Micro MATE-N-LOK 3 mm Connector System

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1 Product Facts Wire-to-wire and wire-toboard pin and receptacle connector system ontacts are on 3 mm [] centerline spacing -1 contact positions single row - contact positions dual row Panel mount or free-hanging wire-to-wire configurations Dual beam contact design for reliable interconnection ontacts accept -0 [0.-0.] and 30- [ ] WG wire with insulation diameter of.00 [1.5] maximum ontacts available in strip form or loose piece Pcb mount pin header assemblies in both vertical and right-angle styles Surface mount or throughhole pcb pin header attachment Pcb headers are IR reflow process compatible Recognized under the omponent Program of Underwriters Laboratories Inc. US to US and anadian Standards, File No. E7 Passed Tests for VDE under Registration Number 00050/ontinuous Surveillance The Micro MTE-N-LOK 3 mm onnector System is a wire-to-wire and wire-toboard connector system with contacts on a 3 mm [] centerline. oth single-row and dual-row configurations are available. rimp, snap-in pin and receptacle contacts are used to terminate -0 [0.-0.] and 30- [ ] WG wire. Plug and receptacle housings allow wire-to-wire and wire-topanel configurations. Header assemblies for wireto-board interconnections include vertical and rightangle components. These IR reflow process compatible headers are available in through-hole and surface mount configurations. Typical uses of the Micro MTE-N-LOK 3 mm onnector System include the appliance, instrumentation, industrial machinery, home equipment, and security system industries. Technical Documents pplication Specification Micro MTE-N-LOK onnectors Product Specification mm Micro MTE-N-LOK onnector enterline Performance haracteristics Voltage Rating 50 vac urrent Rating 5 amp max. on 0 WG wire ontact Resistance 0 milliohms max. final Dielectric Withstanding Voltage 1500 V Insulation Resistance 00 megohms min. Operating Temperature -0 to +5 Mating Force 1.5lb [.7N] max per contact 17

2 (ontinued) enterline onnector pplication rimp, Snap-In ontacts s Single Row Dual Row Plug Housings Single Row, Free-Hanging Single Row, Panel Mount Dual Row, Free-Hanging Dual Row, Panel Mount Vertical Header ssemblies Low Profile s, Right ngle Surface Mount Housings Single Row, Through-Hole, with Retention Feature on Soldertail and Polarization Feature to P Single Row, Through-Hole, with Metal Through-Hole Single Row, Surface Mount, with Metal Through-Hole Single Row, Surface Mount, with Surface Mount Dual Row, Through-Hole, with Retention Feature on Soldertail Dual Row, Through-Hole, with Retention Feature on Soldertail and Metal Through-Hole Dual Row, Surface Mount, with Metal Through-Hole Dual Row, Surface Mount, with Surface Mount Right-ngle Header ssemblies Single Row, Through-Hole, with Metal Through-Hole Single Row, Through-Hole, with Plastic oardlock Single Row, Surface Mount, with Metal Through-Hole Single Row, Surface Mount, with Surface Mount Single Row, Surface Mount, with Plastic oardlock Dual Row, Through-Hole, with Metal Through-Hole Dual Row, Through-Hole, with Plastic oardlock Dual Row, Surface Mount, with Metal Through-Hole Dual Row, Surface Mount, with Plastic oardlock Dual Row, Surface Mount, with Surface Mount urrent Rating Verification for 30 Maximum Temperature Rise 0% Energized 5 3 Multiplication Factor Wire Size (WG) ircuit Positions 0 to to to mbient Temperature - entigrade Maximum Operating Temperature To determine acceptable current carrying capacity for connector size and wire gage indicated, use the Multiplication Factor from the chart above and multiply it times the ase rated urrent at the maximum ambient operating temperature shown in the current rating figure. 1

3 (ontinued) onnector pplication Wire-to-Wire and Wire-to-Panel ontact Receptacle Housing ontact Plug Housing Single Row -790-, , -79-, Page Page , , -791-, Page Free-Hanging Page 5 Panel Mount Page enterline Dual Row ontact Receptacle Housing ontact Plug Housing Free-Hanging Page , , -79-, Page Page -790-, , -791-, Page Panel Mount Page 19

