General Purpose ESD Protection - SP1003 Series. Description. Features. Applications. Mobile phones Smart phones PDAs Portable navigation devices
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1 General Purpose ESD Protetion - SP003 Series SP003 Series - 30pF 30kV Unidiretional Disrete TVS RoHS Pb GREEN Desription Zener diodes fabriated in a proprietary silion avalanhe tehnology protet eah I/O pin to provide a high level of protetion for eletroni equipment that may experiene destrutive eletrostati disharges (ESD. These robust diodes an safely absorb repetitive ESD strikes at ±30kV (ontat disharge, IEC without performane degradation. Additionally, eah diode an safely dissipate 7A of 8/0µs surge urrent (IEC with very low lamping voltages. Features Pinout SOD73 SOD88 (AEC-Q0 qualified ESD, IEC , ±30kV ontat, ±30kV air EFT, IEC , 40A (5/50ns Lightning, IEC , 7A (8/0µs Low leakage urrent of 00nA (MAX at 5V Appliations Tiny SOD73/ SOD88 (JEDEC MO-36 pakage saves board spae Fits solder footprint of industry standard 040 (005 devies AEC-Q0 qualified (SOD88 pakage Funtional Blok Diagram Mobile phones Smart phones PDAs Portable navigation devies Digital ameras Portable medial devies Appliation Example Additional Information Low-speed port I/O port Controller Datasheet Resoures Samples Outside World (4 SP003-0 B B B3 B4 Signal Ground Shield Ground Life Support Note: Not Intended for Use in Life Support or Life Saving Appliations The produts shown herein are not designed for use in life sustaining or life saving appliations unless otherwise expressly indiated.
2 General Purpose ESD Protetion - SP003 Series Absolute Maximum Ratings Parameter Value Units I PP Peak Pulse Current (t p =8/0μs 7.0 A T OP Operating Temperature 40 to 5 C T STOR Storage Temperature 55 to 50 C CAUTION: Stresses above those listed in Absolute Maximum Ratings may ause permanent damage to the devie. This is a stress only rating and operation of the devie at these or any other onditions above those indiated in the operational setions of this speifiation is not implied. Thermal Information Parameter Rating Units Storage Temperature Range 55 to 50 C Maximum Juntion Temperature 50 C Maximum Lead Temperature (Soldering 0-40s 60 C Eletrial Charateristis (T OP =5ºC Parameter Test Conditions Min Typ Max Units Forward Voltage Drop V F I F = 0mA 0.8. V Reverse Voltage Drop V R I R =ma V Reverse Standoff Voltage V RWM I R µa 5.0 V Reverse Leakage Current I LEAK V R =5V 00 na I pp =6A t p =8/0µs.4 V Clamp Voltage V C I pp =7A t p =8/0µs.0 V Dynami Resistane R DYN TLP, t p =00ns, /O to GND 0.5 Ω IEC (Contat Disharge ±30 kv ESD Withstand Voltage V ESD IEC (Air Disharge ±30 kv Diode Capaitane C D Reverse Bias=0V 30 pf Note: Parameter is guaranteed by design and/or devie haraterization. Capaitane vs. Reverse Bias Clamping Voltage vs. I PP Capaitane (pf Clamp Voltage (V C DC Bias (V Peak Pulse Current-I PP (A
3 Temperature TVS Diode Arrays (SPA Diodes General Purpose ESD Protetion - SP003 Series Transmission Line Pulsing (TLP Plot Leakage vs. Temperature TLP Current (A TLP Voltage (V Leakage Current (na Temperature (ºC Pulse Waveform 0% 00% 90% 80% Perent of I PP 70% 60% 50% 40% 30% 0% 0% 0% Time (μs Soldering Parameters Reflow Condition - Temperature Min (T s(min 50 C Pb Free assembly T P Ramp-up t P Critial Zone TL to TP Pre Heat - Temperature Max (T s(max 00 C - Time (min to max (t s ses Average ramp up rate (Liquidus Temp (T L to peak T S(max to T L - Ramp-up Rate 3 C/seond max 3 C/seond max T L T S(max T S(min t S Preheat t L Ramp-down Reflow - Temperature (T L (Liquidus 7 C - Temperature (t L seonds 5 time to peak temperature Time Peak Temperature (T P 60 +0/-5 C Time within 5 C of atual peak Temperature (t p 0 40 seonds Ramp-down Rate 6 C/seond max Time 5 C to peak Temperature (T P 8 minutes Max. Do not exeed 60 C
4 General Purpose ESD Protetion - SP003 Series Part Numbering System SP 003 TVS Diode Arrays (SPA Diodes Series Number of Channels -0 = Channel Part Marking System C Produt ID SOD73 Pin Indiator 0 * T G G= Green T= Tape & Reel Pakage D: SOD73 E: SOD88 SOD88 C Produt ID Pin Indiator Produt Charateristis Lead Plating Pre-Plated Frame or Matte Tin Lead Material Copper Alloy Lead Coplanarity 004 inhes (mm Substitute Material Silion Body Material Molded Epoxy Flammability UL 94 V-0 Notes :. All dimensions are in millimeters. Dimensions inlude solder plating. 3. Dimensions are exlusive of mold flash & metal burr. 4. Blo is faing up for mold and faing down for trim/form, i.e. reverse trim/form. 5. Pakage surfae matte finish VDI -3. Ordering Information Part Number Pakage Marking Min. Order Qty. SP003-0DTG SOD73 or 8,000 SP003-0ETG SOD88 or 0,000 Pakage Dimensions SOD73 SOD73 b L D HE A E.0 [43] 0.45 [8] 0.50 [0] Reommended Solder Pad Layout Millimeters (Inhes Millimeters Inhes A b D E HE L Pakage Dimensions SOD Reommended Soldering Pad Layout Pakage SOD88 JEDEC MO-36 Millimeters Inhes Min Typ Max Min Typ Max A B C D E F
5 General Purpose ESD Protetion - SP003 Series Embossed Carrier Tape & Reel Speifiation SOD73 KO P PO ØD ØD P AO E W BO User Feeding Diretion t Millimetres Inhes E D D PO W P P AO BO KO t Pin Loation Embossed Carrier Tape & Reel Speifiation SOD88 User Feeding Diretion Pin Loation Millimetres Inhes A B C dø E F P P P W
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7 OUT1 8 OUT2 9 OUT3 10 OUT4 11 OUT5 12 OUT6 13 OUT7 14 OUT8 15 OUT9 16 OUT10 17 OUT11 18 OUT12 19 OUT13 20 OUT14 21 OUT15 22 OUT16 OUT17 23 OUT18
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