The Driving the Gigabit Society Chips aus Berlin Copyrights BVMed-Bilderpool, Einsteinufer 37, 10587 Berlin www.hhi.fraunhofer.de
Time Bar Starting advanced research in fiber optic transmission 3D Technology Fiber Optical Sensor Systems Research topics: telegraphy, telephone engineering, high frequency engineering Terrestrial broadband technology, photonics, electronic imaging technology for multimedia Photonic Networks and Components, Electronic Imaging, Mobile Broadband Systems High Speed Hardware Architectures * 1927 1945 1968 1975 1985 2003 2009 2010 * Copyright Bildarchiv Foto Marburg 18.06.2012 2
Mission We focus on those fields in which we truly excel. 18.06.2012 3
Mission We develop efficient, effective and forward-looking solutions for our customers. Copyright FOC-fibre optical components GmbH 18.06.2012 4
Internal Mission Statement Scientific excellence brings market success. Jede E-Mail in den USA geht über Chips aus dem HHI. 18.06.2012 5
Global Activities Goslar Berlin Boston San Jose Tokio Industrial Customers 24 Countries 129 Cities 18.06.2012 6
The Whole Value Chain Network Architectures Algorithms Test Simulation and Modelling Test Simulation and Modelling Photonics and Networks Imaging and Display System Realisation Photonic Components System Realisation Cameras and Displays Boards FPGAs ASICs Boards FPGAs ASICs 18.06.2012 7
Research & Development Photonic Components Detectors and photoreceivers InP based Mach- Zehnder modulators Lasers Polymer optoelectronic integrated circuits Terahertz generation and detection Diffractive optical elements InP-based wafers for optical and optoelectronic components 18.06.2012 8
New Laser Type High Power Laser up to 0,7 W Features excellent single mode optical sources based on buried heterostructure laser design laser diode with multi quantum well active region proven reliability (ageing tests available) mounted on compact headers (CSor C-mount) or fibre-pigtailed modules (RoHS compliance!)
1300 nm Electro-Absorption-Modulated DFB Laser DFB 25 Gb/s, ER > 10dB 40 Gb/s, ER > 9dB EA-Modulator DFB = 40 ma, EAM bias = -1.2 V, T = 20 C, on-chip-measurement, PRBS 2 31-1
IQ modulator for 2 x 50 Gbit DQPSK InP-based IQ modulator for 2 x 50 Gbit/s IQ constellation diagram One-sided contact scheme for polarization muxed QPSK EO response > 40 GHz and extinction ratio > 30 db martin.schell@hhi.fraunhofer.de 21.01.2011 11
IQ modulator in lab package martin.schell@hhi.fraunhofer.de 21.01.2011 12
APACHE: 10x100 Gb/s DQPSK TX Hybrid integration of monolithic InP chips onto optical Si boards Monolithic tunable DFB laser array Planar optical Si board (motherboard) Monolithic 2x50 Gb/s Twin IQ MZ modulator arrays martin.schell@hhi.fraunhofer.de 21.01.2011 13
High Speed Detectors up to 100 GHz Bandwidth standard MESA type 2.5 to 40 GB/s pintwa photoreceiver with integrated travelling wave amplifier up to 100 GHz bandwidth spot size waveguide photoreceiver OEIC converter 3dB cut-off frequency up to 30 GHz responsivity > 1.1 A/W dark durrent < 5 na flip-chip or wire bonding integrated Bias-T single input and dual input / balanced designs available detector chips, integrated with waveguide and spot size converter, and packaged versions available
High Speed Detectors: Results up to 160 Gbit 80 Gbit/s RZ 100 Gbit/s RZ 160 Gbit/s RZ 0.5 V 0.3 V 0.5 V 10 ps 4 ps
100G photodetector & demux 100G detector 100G -> 2x50G demux (later: 4x25G) Data in Ref data Output Output Clock interface costs >1000$ BOM for electrical connectors 3 to 6 db electrical loss electrical loss may require additional preamp martin.schell@hhi.fraunhofer.de 21.01.2011 16
InP monolithic QPSK receiver InP monolithically integrated l-dfb 90 Hybrid 0-90 - 180-270 - 50G balanced PD 50G balanced PD 50G pre amp 50G pre amp demux/ clock rec. martin.schell@hhi.fraunhofer.de 21.01.2011 17
Hybrid Integration Concept PolyBoard Thin Film Elements LD/LD array coupling PD/PD array coupling U grooves spectral filtering, PBS, etc. butt joint, incl. taper via integrated 45 mirror passive fiber/chip coupling Tool Box = Generic Integration Smaller footprint, higher flexibility, rapid prototyping, wafer scale integration capability
Thin Film Filter Multiplexer Polymer-based coherent receiver chip with 4 channel detector array (4x25Gb/s) PD array (InP) 90hybrid (polymer) Norbert Keil 18.06.2012 19
Be our Guest Become a Partner Einsteinufer 37 10587 Berlin, Germany Phone +49 30 31002-0 www.hhi.fraunhofer.de 18.06.2012 20