DURAMID -E-Cu quality 115 ML

Transcription

1 J B-MV6 DURAMID -E-Cu quality 115 ML Base material with organic reinforcement

2 Basematerial for HDI-Technology DURAMID -E-Cu quality 115 ML Technologies and materials Compact new technologies are required with successive integration on the subassembly level. This no doubt also includes the production of minute holes (micro-vias) and therefore constitutes a major technical challenge for the printed circuit board production industry. Suitable base materials are required if laser or plasma technology is to be used to produce these micro-vias. MCM-L made from DURAMID E-Cu quality 115 ML (laser drilled) Source: Siemens AG ZT-ME6 Base material with organic THERMOUNT * reinforcement is supplied by Isola under the DURAMID -E-Cu quality 115 ML banner and is particularly suitable for use with such techniques. Multilayers produced with this material show extremely uniform and closely toleranced insulating layers. The good dielectric properties make DURAMID -E-Cu quality 115 ML the preferred type of base material for impedance-controlled multilayers. DURAMID -E-Cu quality 115 ML is based on a High-T g -epoxy-resin-system and can be processed with conventional ML technology. This is a particular advantage when DURAMID -E-Cu quality 115 ML is to be used instead of high frequency materials on account of the former's good dielectric properties. * THERMOUNT DuPont registered trade name The material properties are outstandingly complemented by the very low surface roughness due to the use of nonwoven aramide reinforcement, as well as by the low coefficient of thermal expansion in x and y directions. Source: Viasystems Mommers B.V. Laser-drilled blind holes in DURAMID -E-Cu quality 115 ML PCBs

3 Supply forms and storage Prepregs DURAMID -E quality 115 ML Standard Prepregs DURAMID -E quality 115 ML prepregs are available as cut panels according to your specifications and on rolls. Standard roll widths of approx. 965 mm. Other roll widths on request. Laminates DURAMID -E-Cu quality 115 ML is produced in panels according to your specifications. Sheet size: 1225 mm x 925 mm. Other sheets sizes on request. Copper foil Reinforcement material Prepregs THERMOUNT Weight Nominal thickness 1) Resin content Type in pressed condition g/m 2 mm inch % 4.0 N ± ± 5 1) Approximate value to estimate the final thickness of the multilayer. Fluctuations in the insulation thickness are possible. The insulation thickness is affected by the respective copper coating. DURAMID -E-Cu quality 115 ML Standard Laminate constructions Nominal Thickness Thickness tolerances Construction mm inch IPC-4101A cl. B THERMOUNT Substrate thickness ± x 4.0 N710 without copper ± x 4.0 N ± x 4.0 N710 Other thicknesses on request. Typical copper foil thicknesses (18, 35, 70 µm) correspond to IPC-4562, grade 3 (HTE-quality). For laminates with a substrate 0.1 mm VLP foil with HTE properties is used. Storage The prepregs' shelf life of six months at < 5 C or three months at < 20 C and a relative humidity of < 50 % can be extended considerably by cold storage. Care must be taken to avoid condensation when removing the prepregs from the cold store. Approval Underwriters Laboratories Inc. File-No. E41625 Current product information can also be obtained from our website

