Report. Soldering Tests at COM Express Connectors, Type Receptacle and Plug. Order: Bergwerkstraße 50 D Peiting. Your Order-No.

Save this PDF as:
 WORD  PNG  TXT  JPG

Size: px
Start display at page:

Download "Report. Soldering Tests at COM Express Connectors, Type Receptacle and Plug. Order: Bergwerkstraße 50 D 86971 Peiting. Your Order-No."

Transcription

1 Zentrum für Verbindungstechnik in der Elektronik Argelsrieder Feld Oberpfaffenhofen-Weßling Telefon: / Telefax: / Report Order: Soldering Tests at COM Express Connectors, Type Receptacle and Plug Customer: ept GmbH Bergwerkstraße 50 D Peiting Your Order-No.: ZVE Order No.: Report Size: Editor: 13 pages Dr. S. Wege Date:

2 Soldering Tests at COM Express connectors, type Receptacle and Plug Summary For the investigation two types of COM Express connectors (Receptacle and Plug) exist. The solderability of the pins should be controlled using a reflow soldering process. The conclusion of all results is that the two types of the connectors show a good soldering behavior and the formation of the solder joints is in accordance with the criteria of the IPC A 610 standard, also for class Investigations For the investigation two types of SMD connectors (COM Express, Receptacle and Plug) exist. The solderability of the pins should be controlled using a reflow soldering process. Additionally comparable soldering tests with two similar types of SMD connectors, produced by Tyco, were made. Also connectors which were soldered by ept, using a small version of a reflow oven, were available. The quality of the solder joints of all variations should be assessed and compared, considering the criteria of the IPC A 610 standard. For the soldering tests the testboards were supplied by ept. A standard leadfree solder paste with the composition SAC 305, type 4 was used. The printing of the solder paste was made with a manual equipment of ept. The placement of the connectors was also manually. For the soldering tests a SMT reflow machine and a standard leadfree profile with a peak temperature of 245 C were used. The results of soldering tests were optically inspected. Additionally at some specimens an X- ray inspection was made to check the uniformity of the solder formation at all pins of the connectors and to control the porosity in the solder gap between the printed circuit board and the pin. Figure 1: overview of the test boards with the soldered connectors page 1

3 Results The results of the optical inspection for the connectors of ept are shown in the figures 2 7. The pins of the connector type Receptacle are completely wetted and an acceptable solder fillet in the bend of the pin was formed. The solder doesn t reach the package of the connector. Therefore the solder joints fulfill the acceptability criteria of the IPC A 610 standard. The pins of the connector type Plug are gold-plated and have a larger thickness. The pins are also completely wetted. The height of the solder fillet in the bend is about 50 % of the thickness of the pin. Figure 2: connector type Receptacle (ept) optical inspection of the soldered pins Figure 3: connector type Receptacle (ept) optical inspection of the soldered pins page 2

4 Figure 4: connector type Receptacle (ept) formation of the solder joints at the side of the pins Figure 5: connector type Plug (ept) optical inspection of the soldered pins Figure 6: connector type Plug (ept) optical inspection of the soldered pins page 3

5 Figure 7: connector type Plug (ept) formation of the solder joints at the side of the pins The solder joints of the Tyco connectors (Figure 8 and 9) with a similar type show a comparable appearance to the results for the connectors of ept. At the connectors, type plug, the surface of the solder joints looked more homogeneous, because the pins were tin-coated. At this component the height of the solder fillet in the bend is also only about 50 % of the thickness of the pin. Figure 8: connector type Receptacle (Tyco) optical inspection of the solder joints Figure 9: connector type Plug (Tyco) optical inspection of the soldered pins page 4

6 The results of the X-ray inspection are demonstrated in the figures It can be seen that at all researched variations the solder joints are homogeneous formed about the whole length of the pin and the porosity in the solder joint directly under the pin is small. Figure10: X-ray analysis - soldered connector type Plug (ept) soldering tests (ept) Figure11: X-ray analysis - soldered connector type Plug (ept) soldering tests (ZVE) page 5

7 Figure12: X-ray analysis - soldered connector type Receptacle (ept) soldering tests (ZVE) Figure13: X-ray analysis - soldered connector type Receptacle (ept) soldering tests (ZVE) page 6

8 Figure14: X-ray analysis - soldered connector type Receptacle (Tyco) soldering tests (ZVE) Figure15: X-ray analysis - soldered connector type Receptacle (Tyco) soldering tests (ZVE) page 7

9 Figure16: X-ray analysis - soldered connector type Plug (Tyco) soldering tests (ZVE) Figure17: X-ray analysis - soldered connector type Plug (Tyco) soldering tests (ZVE) page 8

10 Figure18: X-ray analysis - soldered connector type Plug (Tyco) - serial assembly To examinate the formation of the solder joints exactly additionally a metallographic cross section through two soldered pins of the two connector types (figure 19) was made. The results are demonstrated in figure In both cases the whole length, the heel of the pins is completely wetted and the solder doesn t touch the body of the component. The solder height at the top of the pin is not defined. Therefore the solder joints fulfill the criteria of the IPC A 610 standard, also for class 3. For the assessment of the solder joints the criteria for flat ribbon and gull wing leads were used, because the connector pins have a special shape, which is not described in the IPC A 610 standard. In this case for class 3 applications the acceptance criteria should be adjusted with the customer. Figure19: over view of the connectors, chosen for the metallographic examination left: type Receptacle, right: type Plug page 9

11 Figure 20: overview of the solder joints of connector type Receptacle Figure 21: metallographic cross section through the solder joints of connector type Receptacle overview page 10

