % of values specified in section Specific Reference Data 370 of this specification Document Number: For technical questions, contact: [email protected] Revision: 08-Dec-08 93
18 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, Vishay ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: Revision: 18-Jul-08 1
DC Film Capacitors MKT Radial Potted Type
DC Film Capacitors MKT Radial Potted Type FEATURES 15 mm to 27.5 mm lead pitch. Supplied loose in box and taped on reel Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
AC and Pulse Film Foil Capacitors KP Radial Potted Type
AC and Pulse Film Foil Capacitors KP Radial Potted Type 0.5 L max. W max. Marking H max. FEATURES 5 mm lead pitch, supplied loose in box taped in ammopack or reel Material categorization: for definitions
DC Film Capacitors MKT Radial Potted Type
DC Film Capacitors MKT Radial Potted Type MKT80 FEATURES AEC-Q00 qualified (rev. D) for PCM. mm (for larger available components on request) High temperature capabilities, up to 0 C Capacitance up to 60
Interference Suppression Film Capacitors MKP Radial Potted Type
Interference Suppression Film Capacitors MKP Radial Potted Type FEATURES 7.5 mm to 27.5 mm lead pitch Supplied loose in box, taped on reel Material categorization: For definitions of compliance please
Interference Suppression Film Capacitors MKP Radial Potted Type
MKP338 6 Y2 Vishay BCcomponents Interference Suppression Film Capacitors 168x12(halfpage) l P Dimensions in mm Note (1) F - F < 0.3 mm F = 7.5 mm + 0.6 mm/- 0.1 mm APPLICATIONS For standard line bypass
Metallized Polypropylene Film Capacitors DC-Link Capacitor
Metallized Polypropylene Film Capacitors DC-Link Capacitor FEATURES Slim line, low building height Very long useful life time: Up to 100 000 h at U NDC and 70 C High ripple current capability, low ESR,
High Ohmic/High Voltage Metal Glaze Leaded Resistors
High Ohmic/High Voltage FEATURES A metal glazed film is deposited on a high grade ceramic body. After a helical groove has been cut in the resistive layer, tinned electrolytic copper wires are welded to
High Ohmic/High Voltage Metal Film Leaded Resistors
, High Ohmic/High Voltage FEATURES Metal film technology High pulse loading (up to 10 kv) capability Small size (0207/0411) Compatible with lead (Pb)-free and lead containing soldering processes Compliant
AC Line Rated Ceramic Disc Capacitors Class X1, 760 V AC, Class Y1, 500 V AC
AC Line Rated Ceramic Disc Capacitors Class X1, 760 V AC, Class Y1, 500 V AC QUICK REFERENCE DATA DESCRIPTION VALUE Ceramic Class 1 2 Ceramic Dielectric U2J U2J Y5S, Y5U Y5S, Y5U Voltage (V AC ) 500 760
High Ohmic/High Voltage Metal Glaze Leaded Resistors
VR37 High Ohmic/High Voltage FEATURES A metal glazed film is deposited on a high grade ceramic body. After a helical groove has been cut in the resistive layer, tinned electrolytic copper wires are welded
Aluminum Capacitors Solid Axial
SAL-A End of Life. Last Available Purchase Date is -December- Radial higher CV/volume Fig. QUICK REFERENCE DATA DESCRIPTION VALUE Maximum case size (Ø D x L in mm) 6.7 x. to.9 x. Rated capacitance range
Aluminum Electrolytic Capacitors Axial Miniature, Long-Life
Aluminum Electrolytic Capacitors Axial Miniature, Long-Life 38 AML 0 ASM smaller dimensions Fig. QUICK REFERENCE DATA DESCRIPTION Nominal case sizes (Ø D x L in mm) 6.3 x.7 to 0 x 5 VALUE 0 x 30 to x 38
Standard Thick Film Chip Resistors
Standard Thick Film Chip Resistors FEATURES Stability R/R = 1 % for 00 h at 70 C 2 mm pitch packaging option for size Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free
High Ohmic (up to 68 MΩ)/ High Voltage (up to 10 kv) Resistors
High Ohmic (up to 68 MΩ)/ A metal glazed film is deposited on a high grade ceramic body. After a helical groove has been cut in the resistive layer, tinned electrolytic copper wires are welded to the end-caps.
