3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection

Size: px
Start display at page:

Download "3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection"

Transcription

1 3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection

2 ABOUT AKROMETRIX Company Overview Akrometrix mission is to lead the industry in non-contact surface measurement tools. Based on a culture of innovation and fairness, the company is dedicated to building its global presence by designing its operations and products from our customers perspective. We will grow and expand our market leadership without sacrificing our core values of integrity, respect and fairness in all of our interactions. Whether an employee, a customer or a supplier, we strive to uphold these values to their highest levels. Integrity - the belief that we must do what we say and mean what we say in all of our interactions with prospects, customers, vendors and our associates. Respect - the love of doing what excites us for those that can benefit from our technology, expertise, experience and innovation. Fairness - knowing that we will treat everyone from a perspective of equity regardless of the situation. Competitive advantage for Akrometrix is competitive advantage for our customers. Akrometrix will relentlessly leverage, improve and expand what we do best to ensure total satisfaction for our valued customers. In 2007, 95% of the top 20 global semiconductor manufacturing companies relied upon Akrometrix equipment for critical characterization needs. Mission, core values, competitive advantage and solid strategic planning - all come together to make Akrometrix a trusted partner to each of our valued customers. Company History Akrometrix is a Georgia-based company founded in 1994 to provide services and equipment to measure and resolve thermo-mechanical surface flatness issues in manufacturing and assembly operations, most notably in the production of electronic circuit substrates and components. Its pioneering technology was based on the research of Dr. I. Charles Ume, a professor at the Georgia Institute of Technology (Georgia Tech). Akrometrix licensed and commercialized the application of Dr. Ume s technology, which today serves as a crucial component in the production, and continued miniaturization, of advanced electronics products. Akrometrix has become the industry leader in real-time metrology emphasizing resolution of thermo-mechanical issues at all levels of electronic materials production, components fabrication and assembly processes. More than ever, Akrometrix product and service offerings directly reflect our close interaction and long standing relationships with our valued customer base. A comprehensive strategy that includes modular metrology (Shadow Moiré, Digital Image Correlation, Digital Fringe Projection), expanded thermal environment simulation (-50 C to 300 C), powerful analysis algorithms and data management solutions enables our customers to implement a company wide platform for effective warpage management. Our global presence offers high caliber sales, service and applications support to all of the industry. This platform and the new generation of equipment offerings positions all segments of the supply chain to immediately realize benefits in the form of improved first pass yields and product reliability. In addition to being integral to solving today s package and board assembly challenges, Akrometrix technology and equipment will be leading the charge towards the future as we introduce adaptive processing capabilities that will further enhance the utility and value of our customers investments.

3 THE TECHNOLOGY TherMoiré Akrometrix patented TherMoiré systems are the industry leading tools for advanced characterization of temperature-dependent warpage. First introduced in 1998 for use as a laboratory tool, today s generation of TherMoiré product offerings serves as the platform for an enterprise-wide warpage management solution. Innovative developments in hardware, software and data management make the TherMoiré an essential value-added component for microelectronics manufacturing around the world. TherMoiré technology can simulate your thermal processing and operating environment conditions, while capturing a complete history of out-of-plane displacement behavior. Applying this critical information to form - or achieve compliance for - component/substrate behavior allowances (i.e. warpage specifications) can directly impact level I and level II assembly yields and enhance product reliability. TherMoiré In-Process Warpage Measurement Systems Dynamic Temperature Profiling - temperature ranges from -50 C to 300 C Modular Metrology - Shadow Moiré, Digital Image Correlation, Digital Fringe Projection Automated Analyses - Bow, Twist, Coplanarity, Signed Warpage, CTE, Surface Tilt, etc. Data Management - Centralized database tools for production monitoring, trending and customer conformity/assurance requirements. All of the above combine to provide users with a low cost per test, a clear ROI and a platform for longterm, value-added functionality across both development and production operations. Digital Fringe Projection The Digital Fringe Projection (DFP) technique compliments the shadow moiré technique by adding step height measurement capabilities at high data point density. This technique is particularly useful for measurement of connectors, sockets, assembled modules, and PCB local areas. No grating is needed for the DFP technique, which helps with issues like outgassing and temperature uniformity sometimes seen with the shadow moiré technique. DFP also has the advantage of not being limited by data density, unlike the shadow moiré technique. DFP has the disadvantage of warpage resolution being dependant on field of view. For this technique a field of view of 64x48mm, generating a measurement resolution of 5 microns, was chosen for the DFP Module and CXP.

4 PRODUCTS AXP The TherMoiré AXP is a modular metrology solution that utilizes the shadow moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm. With time-temperature profiling capability, the TherMoiré AXP captures a complete history of a sample s behavior during a user-defined thermal profile. The combination of shadow moiré measurement and dynamic temperature profiling is the foundation of the patented TherMoiré platform. Dynamic profiling is the most effective approach to analyze mechanical behavior induced by real-world processes and operating environments. Using the TherMoiré AXP, engineers can gain a better understanding of the interactions between materials, packages, substrates and complete assemblies. The TherMoiré AXP is an expandable modular metrology platform: Up to 400 mm x 400 mm maximum sample size Acquisition of 1.4 million displacement data points in less than 2 seconds Enhanced temperature uniformity convective heating and cooling High resolution measurement of small form factor samples XYZ axis strain and CTE calculation Increased lab productivity with advanced, powered cooling Support for reliability testing from -50 C to 150 C+ and reflow simulation to 280 C+ Multiple part testing for increased throughput CXP The CXP (Convection Expandable Platform) is a low cost, stand alone equipment primarily targeted at the EMS and PCB Fab Market. The CXP uses the Digital Fringe Projection technique to measure a field of view of 64x48mm with a measurement resolution of 5 microns. The CXP use the same Studio software used to run the Akrometrix TherMoiré platforms. The CXP uses a convection oven for heating and cooling and includes a 2MP camera and projector for DFP measurements. The CXP oven can hold samples up to 300x300mm in size and the 64x48mm field of view is movable around the full oven 300x300mm field of view through a sliding gantry. The CXP provides a cost effective solution for customers looking to adhere to the IPC 9641 industry standard concerning measuring local board warpage.