12 Figure 22: metallographic cross section through the solder joints of connector type Receptacle detailed view of figure 21 Figure 23: metallographic cross section through the solder joints of connector type Receptacle detailed view of figure 22 Figure 24: connector type Receptacle formation of the solder joints at the boundary of the pin and the PCB page 11

13 Figure 25: overview of the solder joints of connector type Plug Figure 26: metallographic cross section through the solder joints of connector type Plug overview page 12

14 Figure 27: metallographic cross section through the solder joints of connector type Plug detailed view of figure 26 Figure 28: metallographic cross section through the solder joints of connector type Plug detailed view of figure 27 Figure 29: connector type Plug formation of the solder joints at the boundary of the pin and the PCB page 13

SOLDER CHARGE SMT: THE DESIGN AND VALIDATION OF NEW SOLDER ATTACH TECHNOLOGIES

SOLDER CHARGE SMT: THE DESIGN AND VALIDATION OF NEW SOLDER ATTACH TECHNOLOGIES SOLDER CHARGE SMT: THE DESIGN AND VALIDATION OF NEW SOLDER ATTACH TECHNOLOGIES Jim Hines 1, Kirk Peloza 2, Adam Stanczak 3, David Geiger 4 1 Molex Lisle, IL, USA 2 Molex Lisle, IL, USA 3 Molex Lisle, IL,

More information

PCB inspection is more important today than ever before!

PCB inspection is more important today than ever before! PCB inspection is more important today than ever before! Industry experts continue to stress the need to inspect hidden solder joints! Figure 1. The BGA package has not been placed into the paste deposit.

More information

17 IMPLEMENTATION OF LEAD-FREE SOLDERING TECHNOLOGY. Eva Kotrčová České Vysoké Učení Technické Fakulta Elektrotechnická Katedra Elektrotechnologie

17 IMPLEMENTATION OF LEAD-FREE SOLDERING TECHNOLOGY. Eva Kotrčová České Vysoké Učení Technické Fakulta Elektrotechnická Katedra Elektrotechnologie 17 IMPLEMENTATION OF LEAD-FREE SOLDERING TECHNOLOGY Eva Kotrčová České Vysoké Učení Technické Fakulta Elektrotechnická Katedra Elektrotechnologie 1. Introduction Lead is the toxic heavy metal which is

More information

BGA - Ball Grid Array Inspection Workshop. Bob Willis leadfreesoldering.com

BGA - Ball Grid Array Inspection Workshop. Bob Willis leadfreesoldering.com BGA - Ball Grid Array Inspection Workshop Bob Willis leadfreesoldering.com Mixed Technology Assembly Processes Adhesive Dispensing Component Placement Adhesive Curing Turn Boar Over Conventional Insertion

More information

Electronic Board Assembly

Electronic Board Assembly Electronic Board Assembly ERNI Systems Technology Systems Solutions - a one stop shop - www.erni.com Contents ERNI Systems Technology Soldering Technologies SMT soldering THR soldering THT soldering -

More information

AOI and X-ray Inspection of PCB Assemblies

AOI and X-ray Inspection of PCB Assemblies AOI and X-ray Inspection of PCB Assemblies Electronic Materials and Assembly Processes for Space (EMPS) Workshop HYTEK, Aalborg, Denmark 29th May 2013 Automatic Optical Inspection (AOI) and X-ray Inspection

More information

SMD Steel Spacer. Performance Testing. Content 1. Shear Force 2. Pull Strength 3. Breaking Torque 4. Additional Information 5.

SMD Steel Spacer. Performance Testing. Content 1. Shear Force 2. Pull Strength 3. Breaking Torque 4. Additional Information 5. SMD Steel Spacer WA-SMSI, WA-SMST & WA-SMSE Performance Testing Content 1. Shear Force 2. Pull Strength 3. Breaking Torque 4. Additional Information 5. Test Conditions Shear Force Distance pressure point

More information

ERNI Electronic Solutions

ERNI Electronic Solutions ERNI Electronic Solutions Development and production of electronic assemblies www.erni-es.com Catalog E 074599 07/10 Edition 1 Welcome to ERNI Electronic Solutions! Your specialist for electronics development,

More information

RoHS-Compliant Through-Hole VI Chip Soldering Recommendations

RoHS-Compliant Through-Hole VI Chip Soldering Recommendations APPLICATION NOTE AN:017 RoHS-Compliant Through-Hole VI Chip Soldering Recommendations Ankur Patel Associate Product Line Engineer Contents Page Introduction 1 Wave Soldering 1 Hand Soldering 4 Pin/Lead

More information

PCB Quality Inspection. Student Manual

PCB Quality Inspection. Student Manual PCB Quality Inspection Student Manual Unit 2: Inspection Overview Section 2.1: Purpose of Inspection What Is The Purpose of Inspection? There are 2 reasons why Inspection is performed: o To verify the

More information

Today's Vapor Phase Soldering An Optimized Reflow Technology for Lead Free Soldering

Today's Vapor Phase Soldering An Optimized Reflow Technology for Lead Free Soldering Today's Vapor Phase Soldering An Optimized Reflow Technology for Lead Free Soldering Dipl.-Ing. Helmut Leicht; Andreas Thumm IBL-Löttechnik GmbH www.ibl-loettechnik.de, Germany ABSTRACT In the beginning

More information

How do you create a RoHS Compliancy-Lead-free Roadmap?

