YAS532B MS-3R Magnetic Field Sensor Type 3R

Transcription

1 MS-3R Magnetic Field Sensor Type 3R Overview The is a 3-axis geomagnetic sensor device with the following circuits integrated on one chip: a buffer amplifier, an AD converter, a clock generator circuit, and a serial data interface circuit (compliant with I 2 C bus interface). The allows a compact electronic compass with high sensitivity and low power consumption in mobile phones or mobile GPS systems. Catalog CATALOG No. LSI-4AS532B

2 Features Features 3-axis magnetic sensors and peripheral circuits integrated on one chip High sensitivity geomagnetic sensors Supports the I 2 C bus interface (100kbps/400kbps, slave mode) Small footprint with the small-sized package Automatic power-down control after the acquisition, and low-power consumption Reduced communication load with a host controller via deferred acquisition and interrupt outputs Package Size Power Supply Operating Temperature Current Consumption Lead-free 6-ball WLCSP (-PZ) 1.46mm 1.46mm Core supply voltage (VDD) 1.7V to 3.6V Digital interface supply voltage (IOVDD) 1.7V to VDD 40 C to +95 C 4mA (VDD=2.6 V, during the acquisition) 32µA (Average consumption in 8Hz) Manufacturing process CMOS+Magnetic Sensor Magnetic Sensor Maximum measurable magnetic field Magnetic field sensitivity (X, Y) Magnetic field sensitivity (Z) Acquisition Time 1200 μt 0.15 μt/count 0.25 μt/count 1 ms (Magnetic sensor acquisition + Temperature acquisition) 4AS532B40 2

3 Pin Assignments Pin Assignments The figure below shows the pin assignment and its description: 2A 2B 2C 1A 1B 1C < 6-pin WLCSP Top View > Pin No. Pin Name I/O Function 1A INT O Interrupt output pin 1B VSS - GND 1C SDA Is/Od Serial data 2A IOVDD - Interface power supply (Typ. 1.8V) 2B SCL Is Serial clock 2C VDD - Core power supply (Typ. 2.6V) Is : Schmitt trigger input Od : Open-drain output O : Output 4AS532B40 3

4 Pin Descriptions Pin Descriptions Power supply pins (VDD, IOVDD, VSS) These are power supply pins: VDD : Core power supply (Typ. 2.6V) IOVDD : Interface power supply (Typ. 1.8V) VSS : GND Interface pins (SCL, SDA, INT) SCL : Serial clock input pin SDA INT Pull up this pin externally. : Serial data input and output pin Pull up this pin externally. : Interrupt output pin. An interrupt signal is sent through this output pin when the acquisition is completed. A high or low level output can be select with the configuration registers. Leave this pin open when not used. 4AS532B40 4

5 Block Diagram Block Diagram Magnetic Sensor 1 Powerdown Control VDD IOVDD Magnetic Sensor 2 Magnetic Sensor 3 Reset Coils Test Coils Temperature Sensor Gain A/D Clock Generator Serial Data Interface (Registers) Power-on Reset INT SCL SDA VSS Block Diagram Magnetic Sensor Three magnetic sensors are on the chip. The supply voltage is supplied only to the sensor corresponding to the axis to be measured. Buffer Amplifier The buffer amplifier, operating only when measuring the magnetic field, amplifies the magnetic sensor output. Temperature Sensor The temperature sensor, operating only when measuring the temperature, can be used to compensate for the temperature characteristics of the sensor. A/D Converter (ADC) The ADC, operating only when measuring the magnetic field, transforms the magnetic sensor output amplified with the buffer amplifier or the temperature sensor output, to the digital form. 4AS532B40 5

6 Block Diagram Clock Generator The clock generator, operating only when measuring the magnetic field or the temperature, supplies clocks to the ADC and the digital circuits. Power-on Reset Circuit The power-on reset circuit detects the ramp-up of the core supply voltage and resets the internal circuit. Reset Coils The Reset coils are used to restore the function of a damaged magnetic sensor because of the high magnetic field received. Generating magnetic field with the reset coils restores the magnetic sensor characteristics. Serial Data Interface The serial data interface is compliant with I 2 C bus interface and operates in slave mode. Data are transferred via the following pins: SCL Serial clock input pin SDA Serial data input and output pin 4AS532B40 6

