Peter also specialises in working with SME's at Board level in strategic marketing and business development.

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1 SEA Session P. Connock Chairman memsstar Ltd, Livingston, United Kingdom Peter Connock has been working in the semiconductor industry for over 40 years with a wide range of responsibilities in development, customer service, marketing and management. He has held long term positions at Edwards, Applied Materials and memsstar in locations around the world. In his current role, PENTA Director at AENEAS, he is responsible for the management of the EUREKA cluster PENTA a public private partnership focussed on catalysing Research Development & Innovation in the micro and nanoelectronics enabled systems and applications sector in Europe. PENTA will launch its 4th annual call in November This complements his long term Board Chairmanship of memsstar, Europe's premier semiconductor equipment remanufacturer and services provider. It also serves the global MEMS marketplace, offering etch and deposition expertise, experience, proprietary and remanufactured systems and know how to deliver innovative products and services for research, commercial R&D and production. He has further augmented his operational activities by providing support to industry representative bodies such as SEMI serving on the ISS and Secondary Equipment committees in Europe for many years. Peter also specialises in working with SME's at Board level in strategic marketing and business development. Linked In: The Evolving Landscape of the Secondary Equipment Market & Fab Supplier Interactions T. Salmon VP, Collaborative Technology Platforms Fab Owners Alliance (FOA), Milpitas, United States This talk will include an overall market view of secondary equipment activities, both in Europe and globally, as well as an update on the Fab Owners Alliance (now part of SEMI) and how companies in Europe can engage.

2 As Vice President of Collaborative Technology Platforms, Tom Salmon works with SEMI s staff to ensure that members, standards users, and volunteers worldwide receive maximum value from their association with SEMI. Additionally, he manages a number of SEMI s business and technology communities, including the Fab Owners Alliance, SEMI s Smart Manufacturing initiative, the Electronic Materials Group, Advanced Packaging, and Secondary Equipment and Applications groups. Before joining SEMI, he held several management positions in manufacturing, logistics, customer relations, and sales. Salmon is a member of the Heterogeneous Integration Roadmap Committee, the IEEE and the American Society of Association Executives, and holds a BA from the University of Minnesota and a Level One Proficiency Certificate from Japan s Ministry of Education.

3 EU Regulatory Framework for Semiconductor Manufacturing E. Demircan Sr Manager Advocacy and Public Policy SEMI Europe, Brussels, Belgium While, digitization provides enormous opportunities to the semiconductor industry in Europe, the cost of research and developing technologies in new fields might be higher than conventional applications. The use of secondary manufacturing equipment in new technologies can be a great source of competitiveness as it is an economically beneficial and environmentally sound strategy to extend the useful life of equipment as long as possible. The presentation will shed light on regulatory challenges facing the semiconductor manufacturing industry, including environmental, trade, data, safety and security issues, with a focus on equipment. Emir Demircan, Sr Manager Advocacy and Public Policy at SEMI, is a professional in government affairs. At SEMI, he is responsible for leading EU advocacy initiatives and coordinating relations with the EU. Before joining SEMI, he worked at other advanced manufacturing related associations in Brussels, the European Commission and Sun Chemical. He has a background in international political economy.

4 Obsolescence the greatest challenge facing mature fabs G. Bignell Front End Equipment Purchasing Director STMicroelectronics, Crolles, France Today s successful IOT and automotive fabs are often using equipment manufactured at a time when telephones still had cables connected to them and mails were delivered by a postman. How do we reconcile the huge gap between technologies of the 1990 s/ early 2000 s and 2019? IOT economies of scales demands low cost manufacturing and Automotive demands very stringent quality control. Many of the parts needed to repair these older tools are become obsolete and no longer available, whereas the engineers trained to work on them represent an aging population who have moved on to other jobs or often retired. The challenge facing us is to continue using the older tools whilst meeting all the cost and quality targets. We need a smart approach and help from all within the Secondary Equipment arena. Gareth Bignell has been responsible for the sourcing of ST s fab equipment, spares and maintenance contracts for all ST sites worldwide as well as maintenance cost reduction programs for the last 10 years. Prior to this, he was the equipment selection program manager for the Crolles2 Alliance where he closely worked with Freescale and NXP on sourcing all of the 300mm tools for this successful multicompany alliance. He started his career as an equipment engineer in Inmos UK before holding various engineering and management roles at ST s Agrate and Crolles sites. Gareth has worked in the semiconductor industry for more than 30 years since graduating from the University of Wales, Newport.

