High Performance Packaging what does the future hold? Grace O'Malley inemi
|
|
- Ashlynn Powell
- 7 years ago
- Views:
Transcription
1 High Performance Packaging what does the future hold? Grace O'Malley inemi
2 What is High Performance Packaging? 1
3 What is High Performance Packaging? Meets Performance Electrical Thermal Mechanical Environmental Protection Highly Reliable Life time Operating conditions At an acceptable Cost 2
4 Objectives Overview of what's happening in the electronics manufacturing industry Highlights from the inemi Packaging Roadmap Packaging trends in general High performance packaging technologies Challenges 3
5 inemi Overview & Roadmap
6 About inemi Mission: Forecast and Accelerate improvements in the Electronics Manufacturing Industry for a Sustainable Future. 5 Key Deliverables: Technology Roadmaps Collaborative Deployment Projects Research Priorities Documents Proactive Forums Position Papers International Electronics Manufacturing Initiative (inemi) is an industry-led consortium of over 100 global manufacturers, suppliers, industry associations, government agencies and universities. Working on advancing manufacturing technology since Visit us at 5 5
7 2013 Roadmap > 650 participants > 350 companies/organizations 18 countries from 4 continents 20 Technology Working Groups (TWGs) 6 Product Emulator Groups (PEGs) > 8 Man Years of Development Time > 1900 pages of information Roadmaps the needs for
8 inemi Roadmap Biannual Process 21 Technology Working Groups (TWGs) Modeling, Simulation, and Design Connectors RF Components & Subsystems Test, Inspection & Measurement Solid State Illumination Large Area, Flexible Electronics Semiconductor Technology Photovoltaics MEMS/ Sensors Packaging & Component Substrates Passive Components Optoelectronics Thermal Management Mass Storage (Magnetic & Optical) Ceramic Substrates Energy Storage & Conversion Systems Organic PCB Board Assembly Final Assembly Customer Information Management Systems Environmentally Conscious Electronics Red=Business Green=Engineering Purple=Manufacturing Blue=Component & Subsystem 9
9 Portable / Consumer Office Systems Defense and Aerospace Medical Products Automotive High-End Systems Roadmap Development Product Sector Needs Vs. Technology Evolution TWGs (20) Product Emulator Groups Semiconductor Technology Business Processes Prod Lifecycle Information Mgmt. Design Technologies Modeling, Thermal, etc. Manufacturing Technologies Board Assy, Test, etc. Comp./Subsyst. Technologies Packaging, Substrates, Displays, etc. 10
10 Selected Parameters for Automotive Electronics Year of Production Battery performancefor HEV (Power oriented development) Power density per weight (W/kg) Energy density per weight (Wh/kg) Battery performancefor BEV (Energy oriented development) Power density per weight (W/kg) Energy density per weight (Wh/kg) Capacitor pack (F) Power devices Inverter power density (W/cm3) Specific on-resistance at breakdown voltage of 1.2kV Max junction temperature (degree C) Rthja required for inverter power density (W/cm3) with regard to Ta of 125deg C (deg C/W/cm3) Max mold temperature (deg C) package termical resistance (m Ohm) Logic devices Temperature attached to engine (degree C) Max junction temperature (degree C)
11 Thirteen Contributing Industry Organizations Semiconductors inemi / ITRS / MIG/PSMA Packaging TWG inemi / MIG / ITRS MEMS TWG inemi / IPC / EIPC / TPCA Organic PWB TWG Organic Printed Circuit Boards Interconnect Substrates Ceramic inemi Board Assembly TWG inemi Roadmap inemi Information Management TWG Supply Chain Management inemi Optoelectronics TWG inemi Mass Data Storage TWG Magnetic and Optical Storage Optoelectronics and Optical Storage 12
12 Key Industry Trends & Drivers
13 Integration driving Growth User Interface + Smaller Form Factor + Lower Prices + New Services Source: Morgan Stanley Estimates 14
14 Overall Key Trends Convergence - pace of product enhancements is growing rapidly Medical-Consumer Automotive-Entertainment Communication-Entertainment Infrastructure (Business Model) changes: Fabless Semiconductor Fabrication Redundant Elements EMS and ODM roles grow; R&D Challenges Quality, reliability, cost still paramount Form factor - Miniaturization and Thinner still important Product Personalization Counterfeit Products a growing issue Rare Earth and Conflict Materials are new concerns 15
15 Strategic Concerns Restructuring from vertically integrated OEMs to multi-firm supply chains Resulted in a disparity in R&D Needs vs. available resources Critical needs for R&D Middle part of the Supply Chain is least capable of providing resources Industry collaboration Variety of paths : University R&D centers, Industry consortia, ad-hoc cross-company R&D teams The mechanisms for cooperation throughout the supply chain must be strengthened. Cooperation and risk sharing among OEMs, ODMs, EMS firms and component suppliers is needed to focus on the right technology and to find a way to deploy it in a timely manner. 16
16 Packaging Roadmap
17 Primary Contributors CONTRIBUTORS W. R. Bottoms, 3MTS, Chair William Chen, ASE, Co-Chair Keith Newman, Sun Microsystems Bernd Appelt, ASE Henry Utsunomiya, Interconnection Technologies, Inc. Chuck Richardson, inemi Bob Pfahl, inemi Jie Xue, Cisco Rolf Aschenbrenner, Fraunhofer Institute IZM 18
18 State of the semiconductor packaging market Market for semiconductors has rebounded driven mainly by mobile computing. Increased focus on shrinking form factor and low power High level of integration (SoC, SiP) Use of 3D packaging and embedded components Majority of devices are packaged by assembly contractors Very competitive markets with low gross margin. Constrained ability to invest in the new technology required to meet emerging market requirements. Key Drivers in terms of markets Replacement of transportation with communication Internet of things Sensors and data everywhere Improvement of energy efficiency through use of electronics Hybrid and electric cars Environmental controls including smart thermostats, automatic lighting control, etc. Load shedding power controls for electronic systems based on real time use conditions. Improved energy efficiency for electric motors, appliances, consumer products Improved lighting efficiency through the use of LEDs Innovation in packaging will be one enabling factor in bringing these new technologies to market providing cost and performance advantages. 19
