3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection

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1 3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection

2 ABOUT AKROMETRIX Company Overview Akrometrix mission is to lead the industry in non-contact surface measurement tools. Based on a culture of innovation and fairness, the company is dedicated to building its global presence by designing its operations and products from our customers perspective. We will grow and expand our market leadership without sacrificing our core values of integrity, respect and fairness in all of our interactions. Whether an employee, a customer or a supplier, we strive to uphold these values to their highest levels. Integrity - the belief that we must do what we say and mean what we say in all of our interactions with prospects, customers, vendors and our associates. Respect - the love of doing what excites us for those that can benefit from our technology, expertise, experience and innovation. Fairness - knowing that we will treat everyone from a perspective of equity regardless of the situation. Competitive advantage for Akrometrix is competitive advantage for our customers. Akrometrix will relentlessly leverage, improve and expand what we do best to ensure total satisfaction for our valued customers. In 2007, 95% of the top 20 global semiconductor manufacturing companies relied upon Akrometrix equipment for critical characterization needs. Mission, core values, competitive advantage and solid strategic planning - all come together to make Akrometrix a trusted partner to each of our valued customers. Company History Akrometrix is a Georgia-based company founded in 1994 to provide services and equipment to measure and resolve thermo-mechanical surface flatness issues in manufacturing and assembly operations, most notably in the production of electronic circuit substrates and components. Its pioneering technology was based on the research of Dr. I. Charles Ume, a professor at the Georgia Institute of Technology (Georgia Tech). Akrometrix licensed and commercialized the application of Dr. Ume s technology, which today serves as a crucial component in the production, and continued miniaturization, of advanced electronics products. Akrometrix has become the industry leader in real-time metrology emphasizing resolution of thermo-mechanical issues at all levels of electronic materials production, components fabrication and assembly processes. More than ever, Akrometrix product and service offerings directly reflect our close interaction and long standing relationships with our valued customer base. A comprehensive strategy that includes modular metrology (Shadow Moiré, Digital Image Correlation, Digital Fringe Projection), expanded thermal environment simulation (-50 C to 300 C), powerful analysis algorithms and data management solutions enables our customers to implement a company wide platform for effective warpage management. Our global presence offers high caliber sales, service and applications support to all of the industry. This platform and the new generation of equipment offerings positions all segments of the supply chain to immediately realize benefits in the form of improved first pass yields and product reliability. In addition to being integral to solving today s package and board assembly challenges, Akrometrix technology and equipment will be leading the charge towards the future as we introduce adaptive processing capabilities that will further enhance the utility and value of our customers investments.

3 THE TECHNOLOGY TherMoiré Akrometrix patented TherMoiré systems are the industry leading tools for advanced characterization of temperature-dependent warpage. First introduced in 1998 for use as a laboratory tool, today s generation of TherMoiré product offerings serves as the platform for an enterprise-wide warpage management solution. Innovative developments in hardware, software and data management make the TherMoiré an essential value-added component for microelectronics manufacturing around the world. TherMoiré technology can simulate your thermal processing and operating environment conditions, while capturing a complete history of out-of-plane displacement behavior. Applying this critical information to form - or achieve compliance for - component/substrate behavior allowances (i.e. warpage specifications) can directly impact level I and level II assembly yields and enhance product reliability. TherMoiré In-Process Warpage Measurement Systems Dynamic Temperature Profiling - temperature ranges from -50 C to 300 C Modular Metrology - Shadow Moiré, Digital Image Correlation, Digital Fringe Projection Automated Analyses - Bow, Twist, Coplanarity, Signed Warpage, CTE, Surface Tilt, etc. Data Management - Centralized database tools for production monitoring, trending and customer conformity/assurance requirements. All of the above combine to provide users with a low cost per test, a clear ROI and a platform for longterm, value-added functionality across both development and production operations. Digital Fringe Projection The Digital Fringe Projection (DFP) technique compliments the shadow moiré technique by adding step height measurement capabilities at high data point density. This technique is particularly useful for measurement of connectors, sockets, assembled modules, and PCB local areas. No grating is needed for the DFP technique, which helps with issues like outgassing and temperature uniformity sometimes seen with the shadow moiré technique. DFP also has the advantage of not being limited by data density, unlike the shadow moiré technique. DFP has the disadvantage of warpage resolution being dependant on field of view. For this technique a field of view of 64x48mm, generating a measurement resolution of 5 microns, was chosen for the DFP Module and CXP.