5 Technology Drivers and Challenges in a Growing More than Moore Market Place J. Cummings Managing Director Applied Materials, Santa Clara, United States In recent years, the 200mm wafer fab equipment market has enjoyed somewhat of a renaissance. With the meteoric rise of emerging technologies or the so called More than Moore (MTM) class of device technologies, the 200mm and below wafer fabs are seeing increased wafer volume demand and tool utilization rates that are driving the demand for both capacity add and new technology tools alike. While this has proven to be a boon in many respects for equipment OEMs, there are new and existing challenges to be overcome in supporting a growing 200mm market. From new device technologies and application segment trends, to supply chain inventory, impact of new vs. used on price and delivery times, device technology transitions, to presenting the value of wafer size migration. This presentation outlines and discusses some of the challenges faced by Applied Materials 200mm Equipment Product Group as it navigates the pitfalls and opportunities in rapidly changing trailing edge semiconductor equipment market place. John has been with Applied Materials for 24 years. He started in Semiconductor Equipment Sales and later as Sales to Account and Region General Manager before coming to headquarters in Santa Clara, CA with global Business Management responsibilities. In his current role these past 7 years, he is focused on the specialty equipment, or More Than Moore, segment of semiconductor customers. Before joining Applied Materials, John served as a US Navy officer and aviator for 9 years, operationally in anti submarine warfare during the Cold War and as an Instructor Pilot. John holds a Bachelor of Science degree in Physics from the Virginia Military Institute and an MBA from the University of West Florida.

6 Remanufacturing and related support services customised manufacturing solutions T. Sandbrink-Koblenz European Account Manager memsstar, Livingston, United Kingdom Today s European wafer manufacturing landscape reaches from classical CMOS to More than Moore applications. With some current and future exceptions, fabs are predominantly on established 200mm platforms with toolset vintages from the mid1990s to mid2000 s (when such tools were made obsolete). Currently, a proven supplier base supports the cost structure of these Fabs by delivering a mix of secondary and new equipment. The current installed base and technology capability in production is capable of addressing requirements of future products for the IoT. The last 5 years of high growth for the world wide and European nano and micro fabrication industry has created challenges when increasing capacity through the use of secondary manufacturing equipment. Challenges such as core tool availability, suitability and spares supply have become a real challenge int his world of legacy equipment. In addition, the availability of skilled personnel with long time experience on these platforms is also becoming an issue. The presentation will summarize the near to midterm industry requirements, investigate the secondary market supply chain, discuss new challenges in making the existing equipment fit for beyond CMOS applications and processes. Following this discussion, the talk will look at already available and emerging solutions for the bespoke challenges and will give an outlook on how further improvements can be made through close customer/supplier collaborations. Toni Sandbrink Koblenz has been working in the semiconductor industry for over 20 years with a wide range of responsibilities in sales, customer service and process engineering in the fields of defect inspection, etch and deposition technologies. He has held positions at Infineon, Negevtech, Oxford Instruments and memsstar in multiple locations. He holds a Dipl.Ing. in electrical engineering specializing in semiconductor processes and in his current role as European Account Manager at memsstar, he is responsible for maintaining and developing memsstar s central European customer base.

7 Mapper Lithography: 200mm Applications E. Hoeberichts SVP Sales & Marketing Mapper Lithography B.V., Eindhoven, Netherlands Mapper Lithography presentation will provide information on device innovation with direct write multi beam technology. This can be implemented in 300 and 200mm and sub 200mm wafer fabs. The examples of innovative features will be on sub 100nm features for 200mm fabs and on chip security features for highest levels of cyber security. This supports the extended lifespans of existing fabs and as such supports SEMI SEA activities to continue to support and develop on existing technology nodes. Eduard Hoeberichts has been in the semiconductor industry since 1995, and has extensive experience in business management, lithography and technology development for IC manufacturing and More than Moore Applications. SVP Sales & Marketing Mapper Lithography B.V. for the development of new e beam technology for advanced node IC manufacturing. A strong emerging application is hardware based (cyber) security with direct write multi e beam lithography. UniqIC B.V. CEO. UniqIC develops technology for high secure IC's to provide customers end to end solutions for highly secure ICs. FabMax B.V. Owner. Business development and investment projects. Key projects for technology development, incl. business, investment and training of workforce in Vietnam. Co Chair of SEMI SEA Global Interest Group since 2009 ( ASML ( ) initially as Director of Investor Relations (95 96) & Senior VP ASML President of Division Special Applications 200mm (97 07). Education: MA in Finance & Economics and MBA from Webster University Leiden. BA in Marketing (HEAO). Languages: Netherlands, English, German fluent. French, Spanish good basic knowledge. Learning Vietnamese.