Aluminum Electrolytic Capacitors Radial Miniature, Low Impedance, High Vibration Capability
Aluminum Electrolytic Capacitors Radial Miniature, Low Impedance, High Vibration Capability 048 RML 48 RUS lower longer life 36 RVI miniaturize 50 RMI high vibration FEATURES Very long useful life: 7000
QUICK REFERENCE DATA. Pilkor components FEATURES APPLICATIONS
MKP RADIAL POTTED CAPACITORS Pitch 10.0/15.0/22.5/27.5 mm QUICK REFERENCE DATA Capacitance range (E6 series) * 0.01μF to 3.3μF Capacitance tolerance ±10 %, ±20 % Rated (AC) voltage 50 to 60 Hz 275 V ~
film capacitors QUICK REFERENCE DATA Pilkor components FEATURES APPLICATIONS 10 and 15mm 22.5 and 27.5mm
MKP RADIAL POTTED CAPACITORS Pitch 10.0/15.0/22.5/27.5/37.5mm 10 and 15mm 22.5 and 27.5mm QUICK REFERENCE DATA Capacitance range (E6 series) * Capacitance tolerance Rated (AC) voltage 50 to 60 Hz Climatic
High Ohmic/High Voltage Metal Glaze Leaded Resistors
High Ohmic/High Voltage Metal Glaze Leaded Resistors FEATURES Technology: Metal glaze A metal glazed film is deposited on a high grade ceramic body. After a helical groove has been cut in the resistive
Pulse Proof Thick Film Chip Resistors
Pulse Proof Thick Film Chip Resistors FEATURES High pulse performance, up to kw Stability R/R 1 % for h at 70 C AEC-Q200 qualified Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
Aluminum Electrolytic Capacitors Power Eurodin Printed Wiring
Aluminum Electrolytic Capacitors Power Eurodin Printed Wiring 00/0 PEDPW Fig. QUICK REFERENCE DATA DESCRIPTION VALUE 00 0 Nominal case size (Ø D x L in mm) x 0 to 0 x 00 Rated capacitance range 0 μf to
Aluminum Electrolytic Capacitors Power Economic Printed Wiring
Aluminum Electrolytic Capacitors Power Economic Printed Wiring 0/0 PECPW 00/0 PEDPW Fig. QUICK REFERENCE DATA DESCRIPTION high ripple current 0/0 PECPW long life 0 C Nominal case size (Ø D x L in mm) Rated
High-ohmic/high-voltage resistors
FEATURES High pulse loading capability Small size. APPLICATIONS Where high resistance, high stability and high reliability at high voltage are required High humidity environment White goods Power supplies.
Pulse Proof, High Power Thick Film Chip Resistors
Pulse Proof, High Power Thick Film Chip Resistors STANDARD ELTRICAL SPIFICATIONS MODEL CASE SIZE INCH CASE SIZE METRIC POWER RATING P 70 W LIMITING ELEMENT VOLTAGE U max. AC/DC -HP e3 FTURES Excellent
High-ohmic/high-voltage resistors
FEATURES These resistors meet the safety requirements of: UL1676 (range 510 kω to 11 MΩ) EN60065 BS60065 (U.K.) NFC 92-130 (France) VDE 0860 (Germany) High pulse loading capability Small size. APPLICATIONS
Surface Mount Multilayer Ceramic Chip Capacitor Solutions for High Voltage Applications
Surface Mount Multilayer Ceramic Chip Capacitor Solutions for High Voltage Applications ELECTRICAL SPECIFICATIONS X7R GENERAL SPECIFICATION Note Electrical characteristics at +25 C unless otherwise specified
IR Receiver Module for Light Barrier Systems
Not for New Design - Alternative Available: New TSSP4038 (#82458) www.vishay.com IR Receiver Module for Light Barrier Systems TSOP4038 2 3 MECHANICAL DATA Pinning: = OUT, 2 = GND., 3 = V S 6672 FEATURES
SMD Aluminum Solid Capacitors with Conductive Polymer
SMD Aluminum Solid Capacitors with Conductive Polymer FEATURES New OS-CON series provides improved characteristics with up to 25 C temperature capability and 35 V maximum voltage rating in a SMD package
Power Resistor Thick Film Technology
Power Resistor Thick Film Technology LTO series are the extension of RTO types. We used the direct ceramic mounting design (no metal tab) of our RCH power resistors applied to semiconductor packages. FEATURES