4 (ontinued) enterline onnector pplication Wire-to-P Single Row ontact -790-, , -79-, (Page ) Receptacle Housing (Page 3) Header Vertical Through-Hole, with Retention Feature on Soldertail and Polarization Feature to P , -150-, (Page 30) Vertical Through-Hole, with Metal Through-Hole , , (Page 31) Vertical Surface Mount, with Metal Through-Hole , -150-, (Page 3) Vertical Surface Mount, with Surface Mount , , (Page 33) Right-angle, Through-Hole, with Metal Through-Hole , -150-, (Page 3) Right-angle, Through-Hole, with Plastic oardlock , , (Page 39) Low Profile, Single Row Right-angle, Surface Mount, with Metal Through-Hole , , (Page 0) -790-, , -79-, (Page 9) , -09-, , -09-, (Page 9) Right-angle, Surface Mount, with Surface Mount , , (Page 1) Right-angle, Surface Mount, and Plastic oardlock , , (Page ) Low Profile, Single Row , -09- (Page 9) 0

5 (ontinued) onnector pplication Wire-to-P Dual Row ontact Receptacle Housing Header Vertical Through-Hole, with Retention Feature on Soldertail and Optional Metal Through-Hole , , -793-, (Page 3) -790-, -791-, -79- (Page 35) Vertical Surface Mount, with Metal Through-Hole , -793-, (Page 3) Vertical Surface Mount, with Surface Mount -793-, , (Page 37) enterline -790-, , -79-, (Page } (Page ) Right-angle, Through-Hole, with Metal Through-Hole , -797-, (Page 3) Right-angle, Through-Hole, with Plastic oardlock -791-, , (Page ) Right-angle, Surface Mount, with Metal Through-Hole -79-, -795-, -79- (Page 5) Right-angle, Surface Mount, with Plastic oardlock -791-, -79-, (Page ) Right-angle, Surface Mount, with Surface Mount -797-, -79-, (Page 7) 1

6 (ontinued) enterline rimp, Snap-In ontacts Receptacle Phosphor ronze Plug rass Plating.0000 (.0005) minimum bright tin entire stock over (.00017) minimum entire stock Plating (.00003) minimum gold in localized gold plate area (.0005) minimum bright tin in localized tin plate area, both over (.00017) minimum on entire stock Plating (.00007) minimum gold in localized gold plate area (.0005) minimum bright tin in localized tin plate area, both over (.00017) minimum on entire stock onnectors used with: Receptacle ontacts used with s pages 3- Plug ontacts used with Plug Housings pages 5- pplication Tooling pages 07- Receptacle ontacts Wire Size ontact s Tooling s Range Ins. Dia. Finish Strip Loose WG [mm] Range pplicator Hand Tool Form Piece Plating Plating Plating * Plating Plating Plating * *1=OMTOR LS Machine, =-O-LETRI Model K Terminator, 3=-O-LETRI Model G Terminator.9 [1.17] Ref. ontact Extraction Tools 399- for Receptacle ontacts for Plug ontacts Plug ontacts Wire Size ontact s Tooling s Range Ins. Dia. Finish Strip Loose WG [mm] Range pplicator Hand Tool Form Piece Plating Plating Plating * Plating Plating Plating * *1=OMTOR LS Machine, =-O-LETRI Model K Terminator, 3=-O-LETRI Model G Terminator.51 [13.73] Ref.

7 (ontinued) s Single Row Material Nylon, lack Flammability Rating UL 9V-0 ontacts: Receptacle ontacts page Mateable Housings and Headers: Single Row Plug Housings pages 5- Single Row Vertical Pin Header ssemblies pages Single Row Right-ngle Pin Header ssemblies pages 3-7 Typ..51 [.37].553 [1.0].15 [3.].3 [.70] enterline Number Dimension Part of ircuits Numbers

8 (ontinued) enterline s (ontinued) Dual Row Material Nylon, lack Flammability Rating UL 9V-0 ontacts: Receptacle ontacts page Mateable Housings and Headers: Dual Row Plug Housings pages 7- Dual Row Vertical Pin Header ssemblies pages 3-37 Dual Row Right-ngle Pin Header ssemblies pages 3-7 Typ..51 [.37].553 [1.0].70 [.].1 [11.70] Number Dimension Part of ircuits Numbers

