Diagonal 4.5mm (Type 1/4) Progressive Scan CCD Image Sensor with Square Pixel for Color Cameras

Transcription

1 ICX09Q Diagonal.mm (Type /) Progressive Scan CCD Image Sensor with Square Pixel for Color Cameras Description The ICX09Q is a diagonal.mm (Type /) interline CCD solid-state image sensor with a square pixel array which supports A format. Progressive scan allows all pixels signals to be output independently within approximately /0 second. Also, the adoption of monitoring mode allows output to an NTSC monitor without passing through the memory. This chip features an electronic shutter with variable charge-storage time which makes it possible to realize full-frame still image without a mechanical shutter. High resolution and high color reproductivity are achieved through the use of,, primary color mosaic filters. Further, high sensitivity and low dark current are achieved through the adoption of HAD (Hole-Accumulation Diode) sensors. This chip is suitable for applications such as electronic still cameras, PC input cameras, etc. Features Progressive scan allows individual readout of the image signals from all pixels. High horizontal and vertical resolution (both approx. 00T-lines) still image without a mechanical shutter. Supports monitoring mode Square pixel Supports A format Horizontal drive frequency:.7mhz No voltage adjustments (reset gate and substrate bias are not adjusted.),, primary color mosaic filters on chip High resolution, high color reproductivity, high sensitivity, low dark current Continuous variable-speed shutter Low smear Excellent antiblooming characteristics Horizontal register:. drive -pin high precision plastic package (enables dual-surface standard) pin DIP (Plastic) Pin Pin H Optical black position (Top iew) Device Structure Interline CCD image sensor Image size: Diagonal.mm (Type /) Number of effective pixels: 69 (H) 9 () approx. 0K pixels Total number of pixels: 69 (H) 0 () approx. 0K pixels Chip size:.60mm (H).97mm () Unit cell size:.6µm (H).6µm () Optical black: Horizontal (H) direction: Front pixels, rear pixels ertical () direction: Front pixels, rear pixels Number of dummy bits: Horizontal 6 ertical Substrate material: Silicon Wfine CCD is a registered trademark of Sony Corporation. epresents a CCD adopting progressive scan, primary color filter and square pixel. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. E00

2 DD ND φsu CSU φ Hφ Hφ ertical register OUT ND L φ φa φ φ ICX09Q lock Diagram and Pin Configuration (Top iew) 7 6 Note) Horizontal register 9 0 Note) : Photo sensor Pin Description Pin No. Symbol Description Pin No. Symbol Description 6 7 φ ertical register transfer clock φ ertical register transfer clock 9 φa φ L ND ND Hφ Horizontal register transfer clock OUT ertical register transfer clock 0 ertical register transfer clock Protective transistor bias Signal output Hφ Horizontal register transfer clock DD ND φsu CSU Supply voltage ND Substrate clock Substrate bias φ eset gate clock DC bias is generated within the CCD, so that this pin should be grounded externally through a capacitance of 0.µF. Absolute Maximum atings Item atings Unit emarks DD, OUT, φ φsu 0 to +0 φa, φ φsu 0 to + Against φsu φ, φ, L φsu 0 to +0. Hφ, Hφ, ND φsu 0 to +0. CSU φsu to DD, OUT, φ, CSU ND 0. to + Against ND φ, φa, φ, φ ND 0 to + Hφ, Hφ ND 0 to + Against L φa, φ L φ, φ, Hφ, Hφ, ND L 0. to + 0. to + etween input clock pins oltage difference between vertical clock input pins Hφ Hφ Hφ, Hφ φ to + to + to + Storage temperature 0 to +0 C Operating temperature 0 to +60 C + (Max.) when clock width < 0µs, clock duty factor < 0.%.

3 ICX09Q ias Conditions Supply voltage Item Symbol Min. Typ. Max. Unit emarks DD..0. Protective transistor bias Substrate clock eset gate clock L φsu φ L setting is the L voltage of the vertical transfer clock waveform, or the same power supply as the L power supply for the driver should be used. Do not apply a DC bias to the substrate clock and reset gate clock pins, because a DC bias is generated within the CCD. DC Characteristics Item Symbol Min. Typ. Max. Unit emarks Supply current IDD 6.0 ma Clock oltage Conditions Item Symbol Min. Typ. Max. Unit Waveform diagram emarks eadout clock voltage T..0. H0A H = H0A H, HA, H, H L, LA, L, L... L = (L+L)/ ertical transfer clock voltage φ, φa, φ, φ L L HH 0. High-level coupling HL.0 High-level coupling LH 0. Low-level coupling LL 0. Low-level coupling Horizontal transfer clock voltage φh HL eset gate clock voltage φ LH LL L Lm Low-level coupling Low-level coupling Substrate clock voltage φsu