5 SOFTWARE Akrometrix Studio 7.2 Akrometrix Studio is an advanced set of integrated software modules that work together to provide the most comprehensive set of surface characterization and analysis capabilities available. When used with the TherMoiré AXP surface measurement system, Studio powers a set of modular metrology solutions that generate fast, comprehensive surface information characterizing a wide range of microelectronic components and assemblies. Studio enables the user to draw conclusions and make decisions using a variety of powerful graphical and analytical analyses. Advanced thermal profiling performance combined with state-of-the-art metrology techniques including Shadow Moiré, Digital Fringe Projection (DFP) and Digital Image Correlation (DIC), deliver the next generation in accurate, affordable, and easy-to-implement automated flatness inspection solutions. On-Demand Measurement capabilities Run multiple phase image and 3D measurement results windows concurrently View displacement graphs and data when data is acquired Smooth phase images and re-render on the same screen Analyze results after changing any variable Compare measurements from multiple machines using built-in meta data Enhanced set-up capabilities for thermal profiling Show saturated and dark pixels for optimized image acquisition Control Region of Interest (ROI) settings with precision Continuously monitor sample environment with Live Camera Akrometrix Interface Analysis Surface-mount components warp during the reflow process, and the area where they attach also changes shape during assembly. This interface between components is where solder, paste, and gaps created due to thermal expansion combine to create 100% good products, or defects such as Head-on-Pillow, Shorts, and Opens. Fully understanding that critical interface between surfaces is more important than ever. While standard Akrometrix software allowed the analysis of an individual surface, such as a PCB or BGA, Interface Analysis is new software that enables 3D, 2D, and statistical review of a complete interface. Users can now visualize and quantify exactly how two surfaces will mate together. By combining this feature with the ability to measure surfaces at each temperature point during reflow, solder joint formation or failure can be predicted much more easily. Interface Analysis works with data supplied by any of the 200+ TherMoiré systems in use throughout the worldwide Electronics supply chain today. Introducing unique features such as Pass/Warning/Fail maps, and various gap and surface gauge information, Interface Analysis lets users see what is happening between two dynamic surfaces through the reflow process. Applications include SMT Assembly Planning and Troubleshooting, Failure Analysis, Supplier Qualification and Comparison, Ongoing SPC, Package Design, and FEA Modeling Validation

6 Microtronics mindset is Creating Value for our customers in the industries we are serving. Our deep experience and leadership in core Quality control technologies leads us in development and distributing cutting edge equipment. By permanent improvement, world wide support, trainings and tight cooperation with our customers, we guarantee high quality products and service. Local representatives are permantly trained to give you the best possible support - worlwide. Your Local Contact: Microtronic GmbH Kleingrötzing Neumarkt-Sankt Veit Tel: Fax: -30 Emai: Copyright Microtronic GmbH Änderungen vorbehalten

Projection Moiré vs. Shadow Moiré for Warpage Measurement and Failure Analysis of Advanced Packages

Projection Moiré vs. Shadow Moiré for Warpage Measurement and Failure Analysis of Advanced Packages Projection Moiré vs. Shadow Moiré for Warpage Measurement and Failure Analysis of Advanced Packages Joe Thomas ZN Technologies, LLC Atlanta, GA USA joe@zntechnologies.com ABSTRACT There are three key industry

More information

pb tec solutions GmbH, Max-Planck-Str. 11, 63755 Alzenau (Germany) Tel.: +49 6023 94771 0 Fax: +49 6023 94771 29 www.pbtecsolutions.

pb tec solutions GmbH, Max-Planck-Str. 11, 63755 Alzenau (Germany) Tel.: +49 6023 94771 0 Fax: +49 6023 94771 29 www.pbtecsolutions. pb tec solutions GmbH, Max-Planck-Str. 11, 63755 Alzenau (Germany) Tel.: +49 6023 94771 0 Fax: +49 6023 94771 29 www.pbtecsolutions.de info@pbtecsolutions.de Model Description AOI systems MV-3 MV-6E/EM

More information

NON-CONTACT 3D SURFACE METROLOGY

NON-CONTACT 3D SURFACE METROLOGY LOGO TITLE NON-CONTACT 3D SURFACE METROLOGY COMPANY PROFILE SLOGAN BECAUSE ACCURACY MATTERS LOGO TITLE APPLICATIONS THICK FILM The non-contact measurement technology checks the wet sample immediately after

More information

Embedding components within PCB substrates

Embedding components within PCB substrates Embedding components within PCB substrates Max Clemons, Altium - March 19, 2014 Continued pressure for electronic devices that provide greater functionality in ever-smaller formfactors is not only providing

More information

SOLDER CHARGE SMT: THE DESIGN AND VALIDATION OF NEW SOLDER ATTACH TECHNOLOGIES

SOLDER CHARGE SMT: THE DESIGN AND VALIDATION OF NEW SOLDER ATTACH TECHNOLOGIES SOLDER CHARGE SMT: THE DESIGN AND VALIDATION OF NEW SOLDER ATTACH TECHNOLOGIES Jim Hines 1, Kirk Peloza 2, Adam Stanczak 3, David Geiger 4 1 Molex Lisle, IL, USA 2 Molex Lisle, IL, USA 3 Molex Lisle, IL,

More information

MACHINE VISION FOR SMARTPHONES. Essential machine vision camera requirements to fulfill the needs of our society

MACHINE VISION FOR SMARTPHONES. Essential machine vision camera requirements to fulfill the needs of our society MACHINE VISION FOR SMARTPHONES Essential machine vision camera requirements to fulfill the needs of our society INTRODUCTION With changes in our society, there is an increased demand in stateof-the art

More information

SIMATIC IT Production Suite Answers for industry.

