GOLD-COATED SUBSTRATES

Similar documents
Introduction to VLSI Fabrication Technologies. Emanuele Baravelli

Lecture 12. Physical Vapor Deposition: Evaporation and Sputtering Reading: Chapter 12. ECE Dr. Alan Doolittle

Conductivity of silicon can be changed several orders of magnitude by introducing impurity atoms in silicon crystal lattice.

Types of Epitaxy. Homoepitaxy. Heteroepitaxy

Barrier Coatings: Conversion and Production Status

Optical Properties of Sputtered Tantalum Nitride Films Determined by Spectroscopic Ellipsometry

Lapping and Polishing Basics

CALCULATING THE SIZE OF AN ATOM

Flex Circuit Design and Manufacture.

h e l p s y o u C O N T R O L

Improved Contact Formation for Large Area Solar Cells Using the Alternative Seed Layer (ASL) Process

Coating Technology: Evaporation Vs Sputtering

2. Deposition process

Demonstration of sub-4 nm nanoimprint lithography using a template fabricated by helium ion beam lithography

Evaluating Surface Roughness of Si Following Selected Lapping and Polishing Processes

How to Build a Printed Circuit Board. Advanced Circuits Inc 2004

Pulsed laser deposition of organic materials

Contents. Introduction... A Note About Heatsinks... Precautions...

Physics 441/2: Transmission Electron Microscope

Spectroscopic Ellipsometry:

Opaline Photonic Crystals: How Does Self-Assembly Work?

Module 7 Wet and Dry Etching. Class Notes

Results Overview Wafer Edge Film Removal using Laser

Nanoparticle Deposition on Packaging Materials by the Liquid Flame Spray

Design of inductors and modeling of relevant field intensity

Chapter 4 COATINGS Full Reflective Coatings:

Supporting Online Material for

Name: Class: Date: Multiple Choice Identify the letter of the choice that best completes the statement or answers the question.

OPTIMIZING OF THERMAL EVAPORATION PROCESS COMPARED TO MAGNETRON SPUTTERING FOR FABRICATION OF TITANIA QUANTUM DOTS

Surface characterization of oxygen deficient SrTiO 3

Good Boards = Results

Zero Width Glass Cutting with CO 2 Laser

Chip-on-board Technology

ad notam INSTALLATION GUIDE MONITOR ON GLASS MOUNTING SYSTEM (MGS) Art.No. MGS-xxxx

Paper Chromatography: Separation and Identification of Five Metal Cations

Specifying Plasma Deposited Hard Coated Optical Thin Film Filters. Alluxa Engineering Staff

Ion Beam Sputtering: Practical Applications to Electron Microscopy

The study of structural and optical properties of TiO 2 :Tb thin films

Chapter 8. Low energy ion scattering study of Fe 4 N on Cu(100)

How compact discs are made

Sputtered AlN Thin Films on Si and Electrodes for MEMS Resonators: Relationship Between Surface Quality Microstructure and Film Properties

Contents. Introduction... A Note About Heatsinks... Precautions...

Figure 1 Wafer with Notch

Wafer Placement Repeatibility and Robot Speed Improvements for Bonded Wafer Pairs Used in 3D Integration

Microscope Lab Introduction to the Microscope Lab Activity

Semiconductor doping. Si solar Cell

ALD Atomic Layer Deposition

Lecture 6 Scanning Tunneling Microscopy (STM) General components of STM; Tunneling current; Feedback system; Tip --- the probe.

Modification of Pd-H 2 and Pd-D 2 thin films processed by He-Ne laser

ATOMIC FORCE MICROSCOPY

Adhesive Bonding of Natural Stone

JOURNAL INTEGRATED CIRCUITS AND SYSTEMS, VOL 1, NO. 3, JULY

MICROPOSIT LOL 1000 AND 2000 LIFTOFF LAYERS For Microlithography Applications

Atomic Force Microscopy Observation and Characterization of a CD Stamper, Lycopodium Spores, and Step-Height Standard Diffraction Grating

A Remote Plasma Sputter Process for High Rate Web Coating of Low Temperature Plastic Film with High Quality Thin Film Metals and Insulators

