The Complete ERSA Line. Professional Solutions for State-of-the-Art Electronics Production

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1 Subject to change by ERSA The Complete ERSA Line. Professional Solutions for State-of-the-Art Electronics Production Selective soldering BGA & SMD inspection Wave soldering Hand soldering Over 70 ERSA agencies are located in more than 65 countries. Reflow soldering Process software Headquarters ERSA GmbH Leonhard-Karl-Str Wertheim / Germany Phone: ++49 (0) 9342 / Fax: ++49 (0) 9342 / info@ersa.de America ERSA Inc. Pilgrim Road 1779 Plymouth, WI USA Phone: Fax: info@ersainc.com Lead-free soldering, inspection or rework: ERSA solutions for a safe process. Ask for the latest issue of the ERSA multimedia Demo CD, version 5.0! Asia ERSA Asia Pacific Suite 3505, 35/F., China Resources Building 26 Harbour Road, Wan Chai Hong Kong Tel.: / Fax: / kurtz@kfe.com.hk Award Winning Lead-Free Rework Solutions Room 601, Beethoven Plaza 1158 Chang Ning Road Shanghai China Tel.: ++86 (21) Fax: ++86 (21) kurtz@kurtz.com.cn ERSA GmbH For further information, accessories and auxiliaries please refer to our website or contact ERSA directly. Industrial Technology Companies Complete Lead-Free Soldering & Inspection Solutions

2 SMT Vision Award, Best New Rework Product, Apex, USA, 2002 The Award Winning, Patented Originals! Lead-Free BGA Rework Solutions from Europe s Largest Supplier of Soldering Systems. Best Product in Show, Component & Electronic Prod. 2000, Sweden EP&P Excellence Award and EP&P Grand Award, Nepcon West, USA, 2000 ERSA has been committed to innovation in the soldering industry since it pioneered the first patented electric soldering iron for production use in Today, the eagle justly represents the clear vision, determination and agility with which ERSA looks to provide complete soldering solutions never before imagined. The patented ERSASCOPE was the first visual BGA inspection system which, after 20 years of BGA production, finally made clear inspection of the soldering joints beneath a BGA a reality! Under the motto, To See is to Survive, this revolutionary technology not only won all of the industry s most significant innovation awards around the globe, but also allowed previously undetected problems to be discovered, analyzed and corrected at over 2,000 of the world s leading manufacturers. More than 4 years earlier, ERSA introduced the first low cost BGA rework station to the market, the patented IR 500 A. Utilizing the market feedback from more than 3,500 IR 500 users worldwide, ERSA s next generation of IR rework systems has succeeded in creating the world s first truly closed-loop reflow system. Presented at the APEX 2002 exhibition in January, the IR 550 / PL 550 was awarded the SMT Vision Award for the Best New Rework Product. ERSA s ongoing commitment is adding value to our customers lead free operation. This catalogue will introduce complete lead free rework solutions designed for process optimization; increasing quality, increasing production and decreasing operational costs are the measurable results! ERSA IR Rework Systems with unique Closed-Loop process optimization SMT Vision Award, APEX, Inspection Category, USA, 2000 Dr.-Rudolf Eberle Innovation Award, Germany, 1999 Most Innovative Product - ELENEX, Australia,

3 ERSA Closed Loop Process Optimization with the IR 550 A Rework System INPUT CSP BGA Processing of all SMT components 1 CBGA 2 OUTPUT 5 3 MIC IRS W 800 W Select the optimal process profile from the data specifications of the paste and/or component supplier The patented, non-contact IRS temperature sensor measures the real time temperature of the component and the solder joint during the reflow process Microprocessor uses the IRS sensor info to drive the 1600W heating system to take PCB and component exactly along the prescribed curve. Autopilot drives the perfect profile every time! The RPC camera allows precise calibration of the IRS and supplies high resolution process images during the reflow Consistent quality of process results 5 The IRSoft temperature and process profile software documents every aspect of the reflow process for guaranteed reproducibility of ideal soldering results Alternative technologies, such as medium wavelength IR can offer a True Closed Loop Selective Reflow Process. Uniform heat distribution can be achieved with this safe technology. The IR 550A can conduct low temperature LF rework with perfect gradients, and without the use of nozzles or N 2! Cycle times can be cut in half be using a linear profile! Profiling individual boards is no longer a requirement! The ERSA IR550 rework system provides not only the advantages of true Reflow Process Control using zoom camera technology, but also allows for the use of the patented IRS non-contact Infrared Temperature Sensing which measures the temperature of the component during the reflow process. The microprocessor uses this information to drive the heating system. The result is a perfect profile every time! The bottom line is, that implementing low temperature, medium wavelength IR selective reflow as an alternative approach to hot air rework for LF applications can save the tremendous costs of N 2, the costs of nozzles, the costs of rework failures, and the costs of decreased productivity. 4 5

