Nanotechnology and the Emerging Global Knowledge Economy: Challenges and Opportunities. Nextreme Thermal Solutions

Transcription

1 Nanotechnology and the Emerging Global Knowledge Economy: Challenges and Opportunities Nextreme Thermal Solutions 3040 Cornwallis Road, Research Triangle Park, NC Ph: (919) ; Fax: (919)

2 Nextreme etec Paper-thin heat pump Nextreme is positioned to deliver a new solution for semiconductor chip cooling and power generation Nextreme is delivering prototypes for both applications now 2

3 Nextreme Thermal Solutions (RTP, NC) New Solutions for Electronics Cooling and Power Generation Product: thin-film thermoelectric component What: a solid-state refrigerator the size of a piece of confetti Application: cooling integrated circuits & power generation Founded December, 2004; $8M Series A venture financing RedShift Ventures, Aurora Funds, Harris & Harris, In-Q-Tel, RTI Spin-off from RTI International, a $500M nonprofit research organization, Located in Research Triangle Park, North Carolina Unprecedented performance because of nano-structured, thin-film thermoelectric technology 34 employees; experienced management and technology team 3

4 Nanotechnology Nanostructured Thin Film Thermoelectric Material Thin film thermoelectric material engineered on a nanoscale for improved performance Nanostructured material enhances thermoelectric parameters relative to conventional material ZT T c c = α 2 cold Tc κρ α Seebeck κ thermal ρ resistivity side temperature coefficient conductivity 4

5 Electronics: Market Trends Semiconductors Higher densities continue to drive power dissipation Higher temperature Electronic and Optoelectronic Packaging Smaller, higher density packaging Higher temperature System Design More plastic, dust-proofing, no noise, more features, higher speeds, and miniaturization Higher temperature Commoditized thermal management solutions Do not meet emerging needs 5

6 Nextreme Strategy and Opportunities Electronic Packaging Semiconductor Processing Thermal Management Mission Solve problems where thermal management is a constraint Applications Semiconductor chip cooling Electronics system cooling Waste heat recovery Markets Computing Optoelectronics Consumer electronics Medical devices Power generation sensors and automotive 6

7 Technology Overview

8 Nextreme s Technology Product Thermoelectrics Solid-state heat pump Technology/Applications Heat Pump Heat or Cool Clean Power Converts heat into electricity Nextreme s Uniqueness Replace conventional, bulk materials with thinfilms Thin/small Fast Very high power pumping capability High power density Small footprint 8

9 The Nextreme Performance Advantage Enables High Power Cooling Conventional TEC Bulk (6.3 x 10.3 x 1.8 mm 3 ) Thin Film TEC (3.5 x 3.0 x 0.1 mm 3 ) 40 T (ºC) Nextreme Load Line Bulk Performance Thin Film New Applications Performance Space Advantage Power Pumped (W/cm 2 )

10 Recent Performance Improvements New Nanostructured Material Delivers Unique Performance C Load Line Comparisons Tmax (ºC) Melcor HOT F2A Standard SL Recent Improvements Qmax/A (W/cm²) 10

11 The Nextreme Performance Advantage Enables Embedded Cooling TEC L (cm) W (cm) H (cm) T max (ºC) Q max (W) T max /H (ºC/cm) Q max /A (W/cm 2 ) Response Time Melcor HOT F2A seconds Nextreme Thin Film TEC milliseconds ºC Performance Comparisons Melcor HOT F2A Nextreme Thin Film TEC T/H (ºC/cm) Pumping Power Density (W/cm²) 11

12 Products and Applications

13 Product: Micro Thermoelectric Module Solid State Heat Pump or Power Generator Size ~2.5mm x 2.5mm x 100 µm thickness Cooling Cooling: 40 C Power Pumping: >150 W/cm 2 PN couple (0.32 mm sq.) Heat Spreader Ground Power Generation Maximum efficiency: 4.5% Power 2.5 mm sq. Power density: >1 W/cm 2 etec (7x7) 13