9 (ontinued) Plug Housings Single Row, Free-Hanging Material Nylon, lack Flammability Rating UL 9V-0 ontacts: Plug ontacts page Single Row s page 3 Typ..15 [3.].5 [1.9].335 [.50] enterline Number Dimension Part of ircuits Numbers

10 (ontinued) enterline Plug Housings (ontinued) Single Row, Panel Mount Material Nylon, lack Flammability Rating UL 9V-0 ontacts: Plug ontacts page Single Row s page 3.10 [3.05].15 [3.1] Recommended Panel utout*.1 [.1] Ref..17 [5.51].15 [3.].5 [1.9].335 [.50] Number Dimensions Part of ircuits Numbers *Recommended panel thickness [ ]. lways consult customer drawing for panel cutout dimensions.

11 (ontinued) Plug Housings (ontinued) Dual Row, Free-Hanging Material Nylon, lack Flammability Rating UL 9V-0 ontacts: Plug ontacts page Dual Row s page Ref..70 [.].5 [1.9].335 [.50] enterline Number Dimension Part of ircuits Numbers

12 (ontinued) enterline Plug Housings (ontinued) Dual Row, Panel Mount Material Nylon, lack Flammability Rating UL 9V-0 ontacts: Plug ontacts page Dual Row s page.10 [.0].07 [1.9] Recommended Panel utout*.0 [7.11] Ref..33 [.71].70 [.].335 [.50].5 [1.9] Number Dimensions Part of ircuits Numbers *Recommended panel thickness [ ]. lways consult customer drawing for panel cutout dimensions.

13 (ontinued) New: Low Profile Low Profile Receptacle Housings Material Nylon, lack Flammability Rating V0.50 [.37].15 [3.] Positions olor Dimension s lack lack lack Natural Natural Natural enterline Low Profile Right ngle Surface Mount Housings.15 [3.] Material Hight Temp Nylon, lack Flammability Rating V0 ontacts: rass Plating (.005) minimum tin over [0.0017] minimum.05 [0.].00 [0.51].050 ±.003 [1.7 ± 0.0] Typ..1 [5.].39 [11.1].13 [3.35] Typ..115 ±.003 [.9 ± 0.0] Dimensions Part Positions olor Numbers lack lack lack Natural Natural Natural Note: Less than.7mm in vertical board surface height required! 9

14 PageHead_1_Helvdd Micro MTE-N-LOK 3 mm (ontinued) onnector System (ontinued) enterline Vertical Header ssemblies Single Row, Through-Hole, with Retention Feature on Soldertail and Polarization Feature to P Housing High Temperature Nylon, lack Flammability Rating UL 9V-0 ontacts rass Plating.0000 [0.005] min. tin over [0.0017] min. Plating [0.0003] gold in Plating [0.0007] gold in.077 [1.9] Typ. Typ..031 Dia. Ref. [0.0].00 Dia. Typ. [1.0].051 [1.30].15 [3.].00 [0.51].3 [9.] Ref..15 [3.1] Ref. Single Row s page Dia. Plc. [1.7] Recommended P oard Layout* Dimensions Header s Mates with ircuits Plating Plating Plating *Recommended P oard thickness.0 [1.57]. lways consult customer drawing for P oard layout dimensions. 30

15 PageHead_1_Helvdd Micro MTE-N-LOK 3 mm (ontinued) onnector System (ontinued) Vertical Header ssemblies (ontinued) Single Row, Through-Hole, with Metal Through-Hole Housing High Temperature Nylon, lack Flammability Rating UL 9V-0 ontacts rass Plating.0000 [0.005] min. tin over [0.0017] min. Plating [0.0003] gold in Plating [0.0007] gold in s Phosphor ronze,.0000 [0.005] min. tin over [0.0017] min..05 [.15].095 Dia. [.1] Plc. Ref. Typ..00 Dia. Typ. [1.0].051 [1.30].15 [3.].00 [0.51].3 [9.] Ref..15 [3.1] Ref. ontact enterline Single Row page 3 Recommended P oard Layout* Dimensions Header s Mates with ircuits Plating Plating Plating *Recommended P oard thickness.0 [1.57]. lways consult customer drawing for P oard layout dimensions. 31