19 Paradigm Shifts Need for continuous introduction of complex multifunctional products to address converging markets favors modular components or SiP (2-D & 3-D): Increases flexibility - Shortens design cycle Cloud connected digital devices have the potential to enable major disruptions across the industry Rapid evolution and new challenges in energy consuming products such as SSL, Automotive and more Sensors everywhere MEMS and wireless traffic! More Moore (scaling of pitch) has reached its forecast limit and must transition to heterogeneous integration - More Than Moore. 20
20 Packaged Devices are getting more complex Scaling (More Moore) [Geometrical & Equivalent scaling] Moore s Law & More Functional More Diversification than Moore: Diversification (More than Moore) Analog/RF HV HVPower Passives Passives Power Sensors Actuators Biochips More Moore: Miniaturization Baseline CMOS: CPU, Memory, Logic 130nm 90nm 65nm 45nm 32nm 22nm.. V Information Processing Digital content System-on-chip (SoC) Interacting with people and environment Non-digital content System-in-package (SiP) Combining SoC and SiP: Higher Value Systems Beyond CMOS 21
21 0214.1/105bp Product/Package Type Volume (Bn Units) SiP/MCP FORECAST Forecast Leading Suppliers/Players Stacked Die In Package and ASE, SPIL, Amkor, STATS ChipPAC, Samsung, 8 11 Memory Card Micron, SKHynix, Toshiba, SanDisk Stacked Package on Package Amkor, STATS ChipPAC, ASE, SPIL, Samsung, Bottom Package Only Apple, Qualcomm, Sony, Panasonic PA Centric RF Module RFMD, Skyworks, Anadigics, Renesas, TriQuint, Avago Connectivity Module (Bluetooth/WLAN) Murata, Taiyo Yuden, ACSIP, ALPS Graphics/CPU or ASIC MCP Intel, IBM, Fujitsu, Xlinx, Altera Leadframe Module NXP, STMicro, TI, Freescale, Toshiba, 3 5 (Power/Other) Infineon, Renesas, IR, ON Semi MEMS and Controller 5 8 ST, Analog, Bosch, Freescale, Knowles, SKHynix, InvenSense Denso TOTAL Prismark Partners LLC 22 22
22 High Performance Packaging Technologies and Challenges
23 Potential Solution: 2.5D/3D Photonic Co-integrated SiP TSV memory stack, direct bonding interconnect, Large on-package memory cache Multiple voltage regulators to match power delivery to each component to the work in process Electronics, Photonics and Plasmonics on an SOI Substrate Photonic engine DRAM Flash memory DRAM Flash memory DRAM Flash memory DRAM Flash memory Memory controller DRAM CMOS logic DRAM Memory controller Silicon Substrate with TSV interconnects and Si Waveguides Power Controller Photonic/electronic Circuit Board PCB with electronic and photonic signals with embedded components 24
24 SiP Physical density Difficult Challenges by Package Type Thermal management Cross talk Noise isolation Power delivery Heterogeneous integration (compound semiconductors, photonics to the package, MEMS, etc.) Wafer level packaging 3D Heterogeneous integration Embedded components Alignment accuracy Large area packages and interposers Stress due to CTE mismatch Warpage 3D Integration Cost Power integrity (lower operating voltage) Thermal management Thin wafer and die handling Bandwidth 25
25 System in Package (SiP) Poses Many Difficult Challenges 26
26 Technologies Enabling 3D Integration Through Silicon Via active wafer & interposers Two side wafer level Processes RDL and MicroBumping Embedded Components (active & passive) Wafer thinning & Handling Wafer to Wafer Bonding Die to Wafer Bonding Micro bump assembly Design Tools Micro fluidics Cooling Assembly of TSV die Test of TSV Die Source: Phil Garrou, 2009
27 Difficult Challenges: Materials Materials Incorporation of ballistic conductors Improved thermal conductivity (die attach, underfill, encapsulant, interlayer dielectric, other) Pb free solder materials Low temp bonding (adhesives and other materials) Low cost, high density component substrates with low CTE Flexible component substrates compatible with wearable electronics 28
28 New Materials Will Be Required Many are in use today Cu interconnect Ultra Low k dielectrics High k dielectrics Organic semiconductors Green Materials Pb free Halogen free Many are in development Nanotubes Nano Wires Macromolecules Nano Particles Composite materials But improvements are needed 29
29 Carbon Conductors Look Better Than Cu Many questions still to be answered before graphene or CNT can be considered as practical interconnect materials. The results so far are very promising. 30
30 Major Gaps and Showstoppers Power requirements (Particularly package related) Thermal management for high thermal density Cost (lowest system cost may not be lowest package cost) Heterogeneous integration (Both device & material) Physical density of Bandwidth Latency There are many details associated with each of these issues and solutions will require new materials, new package architectures and new packaging processes. 31
31 Reducing power, ensuring reliability and power integrity at the point of use are major challenges. What are the potential solutions? 32
32 How Can We Reduce Power? Continue Moore s Law Scaling Reduce leakage currents (new transistor designs) Transistors are less than 10% of IC power today and going down Reduce on-chip Interconnect power by: Improved conductor conductivity Decrease capacitance Reduce interconnect length Reduce operating frequency Reduce operating voltage Voltage regulator per core Reduce high speed electrical signal length Move photons closer to the transistors (new material) (new material) (3D integration) (increased parallelism) (increased parallelism) (On-package photonics) 33
33 Thermal management is critical due to higher circuit density and lower operating temperature requirement. What are the potential solutions? 34
34 Potential Thermal Management Solutions Don t make heat in the first place Improved thermal conductivity through new materials Incorporation of microfluidics, heat pipes Segregation of high temperature components T. Brunschwiler et al., 3D-IC 2009 (IBM) 35
35 Thermal Management Materials Requirements Examples Thermal Interface Mat. Mold Compound Conductors Adhesives Underfill Adhesion Functional Properties Moisture Resistance Modulus Fracture Toughness CTE Highly coupled Material Properties Novel materials to achieve optimal performance for each parameter 36
36 Thermal Management Challenges for Packaging Finding solutions is not going to be easy High thermal dissipation density Hot spots Differential thermal expansion Heterogeneous integration Both circuit type and material The result is thermal limitations for: Bandwidth Power density Cost Reliability 37
37 Package Cost has not scaled with device cost and now poses a significant Gap that will become a showstopper without major innovation 38
38 Gaps with no Known Solution The most common reason for no known solution is cost not meeting market need Potential Solutions include: Increase parallelism in manufacturing Reduce the number of process steps 39
39 WLP, FOWLP and Panel Processing Increase Parallelism and Reduce Cost FOWLP Cost/die $0.5 $ mm WLP, Yield, test and productivity of FOWLP lines will rapidly increase FOWLP Production volume will increase dramatically with time Depreciation of the infrastructure with time New infrastructure will emerge for Panel manufacturing using 0ld LCD 300mm FOWLP display Processing $0.20 $0.10 Cost reduction! FOWLP already in production Panel Processing in development Panel Processing 470mmx370mm Source: Yole
40 Reduce Processing Steps to reduce Cost Remove package underfill New materials and lower processing temperature to reduce stress Reduce CTE differential Lower modulus materials with improved fracture toughness Improved interfacial adhesion Ziptronix DIB Cu nano-solder Ultra-conducting CU New ULK dielectrics Alchimer metal Reduce stress concentration by design Simulation 41
41 Summary
42 Packaging Gaps / Technology needs < 5 years Need lower cost multilayer interposers and integrated passives Address package warpage at elevated temperatures Develop high thermal conductive materials for high thermal density devices Handling of thinned wafer and die Develop equipment for wafer level packaging, fan out, 3D etc. Address equipment requirements to support assembly of complex SiPs with MEMS, 43 43
43 Packaging Gaps/ Technology needs > 5 years Improved design systems enable electrical, mechanical and thermal co-design and simulation tools that can be used to predict the reliability of packages/systems with high level of confidence Further packaging technologies will incorporate a wide range of materials and equipment that are not available today
44 Invitation to get involved Participate through and webex meetings over the next 3 months to update and review the 2015 roadmap chapter
45 contacts: Grace O Malley gomalley@inemi.org Steve Payne- Europe Steve.payne@inemi.org Haley Fu - Asia haley.fu@inemi.org
Material Requirements For 3D IC and Packaging Presented by: W. R. Bottoms
Material Requirements For 3D IC and Packaging Presented by: W. R. Bottoms Frontiers of Characterization and Metrology for Nanoelectronics Hilton Dresden April 14-16, 2015 Industry Needs Are Changing Moore
More informationHighlights of inemi 2013 Technology Roadmaps
Highlights of inemi 2013 Technology Roadmaps Speaker: Chuck Richardson, inemi Pan Pacific Microelectronics Symposium January 22-24, 2013 Makena Beach and Golf Resort, Maui, Hawaii Topics inemi Introduction
More informationDual Integration - Verschmelzung von Wafer und Panel Level Technologien
ERÖFFNUNG DES INNOVATIONSZENTRUMS ADAPTSYS Dual Integration - Verschmelzung von Wafer und Panel Level Technologien Dr. Michael Töpper BDT Introduction Introduction Why do we need such large machines to
More informationSemi Networking Day Packaging Key for System Integration
Semi Networking Day Packaging Key for System Integration Le Quartz, 75 Cours Emile Zola 69100 Villeurbanne, France Tel : +33 472 83 01 80 - Fax : +33 472 83 01 83 Web: http://www.yole.fr Semi Networking
More informationDry Film Photoresist & Material Solutions for 3D/TSV
Dry Film Photoresist & Material Solutions for 3D/TSV Agenda Digital Consumer Market Trends Components and Devices 3D Integration Approaches Examples of TSV Applications Image Sensor and Memory Via Last
More informationConcevoir et produire des semiconducteurs en Europe: une Utopie? Let s have a look
Concevoir et produire des semiconducteurs en Europe: une Utopie? Let s have a look Gérard MATHERON MIDIS MINATEC 24 avril 2009 1 Advanced Wafer Manufacturing Challenges Advanced Wafer Manufacturing Challenges
More informationAcoustic/Electronic stack design, interconnect, and assembly Techniques available and under development
Acoustic/Electronic stack design, interconnect, and assembly Techniques available and under development - supported by the European Commission under support-no. IST-026461 e-cubes Maaike M. V. Taklo :
More informationWafer Level Fan-out and Embedded Technology for Potable/Wearable/IoT Devices. Max Lu, Deputy Director, SPIL
Wafer Level Fan-out and Embedded Technology for Potable/Wearable/IoT Devices Max Lu, Deputy Director, SPIL 2 Outline Market Trend & Industry Benchmark KEY Innovative Package Solutions Molded WLCSP Fan-Out
More informationAdvanced VLSI Design CMOS Processing Technology
Isolation of transistors, i.e., their source and drains, from other transistors is needed to reduce electrical interactions between them. For technologies
More informationK&S Interconnect Technology Symposium
Advanced Packaging Interconnect Trends and Technology Developments E. Jan Vardaman, President, Advanced Packaging Market Share 28 billion WB 13.8 billion FC & WLP 41 billion WB 28.5 billion FC & WLP Source:
More informationINEMI 2007 Roadmap Organic Substrates. Jack Fisher, Interconnect Technology Analysis, Inc. Celestica-iNEMI Technology Forum May 15, 2007
INEMI 2007 Roadmap Organic Substrates Jack Fisher, Interconnect Technology Analysis, Inc. Celestica-iNEMI Technology Forum May 15, 2007 Introduction The interconnecting substrates functional role provides
More information1.Introduction. Introduction. Most of slides come from Semiconductor Manufacturing Technology by Michael Quirk and Julian Serda.
.Introduction If the automobile had followed the same development cycle as the computer, a Rolls- Royce would today cost $00, get one million miles to the gallon and explode once a year Most of slides
More informationThermal Management for Low Cost Consumer Products
Thermal Management for Low Cost Consumer Products TI Fellow Manager: Advanced Package Modeling and Characterization Texas Instruments rvin@ti.com Outline The challenges Stacked die, Package-on-Package,
More informationEmbedding components within PCB substrates
Embedding components within PCB substrates Max Clemons, Altium - March 19, 2014 Continued pressure for electronic devices that provide greater functionality in ever-smaller formfactors is not only providing
More informationState-of-Art (SoA) System-on-Chip (SoC) Design HPC SoC Workshop
Photos placed in horizontal position with even amount of white space between photos and header State-of-Art (SoA) System-on-Chip (SoC) Design HPC SoC Workshop Michael Holmes Manager, Mixed Signal ASIC/SoC
More informationSUSS MICROTEC INVESTOR PRESENTATION. November 2015
SUSS MICROTEC INVESTOR PRESENTATION November 2015 DISCLAIMER This presentation contains forward-looking statements relating to the business, financial performance and earnings of SUSS MicroTec AG and its
More informationEurotraining survey on Microsytems training requirements
Eurotraining survey on Microsytems training requirements Hervé Fanet CEA LETI Annette Locher FSRM Chantal Tardif CEA INSTN Abstract One objective of the Eurotraining MST project is to identify training
More informationANNUAL GENERAL MEETING APRIL 30, 2015
ANNUAL GENERAL MEETING APRIL 30, 2015 Safe Harbor Statement This presentation contains statements about management's future expectations, plans and prospects of our business that constitute forward-looking
More informationMiniaturizing Flexible Circuits for use in Medical Electronics. Nate Kreutter 3M
Miniaturizing Flexible Circuits for use in Medical Electronics Nate Kreutter 3M Drivers for Medical Miniaturization Market Drivers for Increased use of Medical Electronics Aging Population Early Detection
More informationA Manufacturing Technology Perspective of: Embedded Die in Substrate and Panel Based Fan-Out Packages
A Manufacturing Technology Perspective of: Embedded Die in Substrate and Panel Based Fan-Out Packages Bernd K Appelt Director WW Business Development April 24, 2012 Table of Content Definitions Wafer Level
More informationCANACCORD GENUITY GROWTH CONFERENCE AUGUST 12-13, 2015
CANACCORD GENUITY GROWTH CONFERENCE AUGUST 12-13, 2015 Safe Harbor Statement This presentation contains statements about management's future expectations, plans and prospects of our business that constitute
More informationWafer Level Testing Challenges for Flip Chip and Wafer Level Packages
Wafer Level Testing Challenges for Flip Chip and Wafer Level Packages by Lim Kok Hwa and Andy Chee STATS ChipPAC Ltd. 5 Yishun Street 23, Singapore 768442 kokhwa.lim@statschippac.com; kenghwee.chee@statschippac.com
More informationMicrosystem technology and printed circuit board technology. competition and chance for Europe
Microsystem technology and printed circuit board technology competition and chance for Europe Prof. Udo Bechtloff, KSG Leiterplatten GmbH 1 Content KSG a continuously growing company PCB based Microsystems
More informationDEVELOPMENTS & TRENDS IN FEOL MATERIALS FOR ADVANCED SEMICONDUCTOR DEVICES Michael Corbett mcorbett@linx-consulting.com Semicon Taiwan2015
DEVELOPMENTS & TRENDS IN FEOL MATERIALS FOR ADVANCED SEMICONDUCTOR DEVICES Michael Corbett mcorbett@linx-consulting.com Semicon Taiwan2015 LINX BACKGROUND Linx Consulting 1. We help our clients to succeed
More informationRiding silicon trends into our future
Riding silicon trends into our future VLSI Design and Embedded Systems Conference, Bangalore, Jan 05 2015 Sunit Rikhi Vice President, Technology & Manufacturing Group General Manager, Intel Custom Foundry
More informationA Career that Revolutionises & Improves Lives
OPTION GROUP B ELECTRONIC ENGINEERING presented by K Radha Krishnan Associate Professor, EEE 25 February 2015 1 A Career that Revolutionises & Improves Lives Scientists investigate that which already is,
More informationFraunhofer IZM-ASSID Targets
FRAUNHOFER INSTITUTE FoR Reliability and MiCroinTegration IZM Fraunhofer IZM ASSID All Silicon System Integration Dresden All Silicon System Integration Dresden Fraunhofer IZM-ASSID Fraunhofer IZM The
More information2009 Spring Conference March 8-9, 2009 Radisson Fort McDowell, Scottsdale, AZ www.imaps.org/programs/gbc09spring.htm
2009 Spring Conference March 8-9, 2009 Radisson Fort McDowell, Scottsdale, AZ www.imaps.org/programs/gbc09spring.htm Supply Chain Development for 3D Packaging 12 Industry leaders present on the global
More informationUnternehmerseminar WS 2009 / 2010
Unternehmerseminar WS 2009 / 2010 Fachbereich: Maschinenbau und Mechatronik Autor / Thema / Titel: Key Enabling Technology Business Planning Process: Product Roadmaps 1 Table of Contents About AIXTRON
More informationGlobal Semiconductor Packaging Materials Outlook
NOVEMBER 2009 Global Semiconductor Packaging Materials Outlook Produced by Semiconductor Equipment and Materials International and TechSearch International, Inc. EXECUTIVE SUMMARY 1 1 INTRODUCTION 5 1.1
More informationK&S to Acquire Assembléon Transaction Overview
K&S to Acquire Assembléon Transaction Overview Safe Harbor Statement In addition to historical statements, this presentation and oral statements made in connection with it may contain statements relating
More informationThe Impact of IoT on Semiconductor Companies
Advisory The Impact of IoT on Semiconductor Companies Rajesh Mani Director, Strategy and Operations April 15, 2015 The Internet of Things (IoT) has been defined in multiple ways here s our take! The collection
More informationAPEC 2015 EV-HEV Market and Technology Trends
APEC 2015 EV-HEV Market and Technology Trends Delphi Infineon Toyota 2015 75 cours Emile Zola, F-69100 Villeurbanne, France Tel: +33 472 83 01 80 - Fax: +33 472 83 01 83 Web: http://www.yole.fr 2015 EV/HEV
More informationUltra Low Profile Silicon Capacitors (down to 80 µm) applied to Decoupling Applications. Results on ESR/ESL.
Ultra Low Profile Silicon Capacitors (down to 80 µm) applied to Decoupling Applications. Results on ESR/ESL. Laurent Lengignon, Laëtitia Omnès, Frédéric Voiron IPDiA, 2 rue de la girafe, 14000 Caen, France
More informationSiP Solutions for IoT / Wearables. Pin-Chiang Chang, Deputy Manager, SPIL
SiP Solutions for IoT / Wearables Pin-Chiang Chang, Deputy Manager, SPIL Electronic Products Integration Trend Year ~2000 2010 2015 Main Stream Products PC / Notebook Mobile Phone / Tablet IoT / Wearables
More informationDigital Integrated Circuit (IC) Layout and Design
Digital Integrated Circuit (IC) Layout and Design! EE 134 Winter 05 " Lecture Tu & Thurs. 9:40 11am ENGR2 142 " 2 Lab sections M 2:10pm 5pm ENGR2 128 F 11:10am 2pm ENGR2 128 " NO LAB THIS WEEK " FIRST
More informationIntegrated Circuit Packaging and Thermal Design
Lezioni di Tecnologie e Materiali per l Elettronica Integrated Circuit Packaging and Thermal Design Danilo Manstretta microlab.unipv.it danilo.manstretta@unipv.it Introduction to IC Technologies Packaging
More informationChip Diode Application Note
Chip Diode Application Note Introduction The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components.
More informationERÖFFNUNG DES INNOVATIONSZENTRUMS ADAPTSYS
ERÖFFNUNG DES INNOVATIONSZENTRUMS ADAPTSYS Cyber Physical Systems Sicherheit für eine Welt im Wandel Harald Pötter RF & Smart Sensor Systems Cyber Physical Systems Sicherheit für eine Welt im Wandel Agenda
More informationSamsung emcp. WLI DDP Package. Samsung Multi-Chip Packages can help reduce the time to market for handheld devices BROCHURE
Samsung emcp Samsung Multi-Chip Packages can help reduce the time to market for handheld devices WLI DDP Package Deliver innovative portable devices more quickly. Offer higher performance for a rapidly
More informationAdvanced Technologies for System Integration Leveraging the European Ecosystem
Advanced Technologies for System Integration Leveraging the European Ecosystem Presented by Jean-Marc Yannou ASE Europe June 27, 2013 Packaging - Key for System Integration Semi networking day, Porto 1
More informationNeal O Hara. Business Development Manager
Neal O Hara Business Development Manager PCS OFFERING User Interface Flex Circuit Solutions Sensor Systems Multilayer Copper Flex Circuits LED Lighting 2 VERTICAL INTEGRATION FPC Connector Picoflex on
More informationSimon McElrea : BiTS 3.10.14
Interconnectology The Road to 3D Mobile Consumer Driven Market This Changes Everything 1 Simon McElrea : BiTS 3.10.14 What Is Advanced/3D Packaging? 2 This Is... But So Is This. The level of Hardware Engineering
More informationL innovazione tecnologica dell industria italiana verso la visione europea del prossimo futuro
L innovazione tecnologica dell industria italiana verso la visione europea del prossimo futuro Mercoledì 2 Aprile 2014 Antonio D Errico, Francesco Testa, Roberto Sabella, Ericsson Silicon Photonics Opportunities
More informationDevelopment of a Design & Manufacturing Environment for Reliable and Cost-Effective PCB Embedding Technology
Development of a Design & Manufacturing Environment for Reliable and Cost-Effective PCB Embedding Technology Outline Introduction CAD design tools for embedded components Thermo mechanical design rules
More informationSiP & Embedded Passives ADEPT-SiP Project
System-in-Package () and the ADEPT- Project David Pedder TWI Ltd, Granta Park, Great Abington, Cambridge Copyright 2006 ADEPT- & Embedded Passives ADEPT- Project Objectives Programme Partners ADEPT- Architecture
More informationAnti-Counterfeit, Miniaturized, and Advanced Electronic Substrates for Medical Device Applications
Anti-Counterfeit, Miniaturized, and Advanced Electronic Substrates for Medical Device Applications Rabindra N. Das, Frank D. Egitto, and How Lin Endicott Interconnect Technologies, Inc., 1093 Clark Street,
More informationinemi Heat Transfer TIG Liquid Cooling Symposium May 31, 2006, 7:00-9:00 p.m. Executive Center 3 Sheraton San Diego Hotel & Marina
inemi Heat Transfer TIG Liquid Cooling Symposium May 31, 2006, 7:00-9:00 p.m. Executive Center 3 Sheraton San Diego Hotel & Marina 0 Introduction Michael K Patterson, Intel Corporation 1 Agenda TIME: TOPIC:
More informationCIRCUITS AND SYSTEMS- Assembly and Printed Circuit Board (PCB) Package Mohammad S. Sharawi ASSEMBLY AND PRINTED CIRCUIT BOARD (PCB) PACKAGE
ASSEMBLY AND PRINTED CIRCUIT BOARD (PCB) PACKAGE Mohammad S. Sharawi Electrical Engineering Department, King Fahd University of Petroleum and Minerals Dhahran, 31261 Saudi Arabia Keywords: Printed Circuit
More informationInternet of Things (IoT) and its impact on Semiconductor Packaging
Internet of Things (IoT) and its impact on Semiconductor Packaging Dr. Nathapong Suthiwongsunthorn 21 November 2014 What is the IoT? From Wikipedia: The Internet of Things (IoT) is the interconnection
More informationHDI-Baugruppen der Zukunft - Applikationen, Entwurf, Technologien
HDI-Baugruppen der Zukunft - Applikationen, Entwurf, Technologien 2,5D SiP Vertikale Integration heterogener Mikroschaltungen Stephan Guttowski 2), David Polityko 1), Herbert Reichl 1) 1) Technical University
More informationFaszination Licht. Entwicklungstrends im LED Packaging. Dr. Rafael Jordan Business Development Team. Dr. Rafael Jordan, Business Development Team
Faszination Licht Entwicklungstrends im LED Packaging Dr. Rafael Jordan Business Development Team Agenda Introduction Hermetic Packaging Large Panel Packaging Failure Analysis Agenda Introduction Hermetic
More informationIntroduction. Focusing on marketing & sales of standard process equipment as standard systems as well
Introduction C-Tech is a global acting company with an experienced team of experts, having its management headquarters in the Netherlands and financial holding in Hungary Focusing on marketing & sales
More informationNATIONAL SUN YAT-SEN UNIVERSITY
NATIONAL SUN YAT-SEN UNIVERSITY Department of Electrical Engineering (Master s Degree, Doctoral Program Course, International Master's Program in Electric Power Engineering) Course Structure Course Structures
More informationINVESTOR PRESENTATION FEBRUARY 2015
INVESTOR PRESENTATION FEBRUARY 2015 Safe Harbor Statement This presentation contains statements about management's future expectations, plans and prospects of our business that constitute forward-looking
More informationUBS Technology Conference
UBS Technology Conference London, 13 March 2013 Ulrich Pelzer Corporate Vice President Finance, Treasury & Investor Relations Table of Contents Infineon at a Glance Power Semiconductors and Manufacturing
More informationInvestor Presentation Q3 2015
Investor Presentation Q3 2015 Veeco Instruments 1 Investor Presentation Veeco at a Glance > Leading deposition and etch solutions provider; Veeco enables high-tech electronic device manufacturing > Founded
More informationFlip Chip Package Qualification of RF-IC Packages
Flip Chip Package Qualification of RF-IC Packages Mumtaz Y. Bora Peregrine Semiconductor San Diego, Ca. 92121 mbora@psemi.com Abstract Quad Flat Pack No Leads (QFNs) are thermally enhanced plastic packages
More information3D ICs with TSVs Design Challenges and Requirements
3D ICs with TSVs Design Challenges and Requirements 3D integrated circuits (ICs) with through-silicon vias (TSVs) offer new levels of efficiency, power, performance, and form-factor advantages to the semiconductor
More information3D innovations: From design to reliable systems
3D innovations: From design to reliable systems Uwe Knöchel, Andy Heinig Fraunhofer IIS, Design Automation Division Zeunerstraße 38, 01069 Dresden uwe.knoechel@eas.iis.fraunhofer.de Phone: +49 351 4640
More informationDevelopments in Point of Load Regulation
Developments in Point of Load Regulation By Paul Greenland VP of Marketing, Power Management Group, Point of load regulation has been used in electronic systems for many years especially when the load
More informationWhite Paper: Pervasive Power: Integrated Energy Storage for POL Delivery
Pervasive Power: Integrated Energy Storage for POL Delivery Pervasive Power Overview This paper introduces several new concepts for micro-power electronic system design. These concepts are based on the
More informationFigure 1. New Wafer Size Ramp Up as a Percentage of World Wide Silicon Area Versus Years Elapsed Since the New Size Was Introduced [1].
White Paper Forecasting the 45mm Ramp Up IC Knowledge LLC, PO Box 2, Georgetown, MA 1833 Tx: (978) 352 761, Fx: (978) 352 387, email: info@icknowledge.com Introduction The introduction and ramp up of 45mm
More informationWelcome & Introduction
Welcome & Introduction Accelerating the next technology revolution Sitaram Arkalgud, PhD Director Interconnect Temporary Bond Workshop SEMICON West July 11, 2011 San Francisco CA Copyright 2008 SEMATECH,
More informationHow to Improve Tablet PCs and Other Portable Devices with MEMS Timing Technology
How to Improve Tablet PCs and Other Portable Devices with MEMS Timing Technology The tremendous success of tablets and smart phones such as the ipad, iphone and Android based devices presents both challenges
More informationLow-Overhead Hard Real-time Aware Interconnect Network Router
Low-Overhead Hard Real-time Aware Interconnect Network Router Michel A. Kinsy! Department of Computer and Information Science University of Oregon Srinivas Devadas! Department of Electrical Engineering
More informationMACHINE VISION FOR SMARTPHONES. Essential machine vision camera requirements to fulfill the needs of our society
MACHINE VISION FOR SMARTPHONES Essential machine vision camera requirements to fulfill the needs of our society INTRODUCTION With changes in our society, there is an increased demand in stateof-the art
More informationNanotechnologies for the Integrated Circuits
Nanotechnologies for the Integrated Circuits September 23, 2015 Dr. Bertrand Cambou Professor of Practice NAU, Cybersecurity School of Informatics, Computing, and Cyber-Systems Agenda The Market Silicon
More informationCommercializing TSV 3DIC Wafer Process Technology Solutions for Next Generation of Mobile Electronic Systems
2013 SEMICON China 3D-IC Forum Commercializing TSV 3DIC Wafer Process Technology Solutions for Next Generation of Mobile Electronic Systems Dr. Shiuh-Wuu Lee, Sr. VP of Technology Research & Development
More information3D System-in-Package : Technology Improvements for Volume Manufacturing
3D System-in-Package : Technology Improvements for Volume Manufacturing C. Faure 1, A. Val 1, P. Couderc 2, N. Chandler 3, E. Preziosi 4, Y. Ousten 5, B. Levrier 5 1 SOLECTRON France, 2 3D Plus, 3 BAE
More informationMARKET ANALYSIS AND KEY TRENDS FROM FD SOI PERSPECTIVE (SEPTEMBER 22, 2014)
MARKET ANALYSIS AND KEY TRENDS FROM FD SOI PERSPECTIVE (SEPTEMBER 22, 2014) INTERNATIONAL BUSINESS STRATEGIES, INC. 632 Industrial Way Los Gatos CA 95030 USA 408 395 9585 408 395 5389 (fax) www.ibs-inc.net
More informationGlobal and China Mobile Phone RF (Radio Frequency) Industry Report, 2008-2009
Global and China Mobile Phone RF (Radio Frequency) Industry Report, 2008-2009 Mobile phone RF system consists mainly of transceivers, power amplifier (abbreviated as PA thereafter) and antenna switch.
More informationOPTOELECTRONICS PACKAGING FOR EFFICIENT CHIP-TO-WAVEGUIDE COUPLING
OPTOELECTRONICS PACKAGING FOR EFFICIENT CHIP-TO-WAVEGUIDE COUPLING G. VAN STEENBERGE, E. BOSMAN, J. MISSINNE, B. VAN HOE, K.S. KAUR, S. KALATHIMEKKAD, N. TEIGELL BENEITEZ, A. ELMOGI CONTACT GEERT.VANSTEENBERGE@ELIS.UGENT.BE
More informationECP Embedded Component Packaging Technology
ECP Embedded Component Packaging Technology A.Kriechbaum, H.Stahr, M.Biribauer, N.Haslebner, M.Morianz AT&S Austria Technologie und Systemtechnik AG Abstract The packaging market has undergone tremendous
More informationThe 50G Silicon Photonics Link
The 50G Silicon Photonics Link The world s first silicon-based optical data connection with integrated lasers White Paper Intel Labs July 2010 Executive Summary As information technology continues to advance,
More informationAeroflex Solutions for Stacked Memory Packaging Increasing Density while Decreasing Area
Aeroflex Solutions for Stacked Memory Packaging Increasing Density while Decreasing Area Authors: Ronald Lake Tim Meade, Sean Thorne, Clark Kenyon, Richard Jadomski www.aeroflex.com/memories Military and
More informationOur Embedded Dream of the Invisible Future
Our Embedded Dream of the Invisible Future Since the invention of semiconductor chips, the evolution of mankind s culture, society and lifestyle has accelerated at a pace never before experienced. Information
More informationHow To Power A Power Control Microprocessor (Power Control) Microprocessor 2 (Power) (Power Power) (Control) (Repower) Microcontroller (Power/Reflow) (Mini) (Microprocessor) (Wired) (Wire
PTC NTC for Surface Mounting Application What is a Thermistor? Thermally Sensitive Resistor Thermistor Positive Temperature Coefficient PTC Negative Temperature Coefficient NTC Characteristics of Thermistors
More informationSmart Systems: the key enabling technology for future IoT
Smart Systems: the key enabling technology for future IoT Roberto Zafalon Technology Programmes, Director R&D and Public Affairs, Italy STMicroelectronics IoT Large Scale Pilots Brokerage Workshop London
More informationMicrostockage d énergie Les dernières avancées. S. Martin (CEA-LITEN / LCMS Grenoble)
Microstockage d énergie Les dernières avancées S. Martin (CEA-LITEN / LCMS Grenoble) 1 Outline What is a microbattery? Microbatteries developped at CEA Description Performances Integration and Demonstrations
More informationSubstrate maturity and readiness in large volume to support mass adoption of ULP FDSOI platforms. SOI Consortium Conference Tokyo 2016
Substrate maturity and readiness in large volume to support mass adoption of ULP FDSOI platforms Christophe Maleville Substrate readiness 3 lenses view SOI Consortium C1 - Restricted Conference Tokyo 2016
More informationThin Is In, But Not Too Thin!