4 PRODUCTS AXP The TherMoiré AXP is a modular metrology solution that utilizes the shadow moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm. With time-temperature profiling capability, the TherMoiré AXP captures a complete history of a sample s behavior during a user-defined thermal profile. The combination of shadow moiré measurement and dynamic temperature profiling is the foundation of the patented TherMoiré platform. Dynamic profiling is the most effective approach to analyze mechanical behavior induced by real-world processes and operating environments. Using the TherMoiré AXP, engineers can gain a better understanding of the interactions between materials, packages, substrates and complete assemblies. The TherMoiré AXP is an expandable modular metrology platform: Up to 400 mm x 400 mm maximum sample size Acquisition of 1.4 million displacement data points in less than 2 seconds Enhanced temperature uniformity convective heating and cooling High resolution measurement of small form factor samples XYZ axis strain and CTE calculation Increased lab productivity with advanced, powered cooling Support for reliability testing from -50 C to 150 C+ and reflow simulation to 280 C+ Multiple part testing for increased throughput CXP The CXP (Convection Expandable Platform) is a low cost, stand alone equipment primarily targeted at the EMS and PCB Fab Market. The CXP uses the Digital Fringe Projection technique to measure a field of view of 64x48mm with a measurement resolution of 5 microns. The CXP use the same Studio software used to run the Akrometrix TherMoiré platforms. The CXP uses a convection oven for heating and cooling and includes a 2MP camera and projector for DFP measurements. The CXP oven can hold samples up to 300x300mm in size and the 64x48mm field of view is movable around the full oven 300x300mm field of view through a sliding gantry. The CXP provides a cost effective solution for customers looking to adhere to the IPC 9641 industry standard concerning measuring local board warpage.

5 SOFTWARE Akrometrix Studio 7.2 Akrometrix Studio is an advanced set of integrated software modules that work together to provide the most comprehensive set of surface characterization and analysis capabilities available. When used with the TherMoiré AXP surface measurement system, Studio powers a set of modular metrology solutions that generate fast, comprehensive surface information characterizing a wide range of microelectronic components and assemblies. Studio enables the user to draw conclusions and make decisions using a variety of powerful graphical and analytical analyses. Advanced thermal profiling performance combined with state-of-the-art metrology techniques including Shadow Moiré, Digital Fringe Projection (DFP) and Digital Image Correlation (DIC), deliver the next generation in accurate, affordable, and easy-to-implement automated flatness inspection solutions. On-Demand Measurement capabilities Run multiple phase image and 3D measurement results windows concurrently View displacement graphs and data when data is acquired Smooth phase images and re-render on the same screen Analyze results after changing any variable Compare measurements from multiple machines using built-in meta data Enhanced set-up capabilities for thermal profiling Show saturated and dark pixels for optimized image acquisition Control Region of Interest (ROI) settings with precision Continuously monitor sample environment with Live Camera Akrometrix Interface Analysis Surface-mount components warp during the reflow process, and the area where they attach also changes shape during assembly. This interface between components is where solder, paste, and gaps created due to thermal expansion combine to create 100% good products, or defects such as Head-on-Pillow, Shorts, and Opens. Fully understanding that critical interface between surfaces is more important than ever. While standard Akrometrix software allowed the analysis of an individual surface, such as a PCB or BGA, Interface Analysis is new software that enables 3D, 2D, and statistical review of a complete interface. Users can now visualize and quantify exactly how two surfaces will mate together. By combining this feature with the ability to measure surfaces at each temperature point during reflow, solder joint formation or failure can be predicted much more easily. Interface Analysis works with data supplied by any of the 200+ TherMoiré systems in use throughout the worldwide Electronics supply chain today. Introducing unique features such as Pass/Warning/Fail maps, and various gap and surface gauge information, Interface Analysis lets users see what is happening between two dynamic surfaces through the reflow process. Applications include SMT Assembly Planning and Troubleshooting, Failure Analysis, Supplier Qualification and Comparison, Ongoing SPC, Package Design, and FEA Modeling Validation

6 Microtronics mindset is Creating Value for our customers in the industries we are serving. Our deep experience and leadership in core Quality control technologies leads us in development and distributing cutting edge equipment. By permanent improvement, world wide support, trainings and tight cooperation with our customers, we guarantee high quality products and service. Local representatives are permantly trained to give you the best possible support - worlwide. Your Local Contact: Microtronic GmbH Kleingrötzing Neumarkt-Sankt Veit Tel: Fax: -30 Emai: Copyright Microtronic GmbH Änderungen vorbehalten

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