4 The ERSA IR Selective Reflow Line: Meeting the Demands of a Tougher Lead Free Reflow Process! As Lead Free soldering is more demanding and the DPM rates increase, rework costs, quality and efficiency will play a more critical role in the lead free future! Smaller LF Process Windows: When LF is implemented, the minimum temperature required to form an intermetallic compound increases to C. Essentially, this represents a C increase to the overall process temperature when compared with today s standard, lead containing solders. Given the fact that the maximum allowable processing temperatures for most SMD components are between 250 C to 260 C, reflow and rework machines will have a very narrow operating window, and they will be working dangerously close to the component s and PCB material limits. Rework soldering process concerns for LF: Maximum allowable component temperatures not to exceed 260 C and thermal gradients - heating gradient: eg. 1-4 C/sec.; cooling gradient: 4-8 C+/sec. Flux specifications; soak conditions; wetting behaviour of component and pad Laminate temperatures (T g ) and PCB warpage Minmum ΔT and ability to work within specified process window Forced Control of Heat Transfer (IR) versus Forced Convection (Hot Air): LF selective reflow will require the best temperature control, the lowest ΔT and the highest coefficient of heat transfer! This can only be achieved via Forced Control of Heat Transfer: an improved control of the heating medium which guarantees uniform heat distribution across the SMD and low temperature selective reflow!. Recognizing, however, that forced convection in an enclosed reflow oven is completely different and more difficult to control than in an open hot air rework nozzle, ERSA engineers decided upon medium wavelength IR as the technology of choice for Forced Control of Heat Transfer in a selective reflow or rework environment. The heat distribution tests, also know as burn pattern tests below show the difference in ΔT across a BGA 225 package. Higher process temperatures & smaller process windows require better temperature control and a smaller ΔT for LF selective reflow or rework! The closed loop IR system guarantees uniform heating, minimal ΔT across the BGA, an optimal heating gradient, a low temperature LF peak, an optimal cooling gradient, and the fastest total cycle time! Minimal ΔT across BGA package with ERSA IR Minimal ΔT Unacceptable ΔT across BGA package with hot air rework nozzle Unacceptable ΔT 6 7

5 ERSA IR 550 A Rework System: Revolutionary BGA/SMT Reflow Technology Closed loop temperature control Non-contact temperature recording of the component, thermocouple optional Upper and lower IR emitters each with 800 W output Tight process window for Lead Free soldering Real time display of desoldering with ERSA IR 550 A, IR Soft and ID View Complete process documentation at the PC with IRSoft adjustable and patented aperture system of the upper IR emitter protects sensitive components against adjacent heating. No rework nozzles are required! ERSA dark IR technology (wavelength range 2-8 µm) requires no nozzles and thus provides a clear view of the component during the entire soldering process. ERSA uses this open environment advantage in its patented procedure for calibrating the measured temperature with SMT Vision Award: Best New Product, Rework Category, Apex, USA, 2002 The award winning IR 550 A rework system is the world s first and only rework system with a true closed loop control system for the component temperature during reflow. The IR 550 A has a patented, non-contact infrared sensor (IRS) for precisely recording the component and PCB temperature non-destructively and reproducibly, for optimal control of the soldering process during rework. The IR 550 A offers the professional user 1,600 W of heating power for all applications, small and large, to include lead free! Due to the increase in temperature range and the tight process window required for lead free soldering, controlling the T across the entire PCB and across the complete area array package will be the ultimate challenge for a reflow system. The 1600W IR Closed-loop reflow technology guarantees a perfect process window, uniform heat distribution and proper peak temperature for high reliability lead free solder joints! The newly designed and more powerful infrared emitters of the IR 550 A represent ERSA s continuing development of medium wavelength, dark IR technology. Multilayer PCBs with heavy mass components and other applications with high heat requirements e.g. lead free, can be easily processed. With uniform and safe heating, the system has the necessary power and flexibility to easily handle even several components within a single process (multi-component processes). The manually the visua ly registered melting point of the solder at the press of a button. The use of a Reflow Process Camera (RPC) such as RPC 500 A, RPC 550 A or PL 550 A, provides the crucial visual information on the exact time of solder melt. Following the process, the integrated fan cools down the components as pre-selected. Use IRSoft (standard with system) for complete process documentation according to DIN ISO 9001 and unique process reproducibility. IRSoft allows twin channel temperature recording when the optional Ni-Cr-Ni thermocouple is connected. The software controls important functions of the unit, thereby enhancing the efficient utilization of this innovative system. Ordering information 0IR550A Microprocessor controlled Rework System (including ERSA IRSoft and Soldering Station; without X-Y PCB table) 0IR X-Y PCB Table (not applicable with PL or RPC 550 A) 0IR K-type thermocouple & attachment kit (optional) 0IR Cooling fan for PCBs (recommended option; not req. for RPC 550A) 8 9