High Surge Axial Cemented Wirewound Resistors
High Surge Axial Cemented Wirewound Resistors FEATURES High voltage surge (up to 12 kv) withstanding capability Non flammable silicon cement coating High grade ceramic core Material categorization: for
50 W Power Resistor, Thick Film Technology, TO-220
50 W Power Resistor, Thick Film Technology, TO-220 FEATURES 50 W at 25 C heatsink mounted Adjusted by sand trimming Leaded or surface mount versions High power to size ratio Non inductive element Material
Electrical Double Layer Energy Storage Capacitors Power and Energy Versions
Electrical Double Layer Energy Storage Capacitors Power and Energy Versions FEATURES Polarized energy storage capacitor with high capacity and energy density Energy version with high stability available
Optocoupler, Phototransistor Output, with Base Connection
Optocoupler, Phototransistor Output, with Base Connection FEATURES i794-4 DESCRIPTION This datasheet presents five families of Vishay industry standard single channel phototransistor couplers. These families
Precision Surface Mount Resistors Wirewound or Metal Film Technologies
Precision Surface Mount Resists irewound Metal Film Technologies FEATURES Accding to CECC 40402-801 (wirewound) ide range of ohmic values (0.04 to 1 M) Low temperature coefficient (± 25 ppm/ C available)
Metal Film Resistors, Industrial, Precision
CMF Industrial Metal Film Resistors, Industrial, Precision FEATURES Small size - conformal coated Flame retardant epoxy coating Controlled temperature coefficient Excellent high frequency characteristics
Optocoupler, Phototransistor Output, with Base Connection
4N25, 4N26, 4N27, 4N28 Optocoupler, Phototransistor Output, FEATURES A 6 B Isolation test voltage 5000 V RMS Interfaces with common logic families C 2 5 C Input-output coupling capacitance < pf NC 3 4
SuperTan Extended (STE) Capacitors, Wet Tantalum Capacitors with Hermetic Seal
SuperTan Extended () Capacitors, Wet Tantalum Capacitors with Hermetic Seal FEATURES SuperTan Extended () represents a major breakthrough in wet tantalum capacitor Available technology. Its unique cathode
Surface Mount Multilayer Ceramic Chip Capacitors for Automotive Applications
Surface Mount Multilayer Ceramic Chip Capacitors for Automotive Applications FEATURES AEC-Q200 qualified with PPAP available Available in 0402 to 1812 body size Three dielectric materials AgPd termination
Silicon NPN Phototransistor
Silicon NPN Phototransistor DESCRIPTION 7 is a silicon NPN phototransistor with high radiant sensitivity in black, T-1¾ plastic package with base terminal and daylight blocking filter. Filter bandwidth
DATA SHEET SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS General Purpose & High Capacitance Class 2, X7R
DATA SHEET SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS General Purpose & High Capacitance Class 2, 6.3 V TO 50 V 100 pf to 22 µf RoHS compliant & Halogen Free Product Specification October 13, 11 V.8 Product
Knob Potentiometer with Switch
Knob Potentiometer with Switch The is a revolutionary concept in panel mounted potentiometers. This unique design consists of a knob driving and incorporating a cermet potentiometer. Only the mounting
High Ohmic / High Voltage Metal Glaze Leaded Resistors
High Ohmic / High Voltage Metal Glaze Leaded Resistors A metal glazed film is deposited on a high grade ceramic body. After a helical groove has been cut in the resistive layer, tinned electrolytic copper
General information. Please refer to our Internet address (http://www.kemet.com) for updated information on KEMET products, services and news.
