AT&S Advanced Packaging ECP

Transcription

1 AT&S Advanced Packaging ECP The Leading Chip Embedding Technology 26/04/ Austria Technologie & Systemtechnik Aktiengesellschaft Fabrksgasse13 A-8700 Leoben Tel +43 (0) Fax +43 (0)

2 Vision No Mobility without ECP We will improve mobility in all segments by providing the best electronic packaging solutions Advanced Packaging BU AP Thorsten Ziegler April 2012

3 Agenda Introduction Thorsten Ziegler ECP technology from AT&S: Thorsten Ziegler Innovation Management and Business intelligence Market view and key applications ECP process and technology requirements Christian Vockenberger Plant tour Christian Vockenberger Advanced Packaging BU AP Thorsten Ziegler April 2012

4 AT&S a Global Electronics Company Manufacturing Procurement Design Sales Austria; China; Korea; India Hong Kong Austria and Germany 16 offices worldwide Leoben-Hinterberg HDI PCB and ECP Klagenfurt Single-sided PWB Fehring Flex and PTH Advanced Packaging Nanjangud, India Volume PTH Shanghai, China High End HDI Ansan, S.Korea Flex and Rigid Flex Advanced Packaging BU AP Thorsten Ziegler April 2012

5 Board of Management AT&S Group Management and Ownership Free float 50,88% Own shares 9,95% Androsch Private foundation 21,51% Dörflinger Private foundation 17,66% Private foundations 39,17 % Dr. Hannes Androsch Chairman of the Supervisory Board DI (FH) Andreas Gerstenmayer Chairman/CEO Mag. Thomas Obendrauf Chief Financial Officer/CFO Ing. Heinz Moitzi Chief Technical Officer

6 History 2011 Acquisition of land and start of construction of plant in Chongqing, China AT&S s seventh manufacturing facility. Extension of capacity in Shanghai by about 30% Relocation of Group Headquarters from Vienna to Leoben-Hinterberg. Ramp-Up Plant II, Nanjangud Ramp-Up of dedicated ECP facility, Hinterberg 2009 Restructuring and reorientation of Leoben plant towards high-value industrial business. Focusing Shanghai on high-end mobile devices segment Move to Vienna Stock Exchange (Prime Market) Start of production in new AT&S plant in Shanghai one of the world s most modern HDI* facilities Establishment of Nörvenich logistics and design centre in Germany AT&S listed on Frankfurt Exchange s Neuer Markt Foundation of AT&S. * High Density Interconnect (laser-drilled printed circuit boards)

7 Financial Figures Q3 2011/12 In EUR '000 CONSOLIDATED INCOME STATEMENT Sept - Dec 2011 Q3 April Dec 2011 YTD Revenues (in EUR 000) 129, ,754 Produced in Asia (in %) Produced in Europe (in %) EBITDA (in EUR 000) 28,215 75,913 EBITDA-Margin (in %) EBIT (in EUR 000) 12,068 31,644 EBIT-Margin (in %) Net income (in EUR 000) 7,896 21,864 Cash Earnings (in EUR 000) 24,051 66,159 figures are based on internal management information and are subject to change 7

8 What is embedding? Embedding uses the space within an organic substrate for active and passive components AT&S ECP - The leading chip embedding technology Typically < 400 embedded connections

9 Highlights of ECP Unique OEM customer benefits regarding miniaturisation (x/y and z), performance, and system integration (ease of use) ECP is AT&S s latest high profile technology launch lead location AT&S Leoben/ Austria ECP is the focus of an EU Funded Industrialisation project (HERMES) Combining significant R&D expertise with beyond state-of-the-art PCB capability Significant capital expenditure Advanced Packaging BU AP Thorsten Ziegler April 2012

10 HERMES Largest EU funded project focussed on INDUSTRIALISATION AT&S consortium leader; 11 partners driving Embedded Component technology Images HERMES consortium

11 Market Outlook - Emerging markets Applications driven through re-invention of the smartphone every year Tablet market created in the last 12 months Mobile gaming market will be created in the next 12 months Longer qualification times for Medical and Automotive but major application fields Ageing Society e-vehicle Green Technology will demand smart metering applications for energy efficient power supply Integrated sensorics is THE major application field across all segments Advanced Packaging BU AP Thorsten Ziegler April 2012

12 ECP Advantages Footprint reduction (Miniaturisation) Integration (BoM simplification) Reliability Performance

13 Different Products System in Board EDC Components in PCB Module Embedded actives ECP System in Package Advanced Packaging BU AP Thorsten Ziegler April 2012

14 Application example System in Board Applications Data storage Memory High speed circuits Key features Integrated design High performance, high impedance lines Benefits Smallest footprint Better performance Shorter conductors Advanced Packaging BU AP Thorsten Ziegler April 2012

15 Application example System in Package Applications Mobile devices Sports equipment Watches Key features New products 3-D package concept Reliability Benefits µsize Integrated module supply chain benefit Advanced Packaging BU AP Thorsten Ziegler April 2012

16 Production Readiness AT&S Advanced Packaging Clean room Class 10K m² Clean room Class 1K 200 m² General Manufacturing m² Dedicated Production Facility Production area 100% ESD protected Advanced Packaging BU AP Thorsten Ziegler April 2012

17 Values Hold our Values close Positivity Spirit of Success Accept challenges Trust and respect Open, honest and direct communication Responsibility Teamwork Commitment Advanced Packaging BU AP Thorsten Ziegler April 2012

18 ECP Marketing Two awards Tens of tradeshows and conferences Hundreds of direct Customer meetings Plus many activities promoting the adoption of embedded component AT&S ECP Website ECP Download area Smartphone Video, Ind + Auto Video ECP Process Flow overview Overview-September pdf HERMES Newsletter major focus on EDA tools Twitter Youtube HERMES Video 3D Laminate Packaging Group

19 Fast Forward Award 2011: Winner Kleine Zeitung vom

20 Events SEMI Beyond 300 mm Grenoble Presentation by Mark Beesley Advantages of panelisation Advantages of PCB processes /26 IMAPS MiNaPAD Grenoble Attendance only NMI 3D Packaging Cambridge Presentation TBD IMAPS International Symposium San Diego Abstract submitted Making New with Old

21 Summing up ECP from AT&S is the leading chip embedding technology Key Benefits - Miniaturization, Performance, better Mechanical Reliability and Integration ECP is in volume production we are Production Ready AT&S is working in a world class supply chain environment (active and passive component suppliers, turnkey suppliers, ) Large number of projects with Industry Leaders, from mobile devices to Industrial and Automotive segments EU Project Hermes drives development, industrialization level and supply chain AT&S is well prepared, and must, serve your customers with reliable ECP Technology

22 Technology

23 What is ECP? AT&S ECP is the leading chip embedding technology Embedding uses the space in a substrate/ PWB for components Advanced Packaging BU AP Thorsten Ziegler April 2012

24 Material & Process difference

25 Why ECP Advanced Packaging BU AP Thorsten Ziegler April 2012

26 Your access to ECP technology: Thorsten Ziegler Head of Sales and Product Management Mobile: Christian Vocky Vockenberger NPI Manager Mobile: Austria Technologie & Systemtechnik Aktiengesellschaft Fabrksgasse13 A-8700 Leoben Tel +43 (0) Fax +43 (0)