7 Electrical Characteristics Electrical Characteristics Absolute Maximum Ratings Item Symbol Min. Typ. Max. Unit Core Supply Voltage VDD V Interface Supply Voltage IOVDD V Digital Input Pin Voltage (SCL, SDA) VIND V Storage Temperature Tstg C Maximum Applicable Magnetic Field Hmax 500 mt Recommended Operating Conditions Item Symbol Min. Typ. Max. Unit Core Supply Voltage VDD V Interface Supply Voltage IOVDD VDD V Operating Ambient Temperature Top C Drawn Currents Standby Current (TOP=25 C, SCL=SDA= IOVDD=VDD=3.0V) Standby Current (TOP=95 C, SCL=SDA= IOVDD=VDD=3.0V) Item Min. Typ. Max. Unit 1 μa 10 μa Current drawn from IOVDD during communication 1 μa Current drawn from VDD during magnetic field acquisition * See Note. Current drawn from VDD during temperature acquisition * See Note. 4.0 ma 2.0 ma Current drawn from VDD (Reset coil is ON) 50 ma Note: After the acquisition the device automatically powers down to enter the standby state. 4AS532B40 7

8 Electrical Characteristics Magnetic Sensor Characteristics (Conditions: TOP = 25ºC, VDD = 2.6 V) Item Min. Typ. Max. Unit Maximum Measurable Magnetic Field 1200 μt Magnetic Field Sensitivity (X,Y) 0.15 μt/count Magnetic Field Sensitivity (Z) 0.25 μt/count Sensitivity Axis Deviation ±5 deg Note: Y and Z sensitivities are for Y1-Y2 and Y1+Y2, respectively. And, the sensitivity axis deviation is for the value corrected with CAL register values. For details, see the application manual. Temperature Sensor Characteristics (Conditions: see Recommended Operating Conditions ) Item Min. Typ. Max. Unit Temperature Acquisition Range C Temperature Resolution 0.18 C/count Acquisition Time (Conditions: see Recommended Operating Conditions ) Item Min. Typ. Max. Unit Acquisition Time ms 4AS532B40 8

9 Electrical Characteristics DC Characteristics Serial Data Interface: SCL, SDA (Conditions: see Recommended Operating Conditions ) Item Symbol Min. Max. Unit L level input voltage V IL IOVDD V H level input voltage V IH 0.7 IOVDD IOVDD+0.3 V L level output voltage (sink current 3mA) V OL IOVDD V Input leakage Current at the input voltage of 0.1 IOVDD to 0.9 IOVDD I i -1 1 μa Input Capacitance Ci 10 pf Interrupt Output INT (Conditions: see Recommended Operating Conditions ) Item Symbol Min. Typ. Max. Unit L level output voltage (IOL=1mA) V OL 0.2 IOVDD V H level output voltage (IOH=-1mA) V OH 0.8 IOVDD V 4AS532B40 9

10 Electrical Characteristics AC Characteristics The table below shows the rules on the power supply power-on sequence. (Conditions: see Recommended Operating Conditions ) Item Symbol Min. Max. Unit Power Supply Ramp Up Time TVON 10 ms Time from when all the power supplies are completely powered up till when the I 2 C interface becomes available TDOP 4 ms When applying IOVDD first, and then VDD: Access to the I 2 C bus is not allowed while IOVDD is ramping up to its operating range. Access to the I 2 C bus is not allowed while VDD is ramping up to its operating range. Otherwise, there are no restrictions on the I 2 C bus access. 4AS532B40 10

11 Electrical Characteristics Serial Data Interface: SCL, SDA (Conditions: see Recommended Operating Conditions ) Item Symbol Min. Max. Unit SCL Clock Frequency f SCL khz Hold Time (repeat) Start Condition t HD;STA 0.6 μs SCL Clock L Time t LOW 1.3 μs SCL Clock H Time t HIGH 0.6 μs Setup Time of the repeat start conditions t SU;STA 0.6 μs Data Hold Time t HD;DAT μs Data Setup Time t SU;DAT 0.1 μs SDA and SCL signals rise time (input) t r 300 ns SDA and SCL signals fall time (input) t f 300 ns SDA signal fall time (output) t of C b 250 ns Stop Condition Setup Time t SU;STO 0.6 μs Bus Free Time between stop and start conditions t BUF 1.3 μs SDA and SCL Capacitive Load C b 400 pf C b : Load capacitance for each bus line (pf) t LOW t r t f SCL t f t HIGH t SU;STA t SU;STO t HD;STA t HD;DAT t SU;DAT t HD;STA SDA t BUF Start Repeated Start Stop Serial Data Interface Timing Specification [Notes] serial data interface is compliant to I 2 C bus as far as described in this document. Spike noise with the width of about 50ns can be suppressed. 4AS532B40 11

