Heat transfer. The origin of energy transfer is the random motion of molecules. Heat is transferred by - thermal conduction - convection - radiation

Similar documents
Carbon Cable. Sergio Rubio Carles Paul Albert Monte

Current, Resistance and Electromotive Force. Young and Freedman Chapter 25

Steady Heat Conduction

Heat Transfer and Energy

How To Calculate Thermal Resistance On A Pb (Plastipo)

In today s world of wireless communications

Lecture 9, Thermal Notes, 3.054

Module 1 : Conduction. Lecture 5 : 1D conduction example problems. 2D conduction

Energy Transport. Focus on heat transfer. Heat Transfer Mechanisms: Conduction Radiation Convection (mass movement of fluids)

Everline Module Application Note: Round LED Module Thermal Management

HEAT AND MASS TRANSFER

THERMAL RADIATION (THERM)

Discontinued. LUXEON V Portable. power light source. Introduction

A. Kinetic Molecular Theory (KMT) = the idea that particles of matter are always in motion and that this motion has consequences.

Peltier Application Note

Free Electron Fermi Gas (Kittel Ch. 6)

The Fundamentals of Thermoelectrics

The Three Heat Transfer Modes in Reflow Soldering

EVERYDAY ENGINEERING EXAMPLES FOR SIMPLE CONCEPTS

Natural Convection. Buoyancy force

Forms of Energy. Freshman Seminar

Blackbody Radiation References INTRODUCTION

SUPERCONDUCTIVITY. PH 318- Introduction to superconductors 1

Thin Film Chip Resistors and Arrays for High Temperature Applications Up to +230 C

Chapter 18 Temperature, Heat, and the First Law of Thermodynamics. Problems: 8, 11, 13, 17, 21, 27, 29, 37, 39, 41, 47, 51, 57

The Electrical Properties of Materials: Resistivity

Thermal Resistance, Power Dissipation and Current Rating for Ceramic and Porcelain Multilayer Capacitors

Indiana's Academic Standards 2010 ICP Indiana's Academic Standards 2016 ICP. map) that describe the relationship acceleration, velocity and distance.

Shrinking a power supply and the challenge to maintain high reliability.

ELECTRICAL CONDUCTION

Chapter 5: Diffusion. 5.1 Steady-State Diffusion

Name Class Date. In the space provided, write the letter of the term or phrase that best completes each statement or best answers each question.

Chapter 4: Transfer of Thermal Energy

Name: Class: Date: 10. Some substances, when exposed to visible light, absorb more energy as heat than other substances absorb.

Objectives. Electric Current

AS COMPETITION PAPER 2007 SOLUTIONS

Experiment #4, Ohmic Heat

The soot and scale problems

Temperature coefficient of resistivity

Energy and Energy Transformations Test Review

2. Room temperature: C. Kelvin. 2. Room temperature:

PS-6.2 Explain the factors that determine potential and kinetic energy and the transformation of one to the other.

KINETIC THEORY AND THERMODYNAMICS

Introduction To Materials Science FOR ENGINEERS, Ch. 5. Diffusion. MSE 201 Callister Chapter 5

POWER AND VOLTAGE RATING

Resistivity. V A = R = L ρ (1)

IR Edixeon Emitter. 1W Edixeon

AS COMPETITION PAPER 2008

Integration of a fin experiment into the undergraduate heat transfer laboratory

AZ State Standards. Concept 3: Conservation of Energy and Increase in Disorder Understand ways that energy is conserved, stored, and transferred.

Ampacity simulation of a high voltage cable to connecting off shore wind farms

Introduction to Electricity & Magnetism. Dr Lisa Jardine-Wright Cavendish Laboratory

Statistical Mechanics, Kinetic Theory Ideal Gas. 8.01t Nov 22, 2004

Crystalline solids. A solid crystal consists of different atoms arranged in a periodic structure.

Chapter Outline. Diffusion - how do atoms move through solids?