COMPARISON OF TEXTURE IN COPPER AND ALUMINUM THIN FILMS DETERMINED BY XRD AND EBSD *

Colorado State University. Durrell Center Roof Repair

CHARACTERIZATION OF POLYMERS BY TMA. W.J. Sichina, National Marketing Manager

For Touch Panel and LCD Sputtering/PECVD/ Wet Processing

Lecture 18 Strain Hardening And Recrystallization

Effect of PWB Plating on the Microstructure and Reliability of SnAgCu Solder Joints

Wafer Manufacturing. Reading Assignments: Plummer, Chap 3.1~3.4

AN900 APPLICATION NOTE

Al 2 O 3, Its Different Molecular Structures, Atomic Layer Deposition, and Dielectrics

Keywords: Planar waveguides, sol-gel technology, transmission electron microscopy

Assessment and Solutions for Hole Wall Pull Away in High Tg and High Technology Laminate Materials

Light management for photovoltaics. Ando Kuypers, TNO Program manager Solar

Plastic Film Texture Measurement With 3D Profilometry

SCENIC VIEW SV 10 SECTION SOLAR CONTROL FILMS

Solvent Cementing Instructions For Plastic Pipe & Fittings

SEM-COM SEALING GLASSES. SEM-COM Company, Inc N. Westwood Ave. Toledo, Ohio 43607

X-ray diffraction techniques for thin films

Chapter 6 Metal Films and Filters

Solar Photovoltaic (PV) Cells

DualBeam Solutions for Electrical Nanoprobing

Defects Introduction. Bonding + Structure + Defects. Properties

Usage of Carbon Nanotubes in Scanning Probe Microscopes as Probe. Keywords: Carbon Nanotube, Scanning Probe Microscope

Chapter 7-1. Definition of ALD

STM, LEED and Mass spectrometry

Troubleshooting Guide for Digital Printing on Creative Papers

CREOL, College of Optics & Photonics, University of Central Florida

Exploring the deposition of oxides on silicon for photovoltaic cells by pulsed laser deposition

Dew-Point Measurement Solutions

Solutions without Boundaries. PCB Surface Finishes. Todd Henninger, C.I.D. Sr. Field Applications Engineer Midwest Region

Bending, Forming and Flexing Printed Circuits

Calibration of AFM with virtual standards; robust, versatile and accurate. Richard Koops VSL Dutch Metrology Institute Delft

Technology White Papers nr. 13 Paul Holister Cristina Román Vas Tim Harper

How do single crystals differ from polycrystalline samples? Why would one go to the effort of growing a single crystal?

Coating Thickness and Composition Analysis by Micro-EDXRF

SECTION 623 CONCRETE BONDING COMPOUND, EPOXY MORTAR AND EPOXY POLYMER CONCRETE OVERLAY SECTION CONCRETE BONDING COMPOUND.

BIOACTIVE COATINGS ON 316L STAINLESS STEEL IMPLANTS

3M Thermal Bonding Film AF42

Fully dry PMMA transfer of graphene on h-bn

Femtosecond laser-induced silicon surface morphology in water confinement

Atomic Force Microscopy. July, 2011 R. C. Decker and S. Qazi

PTFE Slide Bearings 04/10 149

NANO INDENTERS FROM MICRO STAR TECHNOLOGIES

Microscopy and Nanoindentation. Combining Orientation Imaging. to investigate localized. deformation behaviour. Felix Reinauer

Lecture 4 Scanning Probe Microscopy (SPM)

DFX - DFM for Flexible PCBs Jeremy Rygate

Transcription:

GOLD-COATED SUBSTRATES Gold-coated glass slides / mica / silicon wafers / coverslips Our gold-coated substrates offer valuable features that will enable you to: Avoid paying clean room access fees Avoid contamination problems from multi-user evaporators Avoid reproducibility problems Features Include: Plasma-cleaned surfaces Electron-beam deposited metal films Titanium adhesion layer Prepared in a dedicated clean environment Availability of ellipsometric constants Aluminosilicate glass - Near-zero Alkali Content (0.06 wgt %), High Softening Point (975 C) and High Optical Transmittance (92% over a range of 300-1100 nm) APPLICATIONS Gold substrates can be utilized in the following applications: Cell Culture Substrates are prepared in an electron beam evaporator that is solely dedicated to the deposition of gold films. This prevents the occurrence of impurity metals (e.g., trace levels of Cu) contaminating the gold films, as is the case when multi-user equipment is used to coat gold substrates