16 PageHead_1_Helvdd Micro MTE-N-LOK 3 mm (ontinued) onnector System (ontinued) enterline Vertical Header ssemblies (ontinued) Single Row, Surface Mount, with Metal Through-Hole Housing High Temperature Nylon, lack Flammability Rating UL 9V-0 ontacts rass Plating.0000 [0.005] min. tin over [0.0017] min. Plating [0.0003] gold in Plating [0.0007] gold in s Phosphor ronze,.0000 [0.005] min. tin over [0.0017] min. Single Row page 3.3 [.00] Dia..050 [1.7] Typ..1 [3.0].095 [.1] Dia. Plc. Typ. Ref..05 [.15].0 [0.5].0 [.5].051 [1.30].15 [3.].00 [0.51].3 [9.] Ref. ontact.113 [.] Ref..15 [3.97] Ref. Recommended P oard Layout* Dimensions Header s Mates with ircuits Plating Plating Plating *Recommended P oard thickness.0 [1.57]. lways consult customer drawing for P oard layout dimensions. 3

17 PageHead_1_Helvdd Micro MTE-N-LOK 3 mm (ontinued) onnector System (ontinued) Vertical Header ssemblies (ontinued) Single Row, Surface Mount, with Surface Mount.3 [.00] Dia. Ref..051 [1.30].3 [9.] Ref. ontact.15 [3.97] Ref. Housing High Temperature Nylon, lack Flammability Rating UL 9V-0 ontacts rass Plating.0000 [0.005] min. tin over [0.0017] min. Plating [0.0003] gold in Plating [0.0007] gold in s Phosphor ronze,.0000 [0.005] min. tin over [0.0017] min..1 [3.0].050±.003 [1.7±0.0] Typ Typ..0±.003 [.5±0.0].15 [3.].00 [0.51].05±.003 [1.5±0.0] Plc. enterline Single Row page 3.13 [3.35].135±.003 [3.3±0.0] Plc. Recommended P oard Layout* Dimensions Header s Mates with ircuits Plating Plating Plating *lways consult customer drawing for P oard layout dimensions. 33

18 PageHead_1_Helvdd Micro MTE-N-LOK 3 mm (ontinued) onnector System (ontinued) enterline Vertical Header ssemblies (ontinued) Dual Row, Through-Hole, with Retention Feature on Soldertail Housing High Temperature Nylon, lack Flammability Rating UL 9V-0 ontacts rass Plating.0000 [0.005] min. tin over [0.0017] min. Plating [0.0003] gold in Plating [0.0007] gold in s Phosphor ronze,.0000 [0.005] min. tin over [0.0017] min..31 [.7] Z Z.13 [3.50] Min. Typ..15 [3.1] Retention Feature Located On End ontacts Only Plc. Ref..3 [9.] Section Z-Z.70 [.] Dual Row page.00 Dia. Typ. [1.0] Recommended P oard Layout*.079 [.00] Min. Dimensions Header s Mates with ircuits Plating Plating Plating *Recommended P oard thickness.0 [1.57]. lways consult customer drawing for P oard layout dimensions. 3

19 PageHead_1_Helvdd Micro MTE-N-LOK 3 mm (ontinued) onnector System (ontinued) Vertical Header ssemblies (ontinued) Dual Row, Through-Hole, with Retention Feature on Soldertail and Metal Through-Hole ontact Z.3 [9.].70 [.] Housing High Temperature Nylon, lack Flammability Rating UL 9V-0 ontacts rass Plating.0000 [0.005] min. tin over [0.0017] min. Plating [0.0003] gold in Plating [0.0007] gold in.31 [.7] Z.0 [.13].15 [3.1] Retention Feature Located On End ontacts Only Plc. Ref. Section Z-Z enterline s Phosphor ronze,.0000 [0.005] min. tin over [0.0017] min..059 [1.50] Dual Row page.095 [.1] Dia. Typ [.0] Min. Dia. Typ. [1.0] Recommended P oard Layout*.079 [.00] Min. Dimensions Header s Mates with ircuits Plating Plating Plating *Recommended P oard thickness.0 [1.57]. lways consult customer drawing for P oard layout dimensions. 35

