ANNUAL GENERAL MEETING APRIL 30, 2015

Transcription

1 ANNUAL GENERAL MEETING APRIL 30, 2015

2 Safe Harbor Statement This presentation contains statements about management's future expectations, plans and prospects of our business that constitute forward-looking statements, which are found in various places throughout the press release, including, but not limited to, statements relating to expectations of orders, net sales, product shipments, backlog, expenses, timing of purchases of assembly equipment by customers, gross margins, operating results and capital expenditures. The use of words such as anticipate, estimate, expect, can, intend, believes, may, plan, predict, project, forecast, will, would, and similar expressions are intended to identify forward looking statements, although not all forward looking statements contain these identifying words. The financial guidance set forth under the heading Outlook constitutes forward looking statements. While these forward looking statements represent our judgments and expectations concerning the development of our business, a number of risks, uncertainties and other important factors could cause actual developments and results to differ materially from those contained in forward looking statements, including the discovery of weaknesses in our internal controls and procedures, our inability to maintain continued demand for our products; the impact on our business of potential disruptions to European economies from euro zone sovereign credit issues; failure of anticipated orders to materialize or postponement or cancellation of orders, generally without charges; the volatility in the demand for semiconductors and our products and services; failure to adequately decrease costs and expenses as revenues decline, loss of significant customers, lengthening of the sales cycle, incurring additional restructuring charges in the future, acts of terrorism and violence; inability to forecast demand and inventory levels for our products, the integrity of product pricing and protect our intellectual property in foreign jurisdictions; risks, such as changes in trade regulations, currency fluctuations, political instability and war, associated with substantial foreign customers, suppliers and foreign manufacturing operations; potential instability in foreign capital markets; the risk of failure to successfully manage our diverse operations; those additional risk factors set forth in Besi's annual report for the year ended December 31, 2014 and other key factors that could adversely affect our businesses and financial performance contained in our filings and reports, including our statutory consolidated statements. We are under no obligation to (and expressly disclaim any such obligation to) update or alter our forward-looking statements whether as a result of new information, future events or otherwise. 2

3 Agenda I. Overview II. Market III. Strategy IV. Financial Review V. Summary 3

4 I. OVERVIEW 4

5 Key Financial Highlights Year Ended December 31, ( millions, except share data) Revenue Orders Gross margin 40% 40% 44% EBITDA Pretax income Net income EPS (diluted) Net margin 6% 6% 19% Net cash Record 2014 Results: Revenue and orders +48.6% and 61.8% Gross Margin +4.0% to 43.8% Net Income +341% to 71.1 million Net cash million Primary drivers: Industry rebound Strategic positioning in advanced packaging has accelerated market share gains Enhanced profit potential of business model Operating initiatives have supported gross and net margin development Solid liquidity base to finance growth and shareholder dividends 5

6 Shareholder Returns 140% 120% Besi Shareholder Total Return Price Dividend 129.4% 4.0% 350.0% 300.0% Cumulative Shareholder Total Return Besi vs. SOX Index % Besi PHLX Semiconductor (SOX) 100% 250.0% 80% 200.0% 60% 47.2% 125.4% 150.0% 40% 5.2% 100.0% 98.6% 20% 0% 17.4% 42.0% 4.3% 13.1% % 0.0% 6

7 Besi Has Achieved Best in Class Industry Metrics Worst Peer BESI ASM Pacific Suss K&S Besi Best Peer Revenue Growth 8.1% 8.1% 19.4% 31.3% 48.6% 48.6% Gross Margin 33.6% 33.6% 35.5% 43.8% 48.6% 48.6% EBITDA Margin 8.7% 8.7% 17.3% 17.4% 21.7% 21.7% Net Margin 3.2% 3.2% 11.2% 12.2% 18.8% 18.8% Return on Equity 4.0% 4.0% 9.2% 19.5% 21.6% 21.6% CF from Ops/ Revenue 3.5% 3.5% 10.4% 15.4% 19.3% 19.3% Inventory Turn ASM Pacific Suss K&S Besi Trailing Twelve Months ended December 31, 2014 Data Source: Bloomberg 7

8 Dividend ( ) Dividend yield Dividend Trends Dividend EPS (diluted) Total Dividend Yield (a) % % 10.0% 8.0% Payout Ratio: % % 5.2% 4.0% % 30% 71% 77% 80% (b) a) Based on year end stock price of b) Proposed for approval at April 2015 AGM 6.0% 4.0% 2.0% 0.0% 8