14 Applications: Thermal Control Low Profile, High Density Packaging VCSELs Edge-emitting lasers Indium arsenide photodetectors Medical implants Microbolometers Microprocessors GPU 14

15 Applications: Power Generation Very High Power Density Solar Panel Conventional TEG Nextreme N x 2 Solar Energy W/cm 2 Waste Heat Recovery Waste Heat Recovery 0.3 W/cm 2 3 W/cm 2 Power Density (W/cm 2 ) Power Density Comparison Solar TEG Nextreme TEG 15

16 Case Studies 1. Medical implant concept 2. Semiconductor chip cooling application 3. Power generation application 4. Optical communications application 5. End

17 Case Study Medical Implant (Concept)

18 Implantable Probe for Local Heating and Cooling The probe is a solid-state, implantable device that provides localized cooling/heating. It can be used to cool nerves, tissues or parts of brain to reduce pain, treat cancers or reduce the effects of seizures. Figure 1 18

19 Advantages New therapeutical approach Solid-state cooling device provides localized heating and cooling Pinpoint heat pump technology Device size can be tailored from the size of a grain of sand to the size of a postage stamp Low power consumption Can be battery powered Single Device (0.32 mm sq.) Substrate Ground Ease of use Easy to implant and power Power 2.5 mm sq. Nextreme micro-cooler (7x7) 19

20 Illustration The amount of heat that can be pumped out of the human body depends on the size of the device and the specific application. For example, 5 10ºC cooling can be achieved by a 1mm x 1mm cooling probe while consuming only 0.75 W of power. The removed heat can be diffused inside the body or it can be pumped out of the body to the outside environment. Hot spot Cooling Heat or cold can be applied locally in a steady-state or cyclical manner. 20

21 Potential Applications Seizure treatment Reduce seizures e.g., focal epilepsy Pain management Cancer treatment Drug Delivery Local Body Temperature (C) Example Implementation Time (s) 21

22 Case Study Semiconductor Chip Cooling

23 Chip Cooling Problem Non-Uniform Power Dissipation Two major trends: Process shrinks + multi-core architecture Leads to non-uniform power dissipation Performance-critical cores Dissipate large amount of power Consume small area Faster, smaller as CMOS scales Chip L2 cache Consumes large area Dissipates little power Larger as CMOS scales 23

24 Solution: In-package Hot Spot Cooling Embedded Thermoelectric Cooler (etec) Heat Sink Thermal Interface Material 2 Substrate Heat Spreader Thermal Interface Material 1 Silicon Die (Microprocessor Chip) Nextreme s etec 14 ºC Demonstrated etec Cools Hot Spot Only 24

25 Value Proposition to OEMs Technical and Cost Comparisons of Selected Cooling Solutions Cooling Solution Nextreme etec Requirement Insert etec into existing package Incremental Cooling Estimated Incremental Cost 14 ºC+ $1-$2 Increase heat sink size 2x 4x size increase 5 ºC $5-$10 Increase fan speed Larger fan 60% speed increase ( rpm) Increase size from mm to mm 5 ºC $0 Liquid cooling Add liquid cooling capability 5 ºC+ $25+ Refrigeration Add refrigeration capability 15 ºC+ $50-$70 Comments Complementary to all other cooling solutions Form factor and weight impede implementation Fan reliability decreases exponentially with speed Unacceptable noise impact (fan noise scales to the fourth power with speed) 5 ºC $2-$4 Form factor limitations Form factor limitations Reliability Cost Form factor limitations Reliability Cost 25