SIMATIC IT Production Suite Answers for industry. Driving Manufacturing Performance SIMATIC IT Production Suite Answers for industry. SIMATIC IT at the intersection of value creation processes With SIMATIC IT, Siemens is broadening the scope of MES. Plant

More information

Power Converter Module Package Process Specification for EN5310, EN5330, and EN5360 Converter Modules

Power Converter Module Package Process Specification for EN5310, EN5330, and EN5360 Converter Modules Power Converter Module Package Process Specification for EN5310, EN5330, and EN5360 Converter Modules Introduction This applications note addresses the following topics: PCB Design Recommendations: o Pad

More information

MANUFACTURING. Prototype Development. New Product Introduction (NPI) Builds. Process Development. Design for Manufacturing (DFM)

MANUFACTURING. Prototype Development. New Product Introduction (NPI) Builds. Process Development. Design for Manufacturing (DFM) MANUFACTURING Contract Assembly Prototype Development New Product Introduction (NPI) Builds Process Development Design for Manufacturing (DFM) Box Build & Test Rework & Repair Feasibility Assessment Experimental

More information

Report. Soldering Tests at COM Express Connectors, Type Receptacle and Plug. Order: Bergwerkstraße 50 D 86971 Peiting. Your Order-No.

Report. Soldering Tests at COM Express Connectors, Type Receptacle and Plug. Order: Bergwerkstraße 50 D 86971 Peiting. Your Order-No. Zentrum für Verbindungstechnik in der Elektronik Argelsrieder Feld 6 82234 Oberpfaffenhofen-Weßling Telefon: 081 53 / 403-0 Telefax: 081 53 / 403-15 Report Order: Soldering Tests at COM Express Connectors,

More information

Automotive Applications of 3D Laser Scanning Introduction

Automotive Applications of 3D Laser Scanning Introduction Automotive Applications of 3D Laser Scanning Kyle Johnston, Ph.D., Metron Systems, Inc. 34935 SE Douglas Street, Suite 110, Snoqualmie, WA 98065 425-396-5577, www.metronsys.com 2002 Metron Systems, Inc

More information

Multilevel Socket Technologies

Multilevel Socket Technologies Multilevel Socket Technologies High Performance IC Sockets And Test Adapters Overview Company Overview Over 5,000 products High Performance Adapters and Sockets Many Custom Designs & Turn-Key Solutions

More information

Optimizing Insertion Extraction Force in a Pin-Socket Interconnect

Optimizing Insertion Extraction Force in a Pin-Socket Interconnect Optimizing Insertion Extraction Force in a Pin-Socket Interconnect IC Socket industry trends are impacted by a combination of technology and market- driven factors. Technology driven factors include miniaturization,

More information

MANUFACTURING. Prototype Development. New Product Introduction (NPI) Builds. Process Development. Design for Manufacturing (DFM)

MANUFACTURING. Prototype Development. New Product Introduction (NPI) Builds. Process Development. Design for Manufacturing (DFM) MANUFACTURING Contract Assembly Prototype Development New Product Introduction (NPI) Builds Process Development Design for Manufacturing (DFM) Box Build & Test Rework & Repair Feasibility Assessment Experimental

More information

VECTORAL IMAGING THE NEW DIRECTION IN AUTOMATED OPTICAL INSPECTION

VECTORAL IMAGING THE NEW DIRECTION IN AUTOMATED OPTICAL INSPECTION VECTORAL IMAGING THE NEW DIRECTION IN AUTOMATED OPTICAL INSPECTION Mark J. Norris Vision Inspection Technology, LLC Haverhill, MA mnorris@vitechnology.com ABSTRACT Traditional methods of identifying and

More information

Flip Chip Package Qualification of RF-IC Packages

Flip Chip Package Qualification of RF-IC Packages Flip Chip Package Qualification of RF-IC Packages Mumtaz Y. Bora Peregrine Semiconductor San Diego, Ca. 92121 mbora@psemi.com Abstract Quad Flat Pack No Leads (QFNs) are thermally enhanced plastic packages

More information

HARTING. Electronic Connectors

HARTING. Electronic Connectors HARTING Electronic Connectors HARTING Electronic Connectors Global Innovative Technology The HARTING Technology Group has established a reputation for excellence and innovation with decades of experience

More information

MACHINE VISION MNEMONICS, INC. 102 Gaither Drive, Suite 4 Mount Laurel, NJ 08054 USA 856-234-0970 www.mnemonicsinc.com

MACHINE VISION MNEMONICS, INC. 102 Gaither Drive, Suite 4 Mount Laurel, NJ 08054 USA 856-234-0970 www.mnemonicsinc.com MACHINE VISION by MNEMONICS, INC. 102 Gaither Drive, Suite 4 Mount Laurel, NJ 08054 USA 856-234-0970 www.mnemonicsinc.com Overview A visual information processing company with over 25 years experience

More information

Your End-to-End PCB products design and Manufacturing in the 21 st Century

Your End-to-End PCB products design and Manufacturing in the 21 st Century Your End-to-End PCB products design and Manufacturing in the 21 st Century Who Are We? An engineering and manufacturing company dedicated to the advancement of technology that provides solutions related

More information

Machine Vision Optimizing Electronics Production

Machine Vision Optimizing Electronics Production Expert Guide Machine Vision Optimizing Electronics Production Introduction Today, semiconductors cannot be manufactured without using machine vision. In fact, machine vision is an enabling technology that

More information

A and M Electronics Contract Manufacturing Circuit Board Assembly 25018 Avenue Kearny Valencia, Ca. 91355 (661) 257-3680 or (800) 923-3058

A and M Electronics Contract Manufacturing Circuit Board Assembly 25018 Avenue Kearny Valencia, Ca. 91355 (661) 257-3680 or (800) 923-3058 A and M Electronics Contract Manufacturing Circuit Board Assembly 25018 Avenue Kearny Valencia, Ca. 91355 (661) 257-3680 or (800) 923-3058 "When Quality Counts, Choose A&M Electronics" SMT, BGA, & Through

More information

DETECTION OF DEFECT ON FBGA SOLDER BALLS USING X-RAY TECHNOLOGY

DETECTION OF DEFECT ON FBGA SOLDER BALLS USING X-RAY TECHNOLOGY DETECTION OF DEFECT ON FBGA SOLDER BALLS USING X-RAY TECHNOLOGY Pavel Řihák Doctoral Degree Programme (2), FEEC BUT E-mail: xrihak02@stud.feec.vutbr.cz Supervised by: Ivan Szendiuch E-mail: szend@feec.vutbr.cz

More information

How to make a Quick Turn PCB that modern RF parts will actually fit on!