9 Dividend Yield vs. Peers 6.0% Dividend Yield 5.0% 5.0% 4.0% 3.7% 3.0% 2.0% 1.0% 2.6% 2.3% 1.4% 1.4% 1.0% 0.0% 0.0% 0.0% 0.0% 0.0% 0.0% 0.0% 0.0% 0.0% Source: Reuters April 27,

10 II. MARKET 10

11 ( millions) (US$ billions) Assembly Equipment Market Trends % 4.7 Source: VLSI January % % 3.4% -7.7% -9.6% -23.1% Besi Revenue Assembly Equipment Market Size YoY Growth Rate E 2015F 48.6% -6.9% -6.9% -16.3% Revenue YoY Growth Rate 150% % 50% 0% -50% 150% 100% 50% 0% -50% % VLSI forecasts strong 2014 assembly market rebound and more muted growth in 2015 Besi revenue growth exceeding assembly market in 5 of past 6 years 11

12 Quarterly Book to Bill Trends Reflect Quarterly Seasonality and Volatility Assembly Market Total Semi Equipment Mar 11 Jun 11 Sept 11 Dec 11 Mar 12 Jun 12 Sept 12 Dec 12 Mar 13 Jun 13 Sept 13 Dec 13 Mar 14 Jun 14 Sept 14 Dec 14 Mar 15 Total Equipment Assembly Market Strong industry growth in H1 followed by weaker H2 has been the trend Assembly market more volatile than general semi equipment business 2014 was no exception Source: Semi April

13 2015 Industry Outlook Market Environment Remains Positive Although Mixed Picture by Supplier and Application VLSI sees assembly system growth in 2015 driven by advanced packaging apps New tech/device buys and capacity additions Strength in smart phones, automotive, IOT and wearables Die bonding and flip chip are positive. TCB flip chip is emerging Companies with thin package capabilities are winning 13

14 M wafers, 300MM Eq. Advanced Packaging Unit Volume and Market Share Are Increasing AP Market Share % Advanced Packaging Silicon Demand Growth & Market Share Advanced Packaging Wafers Advanced Packaging Unit Market Share (%) CAGR : 21.1% 31% 26% 19% 13% 10% 38% 37% 35% 34% 32% 40% 35% 30% 25% 20% 15% 10% 5% % Source: VLSI February 2015 Advanced Packaging (Flip Chip/WLP) is fastest growing assembly process In growth phase with move to <20 nano driven by smart phones, tablets, autos, Internet of Things and wearable devices 14

15 Driven by Growth in Internet Connected Devices 35% CAGR device growth forecast over next 5 years Powered by devices used for Internet of Things (IoT) Positive trajectory for smart phones, tablets, wearables, and automotive Significant potential revenue growth driver for Besi 15

16 New Smart Phone Designs Increase Addressable Market Potential - New Main Components Generation Generation Manufacturer IDM/OSAT Besi system Utilized Processor X X Apple TSMC ->Amkor/Stats/ASE 8800FCQ, AMS-W/LM DRAM Memory X X Hynix/Micron Hynix/Micron 2100sD, FSL NAND Flash X X Hynix/Toshiba Hynix/Amkor/Toshiba 8800FCQ, AMS-W/LM Power Management Apple PM IC X Dialog Dialog 2100sD PMIC X X Qualcomm N/A M3 Microcontroller X NXP Amkor/NXP 8800FCQ, AMS-W/LM Accelerometer/Gyroscope/Barometric Gyroscope X X Invensense Amkor/ASE/STM 2100xP, 2100sD, AMS-W/LM, FCL 3-ax accelerometer X Bosch Bosch evo barometric sensor X Bosch Bosch evo Communications Generation 2012 Generation 2014 Manufacturer IDM/OSAT Besi system Utilized Wifi/NFC Wifi module X X Murata Murata Murata's equipment NFC X NXP Amkor 8800FCQ, AMS-W/LM NFC Booster IC X AMS Daca N/A LTE LTE Modem X Qualcomm Amkor/Stats/Spil/ASE 8800FCQ, AMS-W/LM Low Band LTE PAD X Skyworks Skyworks 2200evo, FSL Mid Band PAD X Skyworks Skyworks 2200evo, FSL High Band PAD X Avago ASE/Amkor 2100xP, 2100sD, AMS-W/LM Receiver/Transceiver RF Transceiver X X Qualcomm Amkor 2100xP, 2100sD, AMS-W/LM RF Receiver X X Qualcomm N/A Envelop Tracking IC X Qualcomm TSMC ->Amkor/Stats/ASE 8800FCQ, AMS-W/LM Antenna Switch X X RFMD Amkor/ASE,/RFMD 2100xP, 2100sD PA PA X X Avago ASE/Amkor 2100xP, 2100sD, AMS-W/LM PA Module X Triquint ASE 2200evo, 2100sD Video/Audio Generation 2012 Generation 2014 Manufacturer IDM/OSAT Besi system Utilized Camera Back side 8M (OSI) X X Apple LG, Sharp, Mitsumi 2200evo Front 1.2M X X Apple Cowell, Sony 2200evo Finger print sensor X Apple ASE 2200evo Audio 2+4 microphones X ST ST 2100 xp Audio Codec X X Cirrus Logic Amkor 2100xP, 2100sD, AMS-W/LM Touch screen control Touch screen control X X Broadcom Signetics 2100sD Touch Transmitter X TI TI FCL Besi systems can assemble 50% of 2012 generation components and 70% of 2014 generation components 16

