Basic Properties and Application Examples of PGS Graphite Sheet

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1 Basic Properties and Application Examples of 1. Basic properties of Graphite sheet 2. Functions of Graphite sheet 3. Application Examples Presentation [Sales Liaison] Panasonic Electronic Devices Co., Ltd. Capacitor Business Unit PM Group Goods Team Contact Direct Line (0774) [For inquiries of technology issues] Panasonic Electronic Devices Japan Co., Ltd. Ceramic Division Engineering Team4 Contact Direct Line (0123)

2 (Pyrolytic Highly Oriented Graphite Sheet) is made of graphite with a structure that is close to a single crystal, which is achieved by the heat decomposition of polymeric film. is a competitive conductive sheet with high thermal conductivity and high flexibility. :C99.9% or more High heat conductivity: Each material has high heat conductivity. Heat conductivity of each material (a-b plane) 25µ 70µ 100µ [Layered Structure ] 3.354~3.356 x 10-8 cm Pure copper Aluminum Magnesium alloy Stainless steel c axis Heat conductive sheet Heat conductivity (W/[m/K]) a-b plane

3 Flexibility of [Bending Test] [Bending Limitation] The sheet is fixed < 0.98N > Bending Angle 90 degrees Bending Radius( R ) R =2(mm) R =5(mm) 10,000 cycls 100,000 cycls or more or more Bend Radius: R 180 degrees 3,000 cycls or more 30,000 cycls or more Bending Angle 180 degrees Flexibility: is bending-resistant due to its flexibility. can be used for areas such as curved 90 degrees surfaces and corners because its heat conductivity will remain unchanged in the absence of folds in.

4 Material Characteristics of Graphite Sheets 100µm (100 +/- 30µm) 70µm (70 +/- 15µm) 25µm (25 +/-10µm) Thermal Conductivity () X,Y direction Z direction 600 to to to Thermal diffusivity (cm2/s) 9 to 10 9 to 10 9 to 10 Density (g/cm3) Specific Heat (50deg.C)(J/gK) Heat resistance (deg.c) Extensional strength (MPa) X,Y direction Z direction Bending test (times) R5 180 deg.c or more or more or more Electric Conductivity (S/cm)

5 Applications of (two functions) 1)Thermal Transfer Graphite sheet Carrying the heat A Diffusing the heat B Heat source (MPUs, PAs, Graphic chips, etc) Graphite sheet B B A B B Heat sink Heat source 2)Thermal Interface Decreasing the thermal resistance and diffusing the heat B A Heat sink Graphite sheet Package Heat sink Graphite sheet Package Heat source Without With The peak temperature drops Surface temperature of the package

6 Application Example of (Transfer) Inspection 1 The heat transfer was monitored with thermograph after the heater was attached to the lower part of, Copper and Aluminum. Size;18x180x0.1mm Cu Al «Heat conductivity when the heater was on.» After 10 seconds «Cooling state when the heater was turned on during the heat balance state» After 20 seconds Resistance heater 10x10mm Applied voltage 8V (appro.12w) Cu Al carries the heat rapidly due to high heat conductivity Cu Al Graphite sheet has high cooling effect.

7 Application of (Transfer) Inspection 2 The heat transfer was monitored with thermograph after the heater was attached to the center part of, Copper and Aluminum. [Measuring method] Resistance Heater Electric power 12W Ambient Temperature:25 deg.c Heater size 10 10mm Sample size(heat sink) mm *The surface of the samples and the heater was subjected to black oxide treatment. After 30 minutes Aluminum Copper The temperature of the heater reveals that carried the heat, keeping the heat temperature lowest among the three materials. The low temperature of surface shows that has high heat dissipation.

8 Thermal Resistance of (Interface) [Measuring Method] The sample is placed and fixed between the transistor and the fin to measure temperature difference, from which the thermal resistance is calculated. Thermal resistance Rth = (T1-T2) / W (deg.c/w) Transistor 1.5x2cm=3cm 2 P =approx. 7W Transistor 7w Sample 15x 20mm Temperature of the transistor T1 Thermal resistance property Thermal resistance represents the degree of non-conductivity of the heat. Materials with lower thermal resistance are a more efficient conductor of heat (Thermal resistance depends on hardness of, and surface condition of material as well as heat conductivity.) Thermal resistance (deg C, cm 2 /W) Thermal resistance Silicon Sheet Competitor s Graphite 0.1mm 0.07mm 0.025mm Silicon Grease Temperature of the fin Heat sink fin T2 150x20mm Pressure(kg/cm 2 ) has low thermal resistance due to its high conductivity and flexibility.

9 Shield Effect of Shield Effect (db) Shielding Effectiveness Test (KEC Method) Shield Effect (db)=-20log(vs/v0) Shield Effect for Electric Field Shield Effect for Magnetic Field Frequency (MHz)