DC Film Capacitors Please refer to our Internet address (http://www.kemet.com) for updated information on KEMET products, services and news. Contents Pitch Rated Voltage Capacitance Page mm Vdc range range
Optocoupler, Phototransistor Output, Dual Channel, SOIC-8 Package
ILD25T, ILD26T, ILD27T, ILD211T, ILD213T Optocoupler, Phototransistor Output, Dual Channel, SOIC-8 Package i17925 A1 C2 A3 C4 i17918-2 8C 7E 6C 5E DESCRIPTION The ILD25T, ILD26T, ILD27T, ILD211T, and ILD213T
handbook, 2 columns handbook, halfpage 085 CS
FEATURES Polarized aluminium electrolytic capacitors, non-solid, self healing Extended voltage and capacitance range SMD-version, fully moulded, insulated Flexible terminals, reflow and wave solderable
Knob Potentiometer FEATURES. P16NP P16NM Panel Cutout. Thickness nut 2 mm washer 1.5 mm. Panel sealing ring 12 wrench Thread M10 x 0.75 10.2 9.
Knob Potentiometer P6, PA6 FEATURES Test according to CECC 4000 or IEC 60393- P6 - Version for professional and industrial applications (cermet) W at 40 C PA6 - Version for professional audio applications
Small Signal Fast Switching Diode
Small Signal Fast Switching Diode MECHANICAL DATA Case: SOD- Weight: approx.. mg Packaging codes/options: 8/K per " reel (8 mm tape), K/box 08/K per 7" reel (8 mm tape), K/box FEATURES Silicon epitaxial
Schottky Rectifier, 1 A
Schottky Rectifier, 1 A BQPbF FEATURES SMB Cathode Anode Small foot print, surface mountable Low forward voltage drop High frequency operation Available RoHS* COMPLIANT Guard ring for enhanced ruggedness
High Speed Infrared Emitting Diode, 870 nm, GaAlAs Double Hetero
TSFF55 High Speed Infrared Emitting Diode, 87 nm, GaAlAs Double Hetero 26 DESCRIPTION TSFF55 is an infrared, 87 nm emitting diode in GaAlAs double hetero (DH) technology with high radiant power and high
1 Form A Solid State Relay
1 Form A Solid State Relay Vishay Semiconductors DIP i1791- SMD DESCRIPTION Vishay solid state relays (SSRs) are miniature, optically coupled relays with high-voltage MOSFET outputs. The LH1518 relays
Optocoupler, Phototransistor Output, 4 Pin LSOP, Long Creepage Mini-Flat Package
Optocoupler, Phototransistor Output, 4 Pin LSOP, Long Creepage Mini-Flat Package FEATURES A 4 C Low profile package High collector emitter voltage, V CEO = 8 V 7295-6 DESCRIPTION The has a GaAs infrared
IR Sensor Module for Reflective Sensor, Light Barrier, and Fast Proximity Applications
IR Sensor Module for Reflective Sensor, Light Barrier, and Fast Proximity Applications MECHANICAL DATA Pinning: = OUT, 2 = GND, 3 = V S 2 3 6672 APPLICATIONS Reflective sensors for hand dryers, towel or
High Power Infrared Emitting Diode, 940 nm, GaAlAs/GaAs
TSAL64 High Power Infrared Emitting Diode, 94 nm, GaAlAs/GaAs DESCRIPTION 94 8389 TSAL64 is an infrared, 94 nm emitting diode in GaAlAs/GaAs technology with high radiant power molded in a blue-gray plastic
Small Signal Fast Switching Diode FEATURES PART ORDERING CODE INTERNAL CONSTRUCTION TYPE MARKING REMARKS
Small Signal Fast Switching Diode MARKING (example only) Bar = cathode marking XY = type code X Y 6 MECHANICAL DATA Case: SOD- Weight: approx.. mg Packaging codes/options: 8/K per " reel (8 mm tape), K/box
High Performance Schottky Rectifier, 3.0 A
High Performance Schottky Rectifier, 3. A Cathode Anode SMC PRODUCT SUMMARY Package SMC I F(AV) 3. A V R 4 V V F at I F.46 V I RM 3 ma at 25 C T J max. 5 C Diode variation Single die E AS 6. mj FEATURES
Optocoupler, Phototransistor Output, with Base Connection
HA/HA2/HA3/HA4/HA5 FEATURES Interfaces with common logic families Input-output coupling capacitance < pf Industry standard dual-in line 6-pin package A C NC 2 3 6 5 4 B C E Isolation test voltage: 5300
Optocoupler, Phototransistor Output, AC Input
