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To our customers, Old Company Name in Catalogs and Other Documents On pril 1 st, 2010, NC lectronics Corporation merged with Renesas Technology Corporation, and Renesas lectronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas lectronics document. We appreciate your understanding. Renesas lectronics website: http://www.renesas.com pril 1 st, 2010 Renesas lectronics Corporation Issued by: Renesas lectronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry.

Notice 1. ll information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas lectronics products listed herein, please confirm the latest product information with a Renesas lectronics sales office. lso, please pay regular and careful attention to additional and different information to be disclosed by Renesas lectronics such as that disclosed through our website. 2. Renesas lectronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas lectronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas lectronics or others. 3. You should not alter, modify, copy, or otherwise misappropriate any Renesas lectronics product, whether in whole or in part. 4. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas lectronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 5. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas lectronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. Renesas lectronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. 6. Renesas lectronics has used reasonable care in preparing the information included in this document, but Renesas lectronics does not warrant that such information is error free. Renesas lectronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. 7. Renesas lectronics products are classified according to the following three quality grades: Standard, High uality, and Specific. The recommended applications for each Renesas lectronics product depends on the product s quality grade, as indicated below. You must check the quality grade of each Renesas lectronics product before using it in a particular application. You may not use any Renesas lectronics product for any application categorized as Specific without the prior written consent of Renesas lectronics. Further, you may not use any Renesas lectronics product for any application for which it is not intended without the prior written consent of Renesas lectronics. Renesas lectronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas lectronics product for an application categorized as Specific or for which the product is not intended where you have failed to obtain the prior written consent of Renesas lectronics. The quality grade of each Renesas lectronics product is Standard unless otherwise expressly specified in a Renesas lectronics data sheets or data books, etc. Standard : Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. High uality : Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anticrime systems; safety equipment; and medical equipment not specifically designed for life support. Specific : ircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. 8. You should use the Renesas lectronics products described in this document within the range specified by Renesas lectronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas lectronics shall have no liability for malfunctions or damages arising out of the use of Renesas lectronics products beyond such specified ranges. 9. lthough Renesas lectronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas lectronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas lectronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 10. Please contact a Renesas lectronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas lectronics product. Please use Renesas lectronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the U RoHS Directive. Renesas lectronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas lectronics. 12. Please contact a Renesas lectronics sales office if you have any questions regarding the information contained in this document or Renesas lectronics products, or if you have any other inquiries. (Note 1) Renesas lectronics as used in this document means Renesas lectronics Corporation and also includes its majorityowned subsidiaries. (Note 2) Renesas lectronics product(s) means any product developed or manufactured by or for Renesas lectronics.

Dual J- Flip-Flops (with Clear) RJ03D0414 0300 Rev.3.00 Jul.22.2005 Features Ordering Information Part Name HD74LS73P HD74LS73RPL Package Type DILP-14 pin SOP-14 pin (JDC) Package Code (Previous Code) PRDP0014B-B (DP-14V) PRSP0014D- (FP-14DNV) Note: Please consult the sales office for the above package availability. Package bbreviation P RP Taping bbreviation (uantity) L (2,500 pcs/reel) Pin rrangement 1C 1CLR 1 1 2 3 CLR J C 14 13 12 1J 1 1 V CC 4 11 GND 2C 2CLR 2J 5 6 7 J C CLR 10 9 8 2 2 2 (Top view) Function Table Inputs Outputs Clear J L X X X L H H L L 0 0 H H L H L H L H L H H H H Toggle H H X X O O H; high level, L; low level, X; irrelevant, ; transition from high to low level, 0; level of before the indicated steady-state input conditions were established. 0; complement of 0 or level of before the indicated steady-state input conditions were established. Toggle; each output changes to the complement of its previous level on each active transition indicated by. Rev.3.00, Jul.22.2005, page 1 of 6

Block Diagram (1/2) Clear J bsolute Maximum Ratings Item Symbol Ratings Unit Supply voltage V CC 7 V Input voltage V IN 7 V Power dissipation P T 400 mw Storage temperature Tstg 65 to +150 C Note: Voltage value, unless otherwise noted, are with respect to network ground terminal. Recommended Operating Conditions Item Symbol Min Typ Max Unit Supply voltage V CC 4.75 5.00 5.25 V Output current I OH 400 µ I OL 8 m Operating temperature Topr 20 25 75 C frequency f clock 0 30 MHz Pulse width t w ( High) 20 t w (Clear Low) 25 ns Setup time t su ( H Data) 20 t su ( L Data) 20 ns Hold time t h 0 ns Note: ; The arrow indicates the falling edge. Rev.3.00, Jul.22.2005, page 2 of 6