Microarrays Gold substrates are prepared in an electron beam evaporator using titanium, not chromium, as the adhesion layer. This avoids the contamination that can occur when a thin layer of chromium is used to promote adhesion of the gold film to an underlying substrate (such as a glass microscope slide), since chromium readily dissolves and diffuses to the surface of the gold film (and can adversely modify the reactivity of the gold). Surface Plasmon Reflectometry Substrates are deposited using an electron beam evaporator, which permits precise control of gold deposition rates and thus the surface roughness. This ensures a high level of control over the thickness and nanometer-scale surface roughness of gold films, as is necessary in order to generate reproducible results with surface plasmon reflectometry. Scanning Probe Microscopy Substrates deposited on mica can be thermally annealed or transferred to epoxy resin (reverse mounting) to form atomically flat surfaces suitable for scanning probe microscopy QUESTIONS AND ANSWERS Are the substrates cleaned before coating them with gold? All of our substrates are cleaned with oxygen plasma prior to coating. Do I have to be careful not to scratch the gold on the substrates? We use source gold that is 99.999% pure - the coatings essentially are "24-karat," which means that the surface is somewhat prone to being scratched if it is not handled carefully. This is not a defect with the coating, it is simply the nature of this metal. Coating adhesion to the substrate is excellent due to the thin titanium layer that is deposited between the substrate and the gold layer. Our own researchers routinely wash gold-coated surfaces with a variety of solvents with no problem. Why is titanium used as the adhesion layer? We use titanium, not chromium, as the adhesion layer, because chromium has been known to diffuse into the overlying gold over time more quickly than titanium. Which substrate provides the smoothest surface? That depends. If you need a smooth substrate surface, choose Gold-coated Silicon Wafers (AU.1000.SL1 or AU.1000.SL2). However, if you want the actual surface of the gold to be as flat as possible, choose Gold-coated Mica (AU.2000.MC1 or AU.2000.MC2) and thermally anneal it by flame or furnace. This will result in gold with atomically flat terraces. The Gold-coated aluminosilicate slides also allow for annealing to improve surface roughness. Why might I want atomically flat terraces of gold on my substrates? Flame annealed gold substrates can provide atomically flat terraces that may be used in many surface science fields including the following:

Electrochemistry: To study the plating of surfaces with different components Biosensors: The gold is covered with self-assembled monolayers of different organic molecules Nanowetting: To study the wetting properties of liquids at the nanoscale level And others... What is the orientation of the gold surface on the substrates (what lattice plane is 'up')? On several substrates (glass, mica) evaporated gold shows a significant tendency, but not an absolute driver, to assume a <111> orientation, which can be greatly enhanced if the coating is properly annealed for a few hours at around 450 C. Deposited onto Silicon (100), however, the gold coating appears to be highly polycrystalline, with <111> orientation being perhaps marginally preferred. Please note that this information is derived from the literature (see below). 1. M.O. Watanabe et al., J. Vac. Sci. Technol. B 9, 924 (1990): "Scanning tunneling microscopy observations of crystal growth of deposited gold films during annealing." Quote: "Before annealing, the surfaces consisted of rolling hills and valleys without any atomically flat regions.... after annealing at 320 C for 3.5-17 hr,... an enlarged STM image [indicates] a (111) surface." 2. Y. Golan et al., Surface Sci. 264, 312 (1992): "Vacuum-deposited gold films I. Factors affecting the film morphology" Quote: "Evaporation of gold onto glass or mica produces large, flat crystallites, with a pronounced {111} texture, while on smooth silicon (100) it results in non-textured films." 3. M. Aguilar et al., Thin Solid Films 317, 189 (1998): "Electromigration in gold thin films." Quote: "The surface of the gold films grown by evaporation on glass is very rough with a typical granular structure with hills of various heights and widths statistically distributed on the surface.... Basically, the peak in the diffractogram corresponding to the <111> orientation is (relative to the standard) more intense than the other ones." 4. M. Aguilar et al., Surface Sci. 482-485, 935 (2001): "Rough growth fronts of evaporated gold films, compared with self-affine and mound growth models." Quote: "Gold was thermally evaporated on polished Si(100) substrates at 30 C under controlled conditions of growth rate, 20 A/sec.... the only preferred orientation normal to the substrate is (111)." How are ellipsometric constants measured? We measure ellipsometric constants for one substrate (not all of the substrates) from a given deposition. The constants are sent with the coated substrates when such data are requested by the customer at the time the original order is placed. This assumes that the coating being ordered is sufficiently reflective (i.e., thick) to allow ellipsometric measurements to be properly made. Can I purchase glass microscope slides coated with just titanium (and not gold)? Yes, we can custom coat glass with just titanium. This will be a custom order. Can I purchase gold-coated substrates that are gold coated but without a titanium adhesion layer? Yes, we can custom coat gold without titanium. This will be a custom order.