4 ICX09Q Clock Equivalent Circuit Constant Item Capacitance between vertical transfer clock and ND Capacitance between vertical transfer clocks Capacitance between horizontal transfer clock and ND Capacitance between horizontal transfer clocks Capacitance between reset gate clock and ND Capacitance between substrate clock and ND ertical transfer clock series resistor ertical transfer clock ground resistor Horizontal transfer clock series resistor eset gate clock series resistor Cφ CφA, Cφ Cφ CφA, Cφ CφA, Cφ Cφ CφH, CφH CφHH Cφ CφSU A, ND φh Ω φ Symbol Min. Typ. Max. Unit emarks 00 pf 00 pf 000 pf 90 pf 60 pf 0 pf pf 7 pf pf 70 pf Ω 00 Ω 6 Ω 7 Ω 6 Ω φ φa CφA A Hφ φh φh Hφ Cφ CφA CφHH Cφ CφA CφH CφH ND Cφ Cφ Cφ Cφ φ φ ertical transfer clock equivalent circuit Horizontal transfer clock equivalent circuit φ φ Cφ eset gate clock equivalent circuit

5 ICX09Q Drive Clock Waveform Conditions () eadout clock waveform T 00% 90% II II φm 0% T φm 0% tr twh tf 0 () ertical transfer clock waveform Note) eadout clock is used by composing vertical transfer clocks φa and φ. φ H HH H HL LH L0 L L LL φa, φ H0A, H0 HH HA, H H HL LH LA, L LL L φ H HH H HL L0 LH L LL H = H0A L = (L0 + L0) / L = L0 φ = H L0 φa = H0A LA φ = H0 L φ = H L0

6 ICX09Q () Horizontal transfer clock waveform Hφ tr twh tf 90% C 0% Hφ φh two φh twl HL Cross-point voltage for the Hφ rising side of the horizontal transfer clocks Hφ and Hφ waveforms is C. The overlap period for twh and twl of horizontal transfer clocks Hφ and Hφ is two. () eset gate clock waveform tr twh tf waveform H twl φ Point A LH LL Lm L LH is the maximum value and LL is the minimum value of the coupling waveform during the period from Point A in the above diagram until the rising edge of. In addition, L is the average value of LH and LL. L = (LH + LL)/ Assuming H is the minimum value during the interval twh, then: φ = H L Negative overshoot level during the falling edge of is Lm. () Substrate clock waveform 00% 90% φm 0% SU 0% (A bias generated within the CCD) φsu tr twh tf φm 6

7 ICX09Q Clock Switching Characteristics Item Symbol twh twl tr tf Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit emarks eadout clock T µs During readout ertical transfer clock φ, φa, φ, φ 0 ns Horizontal transfer clock During imaging During parallel-serial conversion Hφ Hφ Hφ Hφ ns µs eset gate clock φ 6. ns Substrate clock φsu µs During drain charge When vertical transfer clock driver CXD67AN is used. tf tr ns, and the cross-point voltage (C) for the Hφ rising side of the Hφ and Hφ waveforms must be at least φh/ []. two Item Symbol Min. Typ. Max. Unit Horizontal transfer clock Hφ, Hφ.. ns emarks Spectral Sensitivity Characteristics (excludes lens characteristics and light source characteristics) 7

8 ICX09Q Image Sensor Characteristics (Ta = C) Item Symbol Min. Typ. Max. Unit Measurement method emarks sensitivity Sg 0 m Sensitivity comparison r b Saturation signal sat 00 m Ta = 60 C Smear Sm % ideo signal shading SHg 0 % % Zone 0 and I Zone 0 to II' Uniformity between video signal channels ΔSrg ΔSbg % % Dark signal dt m 6 Ta = 60 C Dark signal shading Δdt m 7 Ta = 60 C Line crawl Lcg. % Line crawl Lcr. % Line crawl Lcb. % Lag Lag 0. % 9 Zone Definition of ideo Signal Shading 69 (H) H 0 H 9 () Zone 0, I Zone II, II' 0 0 Ignored region Effective pixel region Measurement System CCD signal output [ A] r/b CCD C.D.S S/H AMP r/b channel signal output [ ] / S/H / channel signal output [ C] Note) Adjust the amplifier gain so that the gain between [ A] and [ ], and between [ A] and [ C] equals.