How to make a Quick Turn PCB that modern RF parts will actually fit on! How to make a Quick Turn PCB that modern RF parts will actually fit on! By: Steve Hageman www.analoghome.com I like to use those low cost, no frills or Bare Bones [1] type of PCB for prototyping as they

More information

Multiple challenges. Comprehensive solutions.

Multiple challenges. Comprehensive solutions. Multiple challenges. Comprehensive solutions. Aerospace & Defense Interconnection Electronic Assemblies Omwise Engineering Interdan Energy Aviv Technologies Group, founded in 1988, is a full service technology

More information

Nitrogen system in explorflow series of Lead free reflow oven system VANSTRON AUTOMATION SMT SOLDERING SYSTEM EXPERT

Nitrogen system in explorflow series of Lead free reflow oven system VANSTRON AUTOMATION SMT SOLDERING SYSTEM EXPERT Nitrogen system in explorflow series of Lead free reflow oven system VANSTRON AUTOMATION SMT SOLDERING SYSTEM EXPERT To understand advantage of using Nitrogen system in the lead free process? Improved

More information

ERNI Systems USA Backplanes & Sub-Racks: Design, Simulation, Manufacturing and Test

ERNI Systems USA Backplanes & Sub-Racks: Design, Simulation, Manufacturing and Test ERNI Systems USA Backplanes Sub-Racks: Design, Simulation, Manufacturing and Test www.erni.com Engineering From Beginning to End Conceptualization From Customer Idea to Statement of Work (SOW) Structuring

More information

01005 Assembly Process, Materials and Tooling. Denis Barbini, Ph.D. Universal Instruments Corporation Advanced Process Lab

01005 Assembly Process, Materials and Tooling. Denis Barbini, Ph.D. Universal Instruments Corporation Advanced Process Lab 01005 Assembly Process, Materials and Tooling Denis Barbini, Ph.D. Universal Instruments Corporation Advanced Process Lab Introduction Introduction to the 01005 History and market information Availability

More information

HOT BAR REFLOW SOLDERING FUNDAMENTALS. A high quality Selective Soldering Technology

HOT BAR REFLOW SOLDERING FUNDAMENTALS. A high quality Selective Soldering Technology HOT BAR REFLOW SOLDERING FUNDAMENTALS A high quality Selective Soldering Technology Content 1. Hot Bar Reflow Soldering Introduction 2. Application Range 3. Process Descriptions > Flex to PCB > Wire to

More information

Glass Interposer Substrates: Fabrication, Characterization and Modeling

Glass Interposer Substrates: Fabrication, Characterization and Modeling Glass Interposer Substrates: Fabrication, Characterization and Modeling Aric B. Shorey, PhD Manager of Commercial Technology Semiconductor Glass Wafers/Corning, Incorporated 5 September 2013 Outline Glass

More information

Taking the Pain Out of Pb-free Reflow

Taking the Pain Out of Pb-free Reflow Taking the Pain Out of Pb-free Reflow Paul N. Houston & Brian J. Lewis Siemens Dematic Electronics Assembly Systems (770) 797-3362 Presented at APEX 2003, Anaheim CA Daniel F. Baldwin Engent, Inc. Norcross,

More information

Electronic Board Assembly

Electronic Board Assembly Electronic Board Assembly ERNI Systems Technology Systems Solutions - a one stop shop - www.erni.com Contents ERNI Systems Technology Soldering Technologies SMT soldering THR soldering THT soldering -

More information

On Demand Delivering Time Critical Technology Solutions

On Demand Delivering Time Critical Technology Solutions On Demand Delivering Time Critical Technology Solutions Supply and Demand On-Demand is a fully equipped technology driven manufacturing facility that offers enhanced flexibility to support rapid and complex

More information

Tube Control Measurement, Sorting Modular System for Glass Tube

Tube Control Measurement, Sorting Modular System for Glass Tube Tube Control Measurement, Sorting Modular System for Glass Tube Tube Control is a modular designed system of settled instruments and modules. It comprises measuring instruments for the tube dimensions,

More information

Measuring of the Temperature Profile during the Reflow Solder Process Application Note

Measuring of the Temperature Profile during the Reflow Solder Process Application Note Measuring of the Temperature Profile during the Reflow Solder Process Application Note Abstract With reference to the application note Further Details on lead free reflow soldering of LEDs the present

More information

Innovative Precision Metrology When accuracy, quality, speed and reliability matter.

Innovative Precision Metrology When accuracy, quality, speed and reliability matter. Innovative Precision Metrology When accuracy, quality, speed and reliability matter. NASA ISIW 2014 - Short range full-field non-contact structured blue light 3D scanning and photogrammetry for rapid and

More information

Fast Z-stacking 3D Microscopy Extended Depth of Field Autofocus Z Depth Measurement 3D Surface Analysis

Fast Z-stacking 3D Microscopy Extended Depth of Field Autofocus Z Depth Measurement 3D Surface Analysis Cam CANIMPEX CPX-SOLUTIONS 3D Digital Microscope Camera FAST PRECISE AFFORDABLE 3D CAMERA FOR MICROSCOPY Fast Z-stacking 3D Microscopy Extended Depth of Field Autofocus Z Depth Measurement 3D Surface Analysis

More information

SPI HS70. Remote Control of Multiple Lines with RMCworks. Systematic Process Management by Inspection Spec Server

SPI HS70. Remote Control of Multiple Lines with RMCworks. Systematic Process Management by Inspection Spec Server SPI HS70 Remote Control of Multiple Lines with RMCworks Machine Status Monitoring It costs highly to post process analysis technicians for each production line. RMCworks provides solution that one technical

More information

TB Crossbow TM Matrix and Crossbow TM 2mm+ Press-Fit Installation and Removal Process For Backplane Connectors. Revision A

TB Crossbow TM Matrix and Crossbow TM 2mm+ Press-Fit Installation and Removal Process For Backplane Connectors. Revision A Crossbow TM Matrix and Crossbow TM 2mm+ For Backplane Connectors Specification Revision Status Revision SCR No. Description Initial Date - S0463 Initial Release L. Taranowski 02/14/07 A S0802 Updated Copyright

More information

Ultraprint 2000 HiE. Ultraprint 2000 HiE Features MODULAR DESIGN ENSURES SUPERIOR ADAPTABILITY

Ultraprint 2000 HiE. Ultraprint 2000 HiE Features MODULAR DESIGN ENSURES SUPERIOR ADAPTABILITY Ultraprint 2000 HiE Since its introduction, the Ultraprint 2000 HiE has become the industry choice for high performance, reliable automated stencil printing. A key factor in its immediate worldwide acceptance

More information

DRIVING COST OUT OF YOUR DESIGNS THROUGH YOUR PCB FABRICATOR S EYES!