How do you create a RoHS Compliancy-Lead-free Roadmap? How do you create a RoHS Compliancy-Lead-free Roadmap? When a company begins the transition to lead-free it impacts the whole organization. The cost of transition will vary and depends on the number of

More information

SMD Terminal Blocks with Push-Buttons

SMD Terminal Blocks with Push-Buttons SMD Terminal Blocks with Push-Buttons SMD Terminal Blocks Small is Big WAGO s new SMD Terminal Blocks provide push-button termination for conductors 0. 0.75 mm/awg 4 18 (060 Series) and 0.5 1.5 mm/awg

More information

PIN IN PASTE APPLICATION NOTE. www.littelfuse.com

PIN IN PASTE APPLICATION NOTE. www.littelfuse.com PIN IN PASTE APPLICATION NOTE 042106 technical expertise and application leadership, we proudly introduce the INTRODUCTION The Pin in Paste method, also called through-hole reflow technology, has become

More information

Bob Willis leadfreesoldering.com

Bob Willis leadfreesoldering.com Assembly of Flexible Circuits with Lead-Free Solder Alloy Bob Willis leadfreesoldering.com Introduction to Lead-Free Assembly Video Clips Component www.bobwillis.co.uk/lead/videos/components.rm Printed

More information

Good Boards = Results

Good Boards = Results Section 2: Printed Circuit Board Fabrication & Solderability Good Boards = Results Board fabrication is one aspect of the electronics production industry that SMT assembly engineers often know little about.

More information

Figure 1 (end) Application Specification 114 13088 provides application requirements for MICTOR Right Angle Connectors for SMT PC Board Applications

Figure 1 (end) Application Specification 114 13088 provides application requirements for MICTOR Right Angle Connectors for SMT PC Board Applications This specification covers requirements for application of MICTOR Vertical Board to Board Plugs and Receptacles designed for pc boards. The connectors have an in row contact spacing on 0.64 [.025] centerlines.

More information

3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection

3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection 3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection ABOUT AKROMETRIX Company Overview Akrometrix mission is to lead the industry in non-contact surface measurement tools.

More information

Edition 2012-032 Published by Infineon Technologies AG 81726 Munich, Germany 2013 Infineon Technologies AG All Rights Reserved.

Edition 2012-032 Published by Infineon Technologies AG 81726 Munich, Germany 2013 Infineon Technologies AG All Rights Reserved. Recommendations for Printed Circuit Board Assembly of Infineon Laminate Packages Additional Information DS1 2012-03 Edition 2012-032 Published by Infineon Technologies AG 81726 Munich, Germany 2013 Infineon

More information

FLASHSOLDERING - A NEW PROCESS FOR REFLOW SOLDERING INSULATED MAGNET WIRE TO ELECTRONIC CONTACTS

FLASHSOLDERING - A NEW PROCESS FOR REFLOW SOLDERING INSULATED MAGNET WIRE TO ELECTRONIC CONTACTS FLASHSOLDERING - A NEW PROCESS FOR REFLOW SOLDERING INSULATED MAGNET WIRE TO ELECTRONIC CONTACTS David W. Steinmeier microjoining Solutions & Mike Becker Teka Interconnection Systems Abstract: Flashing

More information

AND8464/D. Board Level Application Note for 0402, 0502 and 0603 DSN2 Packages APPLICATION NOTE

AND8464/D. Board Level Application Note for 0402, 0502 and 0603 DSN2 Packages APPLICATION NOTE Board Level Application Note for 0402, 0502 and 0603 DSN2 Packages Prepared by: Denise Thienpont, Steve St. Germain ON Semiconductor APPLICATION NOTE Introduction ON Semiconductor has introduced an expanded

More information

Recommended method of attaching QFP prototype sockets to a PCB.

Recommended method of attaching QFP prototype sockets to a PCB. Actel provides simple step-by-step assembly flow instructions for attaching QFP and BGA sockets to a PCB. Also included is solder reflow information along with a sample standard reflow temperature profile.

More information

User Guide Reflow Toaster Oven Controller

User Guide Reflow Toaster Oven Controller User Guide Reflow Toaster Oven Controller Version 1.5-01/10/12 DROTEK Web shop: www.drotek.fr SOMMAIRE 1. Introduction... 3 2. Preparation of THE REFLOW CONTROLLER... 4 2.1. Power supply... 4 2.2. USB

More information

Lead-Free Solder Assembly For Mixed Technology Circuit Boards AIM

Lead-Free Solder Assembly For Mixed Technology Circuit Boards AIM Lead-Free Solder Assembly For Mixed Technology Circuit Boards AIM Several lead-free alloys have been investigated for SMT assembly. The industry has migrated to a family of alloys know as SAC (Tin/Silver/Copper)

More information

How to avoid Layout and Assembly got chas with advanced packages

How to avoid Layout and Assembly got chas with advanced packages How to avoid Layout and Assembly got chas with advanced packages Parts and pitch get smaller. Pin counts get larger. Design cycles get shorter. BGA, MicroBGA, QFN, DQFN, CSP packages are taking the design

More information

MuAnalysis. Printed Circuit Board Reliability and Integrity Characterization Using MAJIC. M. Simard-Normandin MuAnalysis Inc. Ottawa, ON, Canada

MuAnalysis. Printed Circuit Board Reliability and Integrity Characterization Using MAJIC. M. Simard-Normandin MuAnalysis Inc. Ottawa, ON, Canada Printed Circuit Board Reliability and Integrity Characterization Using MAJIC M. Simard-Normandin Inc. Ottawa, ON, Canada Abstract The recent need to develop lead-free electrical and electronic products

More information

Flip Chip Package Qualification of RF-IC Packages

Flip Chip Package Qualification of RF-IC Packages Flip Chip Package Qualification of RF-IC Packages Mumtaz Y. Bora Peregrine Semiconductor San Diego, Ca. 92121 mbora@psemi.com Abstract Quad Flat Pack No Leads (QFNs) are thermally enhanced plastic packages

More information

Electronics Manufacturing Services, Since 1986

Electronics Manufacturing Services, Since 1986 Page 1 of 5 Electronics Manufacturing Services, Since 1986 Professionalized Products and Services, Inc. (PPSI) is a contract manufacturer, located in the Houston area, specializing in PCB assembly and

More information

DRIVING COST OUT OF YOUR DESIGNS THROUGH YOUR PCB FABRICATOR S EYES!