lectrical Characteristics Input voltage Output voltage Input current Item Symbol min. typ.* max. Unit Condition V IH 2.0 V V IL 0.8 V V OH 2.7 V J, 20 Clear 60 I IH 0.5 I OL = 8 m V 0.4 I OL = 4 m 80 J, 0.4 Clear 0.8 I IL 0.8 J, 0.1 Clear 0.3 I I 0.4 (Ta = 20 to +75 C) V CC = 4.75 V, V IH = 2 V, V IL = 0.8 V, I OH = 400 µ µ V CC = 5.25 V, V I = 2.7 V m m V CC = 5.25 V, V I = 0.4 V V CC = 5.25 V, V I = 7 V Short-circuit output current I OS 20 100 m V CC = 5.25 V Supply current** I CC 4 6 m V CC = 5.25 V V CC = 4.75 V, V IH = 2 V, V IL = 0.8 V Input clamp voltage V I 1.5 V V CC = 4.75 V, I IN = 18 m Notes: * V CC = 5 V, Ta = 25 C ** With all outputs open, I CC is measured with the and outputs high in turn. t time of measurement, the clock input is founded. Switching Characteristics (V CC = 5 V, Ta = 25 C) Item Symbol Inputs Outputs min. typ. max. Unit Condition Maximum clock frequency f max 30 45 MHz Propagation delay time Timing Definition t PLH Clear 15 20 ns, 15 20 ns t PHL C L = 15 pf, R L = 2 kω t w 3 V 1.3 V 1.3 V 1.3 V t su t h t su t h 0 V 3 V J, 1.3 V 1.3 V "H" Data "L" Data 1.3 V 0 V Rev.3.00, Jul.22.2005, page 3 of 6

Testing Method Test Circuit 1. ƒ max, t PLH, t PHL, (, ) V CC Output Input 4.5V Load circuit 1 RL P.G. Zout=50Ω J C CLR Output CL Same as Load Circuit 1. Notes: 1. Test is put into the each flip-flop. 2. C L includes probe and jig capacitance. 3. ll diodes are 1S2074(H). 2. t PHL (Clear ), t PLH (Clear ) V CC Output Input 4.5V Load circuit 1 RL P.G. Zout=50Ω Input J C CLR Output CL Same as Load Circuit 1. P.G. Zout=50Ω Notes: 1. Test is put into the each flip-flop. 2. C L includes probe and jig capacitance. 3. ll diodes are 1S2074(H). Rev.3.00, Jul.22.2005, page 4 of 6

Waveforms 1 t TLH t THL 10% t w(l) 90% 90% 1.3 V 1.3 V 1.3 V 1.3 V t 10% w(h) 3 V 0 V t PLH t PHL V OH 1.3 V 1.3 V t PHL t PLH 1.3 V 1.3 V V OH Note: input pulse; t TLH 15 ns, t THL 6 ns, PRR = 1 MHz, duty cycle = 50% and for f max, t TLH = t THL 2.5 ns Waveforms 2 t THL t TLH Clear 90% 1.3V 90% 1.3V 10% 10% t w (CLR) t TLH t THL 3V 0V t PHL 10% 90% 90% 1.3V 1.3V t w (C) 20ns 10% 3V 0V V OH 1.3V t PLH V OH Note: 1.3V Crear and clock input pulse; t TLH 15 ns, t THL 6 ns, PRR = 1 MHz, Rev.3.00, Jul.22.2005, page 5 of 6

1 HD74LS73 Package Dimensions JIT Package Code P-DIP14-6.3x19.2-2.54 RNSS Code PRDP0014B-B Previous Code DP-14V MSS[Typ.] 0.97g D 14 8 1 b 3 7 Z L Reference Symbol e 1 D Dimension in Millimeters Min Nom Max 7.62 19.2 20.32 6.3 7.4 5.06 1 0.51 b p 0.40 0.48 0.56 e b p θ e 1 c b 3 c θ 1.30 0.19 0.25 0.31 0 15 e 2.29 2.54 2.79 ( Ni/Pd/u plating ) Z L 2.54 2.39 *1 14 8 F *2 1 JIT Package Code P-SOP14-3.95x8.65-1.27 RNSS Code PRSP0014D- Previous Code FP-14DNV MSS[Typ.] 0.13g D NOT) 1. DIMNSIONS"*1 (Nom)"ND"*2" DO NOT INCLUD MOLD FLSH. 2. DIMNSION"*3"DOS NOT INCLUD TRIM OFFST. b p Index mark H c Terminal cross section ( Ni/Pd/u plating ) Reference Symbol D 2 Dimension in Millimeters Min Nom Max 8.65 3.95 9.05 Z 1 e *3 b p 7 x M L 1 1 b p 0.34 0.40 b 1 0.10 0.14 0.25 1.75 0.46 c 0.15 0.20 0.25 c 1 θ 0 8 L θ H e x 5.80 6.10 1.27 6.20 0.25 y Detail F y Z L 0.15 0.635 0.40 0.60 1.27 L 1 1.08 Rev.3.00, Jul.22.2005, page 6 of 6

Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan eep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. ll information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. ny diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. RNSS SLS OFFICS Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology merica, Inc. 450 Holger Way, San Jose, C 95134-1368, U.S. Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology urope Limited Dukes Meadow, Millboard Road, Bourne nd, Buckinghamshire, SL8 5FH, U.. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong ong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, owloon, Hong ong Tel: <852> 2265-6688, Fax: <852> 2730-6071 http://www.renesas.com Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front venue, #06-10, eppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology orea Co., Ltd. ukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, orea Tel: <82> 2-796-3115, Fax: <82> 2-796-2145 Renesas Technology Malaysia Sdn. Bhd. Unit 906, Block B, Menara mcorp, mcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul hsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510 2005. Renesas Technology Corp., ll rights reserved. Printed in Japan. Colophon.3.0