Optocoupler, Phototransistor Output, AC Input DESCRIPTION The SFH62A (DIP) and SFH626 (SMD) feature a high current transfer ratio, low coupling capacitance and high isolation voltage. These couplers have
Schottky Rectifier, 1.0 A
Schottky Rectifier, 1.0 A VS-BQ040-M3 Cathode Anode PRODUCT SUMMARY Package SMB I F(AV) 1.0 A V R 40 V V F at I F 0.38 V I RM 9 ma at 125 C T J max. 150 C Diode variation Single die E AS 3.0 mj FEATURES
Optocoupler, Phototransistor Output, with Base Connection, 300 V BV CEO
SFH64 Optocoupler, Phototransistor Output, with Base Connection, 3 V BV CEO i1794-3 DESCRIPTION The SFH64 is an optocoupler with very high BV CER, a minimum of 3 V. It is intended for telecommunications
ESCC 4001/026 Qualified ( ) High Stability Thick Film Resistor Chips
ESCC 4001/026 Qualified ( ) High Stability Thick Film Resistor Chips thick film chip resistors are specially designed to meet the requirements of the ESA 4001/026 specification. They have undergone the
High Performance Schottky Rectifier, 1 A
High Performance Schottky Rectifier, A VS-MQNPbF Cathode Anode DO-24AC (SMA) PRODUCT SUMMARY Package DO-24AC (SMA) I F(AV) A V R V V F at I F.78 V I RM ma at 25 C T J max. 5 C Diode variation Single die
P6KE6.8A thru P6KE540A. TRANSZORB Transient Voltage Suppressors. Vishay General Semiconductor. www.vishay.com FEATURES PRIMARY CHARACTERISTICS
TRANSZORB Transient Voltage Suppressors DO-204AC (DO-15) PRIMARY CHARACTERISTICS V WM 5.8 V to 459 V V BR uni-directional 6.8 V to 540 V V BR bi-directional 6.8 V to 440 V P PPM 600 W P D 5.0 W I FSM (uni-directional
High Power Infrared Emitting Diode, 940 nm, GaAlAs/GaAs
TSAL51 High Power Infrared Emitting Diode, 94 nm, GaAlAs/GaAs DESCRIPTION 96 1155 TSAL51 is an infrared, 94 nm emitting diode in GaAlAs/GaAs technology with high radiant power, molded in a blue-gray plastic
Optocoupler, Phototransistor Output, High Reliability, 5300 V RMS, Low Input Current
Optocoupler, Phototransistor Output, High Reliability, 53 V RMS, Low Input Current FEATURES A C 1 2 4 3 C E Operating temperature from -55 C to +11 C Good CTR linearity depending on forward current Isolation
High Speed Infrared Emitting Diode, 940 nm, GaAlAs, MQW
High Speed Infrared Emitting Diode, 940 nm, GaAlAs, MQW DESCRIPTION is an infrared, 940 nm side looking emitting diode in GaAlAs multi quantum well (MQW) technology with high radiant power and high speed,
Thick Film Resistor Networks, Dual-In-Line, Molded DIP
Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES Isolated, bussed, and dual terminator schematics available 0.160" (4.06 mm) maximum seated height and rugged, molded case construction Thick
High Performance Schottky Rectifier, 1.0 A
High Performance Schottky Rectifier, 1. A VS-BQ3-M3 Cathode Anode SMB PRODUCT SUMMARY Package SMB I F(AV) 1. A V R 3 V V F at I F.42 V I RM max. 15 ma at 125 C T J max. 15 C Diode variation Single die
Reflective Optical Sensor with Transistor Output
TCRT5000, TCRT5000L Reflective Optical Sensor with Transistor Output FEATURES Package type: leaded Detector type: phototransistor Dimensions (L x W x H in mm): 10.2 x 5.8 x 7 Peak operating distance: 2.5
Axial and Radial Leaded Multilayer Ceramic Capacitors for Automotive Applications Class 1 and Class 2, 50 V DC, 100 V DC and 200 V DC
Axial and Radial Leaded Multilayer Ceramic Capacitors for Automotive Applications Class 1 and Class 2, 5 V DC, 1 V DC and 2 V DC DESIGNING For more than 2 years Vitramon has supported the automotive industry
1 Form A Solid State Relay
Form A Solid State Relay VOAT, VOAABTR FEATURES 9 S S DC S' 3 S' High speed SSR - t on /t off < 8 μs Maximum R ON. Isolation test voltage 3 V RMS Load voltage V Load current A DC configuration DIP- package