17 Besi Has Gained Market Share In Its Addressable Markets Besi Market Share Source: VLSI, Jan 2015 and Besi estimates Total Assembly Equipment Sales 8.6% 10.8% 13.4% Besi Addressable Market 21.8% 27.0% 31.7% Total Die Attach Equipment 27.7% 33.1% 38.7% Die Bonding 29.7% 39.6% 44.0% Flip Chip 22.2% 25.4% 34.1% Other 25.9% 7.5% 10.0% Total Packaging Equipment 11.1% 16.0% 18.0% Molds 12.0% 19.2% 21.2% Lead Trim & Form 15.0% 17.6% 18.1% Singulation 5.3% 5.1% 8.5% Total Plating 75.8% 83.8% 90%+ Gained share in fastest growing segments of the assembly equipment market: Flip chip and multi module die attach and ultra thin molding for advanced packaging applications 17

18 And With Leading Edge Technology Customers Die Attach Packaging In USD Subcontractors ASE 67% 59% 69% 36% 65% 24% Amkor 75% 84% 89% 45% 11% 22% STATSChippac 95% 100% 85% 28% 100% 100% SPIL 47% 93% 89% 37% 76% 19% Unisem 92% 84% 100% N/B N/B N/B JCET 75% 48% 67% 0% 8% 0% Cowell/Foxconn (Camera Modules) 100% N/B 100% N/B N/B N/B IDMs * Skyworks 100% 96% 100% 13% 24% 38% ST Micro 91% 72% 78% 44% 76% 42% Infineon 81% 97% 100% 0% 24% 90% Micron 86% 100% 43% 50% N/B 100% Samsung** 5% 0% N/B 0% 100% N/B % of Besi Die Attach and Packaging systems revenue 49% 48% 60% 54% 66% 54% Customers are largest producers. Engaged in most advanced packaging applications Strong customer market shares: % of die attach requirements % of packaging requirements Customer market shares p.a. vary based on capacity needs and purchasing cycles Primary competition: Die Attach: ASM-PT, Hitachi, Canon Packaging: Towa, Hanmi, ASM-PT N/B No reported bookings for Besi or its competitors * Fabless semiconductor companies such as Qualcomm, Broadcom and Mediatek have assembly production done by subcontractors ** In general, Samsung satisfies approximately 50% of its equipment needs internally 18

19 III. STRATEGY 19

20 Summary Strategy Develop new products and markets Continue enhancing best in class <20 nano assembly equipment portfolio Expand tech capabilities and applications for TCB line IOT and wearables have potential to significantly expand addressable market Increase market share in addressable market Leverage <20 nano expertise in flip chip, molding, multi module attach to further penetrate largest smart phone supply chains and expand in Chinese handset market Apply TCB tech advantage to more mainstream applications Flip Chip/Wire Bond conversion for advanced applications can further grow market share Achieve a more scalable, flexible and lower cost manufacturing model Expand Asian materials sourcing and direct shipments Start Chinese die bonding production for local market Continue common platforms and common parts Better align US dollar/chf/euro exposure Acquire companies with complementary technologies and products Expand tech leadership in advanced packaging including wafer level assembly 20

21 Shipments % Direct Shipments Asian Production Has Significantly Expanded 1,200 Total Asian Shipments Direct Asian Shipments % Direct 96.3% 100.0% 1, % % % % % 80.0% 70.0% 60.0% 50.0% 40.0% 30.0% % 10.0% % 21