DRIVING COST OUT OF YOUR DESIGNS THROUGH YOUR PCB FABRICATOR S EYES! 4/3/2013 S THROUGH YOUR PCB FABRICATOR S EYES! Brett McCoy Eagle Electronics Schaumburg IL. New England Design and Manufacturing Tech Conference Brett McCoy: Vice President / Director of Sales Circuit

More information

Soldering of SMD Film Capacitors in Practical Lead Free Processes

Soldering of SMD Film Capacitors in Practical Lead Free Processes Soldering of SMD Film Capacitors in Practical Lead Free Processes Matti Niskala Product Manager, SMD products Evox Rifa Group Oyj, a Kemet Company Lars Sonckin kaari 16, 02600 Espoo, Finland Tel: + 358

More information

Auditing Contract Manufacturing Processes

Auditing Contract Manufacturing Processes Auditing Contract Manufacturing Processes Greg Caswell and Cheryl Tulkoff Introduction DfR has investigated multiple situations where an OEM is experiencing quality issues. In some cases, the problem occurs

More information

Mounting Instructions for SP4 Power Modules

Mounting Instructions for SP4 Power Modules Mounting Instructions for SP4 Power Modules Pierre-Laurent Doumergue R&D Engineer Microsemi Power Module Products 26 rue de Campilleau 33 520 Bruges, France Introduction: This application note gives the

More information

DETECTION OF DEFECT ON FBGA SOLDER BALLS USING X-RAY TECHNOLOGY

DETECTION OF DEFECT ON FBGA SOLDER BALLS USING X-RAY TECHNOLOGY DETECTION OF DEFECT ON FBGA SOLDER BALLS USING X-RAY TECHNOLOGY Pavel Řihák Doctoral Degree Programme (2), FEEC BUT E-mail: xrihak02@stud.feec.vutbr.cz Supervised by: Ivan Szendiuch E-mail: szend@feec.vutbr.cz

More information

LEAD FREE HALOGENFREE. Würth Elektronik PCB Design Conference 2007. Lothar Weitzel 2007 Seite 1

LEAD FREE HALOGENFREE. Würth Elektronik PCB Design Conference 2007. Lothar Weitzel 2007 Seite 1 LEAD FREE HALOGENFREE Würth Elektronik PCB Design Conference 2007 Lothar Weitzel 2007 Seite 1 Content Solder surfaces/overview Lead free soldering process requirements/material parameters Different base

More information

The Alphabet soup of IPC Specifications. 340 Raleigh Street Holly Springs, NC 27540

The Alphabet soup of IPC Specifications. 340 Raleigh Street Holly Springs, NC 27540 The Alphabet soup of IPC Specifications 340 Raleigh Street Holly Springs, NC 27540 http://www.circuittechnology.com (919) 552 3434 About the IPC IPC-the electronics industry standard Founded in 1957 as

More information

Valuetronics Holdings Limited. A pictorial tour of our Daya Bay facility

Valuetronics Holdings Limited. A pictorial tour of our Daya Bay facility Valuetronics Holdings Limited A pictorial tour of our Daya Bay facility In early 2006, we acquired the land use rights to a 110,200 sqm land parcel in the Daya Bay Technology District, Huizhou City, Guangdong

More information

SURFACE MOUNT SOLDER JOINT WORKMANSHIP STANDARDS CLASS 3 TRAINING CERTIFICATION TEST (DVD-SMT-E) v.3

SURFACE MOUNT SOLDER JOINT WORKMANSHIP STANDARDS CLASS 3 TRAINING CERTIFICATION TEST (DVD-SMT-E) v.3 This test consists of thirty multiple-choice questions. All questions are from the video: Surface Mount Solder Joint Workmanship Standards (DVD-SMT-E). Use the supplied Answer Sheet and circle the letter

More information

Investigation for Use of Pin in Paste Reflow Process with Combination of Solder Preforms to Eliminate Wave Soldering

Investigation for Use of Pin in Paste Reflow Process with Combination of Solder Preforms to Eliminate Wave Soldering Investigation for Use of Pin in Paste Reflow Process with Combination of Solder Preforms to Eliminate Wave Soldering Guhan Subbarayan, Scott Priore Assembly Sciences and Technology, Cisco Systems, Inc.