TC50 High Precision Power Thin Film chip resistors (RoHS compliant Halogen Free) Size 1206, 0805, 0603
WF2Q, WF08Q, WF06Q ±%, ±0.5%, ±0.25%, ±0.%, ±0.05% TC50 High Precision Power Thin Film chip resistors (RoHS compliant Halogen Free) Size 206, 0805, 0603 *Contents in this sheet are subject to change without
Power Resistor for Mounting onto a Heatsink Thick Film Technology
DIMENSIONS in millimeters Power Resistor for Mounting onto a Heatsink Thick Film Technology FEATURES 800 W at 85 C bottom case temperature Wide resistance range: 0.3 to 900 k E24 series Non inductive Easy
Optocoupler, Phototransistor Output, with Base Connection in SOIC-8 Package
Optocoupler, Phototransistor Output, FEATURES High BV CEO, 70 V Vishay Semiconductors i79002 A K NC NC 2 3 4 8 7 6 5 NC B C E Isolation test voltage, 4000 V RMS Industry standard SOIC-8A surface mountable
Power chip resistor size 2512 PRC221 5%; 2% FEATURES Reduced size of final equipment Low assembly costs Higher component and equipment reliability.
FEATURES Reduced size of final equipment Low assembly costs Higher component and equipment reliability. APPLICATIONS Power supplies Printers Computers Battery chargers Automotive Converters CD-ROM. QUICK
WR12, WR08, WR06, WR04 ±1%, ±5% Thick Film General Purpose Chip Resistors Size 1206, 0805, 0603, 0402
WR12, WR08, WR06, WR04 ±1%, ±5% Thick Film General Purpose Chip Resistors Size 1206, 0805, 0603, 0402 *Contents in this sheet are subject to change without prior notice. Page 1 of 10 ASC_WR_V23 APR.- 2015
Standard Recovery Diodes, (Stud Version), 40 A
Standard Recovery Diodes, (Stud ersion), 40 A S- FEATURES High surge current capability Stud cathode and stud anode version Leaded version available DO-203AB (DO-5) PRODUCT SUMMARY I F(A) 40 A Package
Insulated Precision Wirewound Resistors Axial Leads
Insulated Precision Wirewound Resistors Axial Leads In wirewound precision resistors, the series holds a leading position in professional applications whenever an excellent stability of the ohmic value
MBA/SMA 0204, MBB/SMA 0207, MBE/SMA 0414 - Professional www.vishay.com. Professional Metal Film Leaded Resistors
,, - Professional Professional Metal Film Leaded Resistors DESCRIPTION,, and professional leaded thin film resistors are the general purpose resistor for all fields of professional electronics where reliability
Schottky Rectifier, 1.0 A
Schottky Rectifier, 1.0 A VS-BQ060PbF Vishay High Power Products FEATURES Small foot print, surface mountable Low forward voltage drop SMB Cathode Anode High frequency operation Guard ring for enhanced
2.5 A Output Current IGBT and MOSFET Driver
VO. A Output Current IGBT and MOSFET Driver 9 DESCRIPTION NC A C NC _ The VO consists of a LED optically coupled to an integrated circuit with a power output stage. This optocoupler is ideally suited for
Metal Film Resistors, Industrial, Precision
Metal Film Resistors, Industrial, Precision FEATURES Small size - conformal coated Flame retardant epoxy coating Controlled temperature coefficient Available Excellent high frequency characteristics Exceptionally
WW12X, WW08X, WW06X, WW04X ±1%, ±5% Thick Film Low ohm chip resistors
WW12X, WW08X, WW06X, WW04X ±1%, ±5% Thick Film Low ohm chip resistors Size 1206, 0805, 0603, 0402 *Contents in this sheet are subject to change without prior notice. Page 1 of 8 ASC_WWxxX_V12 Nov.- 2011
Silicon PIN Photodiode
Silicon PIN Photodiode DESCRIPTION 94 8583 BPW34 is a PIN photodiode with high speed and high radiant sensitivity in miniature, flat, top view, clear plastic package. It is sensitive to visible and near
Silicon PIN Photodiode
Silicon PIN Photodiode DESCRIPTION 94 8632 is a PIN photodiode with high speed and high radiant sensitivity in a clear, side view plastic package. It is sensitive to visible and near infrared radiation.
MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision www.vishay.com. Precision Thin Film Chip Resistors
Precision Thin Film Chip Resistors FEATURES Rated dissipation P 70 up to 0.4 W for size 1206 AEC-Q200 qualified Approved to EN 140401-801 Superior temperature cycling robustness Sulfur resistance verified
Thick Film Resistor Networks, Military, MIL-PRF-83401 Qualified, Type RZ010 and RZ020 Dual-In-Line, Molded DIP
MDM (Military M831/1 and /2) Thick Film Resistor Networks, Military, MIL-PRF-831 Qualified, Type RZ1 and RZ2 Dual-In-Line, Molded DIP STANDARD ELECTRICAL SPECIFICATIONS VISHAY DALE MODEL/ PIN NO. MIL STYLE
Dual Common-Cathode Ultrafast Plastic Rectifier
(F,B)6AT thru (F,B)6JT Dual Common-Cathode Ultrafast Plastic Rectifier TO-0AB 6xT PIN PIN 3 PIN CASE 3 TO-63AB ITO-0AB F6xT PIN PIN 3 PIN 3 FEATURES Glass passivated chip junction Ultrafast recovery time
SMD High Power Precision Resistors
Key Features High precision - TCR 5ppm/ C and 10ppm/ C Tolerance down to 0.01% Thin film (nichrome) Choice of packages Stable high frequency performance Temperature range -55 C to +155 C Applications Communications
High Power Infrared Emitting Diode, 940 nm, GaAlAs, MQW
High Power Infrared Emitting Diode, 94 nm, GaAlAs, MQW DESCRIPTION 94 8389 is an infrared, 94 nm emitting diode in GaAlAs multi quantum well (MQW) technology with high radiant power and high speed molded
Optocoupler, Photodarlington Output, Dual Channel, SOIC-8 Package
Optocoupler, Photodarlington Output, i179042 DESCRIPTION A1 C 2 A3 C4 8 C 7E 6C 5E The ILD233T is a high current transfer ratio (CTR) optocoupler. It has a gallium arsenide infrared LED emitter and silicon
Silicon PIN Photodiode
VEMD940F Silicon PIN Photodiode DESCRIPTION VEMD940F is a high speed and high sensitive PIN photodiode in a miniature side looking, surface mount package (SMD) with daylight blocking filter. Filter is
Metal Film Resistors, Non-Magnetic, Industrial, Precision
Metal Film Resistors, Non-Magnetic, Industrial, Precision FEATURES Small size - conformal coated Flame retardant epoxy coating Controlled temperature coefficient Excellent high frequency characteristics
Automotive and Anti-Sulfuration Chip Resistor 0402
The resistors are constructed in a high grade ceramic body (aluminium oxide). Internal metal electrodes are added at each end and connected by a resistive paste that is applied to the top surface of the
Type RP73 Series. SMD High Power Precision Resistors. Key Features. Applications. Characteristics - Electrical - RP73 Series - Standard
Key Features n High precision - tolerances down to 0.05% n Low TCR - down to 5ppm/ C n Stable high frequency performance n Operating temperature -55 C to +155 C n Increased power rating - up to 1.0W n
1.5KE6.8A thru 1.5KE540A, 1N6267A thru 1N6303A. TRANSZORB Transient Voltage Suppressors. Vishay General Semiconductor. www.vishay.
TRANSZORB Transient Voltage Suppressors Case Style.5KE FEATURES Glass passivated chip junction Available in uni-directional and bi-directional 500 W peak pulse power capability with a /0 μs waveform, repetitive