6 ERSA PL 550 A: Precision Placement System with Reflow Process Camera The ERSA PL 550 A placement system is a precision placement system for positioning all types of fine pitch BGA/SMT components in sizes from 1 mm x 1 mm to 40 mm x 40 mm. The integrated high resolution PAL CCD motorized zoom camera (up to 80X, with 2 fixed positions) makes precise alignment of the components by means of two superimposed images extremely simple. The images can be brought into alignment through X / Y and rotational fine adjustments. To reduce operator eye strain, the illumination of the component leads and the PCB surface pads are separately controllable and use differently colored LED light sources to ensure clear contrasts. The placement results of the PL 550 A are as accurate as those of in-line automatic systems. The motor-driven Z-axis, the automatically operating pick & place mechanism and the precision PCB table ensure efficient and reliable placement with a placement accuracy of up to ± 1 µm possible, ± 10 µm guaranteed! The split optic cassette is available for applications with larger externally leaded fine-pitch components. Combined with an ERSA IR 500 A or IR 550 A Rework System, the PL 550 A becomes the complete rework solution for the highest standards. Directly following placement, the assembly is precisely moved, without any vibration, to the center of the reflow system for installation. The PL 550 A system also includes a Reflow Process Camera. The innovative technology of the RPC 550 A is immediately available on request, or it can be added to the system later as an upgrade. Direct viewing of the solder joint formation allows the user to optimize the process parameters of the IR system for high-quality soldering results. All camera functions and the motorized placement head are Ordering information 0PL550A 0PL550AU 0VSRPC-UKIT 0PL500A-SPC 0VSID100 0IR Placement accuracy <± 10µm Automatic operating pick & place mechanism (1.5 N attach force) Separately variable colored LED light sources Ergonomic adjustment of important system functions by means of an external mousepad Reflow Process Camera with variable LED ring light and automatic operation conveniently operated with the PL 550 A by means of an external mousepad. The system can be connected to a PC using ERSA IDView or ImageDoc EXP software, or to commercially available video monitors with multisync capability. Precision Placement System with Reflow Process Camera Precision Placement System, retrofitable with Reflow Process Camera (0VSRPC-UKIT) Reflow Process Camera Retrofit Kit for Precision Placement System 0PL550AU Split Optic Cassette (recommended option) ERSA IDView software and Falcon Framegrabber (recommended option) Cooling fan Functional principle of the optional Split Optic Cassette Optional Split Optic Cassette for large, fine pitch QFP components 10 11

7 ERSA IRSoft: Unparalleled Process Documentation for Rework Online process recording of a soldering process with IRSoft and the IR 550 A Rework System Automatic report generation with IRSoft - all process data neatly arranged and available at a single glance! Simultaneous visualization of the reflow process and temperature profile with IRSoft and IDView Continuous display of the operating status of the IR 550 A in the IRSoft status window IR Soft - convenient Wizards for the easiest possible handling With ERSA IRSoft, the complete rework soldering process can be completely documented for the first time! The IRSoft perfectly complements the IR 550 A Rework System s technical features. IRSoft marks a milestone in quality assurance - the basis for the unparalleled reproducibility of rework soldering operations. The user friendly software package allows for easy handling of all process parameters during a rework process. All system process data of a given profile are recorded and stored together with the actual temperature curve. A variety of design options allows for quick adaptation of IRSoft to the user s specific requirements. An online Wizard guides the operator to the user mask, where application-related information can be entered in IRSoft. Pre-selected soldering and de-soldering profiles are available in the profile table for the process control. These profiles can be downloaded from the software to the IR 550 A. Parameter sets are uploaded from the IR 550 A or from an existing file and saved for future use. Both the downloading and uploading are supported by a Wizard, which smoothly guides the user through the individual steps. ERSA IRSoft allows for password-controlled access to the IR 550 rework system. Operating status of the unit and error messages are displayed in the status window. The IRS calibration function as well as many The visual process documentation (i.e. AVI other system settings of the IR 550 A can be movie file) can occur in parallel by using conveniently changed using IRSoft. All data ERSA IDView. of the soldering process, the pre-selected IRSoft provides an analysis function for the profile, the actual time-temperature curves subsequent evaluation of the recorded process data, e.g. automatic ramp and cooling and all operating states are saved in a single file. The documented process data are rate analysis. In addition, the export function makes available all the data processing outputted as a detailed report in the form of a clearly arranged printout. options of Microsoft Excel. Online IR 550 A status display Graphs of temperature profiles and operating states Freely programmable process parameters with uploading and downloading functions Complete process documentation and analysis tools Remote control of important system functions Ordering information IRSoft is included with delivery of the IR 550 A 12 13