DRIVING COST OUT OF YOUR DESIGNS THROUGH YOUR PCB FABRICATOR S EYES! 4/3/2013 S THROUGH YOUR PCB FABRICATOR S EYES! Brett McCoy Eagle Electronics Schaumburg IL. New England Design and Manufacturing Tech Conference Brett McCoy: Vice President / Director of Sales Circuit

More information

AssurX Makes Quality & Compliance a Given Not Just a Goal

AssurX Makes Quality & Compliance a Given Not Just a Goal AssurX Makes Quality & Compliance a Given Not Just a Goal TRACK. MANAGE. AUTOMATE. IMPROVE. AssurX s powerfully flexible software unites and coordinates information, activities and documentation in one

More information

MoveInspect HF HR. 3D measurement of dynamic processes MEASURE THE ADVANTAGE. MoveInspect TECHNOLOGY

MoveInspect HF HR. 3D measurement of dynamic processes MEASURE THE ADVANTAGE. MoveInspect TECHNOLOGY MoveInspect HF HR 3D measurement of dynamic processes MEASURE THE ADVANTAGE MoveInspect TECHNOLOGY MoveInspect HF HR 3D measurement of dynamic processes Areas of application In order to sustain its own

More information

Today's Vapor Phase Soldering An Optimized Reflow Technology for Lead Free Soldering

Today's Vapor Phase Soldering An Optimized Reflow Technology for Lead Free Soldering Today's Vapor Phase Soldering An Optimized Reflow Technology for Lead Free Soldering Dipl.-Ing. Helmut Leicht; Andreas Thumm IBL-Löttechnik GmbH www.ibl-loettechnik.de, Germany ABSTRACT In the beginning

More information

PCB inspection is more important today than ever before!

PCB inspection is more important today than ever before! PCB inspection is more important today than ever before! Industry experts continue to stress the need to inspect hidden solder joints! Figure 1. The BGA package has not been placed into the paste deposit.

More information

STABLCOR Frequently Asked Questions

STABLCOR Frequently Asked Questions Q.1 What is STABLCOR? STABLCOR is a laminate based thermal management technology for the Printed Circuit Board and Substrate markets. Q.2 What are the benefits of using STABLCOR Technology? There are FOUR

More information

GE Intelligent Platforms. solutions for dairy manufacturing

GE Intelligent Platforms. solutions for dairy manufacturing GE Intelligent Platforms solutions for dairy manufacturing Optimize your dairy operations Combining extensive knowledge of the dairy industry and processes with the latest innovative technologies, we have

More information

Rapid Application Development for Machine Vision A New Approach

Rapid Application Development for Machine Vision A New Approach Rapid Application Development for Machine Vision A New Approach Introduction Converging technologies, such as the PCI-bus and Intel MMX, have created so much bandwidth and computing power that automation

More information

Den-on Rework Reference Process for Mobile Products Intel Socket rpga-989using Den-on BGA rework station RD-500III

Den-on Rework Reference Process for Mobile Products Intel Socket rpga-989using Den-on BGA rework station RD-500III Den-on Rework Reference Process for Mobile Products Intel Socket rpga-989using Den-on BGA rework station RD-500III *This document shows the whole process on how to repair the Intel socket rpga-989 using

More information

Boost Your Yield Get more out of Inspection Inspection-Systems for NonWovens 100% Optical Web Inspection. The Winning Way

Boost Your Yield Get more out of Inspection Inspection-Systems for NonWovens 100% Optical Web Inspection. The Winning Way Boost Your Yield Get more out of Inspection Inspection-Systems for NonWovens 100% Optical Web Inspection The Winning Way We deliver technology for yield management ISRA VISION: Advanced technology for

More information

CASE STUDY: SCREEN PRINTING SOLUTIONS FOR SMALL DIE & PRECISION ALIGNMENT CHALLENGES

CASE STUDY: SCREEN PRINTING SOLUTIONS FOR SMALL DIE & PRECISION ALIGNMENT CHALLENGES CASE STUDY: SCREEN PRINTING SOLUTIONS FOR SMALL DIE & PRECISION ALIGNMENT CHALLENGES By William E. Coleman Ph.D., Photo Stencil and Travis Tanner, Plexus Manufacturing Solutions When you have a gold Kovar

More information

One solution, countless benefits

One solution, countless benefits www.exordia.co.za One solution, countless benefits exsam New generation strategic asset management PwC s exsam is built to empower the strategic management of diverse assets. 2 exsam One solution, countless

More information

Wafer Level Testing Challenges for Flip Chip and Wafer Level Packages

Wafer Level Testing Challenges for Flip Chip and Wafer Level Packages Wafer Level Testing Challenges for Flip Chip and Wafer Level Packages by Lim Kok Hwa and Andy Chee STATS ChipPAC Ltd. 5 Yishun Street 23, Singapore 768442 kokhwa.lim@statschippac.com; kenghwee.chee@statschippac.com

More information

Comparison of OSRAM OSTAR Headlamp Pro and OSLON Black Flat Application Note

Comparison of OSRAM OSTAR Headlamp Pro and OSLON Black Flat Application Note Comparison of OSRAM OSTAR Headlamp Pro and Application Note Abstract In this application note a new SMD LED type is presented as an alternative to existing LEDs to create multi-chip light sources for diverse

More information

Surface Mount Technology cooling for high volumes applications by: Cesare Capriz Aavid Thermalloy via XXV Aprile 32 Cadriano (BO) ITALY