4 Technical Values DURAMID -E-Cu quality 115 ML Specification Sheet #: IPC-4101A/55 Reinforcement: nonwoven aramid paper Resin system: primary: epoxy secondary: multifunctional epoxy Flame Retardant Mechanism: bromine epoxy resin minimum UL 94 requirement: V-1 Fillers: n/a ID Reference: UL/ANSI: N/A ANSI: 4101/55 Glass Transition (T g ): 150 C C Explanations: C = preconditioning in humidity chamber E = preconditioning at temperature The figures following the letter symbols indicate with the first digit the duration of the preconditioning in hours, with the second digit the preconditioning temperature in C and with the third digit the relative humidity. Properties Units Laminate thickness < 0.50 mm Specification Isola-Value 1. Peel Strength, minimum A. Low profile copper foil and very low profile copper foil all copper weights > 17 µm N/mm n/a* n/a B. Standard profile copper foil (35 µm) 1. After thermal stress N/mm At 125 C N/mm After process solutions N/mm C. All other foil composite N/mm n/a n/a 2. Volume Resistivity, minimum A. C-96/35/90 MΩ cm B. After moisture resistance MΩ cm n/a n/a C. At elevated temperature E-24/125 MΩ cm Surface Resistivity, minimum A. C-96/35/90 MΩ B. After moisture resistance MΩ n/a n/a C. At elevated temperature E-24/125 MΩ Moisture Absorption, maximum % n/a n/a 5. Dielectric Breakdown, minimum kv n/a n/a 6. 1MHz, maximum (Laminate or prepreg as laminated) Loss 1MHz, maximum (Laminate or prepreg as laminated) Flexural Strength, minimum A. Length direction N/mm 2 n/a n/a B. Cross direction N/mm 2 n/a n/a 9. Flexural Elevated Temperature, length direction, minimum N/mm 2 n/a n/a 10. Thermal Stress at 288 C, minimum A. Unetched s B. Etched s Electric Strength, minimum (Laminate or prepreg as laminated) kv/mm Flammability class V-1 V Glass Transition Temperature (T g ) DSC C n/a > Coefficient of Thermal Expansion (CTE) TMA Fill direction (below T g /above T g ) ppm/k 12/4 Warp direction (below T g /above T g ) ppm/k 12/4 Vertical (below T g /above T g ) ppm/k 110/300 *not applicable Our information and our eventual advice for the application of our products in any form (for instance oral, written or by tests) is given carefully and by the best of our knowledge but is not binding and is provided without making any representation or warranty, expressed or implied, and without any liability. The user is not released also in the case of our prior testing or if the use is based on our practical application advice from it s sole responsibility to use our product and to insure the correct application, the condition and fitness of our product for this application as well as the condition and fitness of the product itself.

5 Information for multilayer production with DURAMID -E-Cu quality 115 ML Recommended press parameters temperature ( C) spec. pressure (bar) Base materials with aramide reinforcement absorb due to the greater affinety to the humidity of the carrier material more moisture than those with glass fiber reinforcement. It is therefore advisable to dry the prepregs for at least 24 hours at room temperature over a desiccant or in a vacuum chamber before pressing. The inner layers should be dried at 150 C for minutes. The stack is placed in a press preheated to 60 C and then held in a vacuum < 50 mm Hg for approx. 20 minutes under contact pressure. The press is then heated to 180 C. When the temperature of the middle layer reaches C, the laminating pressure is increased to approx. 35 bar. The temperature of 180 C is maintained for 35 minutes and then increased to 190 C while simultaneously reducing the laminating pressure to 15 bar. After a dwell time of minutes, the press is cooled to less than 60 C while maintaining the pressure (Fig. 1). The parameters for mechanical drilling are illustrated in Figure temperature (specification) pressure (specification) time (min) Fig. 1 Temperature profile Load: 60 C 60 C heat up in 25 min 180 C 180 C hold for 35 min 180 C heat up in 5 min ca. 190 C 190 C hold for 90 min 190 C in 25 min app. 60 C transfer to cooling press Pressure profile Load: 2 bar (Closing force) 2 bar hold for 20 min 2 bar at once 35 bar 35 bar hold for 40 min 35 bar at once 15 bar 15 bar hold for 120 min 15 bar tranfer to cooling press (contact pressure) Drilling parameters for DURAMID laminates feed rate (inch per minute) hole diameter in mil speed (rounds per minute) Fig. 2

6 Isola USA Corp. Isola GmbH, D Isola Laminate Systems (Suzhou) Co. Ltd. MAS Italia S.p.A. Isola Asia Pacific (Philippines) Inc. Isola Werke UK Ltd. Isola Asia Pacific (Taiwan) Inc. Isola Asia Pacific (Hong Kong) Ltd. Isola Asia Pacific (Singapore) Inc. 09/ ASIEN Isola Asia Pacific (Hong Kong) Ltd. Unit , Tower 1, Metroplaza 223 Hing Fong Road, Kwai Chung, N.T., Hong Kong Phone: / Fax: / asia@isola-group.com Internet: EUROPA Isola GmbH Düren Germany Phone: +49 (0) 24 21/ Fax: +49 (0) 24 21/ europe@isola-group.com Internet: USA Isola USA Corp W. Detroit Street, Suite 170 Chandler, AZ 85226, USA Phone: Fax: info@isola-usa.com Internet: