ACAC K Different values possible.
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1 FEATURES Advanced Thin Film Technology Superior Overall Stability Four Resistors per Substrate Green Product, supports Lead (Pb)-free soldering PRODUCT TYPE PACKAGE TOL RESISTANCE FEATURES DESCRIPTION RANGE 70 C ± % Ω Thin Film Chip Resistor Array Surface Mount Professional ACAC K Different values possible. Precision ACAC K Different values possible. Matching & tracking is specified. 8, 10, 16 Terminal 8,10, 16 terminal leadless wraparound package with four TRA06E M or eight elements. The networks features small size Thin Film Automotive Grade Chip Resistor Arrays Sulfur Resistant Excellent stability in critical conditions Zero ohm available in all sizes Surface Mount Small Outline Molded DIP Zero Ohm jumper available Chip Resistor Array for Surface Mount Thick Film Resistance Element with Wraparound Terminations Chip Resistor/ Capacitor Arrays X7R / Y5U Dielectric Thick Film Resistance Elements with Wraparound Terminations for surface mounting ARA04S ARA06E ARA06S ARA12E ARA12S SOGC-16 SOGC-20 SOMC-14 SOMC-16 SOMC-20 CRA06E CRA06S CRA12E CRA04P CRA04S CRA06P CRA08C CRA12S CRCA12E CRCA12S CRCC M FEATURES Rugged Thick Film Materials with Established High Reliability Isolated and commoned Elements together with Terminator Array Configurations are available Standard or Custom Designed Packages can be supplied High Profile, Low Profile and Medium Profile Styles to suit most p.c.b. PRODUCT TYPE PACKAGE TOL RESISTANCE FEATURES DESCRIPTION RANGE 70 C ± % Ω M All Styles: SOGC Only: M 01 Commoned Elements 45 TTL to ECL Transistor M 03 Isolated Elements 46 SCSI-BUS Signal Terminator M 05 Terminator Array M Custom schematics available M M M M M 2 or 4 Nominally Equal Resistors; isolated from all others and wired directly across: Isolated or Bussed in 4, 8, 10 or 16 element package. 2 or 4 Nominally Equal resistors; isolated from all others and wired directly across: Isolated or Bussed in 4, 8,10 or 16 package Cap Range(pF): X7R= ; Y5U= X7R= ; Y5U= X7R= ; Y5U= PRODUCT TYPE PACKAGE TOL ATTENUATION FEATURES DESCRIPTION RANGE 70 C ± % db Surface Mount Chip Resistor Attenuator Frequenct range: DC to 3Ghz CZA04S CZA06S /0.5dB 1-5/ /0.5dB 1-5/6-20 Impedance: 50Ω Impedance: 50, 75, 100, 300, 6900Ω PRODUCT TYPE PACKAGE NUMBER CIRCUIT RESISTANCE STD RESISTOR PINS Ω ± % 70 C Thick Film Single-In-Line Conformally Coated Temperature Coefficient 100ppm/ C [-55 to +125 ) CSCxxA-01 CSCxxA-03 CSCxxA-05 CSCxxB-01 CSCxxB-03 CSCxxB-05 Low (4.95mm) 4-10 Commoned M Low (4.95mm) 4-10 Isolated M Low (4.95mm) 4-10 Terminator See Data Medium (6.35mm) 4-12 Commoned M Medium (6.35mm) 4-12 Isolated M Medium (6.35mm) 4-12 Terminator See data
2 PRODUCT TYPE PACKAGE NUMBER CIRCUIT RES. STD RESISTOR PINS Ω ± % 70 C Thick Film Molded Single-In-Line Temperature Coefficient 100ppm/ C [-55 to +125 ) Thick Film Molded Single-In-Line 01, 03, 05 Schematics MIL-PRF Qualified, Type RZ 100% Screen Tested per Group A, Subgroup 1 of MIL-PRF *available S.I.L. Networks C & G Schematics \MIL-PRF-83401/04-6 pin \MIL-PRF-83401/04-8 pin \MIL-PRF-83401/04-10 pin Cermet Resistor Networks Conformal Coating Low Profile Non Inductive R/2R Ladder Networks DIL 'R' Model has additional pin-outs Standard Profile MIL-PRF-83401/07-6 pin MIL-PRF-83401/08-8 pin MIL-PRF-83401/09-10 pin Low Profile R/2R Ladder Networks SIP, Coated 4 Bits to 8 Bits For D/A and A/D Converter and Bi-polar or CMOS Switches MSPxxA-01 MSPxxA-03 MSPxxA-05 MSPxxC-01 MSPxxC-03 MSPxxC-05 MSMxxA-01 MSMxxA-03 MSMxxA-05 MSMxxC-01 MSMxxC-03 MSMxxC-05 M83401/04C M83401/05C M83401/06C M83401/07C M83401/08C M83401/09C M83401/04G M83401/05G M83401/06G M83401/07G M83401/08G M83401/09G SIL 5-4 SIL 6-3 SIL 6-5 SIL 6-8 SIL 8-4 SIL 8-7 SIL 8-12 SIL 9-8 SIL 10-5 SIL 10-9 SIL T14L10 T16LO8 T16LR8 T06S T07S T08S T09S T10S Low (4.95mm) 6,8,9,10 Commoned M Low (4.95mm) 6,8,10 Isolated M Low (4.95mm) 6,8,9,10 Terminator See Data High (8.89mm) 6,8,10 Commoned M High (8.89mm) 6,8,10 Isolated M High (8.89mm) 6,8,10 Terminator See data Low (4.95mm) 6,8,10 Commoned 10-1M 2(1 & 5)* 0.12 Low (4.95mm) 6,8,10 Isolated 10-1M 2(1 & 5)* 0.12 Low (4.95mm) 6,8,10 Terminator See Data 2(1 & 5)* 0.07 High (8.89mm) 6,8,10 Commoned 10-1M 2(1 & 5)* 0.2 High (8.89mm) 6,8,10 Isolated 10-1M 2(1 & 5)* 0.2 High (8.89mm) 6,8,10 Terminator See Data 2(1 & 5)* 0.07 STD (8.72mm) 6,8,10 Commoned 100-1M 1, 2, Low (4.88mm) 6,8,10 Commoned 27-1M 1, 2, STD (8.72mm) 6,8,10 Isolated 100-1M 1, 2, Low (4.88mm) 6,8,10 Isolated 27-1M 1, 2, SIL 5 Common Point K ± 2% or 2Ω 0.10 SIL 6 Independent Res K ± 2% or 2Ω 0.15 SIL 6 Common Point K ± 2% or 2Ω 0.10 SIL 6 Divider K ± 2% or 2Ω 0.10 SIL 8 Independent Res K ± 2% or 2Ω 0.15 SIL 8 Common Point K ± 2% or 2Ω 0.10 SIL 8 Divider K ± 2% or 2Ω 0.10 SIL 9 Common Point K ± 2% or 2Ω 0.10 SIL 10 Independent Res K ± 2% or 2Ω 0.15 SIL 10 Common Point K ± 2% or 2Ω 0.10 SIL 10 Divider K ± 2% or 2Ω 0.10 DIL 14 R/2R Ladder 25K, 50K, 100K ± 2/± 1LSB 0.50 DIL 16 R/2R Ladder 25K, 50K, 100K ± 2/± 0.5LSB 0.50 DIL 16 R/2R Ladder 25K, 50K, 100K ± 2/± 0.5LSB 0.50 High(8.89mm) 6 R /2R Ladder 5K-100K High(8.89mm) 7 R /2R Ladder 5K-100K High(8.89mm) 8 R /2R Ladder 5K-100K High(8.89mm) 9 R /2R Ladder 5K-100K High(8.89mm) 10 R /2R Ladder 5K-100K
3 PRODUCT TYPE PACKAGE NUMBER CIRCUIT RESISTANCE STD RESISTOR PINS Ω ± % 70 C Molded Dual in LIne Package 4.06mm Seated Height Rugged Case Construction Highly Stable Thick Film Low Temperature Coefficient -55 C to C ± 100PPM MDP14-01 MDP14-03 MDP14-05 MDP16-01 MDP16-03 MDP16-05 DIP 14 Commoned M DIP 14 Isolated M DIP 14 Terminator See Data DIP 16 Commoned M DIP 16 Isolated M DIP 16 Terminator See Data MDP16-45 MDP16-46 DIP 16 TTL-ECL Trans 6x180Ω+270Ω+820Ω DIP 16 SCSI-BUS SIG. Terminator7x330Ω+150Ω+330Ω MIL-PRF Qualified Dual in Line package A & B Schematics M A M B M A M B (2.54mm Pitch x 14 or 16 Isolated 27-1M 1,2, mm Row Spacing) 14 or 16 Commoned 27-1M 1,2, (2.54mm Pitch x 14 or 16 Isolated 27-1M 1,2, mm Row Spacing) 14 or 16 Commoned 27-1M 1,2, Dual In Line Package MIL-PRF Type RZ 14 or 16 Pins *available. MDM14-01 MDM14-03 MDM14-05 MDM16-01 MDM16-03 MDM16-05 DIP 14 Commoned 10-1M 2 (1 & 5)* DIP 14 Isolated 10-1M 2 (1 & 5)* DIP 14 Terminator See Data 2 (1 & 5)* DIP 16 Commoned 10-1M 2 (1 & 5)* DIP 16 Isolated 10-1M 2 (1 & 5)* DIP 16 Terminator See Data 2 (1 & 5)* Flat Pack Thick Film Network DFP Commercial and DFM MIL Style *Power 25 C **available TC 100ppm/ C MIL-PRF Qualified TYPE RZ DFP14-11 DFP14-12 DFP16-11 DFP16-12 DFM14-11 DFM14-12 DFM14-15 DIP 14 Isolated 10-1M * DIP 14 Commoned 10-1M * DIP 16 Isolated 10-1M * DIP 16 Commoned 10-1M * DIP 14 Isolated 10-1M 2 (1 & 5)** DIP 14 Commoned 10-1M 2 (1 & 5)** DIP 14 Terminator See Data 2 (1 & 5)** Custom Networks DIPS, Molded SIPS Coated SIPS SIPS-Coated SIPS-Molded DIPS Unlimited Schematics available Design through Production Thick Film Resistive Element Resistance Range 1-20MΩ Fast Turnaround Time High Temperature Solder Joints Temperature Coefficient ±50ppm High Density Designs 2-Sided printing and through holes Ratio Matching ±0.5% available -to MIL-PRF Ultra-high precision laser trimming Custom Resistor, Capacitor, Diode and Inductor Network combinations. Quads, Surface Mount R / RC / RCD R Quad R/C Quads Unlimited Schematics available Design through Production Resistance Range 10-10MΩ NPO or X7R dielectric 0805 to 1210 Sizes Temperature Coefficient ±100ppm High Density Designs 2-Sided printing and through holes Surface Mount "J" leads or Gull Wing leads - 65
4 PRODUCT TYPE PACKAGE NUMBER CIRCUIT RES. STD RESISTOR PINS (Ω) ± % 70 C Resistor/Capacitor Networks - SIL Capacitors NPO and X7R Capacitance Range:33pF-0.1µF Res/Cap Networks - Molded SIP Capacitors NPO and X7R Capacitance Range:33pF-0.1µF TRCxx01 TRCxx02 TRCxx09 MRCN-08 MRCN-10 High (8.89mm) 6-12 Commoned R / C 50-1K R=2-5, C= VDC High (8.89mm) 6-12 Isolated R / C 50-1K R=2-5, C= VDC High (8.89mm) 6-12 Isolated R / C 50-1K R=2-5, C= VDC High profile SIP 8 Commoned R / C Capacitance Range:10, 20 50VDC High profile SIP 10 Isolated R / C NPO=33pF-3900pF 10, 20 50VDC or Line Terminator R /C X7R= 470pF- 0.1µF Resistor/Capacitor Networks Single in LIne ECL Terminators and Line Terminator, Conformal Coated CS206XXXA CS206XXBE CS206XXBM SIP 10 2 Caps./6 Res. SIP Cap., Pin 1. SIP Cap., Pin N. All Styles : Resistor Dissipation 70 C COG = 33pF-3900pF ±10% or X&R = 470pF-0.1µF ±20% CS206XXCT SIP 4-18 Series R/C pairs Pins 2-N Dual In Line Package Molded Resistor/Capacitor Networks Power Rating at 25 C MDRC-1641 MDRC-1642 MDRC-1643 DIP 16 ECL Terminator or 2Ω 0.15 DIP 16 ECL Pull-Down or 2Ω 0.15 DIP 16 Thevenin Eq. Term See Data 2 or 2Ω 0.20 Capacitor Networks Single-In-Line "D" Profile ECL and Line Terminator Schematics CS201XXD1 CS201XXD3 CS201XXD4 SIP 4-18 Common Bus 1 Gd Leads SIP 4-18 Isolated Capacitor Sec. SIP 4-18 Common Bus 2 Gd Leads All Styles: COG = 33pF-3900pF ±10% or X&R = 470pF-0.1µF ±20% Capacitor Networks SIP Coated 50V NPO or X7R dielectric for Line Terminator 01, 02 or 09 Schematics TCN-06 TCN-07 TCN-08 TCN-09 TCN-10 TCN-11 TCN-12 High 6 Capacitance 10,20 na High 7 Ranges: 10,20 High 8 NPO = 10,20 High 9 commoned 33pF-3900pF 10,20 High 10 Isolated 10,20 High 11 or line terminator X7R = 10,20 High pF-0.1µF 10,20 Capacitor Networks Moulded SIP 50V - NPO or X7R dielectric for Line Terminator 01, 02 or 09 Schematics MCN-05 MCN-08 MCN-09 MCN-10 High 05 Commoned, Cap. Range: 10, 20 na High 08 Isolated NPO=33pF-3900pF 10, 20 na High 09 or Line X7R=470pF-0.1µF 10, 20 na High 10 Terminator 10, 20 na 66
5 Product Design Capabilities Multicomps, Custom Networks and Screened Substrates Custom MULTIPLE COMPONENT MODULES (MULTICOMPS) CUSTOM NETWORKS AND SCREENED SUBSTRATES APPLICATIONS Reduce Component Count Simplify Board Layout Reduce Cross Talk Filtering Enhance Motherboard Performance has the extensive technical capability you need for your custom design requirements. Since all custom products are unique and actual performance may vary, some examples are given on the next page. When you are ready to submit your custom design for us to review, please call or fax us; or contact your local Dale representative. Document Number Revision 14-Aug-03 67
6 Custom SCHEMATICS Product Design Capabilities Multicomps, Custom Networks and Screened Substrates MULTIPLE COMPONENT MODULES (MULTICOMPS) CUSTOM NETWORKS SCREENED SUBSTRATES FEATURES AND TYPICAL SPECIFICATIONS* Thick Film Materials: Pd/Ag conductors, Ruthenium based cermet resistors, glass glazes, multilayer dielectric systems, polymer protective coating. Thick Film Printing Techniques: Multi-layer printing, throughhole metallization, crossovers, double-sided designs. Substrate Material: 96% alumina. Substrate Thickness:.025" [.635mm],.030" [.762mm],.045" [1.143mm]. Thicker substrates for higher power applications available. SMT Devices: Inductors, diodes, thermistors, transistors, thin film resistors, integrated circuits. SMT Capacitors: Ceramic: X7R, COG. Capacitance = 10pF to 0.1µF ± 10% tolerance. Tantalum: Capacitance =.1µF to 100µF ± 10% tolerance. Package Configurations: SIP: 4-22 pins. Missing pins available. Maximum length, 2.2" [55.88mm]. Maximum height, 1.0" [25.4mm]. Lead length, 0.185" [4.699mm] maximum. Lead Spacing:.100" [2.54mm], SIP..050" [1.27mm], SMT. Encapsulation Method: Conformal resin. Screened silicon insulator. * Consult factory for possible exceptions to listed specifications. 68 ELECTRICAL SPECIFICATIONS - RESISTORS Resistance Range: 10 ohm to 5 Megohm, standard. < 10 ohm, consult factory. Tolerance: 100 ohm to 1 Megohm: ± 1%, ± 2%. < 100 ohm: ± 2% or ± 1 ohm. > 1 Megohm: ± 5%, standard. Specials: Consult factory. Ratios: ± 0.5%, ± 1%. Specials: Consult factory. Temperature Coefficient (absolute): ± 200PPM/ C, standard. ± 100PPM/ C, special. TCR Tracking: ± 50PPM/ C (like values) and ± 100PPM/ C (mixed values). Operating Temperature: - 55 C to C, standard C to C (consult factory). ELECTRICAL SPECIFICATIONS - SCREENED CAPACITORS Capacitance: 33pF to 270pF. Other values, consult factory. Tolerance: ± 30%, standard. ± 20%, consult factory. Temperature Coefficient: ± 15%, standard. Dielectric Breakdown Voltage: 2.5 X rated 5 seconds, standard. Rated Voltage: 25 volts maximum, standard. Operating Temperature: 0 C to + 70 C, standard. Document Number Revision 14-Aug-03
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