Chapter 6. Current and Resistance

Review: Balancing Redox Reactions. Review: Balancing Redox Reactions

Calculating Heat Loss by Mark Crombie, Chromalox

G482 Electrons, Waves and Photons; Revision Notes Module 1: Electric Current

SAM Teachers Guide Heat and Temperature

CFD SIMULATION OF SDHW STORAGE TANK WITH AND WITHOUT HEATER

6 ELECTRICAL PARAMETERS

Power Dissipation Considerations in High Precision Vishay Sfernice Thin Film Chips Resistors and Arrays (P, PRA etc.) (High Temperature Applications)

HIGH VOLTAGE ELECTROSTATIC PENDULUM

IV. Molecular Clouds. 1. Molecular Cloud Spectra

Progress In Electromagnetics Research M, Vol. 31, , 2013

Integrated Circuit Packaging and Thermal Design

Rusty Walker, Corporate Trainer Hill PHOENIX

1/9/2013. Terminology Calculating Heat Transfer Code Requirements Design Examples and Sustainability

3. What would you predict for the intensity and binding energy for the 3p orbital for that of sulfur?

1. At which temperature would a source radiate the least amount of electromagnetic energy? 1) 273 K 3) 32 K 2) 212 K 4) 5 K

STUDY MATERIAL FOR CLASS Physics- CURRENT ELECTRICITY. The flow of electric charges in a particular direction constitutes electric current.

Surface Mount Technology cooling for high volumes applications by: Cesare Capriz Aavid Thermalloy via XXV Aprile 32 Cadriano (BO) ITALY

Lecture 30 - Chapter 6 Thermal & Energy Systems (Examples) 1

COURSE: PHYSICS DEGREE: COMPUTER ENGINEERING year: 1st SEMESTER: 1st

Cable Size Selection for Energy Efficiency

IDEAL AND NON-IDEAL GASES

Exercises on Voltage, Capacitance and Circuits. A d = ( ) π(0.05)2 = F

Current and Temperature Ratings

Basic Properties and Application Examples of PGS Graphite Sheet

EFFECT OF OBSTRUCTION NEAR FAN INLET ON FAN HEAT SINK PERFORMANCE

Understanding the p-n Junction by Dr. Alistair Sproul Senior Lecturer in Photovoltaics The Key Centre for Photovoltaic Engineering, UNSW

Lecture 12. Physical Vapor Deposition: Evaporation and Sputtering Reading: Chapter 12. ECE Dr. Alan Doolittle

Kinetic Molecular Theory of Matter

Department of Engineering Enzo Ferrari University of Modena and Reggio Emilia

InGaN / Sapphire White Water clear. Parameter Rating Unit

THERMAL ANALYSIS. Overview

Using Thermoelectric Coolers

Heat Pipe Selection Revision 12/04/2001

Chem 1A Exam 2 Review Problems

DIFFUSION IN SOLIDS. Materials often heat treated to improve properties. Atomic diffusion occurs during heat treatment

Brush DC Motor Basics. by Simon Pata Business Unit Manager, Brushless DC

The rate of change of velocity with respect to time. The average rate of change of distance/displacement with respect to time.

Module 2.2. Heat transfer mechanisms

CHAPTER - 1. Chapter ONE: WAVES CHAPTER - 2. Chapter TWO: RAY OPTICS AND OPTICAL INSTRUMENTS. CHAPTER - 3 Chapter THREE: WAVE OPTICS PERIODS PERIODS

FUNDAMENTALS OF ENGINEERING THERMODYNAMICS

CHAPTER 6 THERMAL DESIGN CONSIDERATIONS. page. Introduction 6-2. Thermal resistance 6-2. Junction temperature 6-2. Factors affecting R th(j-a) 6-2

7. What is the current in a circuit if 15 coulombs of electric charge move past a given point in 3 seconds? (1) 5 A (3) 18 A (2) 12 A (4) 45 A

Experiment #3, Ohm s Law

Data Bulletin. Mounting Variable Frequency Drives in Electrical Enclosures Thermal Concerns OVERVIEW WHY VARIABLE FREQUENCY DRIVES THERMAL MANAGEMENT?