8 ERSA RPC 550 A Reflow Process Camera: Seeing is Believing! ERSA RPC 500 A Reflow Process Camera: Lowest Cost, Highest Quality True Process Control! PBGA reflow process as seen live with the RPC camera High quality MACROZOOM Optical lens, 70 x High quality CCD camera Free swivel arm, 180, stable stand Two spot LED flexlight, variable light intensity Retrofits to ERSA IR 500 A and IR 550 A Free swivel, 72x motor-driven zoom camera Variable LED ring light, white External mousepad adjustment of zoom, focus and illumination Two pre-fixed camera sets; optional zoom settings Integrated fan for active assembly cooling Seeing is believing - the best form of process control is being able to see the actual reflow process. The ERSA RPC 550 A Reflow Process Camera is the first system to visualize the creation of BGA / SMT soldered joints during the soldering process, and is a perfect complement to any ERSA IR rework system. In addition to the camera, the ERSA RPC 550 A contains a vibration free, precision movement PCB table and employs a powerful bottom side fan for quickly cooling assemblies after rework. The 180 swiveling, heightadjustable and freely tilting camera with a wide zoom range affords a free view of any assembly during rework. The magnified image of the solder joint shows the solder melt, so that the user can perfectly calibrate the IRS sensor of the rework Ordering information 0VSRPC550A 0VSID100 system. Both operation of the 72 x motorized zoom camera (2 fixed positions) and adjustment of the intensity of the LED ring light occur at an external mousepad. The RPC 550 A can be connected to a PC using ERSA IDView or ImageDoc EXP, or to commercially available video monitors with multisync capability. The IRSoft and IDView software packages provide complete documentation of the temperature and process profiles as well as a video clip during the course of the soldering process. Reflow Process Camera (including cooling fan) ERSA IDView software and Falcon Framegrabber (recommended option) The RPC 500 A includes a high resolution, CCD colour camera and a 7-70 x MACROZOOM quality optical lens which guarantee clear pictures of even the smallest electronic components. During the soldering process, the solder joint is visible and the operator can supervise the forming of the solder connection. Safe, reliable and repeatable rework results are guaranteed! As a solid platform for any ERSA IR-Rework System, the base plate of the RPC 500 A supplies optimal stability on the workbench. Mounted on its bottom side, the 180 swivel arm carries the camera and provides maximum flexibility of viewing angles. Height and viewing angle of the camera can be freely adjusted around the working point of the IR-Rework System. For any Rework Ordering information 0VSRPC500 AP 0VSRPC500 AN 0VSID100 Reflow Process Camera (PAL Version) Reflow Process Camera (NTSC Version ERSA IDView software and Falcon Framegrabber (recommended option) application, free visibility of the component and its solder joints are guaranteed. Optimal illumination of the Rework-Scene is provided by two bright LED spot lights fixed on top of flexible arms, and very easy to adapt for best illumination. The complete LED-light is moving together with the camera. The required zoom (up to 70x!) and focus for the best image can be set at the MACROZOOM lens and fixed in position. A combination of IR 500 A or IR 550 A and the Reflow Process Camera RPC 500 A are synonymous for ideal process control in today s demanding Rework environment! X-Y PCB table for ERSA IR Rework Systems 14 15