Surface Mount Technology cooling for high volumes applications by: Cesare Capriz Aavid Thermalloy via XXV Aprile 32 Cadriano (BO) ITALY Surface Mount Technology cooling for high volumes applications by: Cesare Capriz Aavid Thermalloy via XXV Aprile 32 Cadriano (BO) ITALY Abstract: The automotive technology is fast moving in integrating

More information

Fluorescent Array Imaging Reader

Fluorescent Array Imaging Reader Fluorescent Array Imaging Reader Multiplex Enabled For 2-Color Fluorescent Microarrays Extended Dynamic Range Automated Spot Analysis Compact and Affordable Microarray Analysis With FLAIR FLAIR Sensovation

More information

Driving Business Value with Big Data and Analytics

Driving Business Value with Big Data and Analytics Emily Plachy informsny September 17, 2014 Driving Business Value with Big Data and Analytics Business Analytics Transformation Making IBM a Smarter Enterprise Agenda Case studies Human Resources: Detect

More information

Nordson EFD Solutions: Fluid Positioning & Precision Dispensing in Mobile Device and Wearables Manufacturing

Nordson EFD Solutions: Fluid Positioning & Precision Dispensing in Mobile Device and Wearables Manufacturing Nordson EFD Solutions: Fluid Positioning & Precision Dispensing in Mobile Device and Wearables Manufacturing Introduction As consumers demand thinner, lighter, more sophisticated and durable mobile devices

More information

STERIDRY DRY HEAT Sterilization. Lower Cost, Worry-Free & Green WHY GRUENBERG DRY HEAT STERILIZATION?

STERIDRY DRY HEAT Sterilization. Lower Cost, Worry-Free & Green WHY GRUENBERG DRY HEAT STERILIZATION? WHY GRUENBERG DRY HEAT STERILIZATION? Design assistance from leader in lab animal science sterilization Lowest total cost of ownership Greater output in a smaller footprint Safer operation Extended cage

More information

Integration Services

Integration Services Integration Services EXPERIENCED TEAM ADVANCED TECHNOLOGY PROVEN SOLUTIONS Integrations for large scale metrology applications Metris metrology to streamline your CAPABILITIES Advanced systems design Engineering

More information

Den-on Rework Reference Process for Desktop platform and new Intel Socket LGA-1156 using the Den-on BGA rework station RD-500II and III

Den-on Rework Reference Process for Desktop platform and new Intel Socket LGA-1156 using the Den-on BGA rework station RD-500II and III Den-on Rework Reference Process for Desktop platform and new Intel Socket LGA-1156 using the Den-on BGA rework station RD-500II and III *This document shows the whole process on how to repair the Intel

More information

3D TOPOGRAPHY & IMAGE OVERLAY OF PRINTED CIRCUIT BOARD ASSEMBLY

3D TOPOGRAPHY & IMAGE OVERLAY OF PRINTED CIRCUIT BOARD ASSEMBLY 3D TOPOGRAPHY & IMAGE OVERLAY OF PRINTED CIRCUIT BOARD ASSEMBLY Prepared by Duanjie Li, PhD & Andrea Novitsky 6 Morgan, Ste156, Irvine CA 92618 P: 949.461.9292 F: 949.461.9232 nanovea.com Today's standard

More information

Good Boards = Results

Good Boards = Results Section 2: Printed Circuit Board Fabrication & Solderability Good Boards = Results Board fabrication is one aspect of the electronics production industry that SMT assembly engineers often know little about.

More information

Miniaturizing Flexible Circuits for use in Medical Electronics. Nate Kreutter 3M

Miniaturizing Flexible Circuits for use in Medical Electronics. Nate Kreutter 3M Miniaturizing Flexible Circuits for use in Medical Electronics Nate Kreutter 3M Drivers for Medical Miniaturization Market Drivers for Increased use of Medical Electronics Aging Population Early Detection

More information

WELCOME TO INFOWORLD A DIVISION OF HAWARE VENTURES PVT LTD.

WELCOME TO INFOWORLD A DIVISION OF HAWARE VENTURES PVT LTD. WELCOME TO INFOWORLD A DIVISION OF HAWARE VENTURES PVT LTD. 1. 2. 3. 4. 5. 6. INTRODUCTION ABOUT US VISION MISSION & VALUES OUR SERVICES WHY US? OUR OPERATION a. Marketing strategy b. Talent & HR c. Supply

More information

Profile the easy way..

Profile the easy way.. Profile the easy way.. WHO s USING SolderStar? SolderStar instruments are in use all around the world helping Engineering setup and maintain their solder process quality. We have over 1000 instruments

More information

ADVANCES IN AUTOMATIC OPTICAL INSPECTION: GRAY SCALE CORRELATION vs. VECTORAL IMAGING

ADVANCES IN AUTOMATIC OPTICAL INSPECTION: GRAY SCALE CORRELATION vs. VECTORAL IMAGING ADVANCES IN AUTOMATIC OPTICAL INSPECTION: GRAY SCALE CORRELATION vs. VECTORAL IMAGING Vectoral Imaging, SPC & Closed Loop Communication: The Zero Defect SMD Assembly Line Mark J. Norris Vision Inspection

More information

FLASHSOLDERING - A NEW PROCESS FOR REFLOW SOLDERING INSULATED MAGNET WIRE TO ELECTRONIC CONTACTS

FLASHSOLDERING - A NEW PROCESS FOR REFLOW SOLDERING INSULATED MAGNET WIRE TO ELECTRONIC CONTACTS FLASHSOLDERING - A NEW PROCESS FOR REFLOW SOLDERING INSULATED MAGNET WIRE TO ELECTRONIC CONTACTS David W. Steinmeier microjoining Solutions & Mike Becker Teka Interconnection Systems Abstract: Flashing

More information

Company Profile 2014 October 2014

Company Profile 2014 October 2014 Company Profile 2014 October 2014 Company - Vision We are an independent and international full range Electronic Manufacturing Service (EMS) We provide innovative solutions and as an efficient performing

More information

Achieving high performance with Accenture s on-demand solution for the chemical industry. Driving business performance with SAP Business ByDesign

Achieving high performance with Accenture s on-demand solution for the chemical industry. Driving business performance with SAP Business ByDesign Achieving high performance with Accenture s on-demand solution for the chemical industry Driving business performance with SAP Business ByDesign 2 Accenture helps small to mid-size companies and subsidiaries

More information

TestScape. On-line, test data management and root cause analysis system. On-line Visibility. Ease of Use. Modular and Scalable.