9 ICX09Q Image Sensor Characteristics Measurement Method Color coding and readout of this image sensor b b The primary color filters of this image sensor are arranged in the layout r r shown in the figure on the left (ayer arrangement). r and b denote the signals on the same line as the signal and b b the signal, respectively. r r Horizontal register Color Coding Diagram All pixels signals are output successively in a /0s period. The signal and r signal lines and the b signal and signal lines are output successively. eadout modes The diagram below shows the output methods for the following two readout modes. Progressive scan mode Monitoring mode OUT OUT Note) lacked out portions in the diagram indicate pixels which are not read out.. Progressive scan mode In this mode, all pixel signals are output in non-interlace format in /0s. The vertical resolution is approximately 00T-lines and all pixel signals within the same exposure period are read out simultaneously, making this mode suitable for high resolution image capturing.. Monitoring mode The signals for all effective areas are output during a single field period of NTSC standard (approximately /60s) by repeating readout pixels and non-readout pixels every two lines. The vertical resolution is approximately 00T-lines. Note that the same pixel signal is output for both odd and even fields. Since signals are output in a format which conforms to NTSC, the external circuit can be simplified when monitoring using an NTSC monitor. 9

10 ICX09Q Measurement conditions ) In the following measurements, the device drive conditions are at the typical values of the bias and clock voltage conditions. ) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black level (O) is used as the reference for the signal output, which is taken as the value of the r/b signal output or the / signal output of the measurement system. Definition of standard imaging conditions ) Standard imaging condition I: Use a pattern box (luminance 706cd/m, color temperature of 00K halogen source) as a subject. (Pattern for evaluation is not applicable.) Use a testing standard lens with CM00S (t =.0mm) as an I cut filter and image at F.6. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. ) Standard imaging condition ΙΙ: Image a light source (color temperature of 00K) with a uniformity of brightness within % at all angles. Use a testing standard lens with CM00S (t =.0mm) as an I cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm.. sensitivity, sensitivity comparison Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of /00s, measure the signal outputs (r, b, and ) at the center of each r, b, and channel screens, and substitute the values into the following formula. = (r + b)/ Sg = 00 [m] 0 r = / b = /. Saturation signal Set to standard imaging condition II. After adjusting the luminous intensity to 0 times the intensity with the average value of the r signal output, 0m, measure the minimum values of the r, b, and signal outputs.. Smear Set to standard imaging condition II. With the lens diaphragm at F.6 to F, first adjust the average value of the r signal output to 0m. Measure the average values of the r signal output, b signal output, signal output and signal output (ra, ba, a, a), and then adjust the luminous intensity to 00 times the intensity with average value of the r signal output, 0m. After the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value (sm [m]), independent of the r, b, and signal outputs, and substitute the values into the following formula. ra + ba + a + a Sm = sm 00 [%] (/0 method conversion value) ideo signal shading Set to standard imaging condition II. With the lens diaphragm at F.6 to F, adjust the luminous intensity so that the average value of the r signal output is 0m. Then measure the maximum (rmax [m]) and minimum (rmin [m]) values of the r signal output and substitute the values into the following formula. SHg = (rmax rmin)/0 00 [%] 0

11 ICX09Q. Uniformity between video signal channels After measuring, measure the maximum (max [m]) and minimum (min [m]) values of the signal and the maximum (max [m]) and minimum (min [m]) values of the signal, and substitute the values into the following formula. ΔSrg = (max min)/0 00 [%] ΔSbg = (max min)/0 00 [%] 6. Dark signal Measure the average value of the signal output (dt [m]) with the device ambient temperature 60 C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. 7. Dark signal shading After measuring 6, measure the maximum (dmax [m]) and minimum (dmin [m]) values of the dark signal output and substitute the values into the following formula. Δdt = dmax dmin [m]. Line crawl Set to standard imaging condition II. Adjusting the luminous intensity so that the average value of the r signal output is 0m, and then insert,, and filters and measure the difference between signal lines (Δlr, Δlg, Δlb [m]) as well as the average value of the signal output (ar, ag, ab). Substitute the values into the following formula. Lci = Δli 00 [%] (i = r, g, b) ai 9. Lag Adjust the r signal output value generated by strobe light to 0m. After setting the strobe light so that it strobes with the following timing, measure the residual signal (lag). Substitute the value into the following formula. Lag = (lag/0) 00 [%] D A Strobe light timing Light Output r signal output 0m lag (Lag)