26 Case Study Power Generation

27 Thermoelectric Power Generation Performance 600 Typical Output Power vs. T ext Power (mw) R 2 = T ext (K) 27

28 Thermoelectric Power Generation Delivery Shipping units to government customers Example: 90 unit shipment to spec Target at T=70 ºC: P T=70 ºC = 60 mw Results Target at T=120 ºC: P T=120 ºC = 175 mw Results Delta T (Target)=70 Distributions Power (mwatts) Delta T (Target)=120 Distributions Power (mwatts) Quantiles 100.0% 99.5% 97.5% 90.0% 75.0% 50.0% 25.0% 10.0% 2.5% 0.5% 0.0% Quantiles 100.0% 99.5% 97.5% 90.0% 75.0% 50.0% 25.0% 10.0% 2.5% 0.5% 0.0% maximum quartile median quartile minimum maximum quartile median quartile minimum Moments Mean Std Dev Std Err Mean upper 95% Mean lower 95% Mean N Moments Mean Std Dev Std Err Mean upper 95% Mean lower 95% Mean N

29 Thermoelectric Power Generation Example Application Example: RFID Chip Thermoelectric Device 12 mm x 9.6 mm x mm 4.0 V 0.7 ma hr Example: LiTE*STAR LS101 Rechargeable Li + Battery 25.4 mm x 25.4 mm x mm Heat Sink Size Estimates (not displayed): Natural Convection: Forced Convection: Forced Liquid: 80 mm x 80 mm x 10 mm 30 mm x 30 mm x 5 mm 14 mm x 11 mm x 10 mm 29

30 Case Study Optical Communications

31 Application Requirements Operational Specifications Characteristic At 85 C Unit 2x2 Nextreme module in TO-8 can Q op 0.07 W Q op /area 1.6 W/cm 2 T op 15 K I op TBD A V op TBD V L 2.0 mm W 2.0 mm H 0.4 mm 31

32 TEC Performance at 85ºC DT, Qc, COP and V vs I Delta T (ºC) Qc = 0.0 W Qc = 0.2 W Qc = 0.4 W Qc = 0.6 W Qc = 0.9 W I(A) COP DT = 4 ºC DT = 8 ºC DT = 17 ºC DT = 25 ºC DT = 34 ºC I(A) Qc (W) DT = 0 ºC DT = 8 ºC DT = 17 ºC DT = 25 ºC DT = 34 ºC Voltage (V) DT = 0 º C DT = 42 ºC I(A) I (A) 32

33 Reliability Requirements: GR-468-CORE Category Test Level Physical Characteristics Mechanical Integrity 1 Non-Powered Environmental Stress Powered Environmental Stress Die Shear Strength Mechanical Shock Sampling LTPD SS C R R Vibration R High Temp. Storage Temperature Cycling 2 Power Cycling (On/Off) Applicable to all relevant connections (e.g., TEC/heat sink) Condition A (500 g, 1.0 ms), 5 times/direction Condition A (20 g), 20 to 2000 to 20 Hz, 4 min/cy, 4 cy/axis R C, 2000 hours R C to +85 C, 100 cycles O C to +85 C, 500 cycles R Mass is attached to TEC cold side to simulate laser submount. 2 TEC may be either powered or unpowered during this test. Additional Information Hot-side T max.op. T, 5000 cycles 33

34 Integration of etec into TO-56 with LD 34

35 Assembly LD etec top & bottom headers Submount 35

36 Size Comparison to Typical Bulk TEC 36

37 Nextreme Summary

38 The Nextreme Performance Advantage Enables New Applications in Cooling & Power Generation Size Advantage Uniquely Small Very Fast Response Time 2.5mm x 2.5mm x 0.1mm footprint Cooling Advantage Unique High Power Pumping Capability Conventional discrete TEC (Bulk) Power Generation Advantage Unique High Power Density Nextreme TEG vs. Bulk TEG Output Power Density 40 T (ºC) Bulk Nextreme Load Line Nextreme Performance Thin Film Performance Space Advantage Power Pumped (W/cm 2 ) 175 Output Power Density (W/cm2) Nx2 etec etec Capability Bulk Capability Bulk Nextreme Nextreme Advantage Input Heat Flux Density (W/cm2) 38