TestScape. On-line, test data management and root cause analysis system. On-line Visibility. Ease of Use. Modular and Scalable. TestScape On-line, test data management and root cause analysis system On-line Visibility Minimize time to information Rapid root cause analysis Consistent view across all equipment Common view of test

More information

Q&A. Contract Manufacturing Q&A. Q&A for those involved in Contract Manufacturing using Nelco Electronic Materials

Q&A. Contract Manufacturing Q&A. Q&A for those involved in Contract Manufacturing using Nelco Electronic Materials Q&A Q&A for those involved in Contract Manufacturing using Nelco Electronic Materials 1. Do Nelco laminates have any discoloration effects or staining issues after multiple high temperature exposures?

More information

Sentry Power SystemSM. More Intelligent. More Reliable. Easier to Manage.

Sentry Power SystemSM. More Intelligent. More Reliable. Easier to Manage. Sentry Power SystemSM More Intelligent. More Reliable. Easier to Manage. Sentry Power System. The industry s only data center rack-level power system. Only from Server Tech. You want ultra-reliable power

More information

Enpirion Application Note General Enpirion Product QFN Package Soldering Guideline

Enpirion Application Note General Enpirion Product QFN Package Soldering Guideline Enpirion Application Note General Enpirion Product QFN Package Soldering Guideline 1.0 - Introduction Altera ENPIRION power converter packages are designed with a plastic leadframe package technology that

More information

IMAPs La Rochelle. Indium Corporation. Indium Thermal Materials. Feb 2 nd 2012

IMAPs La Rochelle. Indium Corporation. Indium Thermal Materials. Feb 2 nd 2012 Indium Corporation Feb 2 nd 2012 IMAPs La Rochelle Graham Wilson Applications Engineer Tel: +44 (0)1908 580400 Mobile: +44 (0)7825 189554 E-mail: gwilson@indium.com Web: www.indium.com Agenda Indium Corporation

More information

Pipeline External Corrosion Analysis Using a 3D Laser Scanner

Pipeline External Corrosion Analysis Using a 3D Laser Scanner Pipeline Technology Conference 2013 Pipeline External Corrosion Analysis Using a 3D Laser Scanner Pierre-Hugues ALLARD, Charles MONY Creaform, www.creaform3d.com 5825 rue St-Georges, Lévis (QC), Canada,

More information

FOR HIGH-TECH PRODUCTION

FOR HIGH-TECH PRODUCTION AUTOMATION & METROLOGY AUTOMATION & METROLOGY SOLUTIONS FOR HIGH-TECH PRODUCTION key technologies for multiple industries MANZ AG /// hightech solutions /// 5 2015 Acquisition of KLEO, a company of the

More information

BGA Repair: A Better Understanding can Reduce Fears, Guarantee Process Control and Save Money

BGA Repair: A Better Understanding can Reduce Fears, Guarantee Process Control and Save Money Technical Article : A Better Understanding can Reduce Fears, Guarantee Process Control and Save Money by Mark Cannon Current international studies reinforce the global trend to area array pakkages. BGA,

More information

IPS Analytics Platform Strategy. We make video surveillance intelligent.

IPS Analytics Platform Strategy. We make video surveillance intelligent. IPS Analytics Platform Strategy We make video surveillance intelligent. Overview Market Business Mission Positioning on the Market Solutions (IPS-VM, Edge-based, Server-based) Introduction of new IPS Platform

More information

ECE Senior Design Capstone Project Guidelines

ECE Senior Design Capstone Project Guidelines What is Senior Design Project? Senior Design Project is a set of two required courses that Electrical Engineering students usually take in their last two semesters of study. The Fall semester (ECE 480)

More information

AN-5082 Power56 Wave-Soldering Board Assembly Considerations

AN-5082 Power56 Wave-Soldering Board Assembly Considerations www.fairchildsemi.com AN-5082 Power56 Wave-Soldering Board Assembly Considerations Introduction PQFN packages are commonly mounted on board through reflow process. The board mounting guidelines through

More information

Modular. Precise. Efficient.

Modular. Precise. Efficient. Modular. Precise. Efficient. www.stsindustrie.com 2 STS: Surface Technology Solutions STS: Surface Technology Solutions Modular. Precise. Efficient. STS brings you custom-built solutions for your production

More information

Cost-Effective Production of Thin-Film Solar Modules Allegro Laser Scriber by LPKF SolarQuipment

Cost-Effective Production of Thin-Film Solar Modules Allegro Laser Scriber by LPKF SolarQuipment Cost-Effective Production of Thin-Film Solar Modules Allegro Laser Scriber by LPKF SolarQuipment In musical terminology, Allegro means fast. LPKF Allegro systems perform at high speed with absolute precision.

More information

Quad Flat No-Lead (QFN) Application Note and Best Practices

Quad Flat No-Lead (QFN) Application Note and Best Practices Quad Flat No-Lead (QFN) Application Note and Best Practices Objective The purpose of this application note and best practices guide is to describe the QFN type component and provide testing methodology

More information

IDC MarketScape Excerpt: Worldwide Business Analytics BPO Services 2014 Vendor Assessment

IDC MarketScape Excerpt: Worldwide Business Analytics BPO Services 2014 Vendor Assessment IDC MarketScape IDC MarketScape Excerpt: Worldwide Business Analytics BPO Services 2014 Vendor Assessment Mukesh Dialani THIS IDC MARKETSCAPE EXCERPT FEATURES: TCS IDC MARKETSCAPE FIGURE FIGURE 1 IDC MarketScape

More information

Scalability and Performance Report - Analyzer 2007

Scalability and Performance Report - Analyzer 2007 - Analyzer 2007 Executive Summary Strategy Companion s Analyzer 2007 is enterprise Business Intelligence (BI) software that is designed and engineered to scale to the requirements of large global deployments.