12 Hφ Hφ φ CSU φsu ND DD φ φ φa φ L ND OUT ICX09Q Drive Circuit XSU X XA XS X XS X H H /0 CXD67AN /6 / 00K / ICX09 (ottom iew) p M 00 SK.9K /0./ CCD OUT

13 ICX09Q Sensor eadout Clock Timing Chart Progressive Scan Mode X XA X X XS XS Sensor readout clocks XS and XS are used by composing XA and X..ns ( bit) HD.µs (0 bits).µs ( bits) A

14 ICX09Q Sensor eadout Clock Timing Chart Monitoring Mode X XA X X XS XS Sensor readout clock XS is used by composing XA..ns ( bit) HD.µs (0 bits).µs ( bits) A

15 ICX09Q Drive Timing Chart (ertical Sync) Progressive Scan Mode D HD A CCD OUT

16 ICX09Q Drive Timing Chart (ertical Sync) Monitoring Mode FLD D LK HD A CCD OUT

17 0 70 ICX09Q Drive Timing Chart (Horizontal Sync) Progressive Scan Mode HD LK CLK H H A SU SHP SHD 7 7

18 70 0 ICX09Q Drive Timing Chart (Horizontal Sync) Monitoring Mode HD 7 LK CLK H H A SU SHP SHD

19 ICX09Q Notes on Handling ) Static charge prevention CCD image sensors are easily damaged by static discharge. efore handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges. ) Soldering a) Make sure the package temperature does not exceed 0 C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 0W soldering iron and solder each pin in less than seconds. For repairs and remount, cool sufficiently. c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering tool, use a thermal controller of the zero cross On/Off type and connect it to ground. ) Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. Clean glass plates with the following operation as required, and use them. a) Perform all assembly operations in a clean room (class 000 or less). b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. e careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) When a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. Do not reuse the tape. ) Installing (attaching) a) emain within the following limits when applying a static load to the package. Do not apply any load more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (This may cause cracks in the package.) Cover glass 0N Plastic package Compressive strength 0N.Nm Torsional strength b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive. 9

20 ICX09Q c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area, and indicated values should be transferred to the other locations as a precaution. d) The notch of the package is used for directional index, and that can not be used for reference of fixing. In addition, the cover glass and seal resin may overlap with the notch of the package. e) If the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be generated by the fragments of resin. f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyanoacrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) ) Others a) Do not expose to strong light (sun rays) for long periods, color filters will be discolored. When high luminance objects are imaged with the exposure level control by electronic-iris, the luminance of the image-plane may become excessive and discolor of the color filter will possibly be accelerated. In such a case, it is advisable that taking-lens with the automatic-iris and closing of the shutter during the power-off mode should be properly arranged. For continuous using under cruel condition exceeding the normal using condition, consult our company. b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. c) The brown stain may be seen on the bottom or side of the package. ut this does not affect the CCD characteristics. d) This package has kinds of internal structure. However, their package outline, optical size, and strength are the same. Structure A Structure Package Chip Metal plate (lead frame) Cross section of lead frame The cross section of lead frame can be seen on the side of the package for structure A. 0

21 . ± ± ~ ± ~. 0 to 9 ICX09Q Package Outline Unit: mm.0 H ± ~.7 0. M PACKAE STUCTUE PACKAE MATEIAL Plastic LEAD TEATMENT OLD PLATIN LEAD MATEIAL ALLOY PACKAE MASS 0.60g DAWIN NUME AS-D -0(E) pin DIP (00mil) A D C.7 '. A is the center of the effective image area. 7. The two points of the package are the horizontal reference. The point ' of the package is the vertical reference.. The bottom C of the package, and the top of the cover glass D are the height reference.. The center of the effective image area relative to and ' is (H, ) = (.0,.0) ± 0.mm.. The rotation angle of the effective image area relative to H and is ± The height from the bottom C to the effective image area is. ± 0.0mm. The height from the top of the cover glass D to the effective image area is.9 ± 0.mm. 7. The tilt of the effective image area relative to the bottom C is less than µm. The tilt of the effective image area relative to the top D of the cover glass is less than µm.. The thickness of the cover glass is 0.7mm, and the refractive index is.. 9. The notch of the package is used only for directional index, that must not be used for reference of fixing.