22 Headcount Leading to Lower European Headcount Europe/NA Fixed HC Asia Fixed HC Total 1,800 1,600 1,400 1,510 1,543 1,479 1,434 1,510 1,200 1, % 52% % % 60% Fixed European/North American headcount reduction: Down 18.8% since 2011 Down 3.5% since 2013 Declined from 56% of total in 2009 to 40% at year end % 48% % % 40%

23 ( millions) And Also Reduced Break Even Revenue Levels (13.0%) (9.8%) (2.4%)

24 Headcount Workforce Has Become More Scalable and Flexible Temp % of Total 2, % 2, % 1,500 1,000 1,704 1, , ,632 1, % 6.0% 4.0% 2014 revenue ramp achieved using primarily Asian production temps Aggregate headcount varies with cyclicality and seasonality of business % % Europe/NA Fixed HC Temporary HC Asia Fixed HC Temp % of Total 24

25 Materials Cost Reduction Is Also a Key Priority Supply Chain Actions Qualify and Select Asian Vendors 50% of the way there Development Actions +5% Gross Margin Upside Redesign products Increase standardization of systems Component parts Modules Material costs represent approximately 45% of revenue Shift to Asia centric supply chain: Reduces transport, inventory costs and obsolescence Improves cycle time and ramping flexibility Management Board reviews progress weekly component by component 25

26 Partially Achieved Through Common Parts Product Redesign Potential Unit Cost Savings Areas of focus: Magazine handler Wafer gripper Dispenser Wafer table Wafer Cassette Handler Die Ejector Control Platform DB2100 (7%) 2200evo (11%) 8800FCQ (11%) Average (9%) Development efforts underway to redesign die attach and packaging systems to increase common parts utilized per system Benefits: Lower unit cost, improved working capital mgt, shorter cycle times 26

27 IV. FINANCIAL REVIEW 27

28 2014 Revenue Growth and Margin Expansion Yield Increased Profitability millions Net margin % Revenue Net Income % % 90% 85% 80% Gross Margin 39.8% +4.0 points 43.8% 82.7 MM OPEX +13.4% Headcount 1, ,632 Effective Tax Rate 15.8% points 0.3% points 93.8 MM 18.8% 75% 70% 65% 60% 55% 50% 45% 40% 35% 30% 25% 20% % % 10% 5% 0% 28

29 ( millions) Liquidity Trends (20.0) (40.0) Cash Total Debt Net Cash (24.8) (26.9) (18.6) (17.3) Solid liquidity position million cash at 12/31/ per share vs price (as of December 31, 2014) Net cash reached million at year end 2014 Has Been Utilized to Enhance Shareholder Value 57 million spent on cash dividends and share repurchases Strong balance sheet helps support future organic growth and acquisition opportunities 29

30 Net Cash / Market Cap Net Cash ( millions) Net Cash Position vs. Peers Year End Net Cash ( ) % 160% 120% 80% 40% 0% 176% 114% 106% 99% 71% Year End Net Cash/Revenue (LTM) 43% 41% 37% 33% 33% 31% 27% 26% 21% 13% 12% 10% 8% 2% Source: Bloomberg, Capital IQ 30

31 Key Financial Highlights Q Besi Posts Strong Q1-15 Results. Revenue and Net Income Up 35.6% and 149%, respectively, vs. Q1-14. Orders Up 28.0% vs. Q4-14. Revenue and Profit Exceed Expectations Revenue 94.9 million: +6.6% vs. Q % vs. Q1-14 Orders million: +28.0% vs. Q % vs. Q1-14 Net Income 17.5 million: -11.2% vs. Q % vs. Q1-14 Liquidity Net cash of million million vs. Q million vs. Q

32 Q2-15 Guidance Revenue Gross Margin* Operating Expenses* % 28.3 Up 10-15% 48% - 46% Up 5-7% Q1 Q2 Q1 Q2 Q1 Q2 *excluding restructuring benefit Underlying business growth continues Revenue up approximately 10-15% vs. Q1-15 Gross margins of 46-48% Opex up 5-7% vs. Q1-15 due primarily to higher forex, R&D and warranty Sequential Q2-15 and H1-15/H1-14 revenue and net income growth H2-15 visibility limited 32

33 V. SUMMARY 33

34 Summary Leading semi assembly equipment supplier with #1 or #2 positions in fastest growing assembly segments Scalability and profitability of business model greatly enhanced in cyclical industry Strong 2014 growth. Gaining market share in advanced packaging. Positive outlook for 2015 Solid liquidity position to finance growth Significant upside potential. Advanced packaging growth, operating initiatives and optimization of Asian production model Committed to enhancing shareholder value. Attractive dividend yield relative to peers 34