More information

The Electronics Packaging & Flexible Electronics Centers at Binghamton University

The Electronics Packaging & Flexible Electronics Centers at Binghamton University The Electronics Packaging & Flexible Electronics Centers at Binghamton University November 20, 2014 8-9:30 a.m. PST (US) Research Webinar 1 Agenda About S3IP IEEC Vision & Mission IEEC model History Annual

More information

Electronics Manufacturing Services, Since 1986

Electronics Manufacturing Services, Since 1986 Page 1 of 5 Electronics Manufacturing Services, Since 1986 Professionalized Products and Services, Inc. (PPSI) is a contract manufacturer, located in the Houston area, specializing in PCB assembly and

More information

SOLDERBALL PIN TECHNOLOGY PROVIDES SMT REFLOW SOLUTION TO CO-PLANARITY INTERCONNECTION ISSUES FOR PCB-BASED SUBASSEMBLIES AND POWER MODULES

SOLDERBALL PIN TECHNOLOGY PROVIDES SMT REFLOW SOLUTION TO CO-PLANARITY INTERCONNECTION ISSUES FOR PCB-BASED SUBASSEMBLIES AND POWER MODULES SOLDERBALL PIN TECHNOLOGY PROVIDES SMT REFLOW SOLUTION TO CO-PLANARITY INTERCONNECTION ISSUES FOR PCB-BASED SUBASSEMBLIES AND POWER MODULES by Carlos Juvera SMT Product Manager Autosplice Inc. Abstract:

More information

RENAULT J77 Modus Wing.

RENAULT J77 Modus Wing. RENAULT J77 Modus Wing RENAULT J77 Modus Wing Material : GEP Noryl GTX VP7146 Mould : - Ampcoloy 940 -P20 Melt temperature : 305 C Inlet water temperature : 105 C Total water flow rate : 7 m 3 /h Injection

More information

REVOLUTIONISING CONTACT CENTRE QUALITY MANAGEMENT WITH SPEECH ANALYTICS

REVOLUTIONISING CONTACT CENTRE QUALITY MANAGEMENT WITH SPEECH ANALYTICS REVOLUTIONISING CONTACT CENTRE QUALITY MANAGEMENT WITH SPEECH ANALYTICS TABLE OF CONTENTS Introduction... 1 Challenges of the Traditional Quality Management Process... 1 Challenge #1: Small Sample Size...

More information

Adept Technology, Inc. Industrial Robotics Product Range YOUR INTELLIGENT ROBOTICS PARTNER

Adept Technology, Inc. Industrial Robotics Product Range YOUR INTELLIGENT ROBOTICS PARTNER Adept Technology, Inc. Industrial Robotics Product Range YOUR INTELLIGENT ROBOTICS PARTNER ADEPT ROBOTS Quattro Parallel Robots The Adept Quattro robot is the fastest parallel robot in the world. The patented

More information

Supply Chain Distribution Trends in an Improving Economy

Supply Chain Distribution Trends in an Improving Economy WHITE PAPER Supply Chain Distribution Trends in an Improving Economy An improving economy gives businesses an opportunity to reassess their strategies, plans and tactics as well as the impetus to tune

More information

Every idea starts with ABC. Electronic Contract Manufacturing Cables and Harnesses System Integration Assembly Engineering

Every idea starts with ABC. Electronic Contract Manufacturing Cables and Harnesses System Integration Assembly Engineering Every idea starts with ABC Electronic Contract Manufacturing Cables and Harnesses System Integration Assembly Engineering ABC Assembly offers a dynamic approach to the electronics industry. We are a full-service

More information

STEMMER IMAGING DAYS GOCATOR ALL-IN-ONE 3D SMART SENSORS: INDUSTRIAL APPLICATIONS. Ing. Christian Leitner Territory Manager EMEAR

STEMMER IMAGING DAYS GOCATOR ALL-IN-ONE 3D SMART SENSORS: INDUSTRIAL APPLICATIONS. Ing. Christian Leitner Territory Manager EMEAR STEMMER IMAGING DAYS GOCATOR ALL-IN-ONE 3D SMART SENSORS: INDUSTRIAL APPLICATIONS Ing. Christian Leitner Territory Manager EMEAR LMI TECHNOLOGIES About Our Company QUICK FACTS 37 years experience 175 employees

More information

1.Introduction. Introduction. Most of slides come from Semiconductor Manufacturing Technology by Michael Quirk and Julian Serda.

1.Introduction. Introduction. Most of slides come from Semiconductor Manufacturing Technology by Michael Quirk and Julian Serda. .Introduction If the automobile had followed the same development cycle as the computer, a Rolls- Royce would today cost $00, get one million miles to the gallon and explode once a year Most of slides

More information

Soldering Process Considerations for Land Grid Array Modules

Soldering Process Considerations for Land Grid Array Modules Soldering Process Considerations for Land Grid Array Modules The reflow process is dependant on many parameters; this application note is presented as a guide to soldering LGA modules. Manufacturers are

More information

Your Partner for High Mix Low Volume Printed Circuit Board Assembly, Box Build and Equipment Manufacturing

Your Partner for High Mix Low Volume Printed Circuit Board Assembly, Box Build and Equipment Manufacturing Your Partner for High Mix Low Volume Printed Circuit Board Assembly, Box Build and Equipment Manufacturing AS9100 Rev A Letter Of Conformance Company Profile CEI Contract Manufacturing Limited was listed

More information

IBM Enterprise Content Management Product Strategy

IBM Enterprise Content Management Product Strategy White Paper July 2007 IBM Information Management software IBM Enterprise Content Management Product Strategy 2 IBM Innovation Enterprise Content Management (ECM) IBM Investment in ECM IBM ECM Vision Contents

More information

MANUFACTURING INNOVATION

MANUFACTURING INNOVATION MANUFACTURING INNOVATION CORPORATE HISTORY Founded in 1974, as Dynamic Circuits we mainly served customers with production volume demands. We soon found that the market also had strong requirements for

More information

Automated Optical Inspection is one of many manufacturing test methods common in the assembly of printed circuit boards. This list includes:

Automated Optical Inspection is one of many manufacturing test methods common in the assembly of printed circuit boards. This list includes: What is AOI? Automated Optical Inspection is one of many manufacturing test methods common in the assembly of printed circuit boards. This list includes: Test methods for electronic assemblies: - FT (Functional

More information