1.50mm Height 2220 Package Top View Full Color Chip LEDs Technical Data Sheet. Part No.: LL-R5050RGBC-001

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1 .5mm Height 222 Package Top View Full Color Chip LEDs Technical Data Sheet Part No.: LL-R55RGBC- Spec No.: R55 Rev No.: V.2 Date: Mar./6/26 Page: OF 2

2 Features: P-LCC-6 package. White package. Optical indicator. Colorless clear window. Ideal for backlight and light pipe application. Inter reflector. Low current (2mA) operation. Wide viewing angle. Suitable for vapor-phase reflow, infrared reflow and wave solder processes. Computable with automatic placement equipment. Available on tape and reel (2mm Tape). The product itself will remain within RoHS compliant Version. Descriptions: The R55 is available in soft red, orange, yellow, green, blue and white. Due to the Package design, the LED has wide viewing angle and optimized light coupling by inter reflector, this feature makes the SMT TOP LED ideal for light pipe Application. The low current requirement makes this device ideal for portable equipment or any other application where power is at a premium. Applications: Automotive: Backlight in dashboards and switches. Telecommunication: Indicator and backlight in telephone and fax. Indicator and backlight for audio and video equipment. Indicator and backlight in office and family equipment. Flat backlight for LCD s, switches and symbols. Light pipe application. General use. Spec No.: R55 Rev No.: V.2 Date: Mar./6/26 Page: 2 OF 2

3 Package Dimension: Cathode Mark.9 [.35] [.97] 4. [.58] 5.5 [.27] 4.8 [.89] 4 [.58] 2.9 [.4] 3.3 [.3] 5.5 [.27].5 [.59] Polarity CATHODE BLUE 2 CATHODE RED 3 CATHODE GREEN 4 ANODE GREEN 5 ANODE RED 6 ANODE BLUE 4.8 [.89].2 [.8] 4 [.58] 5 [.97].5 [.59] Recommended Soldering Pad dimensions Unit: mm Tolerance: ±.mm Part No. Chip Material Lens Color Source Color R AlGaInP Hyper Red LL-R55RGBC- G InGaN Water Clear Pure B InGaN Blue Notes:. All dimensions are in millimeters (inches). 2. Tolerance is ±.25mm (. ) unless otherwise specified. 3. Specifications are subject to change without notice. Spec No.: R55 Rev No.: V.2 Date: Mar./6/26 Page: 3 OF 2

4 Absolute Maximum Ratings at Parameters Symbol MAX Unit Hyper Red 6 Power Dissipation PD Pure 95 mw Blue 95 Hyper Red Peak Forward Current (/ Duty Cycle,.ms Pulse Width) IFP Pure ma Blue Hyper Red 25 Continuous Forward Current IF Pure 25 ma Blue 25 Reverse Voltage VR 5 V Hyper Red 2 Electrostatic Discharge (HBM) ESD Pure V Blue Operating Temperature Range Topr -4 to +85 Storage Temperature Range Tstg -4 to + Soldering Temperature Tsld 26 for 5 Seconds Spec No.: R55 Rev No.: V.2 Date: Mar./6/26 Page: 4 OF 2

5 Electrical Optical Characteristics at Parameters Luminous Intensity Symbol Emitting Color IV Viewing Angle 2θ /2 Peak Emission Wavelength Dominant Wavelength Spectral Line Half-Width Forward Voltage Reverse Current λp λd λ VF IR Min. Typ. Max. Unit Test Condition Hyper Red Pure Blue Hyper Red Pure Blue Hyper Red Pure Blue Hyper Red pure Blue Hyper Red Pure Blue Hyper Red Pure Blue Hyper Red Pure Blue 5 mcd Deg nm nm nm V IF=2mA (Note ) IF=2mA (Note 2) IF=2mA IF=2mA (Note 3) IF=2mA IF=2mA µa V R =5V Notes:. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve. 2. θ /2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. The dominant wavelength (λd) is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. Spec No.: R55 Rev No.: V.2 Date: Mar./6/26 Page: 5 OF 2

