TCM1030, TCM1050 DUAL TRANSIENT-VOLTAGE SUPPRESSORS
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1 Meet or Exceed Bell Standard LSSGR Requirements Externally-Controlled Negative Firing Voltage V Max Accurately Controlled, Wide Negative Firing Voltage Range... V to V Positive Surge Current (see Note ): TCM030 TCM00 0/000 6 A 30 A 0/60 2 A 4 A 2/0 3 A 0 A Negative Surge Current (see Note ): TCM030 TCM00 0/000 6 A 2 A 0/60 2 A 29 A 2/0 3 A 36 A High Holding Current TCM ma Min TCM ma Min V S NC D OR P PACKAGE (TOP VIEW) NC No internal connection The D package is available taped and reeled. Add R suffix (i.e., TCM030DR). description The TCM030 and TCM00 dual transient-voltage suppressors are designed specifically for telephone line card protection against lightning and transients (voltage transients) induced by ac lines. One of the terminals (pin or ) and one of the terminals (pin 4 or ) are connected to the tip and ring circuits of a SLIC (subscriber-line interface circuit). The battery feed connections between the SLIC and the subscriber line are from the remaining (pin or ) and (pin 4 or ) through the TCM030 or the TCM00 to the tip and ring lines. Transients are suppressed between tip and ground, and ring and ground. Positive transients are clamped by diodes D and D2. Negative transients that are more negative than V S cause the SCRs, Q and Q2, to crowbar. The high holding current of the SCRs prevent dc latchup as the transient subsides. The TCM030 and TCM00 are characterized for operation from 40 C to C. NOTE : The notation 0/000 refers to a waveshape having tr = 0 µs and tw = 000 µs ending at 0% of the peak value. The notation 0/60 is tr = 0 µs and tw = 60 µs. The notation 2/0 is tr = 2 µs and tw = 0 µs. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright 99, Texas Instruments Incorporated POST OFFICE BOX 6303 DALLAS, TEXAS 26
2 functional block diagram VS 2 Trip Circuit Trip Circuit Q Q2 D D2 6 4 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) TCM030 nonrepetitive peak surge current (see Note ): 0/ ± 6 A 0/ ±2 A 2/ ±3 A TCM00 nonrepetitive peak positive surge current: 0/ A (see Note ) 0/ A 2/ A TCM00 nonrepetitive peak negative surge current: 0/ A (see Note ) 0/ A 2/ A Nonrepetitive peak surge current, t w = 0 ms, half sinewave (see Note 2) A Continuous 60-Hz sinewave at A s Continuous total power dissipation See Dissipation Rating Table Operating free-air temperature range, T A C to C Storage temperature range, T stg C to 0 C Lead temperature,6 mm (/6 inch) from case for 0 seconds: D or P package C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: The notation 0/000 refers to a waveshape having tr = 0 µs and tw = 000 µs ending at 0% of the peak value. The notation 0/60 is tr = 0 µs and tw = 60 µs. The notation 2/0 is tr = 2 µs and tw = 0 µs. 2. This value applies when the case temperature is at or below C. The surge current may be repeated after the device has returned to thermal equilibrium. PACKAGE DISSIPATION RATING TABLE TA A 2 C OPERATING FACTOR TA A = C POWER RATING ABOVE TA = 2 C POWER RATING D 2 mw. mw/ C 3 mw P 000 mw.0 mw/ C 20 mw 2 POST OFFICE BOX 6303 DALLAS, TEXAS 26
3 electrical characteristics over operating free-air temperature range (unless otherwise noted) VCF VC(R) PARAMETER Forward clamping voltage (diode forward voltage) (see Note 3) Reverse clamping voltage (SCR on-state voltage) (see Note 3) TEST CONDITIONS TCM030 TCM00 MIN TYP MAX MIN TYP MAX IFM = -A transient IFM = 0-A transient IFM = 6-A transient 4 2. IFM = 30-A transient 3. ITM = -A transient ITM = 0-A transient ITM = 6-A transient 4 3 ITM = 30-A transient 4. II(trip) Trip current (see Note 4) VS = 0 V ma IH Holding current VS = 0 V 00 0 ma VS = 0 V, I = trip current 0 0 VI(trip) Trip voltage VS = 6 V, I = trip current V ( ) VS = V, I = trip current 90 II(stby) Coff Standby current and at V or, VS = V UNIT V V ± ± µa Transient overshoot voltage VS = 0 V, tr = 0 ns V Off-state (high impedance) and at 0 V 2 2 capacitance and at 0 0 dv/dt Critical rate of rise of off-state voltage (see Note ) VS open, VS = 0 V kv/µs All typical values are at TA = 2 C. NOTES: 3. The current flows through one (or ) terminal and one of the terminals. The voltage is measured between the other (or ) terminal and the other terminal. Measurement time ms. 4. The negative value of trip current refers to the current flowing out of or on the line side that is sufficient in magnitude to trigger the SCRs. Measurement time ns.. The critical dv/dt is measured using a linear rate of rise with the maximum voltage limited to 0 V with VS connected to or being measured. pf POST OFFICE BOX 6303 DALLAS, TEXAS 26 3
