PSSB05P. USB 3.0 Interface HDMI 1.4 Gigabit Ethernet esata
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1 ultra LOW CAPACITANCE - super speed bus protection - TVS ARRAY Description The is an ultra low capacitance transient voltage suppressor array, designed to protect super speed bus applications such as USB 3.0, HDMI.4 and esata from the damaging effects of Electrostatic Discharge and Electrical Fast Transients. The meets IEC (ESD) and IEC (EFT) requirements. At higher operating frequencies or faster edge rates, insertion loss and signal integrity are a major concern. This device offers an ultra low capacitance and low leakage current in a miniature DFN--MLP package. DFN--MLP package Features IEC Compatibility IEC (ESD) IEC Compatibility IEC (EFT) IEC Compatibility IEC (Surge) 0 Watts Peak Pulse Power per Line (tp = 8/0µs) ESD Protection Low Clamping Voltage Protects One Bidirectional Line Ultra Low Capacitance: 0.3 pf Typical RoHS Compliant REACH Compliant Mechanical characteristics Molded JEDEC DFN--MLP Package Approximate Weight: milligrams Lead-Free Pure-Tin Plating (Annealed) Solder Reflow Temperature: Pure-Tin - Sn, 00: C 8mm Tape and Reel Per EIA Standard 48 Flammability Rating UL 94V-0 applications USB 3.0 Interface HDMI.4 Gigabit Ethernet esata PIN CONFIGURATION Ra 0/0 Page
2 typical device characteristics MAXIMUM 5 C Unless Otherwise Specified PARAMETER SYMBOL VALUE UNITS Peak Pulse Power (tp = 8/0µs) - See Figure P PP 0 Watts Operating Temperature T A -55 to 50 C Storage Temperature T STG -55 to 50 C PART NUMBER device marking ELECTRICAL CHARACTERISTICS PER 5 C Unless Otherwise Specified RATED STAND-OFF VOLTAGE V WM VOLTS MINIMUM BREAKDOWN ma V (BR) VOLTS MAXIMUM CLAMPING VOLTAGE (Fig. P = A V C volts MAXIMUM LEAKAGE WM I D µa TYPICAL MHz C J pf S Ra 0/0 Page
3 typical device characteristics,000 figure peak pulse power vs pulse time P PP - Peak Pulse Current - Watts W, 8/0µs Waveform ,000 0,000 t d - Pulse Duration - µs I PP - Peak Pulse Current - % of I PP t f figure pulse wave form Peak Value I PP e -t t d = t/(i PP /) TEST WAVEFORM PARAMETERS t f = 8µs t d = 0µs t - Time - µs Ra 0/0 Page 3
4 typical device characteristics figure 3 eye diagram - USB Ra 0/0 Page 4
5 application information D+, D- V DD Rx+, Rx- figure - USB 3.0 Protection GND GND Tx+, Tx- Six devices placed right at the entry point of the connector or at the individual transmission traces. The provides dedicated ESD protection for each super high speed line for the USB interface. PCB traces are not constrained by the protection devices and can be routed in a manner that best suits the design. These devices can also provide protection for USB.0 applications. circuit board recommendations Circuit board layout is critical for electromagnetic compatibility protection. The following guidelines are recommended: The protection device should be placed near the input terminals or connectors, the device will divert the transient current immediately before it can be coupled into the nearby traces. The path length between the TVS device and the protected line should be minimized. All conductive loops including power and ground loops should be minimized. The transient current return path to ground should be kept as short as possible to reduce parasitic inductance. Ground planes should be used whenever possible. For multilayer PCBs, use ground vias Ra 0/0 Page 5
6 DFN--MLP package information dim outline dimensions millimeters inches min max min max A L C L B C A L4 H 0~0.0 0~0.0 0~ ~0.004 L L L3 L L BSC 0.0 BSC BOTTOM VIEW SIDE VIEW NOTEs. Dimensioning and tolerances per ANSI Y4.M, Controlling dimension: inches. 3. Dimensions are exclusive of mold flash and metal burrs. dim pad layout dimensions millimeters inches min max min max C B END VIEW C H A B A C NOTES. Controlling dimension: inches. B Ra 0/0 Page 6
7 TAPE AND REEL T D P P0 0 Pitches Cumulative Tolerance on tape ± 0. E Top Cover Tape K0 A0 B0 F W P User Direction of Feed Reel Dia. Tape Width specifications A0 B0 K0 D E F W P0 P P tmax 78mm (7 ) 8mm 0.70 ± ± ± ± ± ± ± ± ± ± Notes. Dimensions are in millimeters.. Surface mount product is taped and reeled in accordance with EIA Empty pocket between sprocket holes. 4. Suffix - T70 = 7 Reel - 0,000 pieces per 8mm tape. 5. Marking on Part - marking code (see page ). Package outline, pad layout and tape specifications per document number 0609.R0 9/0. ORDERING INFORMATION base PART NUMBER LEADFREE SUFFIX TAPE SUFFIX QTY/REEL REEL SIZE TUBE qty n/a -T70 0,000 7 n/a Ra 0/0 Page 7
8 company information COMPANY PROFILE ProTek Devices, based in Tempe, Arizona USA, is a manufacturer of Transient Voltage Suppression (TVS) products designed specifically for the protection of electronic systems from the effects of lightning, Electrostatic Discharge (ESD), Nuclear Electromagnetic Pulse (NEMP), inductive switching and EMI/RFI. With over 5 years of engineering and manufacturing experience, ProTek designs TVS devices that provide application specific protection solutions for all electronic equipment/systems. ProTek Devices Analog Products Division, also manufactures analog interface, control, RF and power management products. CONTACT US Corporate Headquarters 99 South Fair Lane Tempe, Arizona 858 USA By Telephone General: Sales: Customer Service: By Fax General: By Sales: sales@protekdevices.com Customer Service: service@protekdevices.com Technical Support: support@protekdevices.com Web COPYRIGHT ProTek Devices 00 - This literature is subject to all applicable copyright laws and is not for resale in any manner. SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice. DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice and that the final judgement concerning selection and specifications is the buyer s and that in furnishing engineering and technical assistance. ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ProTek assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability without limitation special, consequential or incidental damages. LIFE SUPPORT POLICY: ProTek Devices products are not authorized for use in life support systems without written consent from the factory Ra 0/0 Page 8
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