6 Typical Electrical / Optical Characteristics Curves (25 Ambient Temperature Unless Otherwise Noted) Hyper Red: Spectrum Distribution Wavelength p (nm) Luminous Intensity & Ambient Temperature Ambient Temperature Ta ( ) Forward Current Derating Curve Ambient Temperature Ta ( ) Luminous Intensity & Forward Current Forward Current & Forward Voltage f=khz Duty=/ 2 3 Radiation Diagram o Forward Voltage VF (V) o 2 o 3 o 4 o 5 o 6 o 7 o 8 o 9 o Spec No.: R55 Rev No.: V.2 Date: Mar./6/26 Page: 6 OF 2

7 Pure : Spectrum Distribution Wavelength p (nm) Luminous Intensity & Ambient Temperature Ambient Temperature Ta ( ) Forward Current Derating Curve Ambient Temperature Ta ( ) Luminous Intensity & Forward Current Forward Current & Forward Voltage f=khz Duty=/ 2 3 Radiation Diagram o Forward Voltage VF (V) o 2 o 3 o o 5 o 6 o 7 o 8 o 9 o Spec No.: R55 Rev No.: V.2 Date: Mar./6/26 Page: 7 OF 2

8 Blue: Luminous Intensity & Ambient Temperature Ambient Temperature Ta ( ) Forward Current Derating Curve Spectrum Distribution Wavelength p (nm) Ambient Temperature Ta ( ) Forward Current & Forward Voltage Forward Voltage VF (V) Luminous Intensity & Forward Current f=khz Duty=/ 2 3 Radiation Diagram o o 2 o 3 o 4 o 5 o 6 o 7 o 8 o 9 o Spec No.: R55 Rev No.: V.2 Date: Mar./6/26 Page: 8 OF 2

9 Reliability Test Items And Conditions (Per Chip): The reliability of products shall be satisfied with items listed below: Confidence level: 9%. LTPD: %. ) Test Items and Results: No. Test Item Test Hours/Cycles Test Conditions Sample Size Ac/Re Resistance to Soldering Heat 6 Min 2 Thermal Shock 3 Cycles Temperature Cycle High Temperature Storage DC Operating Life Low Temperature Storage High Temperature/ High Humidity 3 Cycles Tsld=26±5, Min. 5sec H: + 5min sec L: - 5min H: + 5min 5min L: -4 5min 25pcs / 25pcs / 25pcs / Hrs. Temp: 25pcs / Hrs. IF=2mA 25pcs / Hrs. Temp: -4 25pcs / Hrs. 85 /85%RH 25pcs / 2) Criteria for Judging the Damage: Item Symbol Test Conditions Criteria for Judgment Min Max Forward Voltage VF IF=2mA --- F.V.*). Reverse Current IR VR=5V --- F.V.*) 2. Luminous Intensity IV IF=2mA F.V.*) *) F.V.: First Value. Spec No.: R55 Rev No.: V.2 Date: Mar./6/26 Page: 9 OF 2

10 Reel Dimensions: Carrier Tape Dimensions: Loaded quantity PCS per reel. Spec No.: R55 Rev No.: V.2 Date: Mar./6/26 Page: OF 2

11 Please read the following notes before using the product:. Over-current-proof Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change (Burn out will happen). 2. Storage 2. Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package, the LEDs should be kept at 3 or less and 9%RH or less. 2.3 The LEDs should be used within a year. 2.4 After opening the package, the LEDs should be kept at 3 or less and 7%RH or less. 2.5 The LEDs should be used within 68 hours (7 days) after opening the package. 2.6 If the moisture adsorbent material (silica gel) has fabled away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment: 6±5 for 24 hours. 3. Soldering Condition 3. Pb-free solder temperature profile. 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. 4. Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 26 for 5 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. Spec No.: R55 Rev No.: V.2 Date: Mar./6/26 Page: OF 2

12 5. Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. 6. Caution in ESD Static Electricity and surge damages the LED. It is recommended to use a wrist band or anti-electrostatic glove when handling the LED. All devices, equipment and machinery must be properly grounded. Spec No.: R55 Rev No.: V.2 Date: Mar./6/26 Page: 2 OF 2

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