Transcription:

Heat transfer Heat = amount of energy that is transferred from one system to another (or between system and surroundings) as a result of temperature difference The origin of energy transfer is the random motion of molecules Heat is transferred by - thermal conduction - convection - radiation

Fourier s Law of Thermal Conduction T(x) J x J x 1 A dq dt x dt/dx x J x = heat flux, dq x /dt = the rate of heat flow A = cross-sectional area HEAT HOT δt δx dq dt COLD Fig. 2.19: Heat flow in a metal rod heated at one end. Consider the rate of heat flow, dq/dt, across a thin section δ x of the rod. The rate of heat flow is proportional to the temperature gradient δ T/δ x and the cross sectional area A. From Principles of Electronic Materials and Devices, Second Edition, S.O. Kasap ( McGraw-Hill, 2002) http://materials.usask.ca A J x = dq dt dt = κ dx dt/dx = temperature gradient κ = thermal conductivity [κ] = W m -1 K -1 or W m -1 0 C -1 Reminder: dc Γ = D dx Fick s First Law

Thermal Conductivities of various materials

Thermal Conductivities of various materials Strong metallic bonding Strong covalent bonding Weak Van-der-Waals bonding

Wiedemann Franz - Lorenz Law Thermal conductivity, κ (W K -1 m -1 ) 450 400 300 200 100 0 κ σ = T C WFL Be W Mg Mo Ni Brass (Cu-30Zn) Bronze (95Cu-5Sn) Steel (1080) Pd-40Ag Hg 0 10 20 30 40 50 60 70 Electrical conductivity, σ, 10 6 Ω -1 m -1 Al Ag-3Cu Ag-20Cu Au Ag Cu κ σt =C WFL =2.45 10 8 W Ω K 2 κ = thermal conductivity σ = electrical conductivity T = temperature C WFL = Lorenz number Fig. 2.20: Thermal conductivity, κ vs. electrical conductivity σ for various metals (elements and alloys) at 20 C. The solid line represents the WFL law with C WFL 2.44 108 W Ω K-2. From Principles of Electronic Materials and Devices, Second Edition, S.O. Kasap ( McGraw-Hill, 2002) http://materials.usask.ca

Wiedemann Franz - Lorenz Law Thermal conductivity, κ (W K -1 m -1 ) 450 400 300 200 100 0 κ σ = T C WFL Be W Mg Mo Ni Brass (Cu-30Zn) Bronze (95Cu-5Sn) Steel (1080) Pd-40Ag Hg 0 10 20 30 40 50 60 70 Electrical conductivity, σ, 10 6 Ω -1 m -1 Al Ag-3Cu Ag-20Cu Au Ag Cu Fig. 2.20: Thermal conductivity, κ vs. electrical conductivity σ for various metals (elements and alloys) at 20 C. The solid line represents the WFL law with C WFL 2.44 108 W Ω K-2. From Principles of Electronic Materials and Devices, Second Edition, S.O. Kasap ( McGraw-Hill, 2002) http://materials.usask.ca Thermal conductivity, κ (W K -1 m -1 ) κ σt =C WFL =2.45 10 8 W Ω K 2 κ = thermal conductivity 50000 10000 σ = electrical Copper conductivity T = temperature 1000 Aluminum C WFL = Lorenz number 100 Brass (70Cu-30Zn) Al-14%Mg 10 1 10 100 1000 Temperature (K) Thermal conductivity vs. temperature for two pure metals (Cu and Al) and two alloys (brass and Al-14%Mg). Data extracted from Thermophysical Properties of Matter, Vol. 1: Thermal Conductivity, Metallic Elements and Alloys, Y.S. Touloukian et. al (Plenum, New York, 1970).

Thermal Conductivities of various materials Strong metallic bonding Strong covalent bonding Weak Van-der-Waals bonding

Thermal conduction in metals and some insulators Metals Ag, Cu, Al... Insulators with very strong covalent bonding C (diamond), BeO (beryllia),... HEAT HOT COLD Equilibrium Hot Cold Energetic atomic vibrations Fig. 2.22: Conduction of heat in insulators involves the generation and propogation of atomic vibrations through the bonds that couple the atoms. (An intuitive figure.) From Principles of Electronic Materials and Devices, Second Edition, S.O. Kasap ( McGraw-Hill, 2002) http://materials.usask.ca Electron Gas Vibrating Cu + ions Heat is transferred by conduction electrons Heat is transferred as atomic vibrations due to strong bonding between atoms

Parabolic heat equation D th 2 T 2 x = T t where D th = κ cρ thermal diffusitivity ρ = density c = specific heat capacity Heat flow in Heat flow out = = Rate of heat accumulation in volume δx Rate of heat accumulation in volume δx = Heat flow in Heat flow out = J x (x)- J x (x+δx) = J x x T x ρ c t 2 T x = κ δx x δ δ 2 C x t C x t D 2 (, ) (, Reminder: = ) Fick s Second Law 2 x t