More information

Recommended PCB Design & Surface Mount Guidelines for Picor Corporation s LGA Packages

Recommended PCB Design & Surface Mount Guidelines for Picor Corporation s LGA Packages Contents for Picor Corporation s LGA Packages Introduction............................... Page 1 Receiving PCB Footprint...................... Page 1 Stencil Designs............................. Page 2

More information

Lead-Free Rework Optimization Project

Lead-Free Rework Optimization Project Lead-Free Rework Optimization Project Project Co-Chairs: Jasbir Bath, Flextronics International Craig Hamilton, Celestica IPC APEX 2008 Background Reliability tests in the previous inemi lead-free assembly

More information

Selective Soldering Defects and How to Prevent Them

Selective Soldering Defects and How to Prevent Them Selective Soldering Defects and How to Prevent Them Gerjan Diepstraten Vitronics Soltec BV Introduction Two major issues affecting the soldering process today are the conversion to lead-free soldering

More information

SMD Power Elements Design Guide. 50 A SMD Technology Small Size High Current

SMD Power Elements Design Guide. 50 A SMD Technology Small Size High Current SMD Power Elements Design Guide 50 A SMD Technology Small Size High Current Contents Surface Mount Technology & Assembly Surface Pad Geometry & Stencil Technical Data Qualification Reliability Test 2 www.we-online.com

More information

MANUFACTURING. Prototype Development. New Product Introduction (NPI) Builds. Process Development. Design for Manufacturing (DFM)

MANUFACTURING. Prototype Development. New Product Introduction (NPI) Builds. Process Development. Design for Manufacturing (DFM) MANUFACTURING Contract Assembly Prototype Development New Product Introduction (NPI) Builds Process Development Design for Manufacturing (DFM) Box Build & Test Rework & Repair Feasibility Assessment Experimental

More information

DVD-71C IPC-A-610E Common Inspection Errors

DVD-71C IPC-A-610E Common Inspection Errors DVD-71C IPC-A-610E Common Inspection Errors Below is a copy of the narration for DVD-71C. The contents for this script were developed by a review group of industry experts and were based on the best available

More information

INDEX. 03. New Product Introduction. 04. Design. 05. Surface Mount Assembly. 06. Conventional Assembly. 07. Wiring and Chassis Assembly

INDEX. 03. New Product Introduction. 04. Design. 05. Surface Mount Assembly. 06. Conventional Assembly. 07. Wiring and Chassis Assembly INDEX 03. New Product Introduction 04. Design 05. Surface Mount Assembly 06. Conventional Assembly 07. Wiring and Chassis Assembly 08. Test Services 09. Quality 10. Procurement Solutions New Product Introduction

More information

PC/104, PC/104 -Plus, VarPol connectors

PC/104, PC/104 -Plus, VarPol connectors 164 PC/104, PC/104 -Plus, VarPol connectors Definitions 166 Technical specifications 168 Hole specifications 169 PC/104 170 PC/104-Plus 172 Accessories: PC/104 and PC/104-Plus 174 VarPol angled pin header

More information

PC/104, PC/104-Plus, VarPol connector

PC/104, PC/104-Plus, VarPol connector 164 Definitions 166 Technical specifications 168 Hole specifications 169 PC/104 170 PC/104-Plus 172 Accessories: PC/104 and PC/104-Plus 174 VarPol angled pin header 175 VarPol straight pin header 176 VarPol

More information

Assembly of LPCC Packages AN-0001

Assembly of LPCC Packages AN-0001 Assembly of LPCC Packages AN-0001 Surface Mount Assembly and Handling of ANADIGICS LPCC Packages 1.0 Overview ANADIGICS power amplifiers are typically packaged in a Leadless Plastic Chip Carrier (LPCC)

More information

Applications of Solder cation With Preforms

Applications of Solder cation With Preforms Applications of Solder Fort cation With Preforms Authored by: Carol Gowans, Paul Socha, and Ronald C. Lasky, Ph.D., P.E. Abstract Although many have predicted the demise of through-hole components, they

More information

Comparison of OSRAM OSTAR Headlamp Pro and OSLON Black Flat Application Note

Comparison of OSRAM OSTAR Headlamp Pro and OSLON Black Flat Application Note Comparison of OSRAM OSTAR Headlamp Pro and Application Note Abstract In this application note a new SMD LED type is presented as an alternative to existing LEDs to create multi-chip light sources for diverse

More information

MANUFACTURING. Prototype Development. New Product Introduction (NPI) Builds. Process Development. Design for Manufacturing (DFM)

MANUFACTURING. Prototype Development. New Product Introduction (NPI) Builds. Process Development. Design for Manufacturing (DFM) MANUFACTURING Contract Assembly Prototype Development New Product Introduction (NPI) Builds Process Development Design for Manufacturing (DFM) Box Build & Test Rework & Repair Feasibility Assessment Experimental

More information

SMD TERMINAL BLOCKS. Small is Big!

SMD TERMINAL BLOCKS. Small is Big! SMD TERMINAL BLOCKS Small is Big! SMD TERMINAL BLOCKS A compact and low-profile PCB connection is required to achieve the most uniform light distribution, while minimizing shadowing. WAGO s surface-mount

More information

DEMO ONLY Version IPC DRM-SMT-E. Photos. Chip Components J-Lead Components Gull Wing Components Class 1 Class 2 Class 3

DEMO ONLY Version IPC DRM-SMT-E. Photos. Chip Components J-Lead Components Gull Wing Components Class 1 Class 2 Class 3 Class 1 DEMO ONLY Version This is a promotional sample of the IPC Training and Guide DRM-SMT-E. Please do not use this SAMPLE for training or reference purposes. IPC is a not-for-profit association for

More information

4N25 Phototransistor Optocoupler General Purpose Type

4N25 Phototransistor Optocoupler General Purpose Type 4N Phototransistor Optocoupler General Purpose Type Data Sheet Lead (Pb) Free RoHS 6 fully compliant RoHS 6 fully compliant options available; -xxxe denotes a lead-free product Description The 4N is an