12 System Configuration Examples System Configuration Examples The figure below shows an example of the application. Leave the INT pin open (N.C.) when not used. Note: For a geomagnetic sensor to deliver its performance, its placement on the board needs to be carefully designed. Contact Yamaha sales staff for details. 1.8V 2.6V GND VDD VSS INT SCL SDA Host CPU (I2C Master) 1.8V IOVDD I2C Device I2C Device Example 1 (INT pin used) 1.8V 2.6V GND VDD VSS INT SCL SDA N.C. Host CPU (I2C Master) 1.8V IOVDD I2C Device I2C Device Example 2 (INT pin not used) 4AS532B40 12

13 Package Information Package Information Caution The product of the WLCSP package should be used under light-shielded conditions. Since the WLCSP package has a structure that a silicon wafer is exposed, if light (such as sunlight) hits the wafer, the device may malfunction (leak current increase etc.) due to electric charge internally generated by the photoelectric effect. 注 ) 1. 表 面 実 装 LSIは 保 管 条 件 および 半 田 付 けについての 特 別 な 配 慮 が 必 要 です 2. 組 立 工 場 により 寸 法 や 形 状 などが 異 なる 場 合 があります 詳 しくはヤマハ 代 理 店 までお 問 い 合 わせください Note: 1. Special attention needs to be paid to the storage conditions and soldering method of the surface mount IC. 2. Dimension, form, etc. may differ depending on assembly plants. For details, please contact your local Yamaha agent. 4AS532B40 13

14 PRECAUTIONS AND INSTRUCTIONS FOR SAFETY WARNING Prohibited Prohibited Prohibited Do not use the device under stresses beyond those listed in Absolute Maximum Ratings. Such stresses may become causes of breakdown, damages, or deterioration, causing explosion or ignition, and this may lead to fire or personal injury. Do not mount the device reversely or improperly and also do not connect a supply voltage in wrong polarity. Otherwise, this may cause current and/or power-consumption to exceed the absolute maximum ratings, causing personal injury due to explosion or ignition as well as causing breakdown, damages, or deterioration. And, do not use the device again that has been improperly mounted and powered once. Do not short between pins. In particular, when different power supply pins, such as between high-voltage and low-voltage pins, are shorted, smoke, fire, or explosion may take place. As to devices capable of generating sound from its speaker outputs, please design with safety of your products and system in mind, such as the consequences of unusual speaker output due to a malfunction or failure. A speaker dissipates heat in a voice-coil by air flow accompanying vibration of a diaphragm. When a DC signal (several Hz or less) is input due to device failure, heat dissipation characteristics degrade rapidly, thereby leading to voice-coil burnout, smoking or ignition of the speaker even if it is used within the rated input value. CAUTION Prohibited Do not use Yamaha products in close proximity to burning materials, combustible substances, or inflammable materials, in order to prevent the spread of the fire caused by Yamaha products, and to prevent the smoke or fire of Yamaha products due to peripheral components. Generally, semiconductor products may malfunction and break down due to aging, degradation, etc. It is the responsibility of the designer to take actions such as safety design of products and the entire system and also fail-safe design according to applications, so as not to cause property damage and/or bodily injury due to malfunction and/or failure of semiconductor products. The built-in DSP may output the maximum amplitude waveform suddenly due to malfunction from disturbances etc. and this may cause damage to headphones, external amplifiers, and human body (the ear). Please pay attention to safety measures for device malfunction and failure both in product and system design. As semiconductor devices are not nonflammable, overcurrent or failure may cause smoke or fire. Therefore, products should be designed with safety in mind such as using overcurrent protection circuits to control the amount of current during operation and to shut off on failure. Products should be designed with fail safe in mind in case of malfunction of the built-in protection circuits. Note that the built-in protection circuits such as overcurrent protection circuit and high-temperature protection circuit do not always protect the internal circuits. In some cases, depending on usage or situations, such protection circuit may not work properly or the device itself may break down before the protection circuit kicks in. Use a robust power supply. The use of an unrobust power supply may lead to malfunctions of the protection circuit, causing device breakdown, personal injury due to explosion, or smoke or fire. Product's housing should be designed with the considerations of short-circuiting between pins of the mounted device due to foreign conductive substances (such as metal pins etc.). Moreover, the housing should be designed with spatter prevention etc. due to explosion or burning. Otherwise, the spattered substance may cause bodily injury. The device may be heated to a high temperature due to internal heat generation during operation. Therefore, please take care not to touch an operating device directly. v02 4AS532B40 14

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