Fourier s Law Q = Aκ ΔT L = ΔT (L/κA) J x = dq dt dt = κ dx J x 1 A dq dt x Q = rate of heat flow or the heat current, A = cross-sectional area, κ = thermal conductivity (material-dependent constant of proportionality), ΔT = temperature difference between ends of component, L = length of component Ohm s Law I = ΔV R = ΔV (L /σa) I = electric current, ΔV = voltage difference across the conductor, R = resistance, L = length, σ = conductivity, A = cross-sectional area

Fourier s Law Q = Aκ ΔT L = ΔT (L/κA) = θ Q = rate of heat flow or the heat current, A = cross-sectional area, κ = thermal conductivity (material-dependent constant of proportionality), ΔT = temperature difference between ends of component, L = length of component Ohm s Law I = ΔV R = ΔV (L /σa) = R I = electric current, ΔV = voltage difference across the conductor, R = resistance, L = length, σ = conductivity, A = cross-sectional area

Definition of Thermal Resistance Q = ΔT θ Q = rate of heat flow, ΔT = temperature difference, θ = thermal resistance Thermal Resistance θ = L Aκ θ = thermal resistance, L = length, A = cross-sectional area, κ = thermal conductivity

Analogy between thermal and electrical phenomena THERMAL PHENOMENA ELECTRICAL PHENOMENA Q = rate of heat flow I = Current ΔT = temperature difference ΔV = bias (voltage) Q = ΔT θ Θ = thermal resistance Heat reservoir ΔT Absolute Hot zero Heat generator Q A L (a) Cold Q R = resistance Q = ΔT/θ EMF (Electromotive Force) Ground ΔT Current supply θ (b) Q I = ΔV R Fig. 2.23: Conduction of heat through a component in (a) can be modeled as a thermal resistance θ shown in (b) where Q = ΔT/θ. From Principles of Electronic Materials and Devices, Second Edition, S.O. Kasap ( McGraw-Hill, 2002) http://materials.usask.ca

Analogy between thermal and electrical phenomena THERMAL PHENOMENA Q = rate of heat flow ΔT = temperature difference Θ = thermal resistance Heat reservoir Absolute zero Heat generator ELECTRICAL PHENOMENA I = Current ΔV = bias (voltage) R = resistance EMF (Electromotive Force) Ground Current supply

Analogy between thermal and electrical phenomena THERMAL PHENOMENA Q = rate of heat flow ΔT = temperature difference Θ = thermal resistance Heat reservoir Absolute zero Heat generator ELECTRICAL PHENOMENA I = Current ΔV = bias (voltage) R = resistance EMF (Electromotive Force) Ground Current supply T i T 0 Q =(T i -T 0 )/Θ IR 2

Analogy between thermal and electrical phenomena THERMAL PHENOMENA Q = rate of heat flow ΔT = temperature difference Θ = thermal resistance Heat reservoir Absolute zero Heat generator C = thermal capacitance ELECTRICAL PHENOMENA I = Current ΔV = bias (voltage) R = resistance EMF (Electromotive Force) Ground Current supply C = capacitance δ Q = CδT δ Q = CδV Q = δt C δt I = δv C δt

Analogy between thermal and electrical phenomena. Equivalent circuit of transistor THERMAL PHENOMENA ELECTRICAL PHENOMENA Q = rate of heat flow I = Current ΔT = temperature difference ΔV = bias (voltage) Θ = thermal resistance R = resistance C = thermal capacitance C = capacitance Heat reservoir EMF (Electromotive Force) Absolute zero Ground Heat generator Current supply

Transistor specifications: estimation of required heat sink BJT(2N3716) P d = 15 W T j = 110 0 C θ jc = 1.17 0 C/W θ cs = 0.5 0 C/W θ sa =?? T 0 = 25 0 C θ ja = θ jc +θ cs + θ sa P d Tj T0 Tj T0 = Q' = = θ θ + θ + θ ja jc cs sa 0 0 Tj T0 110 C 25 C 0 θ ja = = = 5.67 C / W P 15W d θ ca = θ ja -θ jc - θ cs = 5.67-1.17 0.5 = 4 0 C/W