20 PageHead_1_Helvdd Micro MTE-N-LOK 3 mm (ontinued) onnector System (ontinued) enterline Vertical Header ssemblies (ontinued) Dual Row, Surface Mount, with Metal Through-Hole Housing High Temperature Nylon, lack Flammability Rating UL 9V-0 ontacts rass Plating.0000 [0.005] min. tin over [0.0017] min. Plating [0.0003] gold in Plating [0.0007] gold in.0 [.5] Typ. Typ..3 [.00] Dia..050 [1.7] Typ..31 [.9].0 [0.5].05 [0.35].77 [1.1].15 [.70].3 [9.].050 [1.7].70 [.] ontact s Phosphor ronze,.0000 [0.005] min. tin over [0.0017] min. Pick-up utton Kapton Dual Row page.370 [9.0].09 [.50] Min..07 [.0] Min..0 [.1] Recommended P oard Layout*.095 [.1] Dia. Plc. Dimensions Header s Mates with ircuits Plating Plating Plating *Recommended P oard thickness.0 [1.57]. lways consult customer drawing for P oard layout dimensions. 3

21 PageHead_1_Helvdd Micro MTE-N-LOK 3 mm (ontinued) onnector System (ontinued) Vertical Header ssemblies (ontinued) Dual Row, Surface Mount, with Surface Mount Typ..31 [.9] Housing High Temperature Nylon, lack Flammability Rating UL 9V-0 ontacts rass Plating.0000 [0.005] min. tin over [0.0017] min. Plating [0.0003] gold in Plating [0.0007] gold in s Phosphor ronze,.0000 [0.005] min. tin over [0.0017] min. Pick-up utton Kapton Dual Row page.370 [9.0].15 [.70].050 [1.7] Typ [.35] [1.715].050 [1.7].09 [.50] Min. Min..3 [.00] Dia..135 [3.3] Typ. Recommended P oard Layout*.0 [0.5].0 [.5].03 [0.5].3 [9.].05 [1.5] Typ..70 [.] ontact enterline Dimensions Header s Mates with ircuits Plating Plating Plating *lways consult customer drawing for P oard layout dimensions. 37

22 PageHead_1_Helvdd Micro MTE-N-LOK 3 mm (ontinued) onnector System (ontinued) enterline Right-ngle Header ssemblies Single Row, Through-Hole, with Metal Through-Hole Housing High Temperature Nylon, lack Flammability Rating UL 9V-0 ontacts rass Plating.0000 [0.005] min. tin over [0.0017] min. Plating [0.0003] gold in Plating [0.0007] gold in s Phosphor ronze,.0000 [0.005] min. tin over [0.0017] min..170 [.3].05 [.15] Ref. Typ..051 [1.30].5 [7.5] Ref..00 [1.0] Dia. Typ..00 [0.51].15 [3.].351 [.9] Ref. ontact Single Row page [.1] Dia. Plc. Recommended P oard Layout* Dimensions Header s Mates with ircuits Plating Plating Plating *Recommended P oard thickness.0 [1.57]. lways consult customer drawing for P oard layout dimensions. 3

23 PageHead_1_Helvdd Micro MTE-N-LOK 3 mm (ontinued) onnector System (ontinued) Right-ngle Header ssemblies (ontinued) Single Row, Through-Hole, with Plastic oardlock.15 [3.].051 [1.30] Housing High Temperature Nylon, lack Flammability Rating UL 9V-0 ontacts rass Plating.0000 [0.005] min. tin over [0.0017] min. Plating [0.0003] gold in Plating [0.0007] gold in Single Row page 3.00 Dia. [1.0] Plc..170 [.3].059 [1.50] Dia. Ref. Recommended P oard Layout Position*.170 [.3].3 [.00].3 [7.] Ref..00 Dia. [1.0] 3 Plc. Dia. Recommended P oard Layout 3 Position*.00 [0.51].00 [1.0] Dia.Typ..170 [.3] Dia. Plc..05 [.15].351 [.9] Ref. Typ. Recommended P oard Layout -1 Position* enterline Dimensions Header s Mates with ircuits Plating Plating Plating *Recommended P oard thickness.0 [1.57]. lways consult customer drawing for P oard layout dimensions. 39