Thin Is In, But Not Too Thin! K.V. Ravi Crystal Solar, Inc. Abstract The trade-off between thick (~170 microns) silicon-based PV and thin (a few microns) film non-silicon and amorphous silicon PV is addressed
More informationThermal Modeling Methodology for Fast and Accurate System-Level Analysis: Application to a Memory-on-Logic 3D Circuit
Thermal Modeling Methodology for Fast and Accurate System-Level Analysis: Application to a Memory-on-Logic 3D Circuit Cristiano Santos 1,2, Pascal Vivet 1, Philippe Garrault 3, Nicolas Peltier 3, Sylvian
More informationData Storage and HAMR
Data Storage and HAMR Seagate Technology Mark Gubbins April 2013 Overview Storage Business and Hard Drives Magnetic Recording Head Technology HAMR - The Future of Magnetic Recording 2 The Move Toward Mobility
More informationToday's Presenter. Phillip Wright, Ph.D. IntertechPira Consultant and Chief Analyst and Managing Director at WRT Associates, LLC
Today's Presenter Phillip Wright, Ph.D. IntertechPira Consultant and Chief Analyst and Managing Director at WRT Associates, LLC Dr. Wright is a highly experienced technical executive with an extensive
More informationMEMS & SENSORS PACKAGING EVOLUTION
MEMS & SENSORS PACKAGING EVOLUTION Presented by Christophe Zinck ASE Group September 26th, 2013 Outline 1. Brief presentation of ASE Group 2. Overview of MEMS packaging 3. ASE MEMS packaging background
More informationResearch in Nanotechnologies and Sensing
Eemeli työpaja nro 12, Micronova Research in Nanotechnologies and Sensing Tapani Ryhänen Nokia Research Center, Sensor and Material Technologies Laboratory (Cambridge, Otaniemi, Skolkovo) November 12,
More informationLow Voltage, Resistor Programmable Thermostatic Switch AD22105
a Low Voltage, Resistor Programmable Thermostatic Switch AD22105 FEATURES User-Programmable Temperature Setpoint 2.0 C Setpoint Accuracy 4.0 C Preset Hysteresis Wide Supply Range (+2.7 V dc to +7.0 V dc)
More informationChallenges of the Internet of Things for Sensor and Actuator Applications
Challenges of the Internet of Things for Sensor and Actuator Applications Thomas Gessner, Torsten Thieme SEMICON Moscow 2015 Smart Systems Integration Session June 17 th, 2015 Source: Journal Internet
More informationHigh Voltage Power Supplies for Analytical Instrumentation
ABSTRACT High Voltage Power Supplies for Analytical Instrumentation by Cliff Scapellati Power supply requirements for Analytical Instrumentation are as varied as the applications themselves. Power supply
More informationHigh End PCBs Empowering your products with new integration concepts and novel applications
High End PCBs Empowering your products with new integration concepts and novel applications Markus Leitgeb Programme Manager, R&D www.ats.net Austria Technologie & Systemtechnik Aktiengesellschaft Fabriksgasse13
More informationMicrostockage d énergie Les dernières avancées. S. Martin (CEA-LITEN / Grenoble)
Microstockage d énergie Les dernières avancées S. Martin (CEA-LITEN / Grenoble) 1 Outline What is a microbattery? Microbatteries developped at CEA Description Performances Integration and Demonstrations
More informationPOWER FORUM, BOLOGNA 20-09-2012
POWER FORUM, BOLOGNA 20-09-2012 Convertitori DC/DC ad alta densità di potenza e bassa impedenza termica. Massimo GAVIOLI. Senior Field Application Engineer. Intersil SIMPLY SMARTER Challenges when Designing
More informationHome and Digital. Jean-Marc Chery Chief Operating Officer
Home and Digital Jean-Marc Chery Chief Operating Officer Driving Success 2 Digital Convergence Group turnaround in two waves to double revenues by Q4 2015 from Q4 2013 FD-SOI becoming an industry standard,
More informationVON BRAUN LABS. Issue #1 WE PROVIDE COMPLETE SOLUTIONS ULTRA LOW POWER STATE MACHINE SOLUTIONS VON BRAUN LABS. State Machine Technology
VON BRAUN LABS WE PROVIDE COMPLETE SOLUTIONS WWW.VONBRAUNLABS.COM Issue #1 VON BRAUN LABS WE PROVIDE COMPLETE SOLUTIONS ULTRA LOW POWER STATE MACHINE SOLUTIONS State Machine Technology IoT Solutions Learn
More informationCard electrical characteristic, Parallelism & Reliability. Jung Keun Park Willtechnology
Description of the MEMS CIS Probe Card electrical characteristic, Parallelism & Reliability Jung Keun Park Willtechnology Background Overview Design limitation, Things to consider, Trend CIS Probe Card
More informationSemiconductors enablers of future mobility concepts 4. Kompetenztreffen Elektromobilität, 22. Februar 2012, Cologn
Semiconductors enablers of future mobility concepts 4. Kompetenztreffen Elektromobilität, 22. Februar 2012, Cologn Kurt Sievers Executive VP & General Manager NXP Automotive Geschäftsführer NXP Semiconductors
More informationBasic Properties and Application Examples of PGS Graphite Sheet
Basic Properties and Application Examples of 1. Basic properties of Graphite sheet 2. Functions of Graphite sheet 3. Application Examples Presentation [Sales Liaison] Panasonic Electronic Devices Co.,
More informationHDI. HDI = High Density Interconnect. Kenneth Jonsson Bo Andersson. NCAB Group
HDI HDI = High Density Interconnect Kenneth Jonsson Bo Andersson NCAB Group Definitions / Standards (IPC) Pros & Cons Key equipment Build-ups Choice of material Design rules IPC HDI reliability (µvia stacked
More informationIntroduction to Silicon Labs. November 2015
Introduction to Silicon Labs November 2015 1 Company Background Global mixed-signal semiconductor company Founded in 1996; public since 2000 (NASDAQ: SLAB) >1,100 employees and 11 R&D locations worldwide
More information