More information

CONTROLLING THE ASSEMBLY PROCESS WITH THE USE OF SPC

CONTROLLING THE ASSEMBLY PROCESS WITH THE USE OF SPC CONTROLLING THE ASSEMBLY PROCESS WITH THE USE OF SPC William Beair, Alton Moore, and Eric Gilley Raytheon Company McKinney, TX, USA ABSTRACT With increasing deployment of both micro BGA s, 0201discreet

More information

A and M Electronics Contract Manufacturing Circuit Board Assembly 25018 Avenue Kearny Valencia, Ca. 91355 (661) 257-3680 or (800) 923-3058

A and M Electronics Contract Manufacturing Circuit Board Assembly 25018 Avenue Kearny Valencia, Ca. 91355 (661) 257-3680 or (800) 923-3058 A and M Electronics Contract Manufacturing Circuit Board Assembly 25018 Avenue Kearny Valencia, Ca. 91355 (661) 257-3680 or (800) 923-3058 "When Quality Counts, Choose A&M Electronics" SMT, BGA, & Through

More information

Rack C. 25 slots (maximum 50 components) Maximum placement area 620 445 mm. Standard placement area 500 360 mm. Rack A

Rack C. 25 slots (maximum 50 components) Maximum placement area 620 445 mm. Standard placement area 500 360 mm. Rack A placeall 510 Basic machine Range of applications Dispensing and picking and placing of low volume SMT and small series, up to 4.000 components per hour (cph). Component capability Chips 0402 up to 45 45

More information

CASE STUDY: SCREEN PRINTING SOLUTIONS FOR SMALL DIE & PRECISION ALIGNMENT CHALLENGES

CASE STUDY: SCREEN PRINTING SOLUTIONS FOR SMALL DIE & PRECISION ALIGNMENT CHALLENGES CASE STUDY: SCREEN PRINTING SOLUTIONS FOR SMALL DIE & PRECISION ALIGNMENT CHALLENGES By William E. Coleman Ph.D., Photo Stencil and Travis Tanner, Plexus Manufacturing Solutions When you have a gold Kovar

More information

Application Note AN-1080. DirectFET Technology Inspection Application Note

Application Note AN-1080. DirectFET Technology Inspection Application Note Application Note AN-1080 DirectFET Technology Inspection Application Note Table of Contents Page Inspection techniques... 3 Examples of good assembly... 3 Summary of rejection criteria... 4 Types of faults...

More information

Product Specification

Product Specification Product Specification Model No.: DC-240-L01-00-TR Description: H=3.00mm Horizontal SMD DC Power Jacks Pin Shaft Diameter: 0.65mm Packing Method: Tape & Reel (600pcs./R) 1. General 1a. Scope The jacks should

More information

PCB Design Tools. Orcad (Cadence) Allegro (Cadence) Eagle (Cadsoft) P-CAD (Altium)

PCB Design Tools. Orcad (Cadence) Allegro (Cadence) Eagle (Cadsoft) P-CAD (Altium) What Is PCB? A PCB is a printed circuit board, also known as a printed wiring board. It is used in electronics to build electronic devices. A PCB serves two purposes in the construction of an electronic

More information

For board-to-fpc. Narrow Pitch Connectors (0.35mm pitch)

For board-to-fpc. Narrow Pitch Connectors (0.35mm pitch) For board-to-fpc Narrow Pitch Connectors (0.35mm pitch) S35 Series New FEATURES 1. 1.7 mm wide slim two-piece type connector Mated height 0.6 mm Smaller compared to A4F series Width: Approx. 44% down

More information

Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages

Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction This Application Note provides sample PCB land pattern

More information

ERNI Systems USA Backplanes & Sub-Racks: Design, Simulation, Manufacturing and Test

ERNI Systems USA Backplanes & Sub-Racks: Design, Simulation, Manufacturing and Test ERNI Systems USA Backplanes Sub-Racks: Design, Simulation, Manufacturing and Test www.erni.com Engineering From Beginning to End Conceptualization From Customer Idea to Statement of Work (SOW) Structuring

More information

ZIF Connector & Flat Flexible Cable

ZIF Connector & Flat Flexible Cable ZIF Connector & Flat Flexible Cable 09/08-1 ZIF Connector & Flat Flexible Cable As the demand for higher density in electronic equipment increases, the use of Flexible Flat Cable (FFC) or Flexible Printed

More information

Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences

Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences Our thanks to Kester for allowing us to reprint the following article. By Peter Biocca, Senior Market Development Engineer,

More information

Connectors. product overview. Edition 3

Connectors. product overview. Edition 3 Connectors product overview Edition 3 Editorial Good connections bear a name: ept Thomas Bernhard Claus Guglhör Guglhör Guglhör ept designs, produces and distributes electronic connectors for highquality

More information

0.5mm Pitch SMT Board to Board Connector

0.5mm Pitch SMT Board to Board Connector 0.5mm Pitch SMT Board to Board Connector DF12 Series Correspond to automatic mounting The vacuum pick-up area secures the automatic mounting machine for pick and place. Features 1. Broad Variations of

More information

Antenna Part Number: FR05-S1-R-0-105

Antenna Part Number: FR05-S1-R-0-105 Fractus EZConnect Zigbee, RFID, ISM868/9 Chip Antenna Antenna Part Number: FR5-S1-R--15 This product is protected by at least the following patents PAT. US 7,148,85, US 7,22,822 and other domestic and

More information

BGA Repair: A Better Understanding can Reduce Fears, Guarantee Process Control and Save Money

BGA Repair: A Better Understanding can Reduce Fears, Guarantee Process Control and Save Money Technical Article : A Better Understanding can Reduce Fears, Guarantee Process Control and Save Money by Mark Cannon Current international studies reinforce the global trend to area array pakkages. BGA,

More information

Dielectric withstanding voltage

Dielectric withstanding voltage onnectors LV series onnectors for Mobile Equipment for Mobile Equipment Outline This series of connectors is best suited for wiring within ultra miniature electronic equipment such as cellular phones,

More information

A guide to the BGA Package 1. What is it? 2. Why have they caught on? 3. Are they difficult to place by machine? 4. Is it possible to place them by hand? 5. How do you know if a BGA has fully soldered

More information

AOI Systems Limited Automated Optical Inspection

AOI Systems Limited Automated Optical Inspection AOI Systems Limited Automated Optical Inspection First Article Inspection SS15000FA AOI Systems - First Article Inspection First Article Inspection The FA-Inspector is a scanner-based optical inspection

More information

Measuring of the Temperature Profile during the Reflow Solder Process Application Note

Measuring of the Temperature Profile during the Reflow Solder Process Application Note Measuring of the Temperature Profile during the Reflow Solder Process Application Note Abstract With reference to the application note Further Details on lead free reflow soldering of LEDs the present

More information

Rework stations: Meeting the challenges of lead-free solders

Rework stations: Meeting the challenges of lead-free solders Rework stations: Meeting the challenges of lead-free solders Market forces, particularly legislation against the use of lead in electronics, have driven electronics manufacturers towards lead-free solders

More information

The SMT/QuickGrip VSWR

The SMT/QuickGrip VSWR Connectors Product Facts Solderless Cable Termination [.118] Mated Height Excellent Cable Retention Usable With Flexible and Semi-Rigid Micro-Coaxial Cables Tape and Reel Packaging system. The design provides

More information

Handling and Processing Details for Ceramic LEDs Application Note

Handling and Processing Details for Ceramic LEDs Application Note Handling and Processing Details for Ceramic LEDs Application Note Abstract This application note provides information about the recommended handling and processing of ceramic LEDs from OSRAM Opto Semiconductors.

More information

Siemens Chemnitz Siemens AG 2010. Alle Rechte vorbehalten.

Siemens Chemnitz Siemens AG 2010. Alle Rechte vorbehalten. Siemens Chemnitz Seite 1 ACOD Leipzig, 18th Feb 2010 Organization: R&D and Production Research & Development CNCs NC components Motion control PLC-Components Distributed I/Os Peripheral modules Power Electronics

More information

Soldering of EconoPACK TM, EconoPIM TM, EconoBRIDGE TM, EconoPACK +, EconoDUAL, EasyPACK and EasyPIM TM - Modules

Soldering of EconoPACK TM, EconoPIM TM, EconoBRIDGE TM, EconoPACK +, EconoDUAL, EasyPACK and EasyPIM TM - Modules Seite 1 Soldering of EconoPACK TM, EconoPIM TM, EconoBRIDGE TM, EconoPACK +, EconoDUAL, EasyPACK and EasyPIM TM - Modules Soldering with alloys containing lead (SnPb) is the standard connection technology

More information

Soldering And Staking OEpic TOSA/ROSA Flex Circuits To PWBs.

Soldering And Staking OEpic TOSA/ROSA Flex Circuits To PWBs. APP-000010 Rev 03 This application note is intended to give a person involved in the manufacturing engineering of a typical XFP module an overview of the procedures and requirements for soldering an OEpic

More information

EMOSAFE EN-100. Network Isolators for PCB assembly 1 GENERAL DESCRIPTION. Product Data Sheet ENGLISH

EMOSAFE EN-100. Network Isolators for PCB assembly 1 GENERAL DESCRIPTION. Product Data Sheet ENGLISH ENGLISH EMOSAFE EN-100 Product Data Sheet Network Isolators for PCB assembly November 2013 1 GENERAL DESCRIPTION The EMOSAFE EN-100 Network Isolator interrupts all galvanically conducting connections (conductors

More information

SOLDERING TERMINALS TRAINING CERTIFICATION TEST (DVD-18C)

SOLDERING TERMINALS TRAINING CERTIFICATION TEST (DVD-18C) This test consists of twenty multiple-choice questions. All questions are from the video: Soldering Terminals (DVD-18C). Each question has only one most correct answer. Use the Answer Sheet and circle

More information

Metallized Particle Interconnect A simple solution for high-speed, high-bandwidth applications

Metallized Particle Interconnect A simple solution for high-speed, high-bandwidth applications Metallized Particle Interconnect A simple solution for high-speed, high-bandwidth applications The MPI Material Advantage Advantages: High-Density - Scalable Pitches down to 0,8 mm pitch possible - Scalable

More information

Soldering Process Considerations for Land Grid Array Modules

Soldering Process Considerations for Land Grid Array Modules Soldering Process Considerations for Land Grid Array Modules The reflow process is dependant on many parameters; this application note is presented as a guide to soldering LGA modules. Manufacturers are

More information

Molded. By July. A chip scale. and Omega. Guidelines. layer on the silicon chip. of mold. aluminum or. Bottom view. Rev. 1.