10 Application Development(100µseries) 100µseries Adhesive type Insulation type Multilayered type Type 1. only 2. Insulative strong adhesion type 3. Insulative thin adhesion type 4. Low thermal resistancetype 5. High heat resistance type 6. Polyester tape type 7. Polyimide tape type 8. One-sided type 9. Double-sided type Separatin g paper Separating paper Separating paper Separating paper Structure Acrylic double-sided adhesive tape 30µm Acrylic double-sided adhesive tape 10µm Acrylic adhesive 10µm Heat-resistance Acrylic adhesive tape 30µm Polyester tape 30µm Polyimide tape 30kµm Silicon 100µm Silicon 100µm Features Maximizing the heat property and the flexibility of Adding one-side adhesion Employing insulating adhesive tapes Adding one-side adhesion Employing insulating adhesive tapes Adding one-side adhesion Improving thermal conductivity in adhesive layers Adding one-side adhesion Employing high heat resistance double-sided tape Ensuring one-side insulation Employing insulating film Ensuring one-side insulation Employing heatresistant insulating film Improving oneside thermal contact and absorbing roughness of contacted face Low adhesion Heat resistance Improving oneside thermal contact and absorbing roughness of contacted face Low adhesion Heat resistance Thickness 100μm 130µm 110µm 110µm 130µm 130µm 130µm 200µm 300µm Thermal conductivity 600 to to to to to 600 W/ m K 500 to 600 W/ m K 500 to to to 300 Withstand temperature 400 deg. 100 deg.c 100 deg.c 100 deg.c 150 deg.c 100 deg.c 180 deg.c 180 deg.c 180 deg.c Part No. Standard size EYGS x 230mm EYGA091210A EYGA091210M EYGC091210C EYGA091210T EYGA091210P 90x115m EYGA091210K EYGM121810SS 115x80mm EYGM121810SW 115x180mm Maximum size 360x460mm 115x180mm

11 Application Development (70, 25µseries) 70,25µseries Adhesive Type Insulation type TYPE 1. only 2. Insulative strong adhesion type 3. Insulating thin adhesion type 4. High heatresistance type 6. Polyester tape type 7. Polyimide tape type Separating paper Separating paper Separating paper Structure Acrylic double-sided adhesive tape 30µm Acrylic double-sided adhesive tape 10µm Heat-resistance Acrylic adhesive tape 30µm Polyester tape 30µm Polyimide tape 30µm Thickness 70µm 100µm 80µm 100µm 100µm 100µm 70µSeries Thermal conductivity Withstand temperature Part No. 750 to deg.c 100 deg.c EYGS to 700 EYGA091207A 650 to deg.c EYGA091207M 550 to deg.c EYGA091207T 550 to deg.c EYGA091207P 550 to deg.c EYGA091207K Standard size 180x230mm Maximum size 180x460mm 115x180mm 115x180mm 115x180mm 115x180mm 115x180mm Thickness 25µm 55µm 35µm 55µm 55µm 55µm 25µSeries Thermal conductivity Withstand temperature 1500 to to deg.c 100 deg.c 1100 to deg.c 650 to deg.c 650 to deg.c 650 to deg.c Part No. EYGS EYGA091203A EYGA091203M EYGA091203T EYGA091203P EYGA091203K Standard size 115x180mm Maximum size 115x180mm 115x180mm 115x180mm 115x180mm 115x180mm 115x180mm

12 Application Method 1.Application Example of through simulation 2.General Thermal Design Model

13 1.Application Example of (Simulation with heat) In this simulation test, thermal diffusivity will be measured by analyzing heat spot of a layered sample mainly consisting of PWB, IC (heating element), and a case face (ABS Resin). [Model] 50 mm ABS Resin 35x50x1mm K= mm Insulated film 25x40x0.03mm K=0.25 Graphite Sheet 25x40mm Thickness : 0.025mm, 0.07mm Measurement point 9X9 mm at 35 deg.c at 1atm Silicon 9x9x0.5mm K=1 IC 9x9x1.2mm P=1W PWB 25x40x1mm K (xy)=60w/mk,k(z)=1w/mk

14 1.Application Example of (Simulation with heat) Temperature distribution of ABS surface without : The heater (IC) temperature appeared on ABS surface as a heat spot. Model A Result ABS Silicon IC PWB deg.c deg.c deg.c Model B Result ABS deg.c IC PWB deg.c deg.c

15 1.Application Examination of (Simulation with heat) Heat distribution of the ABS surface with 70µ: Diffused the heat and broke the heat spot. TYPE Model A-1-70 Model A-2-70 Model Graphite B-1-70 Sh eet Model B-2-70 size Silicon 25x40x0.07 mm with 25x25x0.07 mm with 25x40x0.07 mm without 25x25x0.07 mm without Result Surface Temp IC Temp PWB Temp deg.c deg.c deg.c deg.c deg.c deg.c deg.c deg.c deg.c deg.c deg.c deg.c You can choose whichever application you think is suitable for your purposes-whether to lower the temperature of heat source or to lower the surface temperature.

16 2.Typical Thermal Design with <Blocking and Sealing of Heat Source> <Heat diffusion to the whole chassis> <Heat transfer to the chassis with larger heat capacity> [Before] Heat spot [After] is attached to heat sources to diffuse heat to the whole chassis. is attached to heat sources in Order to lower the temperatures by heat transfer to larger heat capacity area such as hinge. Heat diffusion to the whole chassis Case Heat dissipation to the hinge with larger heat capacity. Heat dissipation to the intermediate chassis with larger heat capacity. is attached to a case side in order to diffuse heat spots such as PA, resulting in lowered surface temperature. Heat spot 8 to 9 reduced Heat transfer to cooler area PA Isolator Graphite sheet is attached to heat sources in order to lower the temperature of the heat source by heat transfer to cooler area. Graphite Sheet Intermediate chassis such as metal frame is placed between heat sources and the intermediate chassis with larger heat capacity In order to reduce the temperatures of heat sources., an excellent heat transfer material, meets thermal design for various devices with various structures.

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