Glass Microscope Slides Can I immerse gold-coated slides in thiol-based solutions? Glass slides coated with 100/500 angstroms of gold over a thin titanium adhesion layer may be immersed in a solution of 1.0 millimolar thiol in ethanol. The slides certainly may be immersed for one hour at room temperature; however, they have also been immersed for as long as 24 hours at room temperature with good success. What are the glass specifications of the microscope slide substrates? Glass Description and Specifications: 1. Standard substrate format (25 mm x 76 mm x 0.70 mm) 2. Flat to 3.5 micrometer over 25 mm (optical flat) 3. Refractive index of 1.52 (400-700 nm) 4. Transmission of >90 % (380-700 nm) 5. Thermal strain point: 666 C 6. Coefficient of thermal expansion: 42.0 x 10-7 / C (25-671 C) Mica Can I cut the mica? Gold-coated mica may be cut with either a sheet metal bench shear or a sharp pair of scissors. We do not suggest using a scalpel or hobby knife as they might tear the coating along the edge of the mica. If you plan to anneal the gold and want to preserve this flatness as much as possible, we suggest that our standard mica substrates first be coated, then cut to size, then annealed. It may be of benefit to first cut to size prior to coating if preserving coating properties is absolutely critical. Silicon Wafers What is the difference between surface 'flatness' and surface 'roughness'? Surface 'flatness' is typically measured from an imaginary plane across the center of the wafer. Data points are then taken from that imaginary plane to the top surface of the wafer. The specification is given as GTIR (Global Total Indicated Readout) which covers multiple data points across the wafer. The typical GTIR for the standard coated wafers (test grade wafers) is <15 microns. We can also custom coat 'prime grade wafers', which have a typical GTIR of <5 microns. Superflat wafers with a GTIR of <3 microns are also available for coating on a custom basis. This flatness can be achieved only with a double side polished wafer. Surface 'roughness' is measured in angstroms rms. It is a measurement of the hills and valleys on the topical surface, polished side. This number is not specified or measured much for the typical semiconductor user. We cannot quote this specification for a test grade wafer; however, a standard of 20 angstroms rms or better for a prime grade wafer is a good approximation.

PRICING FOR GOLD-COATED SUBSTRATES Catalogue No. Description Size AU.0100.ALSI Aluminosilicate Glass Microscope Slides with 100 angstroms gold over a 20 angstrom titanium adhesion layer (1 inch x 3 inches x 0.7 mm) AU.0100.CSR Glass coverslips with 100 angstroms gold (15 mm round) over a titanium adhesion layer, 0.13 to 0.16 mm thickness 24 coverslips AU.0100.CSS Glass coverslips coated with 100 angstroms gold (22 mm square) over a titanium adhesion layer, 0.13 to 0.16 mm thickness 12 coverslips AU.0500.ALSI Aluminosilicate Glass Microscope Slides with 500 angstroms gold over a 25 angstrom titanium adhesion layer (1 inch x 3 inches x 0.7 mm) AU.0500.CSS Glass coverslips coated with 500 angstroms gold (22 mm square) over a titanium adhesion layer, 0.13 to 0.16 mm thickness 12 coverslips AU.1000.ALSI Aluminosilicate Glass Microscope Slides with 1000 angstroms gold over a 50 angstrom titanium adhesion layer (1 inch x 3 inches x 0.7 mm) AU.1000.SL1 Silicon Wafers (4 inch) 525 µm thickness with 1000 angstroms gold over a titanium adhesion layer 3 wafers AU.1000.SL2 Silicon Wafers (4 inch) 525 µm thickness with 1000 angstroms gold over a titanium adhesion layer 12 wafers AU.2000.MC1 Mica 90-150 µm thickness (easily cut) with 2000 angstroms gold (1 inch x 1.5 inches) 1 piece AU.2000.MC2 Mica 90-150 µm thickness (easily cut) with 2000 angstroms gold (1 inch x 3 inches) 1 piece ** Ellipsometric constants are available at an extra charge for items with 1000 Å or greater of gold **