Molded. By July. A chip scale. and Omega. Guidelines. layer on the silicon chip. of mold. aluminum or. Bottom view.  Rev. 1. Application Note PAC-006 By J. Lu, Y. Ding, S. Liu, J. Gong, C. Yue July 2012 Molded Chip Scale Package Assembly Guidelines Introduction to Molded Chip Scale Package A chip scale package (CSP) has direct

More information

Be the best. PCBA Design Guidelines and DFM Requirements. Glenn Miner Engineering Manager March 6, 2014 DFM DFT. DFx DFC DFQ

Be the best. PCBA Design Guidelines and DFM Requirements. Glenn Miner Engineering Manager March 6, 2014 DFM DFT. DFx DFC DFQ and DFM Requirements DFM DFQ DFx DFT DFC Glenn Miner Engineering Manager Electronics, Inc. Not to be reproduced or used in any means without written permission by Benchmark. Guidelines and Requirements

More information

PERFECT ELECTRONIC TECHNOLOGY FOR MEASURING AND CONTROL.

PERFECT ELECTRONIC TECHNOLOGY FOR MEASURING AND CONTROL. PERFECT ELECTRONIC TECHNOLOGY FOR MEASURING AND CONTROL. Made in Germany. 2 Responsibility and Commitment GOOD IDEAS AND HARD WORK FROM OUR TEAM IN STUTTGART RESULT IN SUPERIOR, RELIABLE PRODUCTS Störk-Tronic

More information

Q&A. Contract Manufacturing Q&A. Q&A for those involved in Contract Manufacturing using Nelco Electronic Materials

Q&A. Contract Manufacturing Q&A. Q&A for those involved in Contract Manufacturing using Nelco Electronic Materials Q&A Q&A for those involved in Contract Manufacturing using Nelco Electronic Materials 1. Do Nelco laminates have any discoloration effects or staining issues after multiple high temperature exposures?

More information

Solder Reflow Guide for Surface Mount Devices

Solder Reflow Guide for Surface Mount Devices June 2015 Introduction Technical Note TN1076 This technical note provides general guidelines for a solder reflow and rework process for Lattice surface mount products. The data used in this document is

More information

B Recommended land pattern: [mm] C Stencil suggestion: 2015-03-11. SSt. SKl CHECKED DATE

B Recommended land pattern: [mm] C Stencil suggestion: 2015-03-11. SSt. SKl CHECKED DATE A Dimensions: [mm] B Recommended land pattern: [mm] D Properties: Properties Surface Material Thread Tightening torque Solder Cream Thickness Packaging Value Tin plated 11SMnPb30 M2.5 0.35 Nm 150 µm Reel

More information

Comparative Wetting Ability of Lead-Free Alloys

Comparative Wetting Ability of Lead-Free Alloys Comparative Wetting Ability of Lead-Free Alloys Understanding the wetting kinetics of lead-free alloys becomes crucial in selecting a suitable lead-free composition for assembling PCBs. KaiHwa Chew, Vincent

More information

IPC-A-610E Certified IPC Specialist (CIS) Course Overview & Schedule

IPC-A-610E Certified IPC Specialist (CIS) Course Overview & Schedule IPC-A-610E Certified IPC Specialist (CIS) Course Overview & Schedule Hours REQUIRED Hours Optional Certification Hours Optional Certification 2.5 Hrs 1 Hr Module 1 Introduction/IPC Professional Policies

More information

Ultra Reliable Embedded Computing

Ultra Reliable Embedded Computing A VersaLogic Focus on Reliability White Paper Ultra Reliable Embedded Computing The Clash between IPC Class 3 Requirements and Shrinking Geometries Contents Introduction...1 Case in Point: IPC Class 3

More information

What is surface mount?

What is surface mount? A way of attaching electronic components to a printed circuit board The solder joint forms the mechanical and electrical connection What is surface mount? Bonding of the solder joint is to the surface

More information

Choosing a Low-Cost Alternative to SAC Alloys for PCB Assembly

Choosing a Low-Cost Alternative to SAC Alloys for PCB Assembly Choosing a Low-Cost Alternative to SAC Alloys for PCB Assembly Our thanks to Indium Corporation for allowing us to reprint the following article. By Brook Sandy and Ronald C. Lasky, PhD, PE., Indium Corporation

More information

Surface Mounting Application Note

Surface Mounting Application Note Surface Mounting Application Note Introduction What is Surface Mounting? In conventional board assembly technology the component leads are inserted into holes through the PC board and connected to the

More information

DESIGN GUIDE Version 1.4. Design Guide for High Current Solutions with WIRELAID

DESIGN GUIDE Version 1.4. Design Guide for High Current Solutions with WIRELAID DESIGN GUIDE Version 1.4 Design Guide for High Current Solutions with WIRELAID High Current Solutions with WIRELAID Technology Your benefit Caused by the increasing requirements of power and digital control

More information

Multilevel Socket Technologies

Multilevel Socket Technologies Multilevel Socket Technologies High Performance IC Sockets And Test Adapters Overview Company Overview Over 5,000 products High Performance Adapters and Sockets Many Custom Designs & Turn-Key Solutions

More information

DVD-111C Advanced Hand Soldering Techniques

DVD-111C Advanced Hand Soldering Techniques DVD-111C Advanced Hand Soldering Techniques Below is a copy of the narration for DVD-111C. The contents for this script were developed by a review group of industry experts and were based on the best available

More information

Assembly of Flexible Circuits with Lead-Free Solder Alloy

Assembly of Flexible Circuits with Lead-Free Solder Alloy Assembly of Flexible Circuits with Lead-Free Solder Alloy Bob Willis bobwillisonline.com Your Delegate Webinar Control Panel Open and close your panel Full screen view Raise hand for Q&A at the end Submit

More information