9 ERSA IR 500 A Rework System: Low Cost BGA/SMT Rework for All Operators and All Budgets! Important Rework Accessories Unique 0201-Rework Kit IR 500 A Rework System - the ideal solution for repairing mobile telephones Hand soldering with the SMD de-soldering Tweezers for the smallest SMT chips ERSA IDView Software Process visualization software to be used with RPC500A, RPC 550A, and PL550A 0VSID050 0VSID100 ERSA IDView Software ERSA IDView Software and Falcon Framegrabber Process Cooling Fan Powerful bottom side cooling fan for rapid PCB cooling 0IR Cooling fan for PCBs Temperature sensors Additional K-type thermal couples provide real time temperature control during rework 0IR Temperature sensor for Micro Con 60 ia 0DIG207 Temperature sensor for DIGITAL 2000 A X-Y PCB table for ERSA IR Rework Systems Upper and lower IR emitters with 200 W and 400 W Automatic desoldering via integrated pump Patented aperture system; no nozzles required Temperature recording at the component via thermocouple Integrated soldering station with Tech tool Five high-powered, temperature controlled soldering and desoldering tools can be attached to the IR 500 A and IR 550 A systems The ERSA IR 500 A Rework System is a compact The IR 500 A is user friendly and easy to operate! All in all, the system is distinguished by it s solution for the widest variety of rework and repair applications (BGAs, SMTs and conventional assemblies) which has proven itself with over 4000 of components it can handle range from the tini- compact design and great flexibility; the variety users worldwide. est SMT chips (0201 s) through BGAs and SMT Utilizing the advantages of dark IR technology connector strips to large, plated-through hole (medium wavelength IR, 2-8 µm), the IR 500 A components (up to 60 x 60 mm). The integrated allows for safe and uniform rework without the digital soldering station comes standard with the need for component specific nozzles. The patented aperture system of the upper IR emitter used to o operate one of the five connectable ERSA Tech Tool soldering iron and can also be protects sensitive components against adjacent soldering or desoldering tools. heating and allows several components to be reworked simultaneously. The integrated vacuum achieved by combining the IR 500 A with an A great increase in process control can be pipette allows the user to automatically lift off a ERSA process camera for process viewing wide variety of components from the PCB during (RPC 500 A, RPC 550 A or PL 550 A.) rework. A contact thermal couple with digital display allows for enhanced process control. Ordering information 0IR500AS Rework System including digital soldering station 0IR X-Y PCB Table (recommended option) 0IR Cooling Fan for PCBs (recommended option) 0PH100 PCB Holder for mobile phones in combination with the X-Y PCB table (optional) PH 100 Small PCB Holder Ideal for cellular phone and odd shaped PCBs; PCB Quick Release 0PH100 PCB holder No-Clean Rework Flux-Pen Ideal for BGA rework 4FMJF8001-PEN Flux-Pen with IF 8001 flux, EN 29454/2.2.3 A, 7 ml No-Clean Rework Flux Gel Ideal for BGA & SMD rework 0FMKANC No-Clean flux cream, EN 29454/1.1.3 C, 5 ml cartridge 0FMKANC No-Clean flux cream, EN 29454/1.1.3 C, 200 ml can PH 300 Large & Small PCB Support Complete PCB holder set prevents large PCB warpage & holds small and odd shape PCBs during rework 0PH300 PCB holder No-Clean Solder Wick 0WICK NC 1.5 No-Clean wicks, length 1.5 m, width 1.5 mm 0WICK NC 2.2 No-Clean wicks, length 1.5 m, width 2.2 mm 0WICK NC 2.7 No-Clean wicks, length 1.5 m, width 2.7 mm Replacement grid & shielding tape 0IR Heat shielding tape (25 mm x 1 m) 0IR Replacement grid for PTH rework (for IR 550 A only) ERSA Rework Soldering Tips 0612 ZD WickTip, 10.5 x 3.6 mm 0612 HD ERSA SolderWell with concave portion, 1.5 mm, bent MD PLCC blade, 1.5 mm 16 17

10 ERSA IR 550 A Accomplishes More Complex Rework Applications Than Any Other System in the World! Pin Grid Array (PGA) Quad Flat No-Lead (QFN) µbga with reworkable epoxy underfill Flex print repair (hard disc drive) Plastic connector PBGA after Reballing Satelite receiver shielding Heavy Mass CCGA PBGA with heat sink BGA on flex print PTH connector Reballing on IR 550 A Digital camera shielding Digital camera Pentium processor socket PTH connector ERSA IR 550 A recommended BGA reballing system (Source IPC 7711) BGA with heat sink SMT plastic connector Metal component housing Micro Lead Frame (MLF) Metal shielding Thru-Hole metal shield BGA with heat sink Super BGA Lan Grid Array (LGA) Pentium processor socket Pentium processor socket PTH card slot CSP mobile phone TBGA Processor socket Plastic PLCC socket The true excellence of a rework system lies in its flexibility to handle the truly difficult rework jobs. Today, over 4,000 ERSA IR Rework users worldwide are benefitting from the extended rework capabilities as seen above: BGA, CBGA, CCGA, CSP, Flip Chip, QFN and MLF, PGA, PTH VGA card slots, re-workable epoxy, flex circuit, BGA on flex circuit, plastic components, metal components and shields, odd shape components, processor sockets, SMD and PTH connectors, PQFPs PLCCs SOICs TSOPs as well as 0603s, 0402s and even 0201s