24 PageHead_1_Helvdd Micro MTE-N-LOK 3 mm (ontinued) onnector System (ontinued) enterline Right-ngle Header ssemblies (ontinued) Single Row, Surface Mount, with Metal Through-Hole Housing High Temperature Nylon, lack Flammability Rating UL 9V-0 ontacts rass Plating.0000 [0.005] min. tin over [0.0017] min. Plating [0.0003] gold in Plating [0.0007] gold in s Phosphor ronze,.0000 [0.005] min. tin over [0.0017] min..1 [5.] Ref..050 [1.7] Typ. Typ..115 [.9].5 [7.5] Ref..15 [3.].00 [0.51].051 [1.30].39 [11.1] Ref. ontact Single Row page [.1] Dia. Plc..05 [.15] Recommended P oard Layout* Dimensions Header s Mates with ircuits Plating Plating Plating *Recommended P oard thickness.0 [1.57]. lways consult customer drawing for P oard layout dimensions. 0

25 PageHead_1_Helvdd Micro MTE-N-LOK 3 mm (ontinued) onnector System (ontinued) Right-ngle Header ssemblies (ontinued) Single Row, Surface Mount, with Surface Mount Housing High Temperature Nylon, lack Flammability Rating UL 9V-0 ontacts rass Plating.0000 [0.005] min. tin over [0.0017] min. Plating [0.0003] gold in Plating [0.0007] gold in.050 [1.7] Typ. Ref. Typ..115 [.9].15 [3.].00 [0.51].051 [1.30].39 [11.1] Ref. ontact enterline s Phosphor ronze,.0000 [0.005] min. tin over [0.0017] min..1 [5.] Single Row page 3.13 [3.35].135 [3.3] Plc. Recommended P oard Layout*.05 [1.5] Dimensions Header s Mates with ircuits Plating Plating Plating *lways consult customer drawing for P oard layout dimensions. 1

26 PageHead_1_Helvdd Micro MTE-N-LOK 3 mm (ontinued) onnector System (ontinued) enterline Right-ngle Header ssemblies (ontinued) Single Row, Surface Mount, with Plastic oardlock Housing High Temperature Nylon, lack Flammability Rating UL 9V-0 ontacts rass Plating.0000 [0.005] min. tin over [0.0017] min. Plating [0.0003] gold in Plating [0.0007] gold in.059 [1.50].050 [1.7] Typ. Ref..050 [1.7] Typ..3 [.00].051 [1.30].15 [3.].3 [7.] Ref..00 [0.51].11 [.0] Ref..115 [.9].050 [1.7] Typ..39 [11.1] Ref. Typ. Single Row page 3.1 [5.] Dia..115 [.9] Recommended P oard Layout * Position.1 [5.] Dia. Recommended P oard Layout * 3 Position.1 [5.].05 [.15] Dia. Plc. Recommended P oard Layout* -1 Positions.115 [.9] Dimensions Header s Mates with ircuits Plating Plating Plating *Recommended P oard thickness.0 [1.57]. lways consult customer drawing for P oard layout dimensions.

27 PageHead_1_Helvdd Micro MTE-N-LOK 3 mm (ontinued) onnector System (ontinued) Right-ngle Header ssemblies (ontinued) Dual Row, Through-Hole, with Metal Through-Hole.051 [1.30].90 [7.37].0 [.5] Housing High Temperature Nylon, lack Flammability Rating UL 9V-0 ontacts rass Plating.0000 [0.005] min. tin over [0.0017] min. Plating [0.0003] gold in Plating [0.0007] gold in s Phosphor ronze,.0000 [0.005] min. tin over [0.0017] min..095 [.1] Dia. Plc..05 [.1].351 [.9].9 [11.9].00 [1.0] Dia. Typ..170 [.3] enterline Dual Row page Recommended P oard Layout* Dimensions Header s Mates with ircuits Plating Plating Plating *Recommended P oard thickness.0 [1.57]. lways consult customer drawing for P oard layout dimensions. 3