4 TYPICAL CHARACTERISTICS OR CURRENT vs OR TO VOLTAGE VS = 4 V TA = 2 C 0.3 or Current A Tip or Ring to Voltage V Figure APPLICATION INFORMATION The trip voltage represents the most negative level of stress applied to the system. Positive transients are clamped by diodes D and D2. When a negative transient is applied, current flows from V S to or where the transient voltage is applied. When the current through or reaches the pulse-trip current, the SCR turns on and shorts or to. The majority of the transient energy is dissipated in the external resistor (nominally 00 Ω for the TCM030 and 0 Ω for the TCM00). Current into V S ceases when the SCR turns on. When the energy of the transient has been dissipated so that the current into or due to the transient plus the battery feed supply is less than the holding current, the SCR turns off. To help ensure reliability and consistency in the firing voltage, it is recommended that two capacitors be connected between V S and, as close to the device terminals as possible. One capacitor should be a 0.-µF, 00-V ceramic unit and the other, a 0.4-µF, 00-V stacked-film (not wound) metalized plastic capacitor. If inductance is present in the line to V S, these capacitors help prevent overshoot in the firing voltage during fast rise-time transients. To avoid dc latchup after the SCR has fired, the current must be less than the holding current, I H. To prevent dc latchup, the line feed current must be limited to the following conditions: V TP V RP R line 2R p I H where V TP and V RP are the voltages on and, respectively, of the TCM030 or TCM00. Induced ac currents into or (e.g., power-line inductive coupling) must be less than the trip current to prevent the SCR from firing. 4 POST OFFICE BOX 6303 DALLAS, TEXAS 26
5 APPLICATION INFORMATION Line short-circuits to external power sources can damage the suppressor due to excessive power dissipation. Conventional protection techniques, such as fuses or PTC (positive temperature coefficient) thermistors, should be used to eliminate or reduce the fault current. Figure 2 shows a typical line card application circuit. Control Receive Voice Transmit Voice Subscriber Line Interface Circuit (SLIC) VBAT T TP RP R 2 4 VS TCM030, TCM00 6 RP (see Note A) RP (see Note A) 0.4 µf (see Note B) 0. µf (see Note C) 4 V NOTES: A. RP is 00 Ω minimum for TCM030 and 0 Ω minimum for TCM00. B. 0.4 µf, 00 V stacked film metalized plastic capacitor C. 0. µf, 00 V ceramic capacitor Figure 2. Typical Line Card Application Circuit POST OFFICE BOX 6303 DALLAS, TEXAS 26
6 D (R-PDSO-G**) 4 PIN SHOWN MECHANICAL DATA PLASTIC SMALL-OUTLINE PACKAGE (,2) (0,) 0.04 (0,3) 0.00 (0,2) M PINS ** DIM A MAX A MIN 0.9 (,00) 0.9 (4,0) (,) 0.33 (,) (0,00) 0.36 (9,0) 0. (4,00) 0.0 (3,) (6,20) 0.22 (,0) 0.00 (0,20) NOM Gage Plane A 0.00 (0,2) (,2) 0.06 (0,40) Seating Plane (,) MAX 0.00 (0,2) (0,0) (0,0) / D 0/96 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion, not to exceed (0,). D. Falls within JEDEC MS-02 6 POST OFFICE BOX 6303 DALLAS, TEXAS 26
7 P (R-PDIP-T) MECHANICAL DATA PLASTIC DUAL-IN-LINE PACKAGE (0,60) 0.3 (9,02) (6,60) (6,0) (,) MAX (0,) MIN 0.30 (,) (,3) 0.02 (0,3) 0.0 (0,3) (,0) MAX 0.2 (3,) MIN 0.00 (0,2) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-00 Seating Plane 0.00 (2,4) 0 M 0.00 (0,2) NOM / B 03/9 PRODUCT PREVIEW POST OFFICE BOX 6303 DALLAS, TEXAS 26
8 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE ( CRITICAL APPLICATIONS ). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER S RISK. In order to minimize risks associated with the customer s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI s publication of information regarding any third party s products or services does not constitute TI s approval, warranty or endorsement thereof. Copyright 99, Texas Instruments Incorporated
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