28 PageHead_1_Helvdd Micro MTE-N-LOK 3 mm (ontinued) onnector System (ontinued) enterline Right-ngle Header ssemblies (ontinued) Dual Row, Through-Hole, with Plastic oardlock Housing High Temperature Nylon, lack Flammability Rating UL 9V-0 ontacts rass Plating.0000 [0.005] min. tin over [0.0017] min. Plating [0.0003] gold in Plating [0.0007] gold in Dual Row page.170 [.3].11 [.0] Min. Position Position.351 [.9].3 [.00]. [.].9 [11.9].90 [7.37].051 [1.30] Position Thru Position.13 [3.50] Min..059 [1.50] [5.00] Min..5 [.50] Min. [.1]. [5.5] Min..00 Dia. Typ. [1.0].170 [.3].11 [.0] Min. Dia. Typ. Recommended P oard Layout* Dimensions Header s Mates with ircuits Plating Plating Plating *Recommended P oard thickness.0 [1.57]. lways consult customer drawing for P oard layout dimensions.

29 PageHead_1_Helvdd Micro MTE-N-LOK 3 mm (ontinued) onnector System (ontinued) Right-ngle Header ssemblies (ontinued) Dual Row, Surface Mount, with Metal Through-Hole Housing High Temperature Nylon, lack Flammability Rating UL 9V-0 ontacts rass Plating.0000 [0.005] min. tin over [0.0017] min. Plating [0.0003] gold in Plating [0.0007] gold in s Phosphor ronze,.0000 [0.005] min. tin over [0.0017] min. Dual Row page.0 [.5].39 [.].90 [7.37].1 [5.]. [5.5] Min..07 [.0] Min..051 [1.30].05 [.15].057 [1.].39 [11.1].15 [15.3] ontacts.05 [0.35].050 [1.7] Typ. Recommended P oard Layout*.115 [.9].095 [.1] Dia. Plc. enterline Dimensions Header s Mates with ircuits Plating Plating Plating *Recommended P oard thickness.0 [1.57]. lways consult customer drawing for P oard layout dimensions. 5

30 PageHead_1_Helvdd Micro MTE-N-LOK 3 mm (ontinued) onnector System (ontinued) enterline Right-ngle Header ssemblies (ontinued) Dual Row, Surface Mount, with Plastic oardlock Housing High Temperature Nylon, lack Flammability Rating UL 9V-0 ontacts rass Plating.0000 [0.005] min. tin over [0.0017] min. Plating [0.0003] gold in Plating [0.0007] gold in Position Position. [.].90 [7.37] Position.3 [.00].051 [1.30].39 [11.1].15 [15.3] Thru Position.115 [.9] Dual Row page.39 [.].1 [5.].11 [.0] Min..1 [5.].39 [.].11 [.0] Min..13 [3.50] Min..197 [5.00] Min..059 [1.50].5 [.50] Min..05 [.15]. [5.5] Min. Recommended P oard Layout* Dia. Typ. Dimensions Header s Mates with ircuits Plating Plating Plating *Recommended P oard thickness.0 [1.57]. lways consult customer drawing for P oard layout dimensions.

31 PageHead_1_Helvdd Micro MTE-N-LOK 3 mm (ontinued) onnector System (ontinued) Right-ngle Header ssemblies (ontinued) Dual Row, Surface Mount, with Surface Mount.90 [7.37].051 [1.30] ontacts Housing High Temperature Nylon, lack Flammability Rating UL 9V-0 ontacts rass Plating.0000 [0.005] min. tin over [0.0017] min. Plating [0.0003] gold in Plating [0.0007] gold in s Phosphor ronze,.0000 [0.005] min. tin over [0.0017] min. Dual Row page.057 [1.].39 [.]. [5.5] Min..1 [5.] Min..153 [3.90].39 [11.1].15 [15.3].050 [1.7].05 [0.].03 [0.3].0 [1.7].135 [3.3] Typ. Recommended P oard Layout*.115 [.9].05 [1.5] enterline Dimensions Header s Mates with ircuits Plating Plating Plating *lways consult customer drawing for P oard layout dimensions. 7

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