Q ' ' Q = κ (2πrL) dt dr ' dr Q = κ (2πL) dt r Q Q b ' ' a dr r = κ (2πL) T 0 T i dt b ln( ) = κ 2πL( Ti T0 ) a κ 2πL( Ti T0 ) = b ln( ) a θ = T i T ' Q 0 = b ln( ) a 2πκL a = 5 mm b = 3 mm ρ = 27 nω m aluminum κ = 0.3 W m -1 K -1 polyethylene I = 500 A L = 1 m ' 2 ρl Q = I = 85. 9W 2 πa b ln( ) θ = a = 0.25 2 πκ L ' 0 0 ΔT = Qθ = 21.5 C T i = 41.5 C 0 C / W

Transistor specifications: derated power T j = 150 0 C θ jc =? P max =? θ cs = 0 θ sa = 5 0 C/W T 0 = 25 0 C

Transistor specifications: non-steady-state regime

Stefan s law P = εσ ( T s S radiated 4 T 4 0 ) σ s = 5.67 10-8 Wm -2 K -4 Stefan s constant, ε = emissivity of the surface, S = surface area emitting the radiation, T = temperature of the surface, T 0 = ambient temperature Effective thermal resistance T>>T 0

Emissivities of different materials

What is the temperature of the filament? 120 V 0.333 A 40 W P = 40 W V = 120 V L = 38.1 cm D = 33 μm ρ (273K) = 5.51 10-8 Ωm ρ (T)~ T 1.2 Power radiated from a light bulb at 2408 C is equal to the electrical power dissipated in the filament.

What is the temperature of filament in electric bulb? 120 V 0.333 A 40 W T =?? P = 40 W V = 120 V L = 38.1 cm D = 33 μm σ s = 5.67 10-8 Wm -2 K -4 ε = 0.35-0.39 Power radiated from a light bulb at 2408 C is equal to the electrical power dissipated in the filament. P 4 4 6 2 5 2 = P = εσ S( T T ) S = πdl = 3.14 33 10 0.381m = 3.95 10 m radiated s 0 40W = (0.35)(5.67 10 8 )(3.95 10 5 )( T 4 (293K) 4 ) T = 2673K T W = 3680 K

Emission spectra of heated bodies T=2673 K Sun spectrum -- in outer space -- on equator -- slanting sunlight T=6050 K 250 500 750 1000 1250 1500 Wavelength, nm

How long does it take to light an electric bulb? t f = 0.042 s = 42 ms

Convection SOLID GAS M V v m Gas Atom Fig. 1.23: Solid in equilibrium in air.during collisions between the gas and solid atoms, kinetic energy is exchanged.

Convection : Newton s law of cooling Newton s law of cooling Q ' = hs ( T T s 0 ) Q = heat flow, T s = temperature of the surface, h = coefficient of convective heat transfer, S = surface area, T 0 = ambient temperature

1000 -

P = 750 W S = 1m 0.75m h 6 W m -2 0 C -1 T =?? P Solution ΔT Q = Θ = ' convection = hs ΔT ΔT = P hs = (6Wm 750W = ) 2 (1m 0.75m) 0 83. 3 2 0 1 C => T = 83.3 + 25 = 108.3 0 C

T i = 25 0 C κ = 0.76 Wm -1 0 C -1 T 1 T 2 T o = -40 0 C S =1m 0.75m l = 10 mm h i = 15 W m -2 0 C -1 h o =25 W m -2 0 C -1 T 1 =?? T 2 =?? Q =??

T i = 25 0 C T 1 h i = 15 W m -2 0 C -1 κ = 0.76 Wm -1 0 C -1 h o = 25 W m -2 0 C -1 T 2 T o = -40 0 C S =1m 0.75m l = 10 mm h i = 15 W m -2 0 C -1 h o = 25 W m -2 0 C -1 T 1 =?? T 2 =?? Q =?? T 2 = -18.5 0 C T 1 = -11.2 0 C

ρ =18 nω m I =700 A a = 5 mm b-a = 1.5 mm c-b = 2 mm κ 1 = 0.3 W m -1 0 C -1 κ 2 = 0.25 W m -1 0 C -1 T 0 = 20 0 C h =25 W m -2 K -1 T =?? T h =??

ρ =18 nω m I =700 A a = 5 mm b-a = 1.5 mm c-b = 2 mm κ 1 = 0.3 W m -1 0 C -1 κ 2 = 0.25 W m -1 0 C -1 T 0 = 20 0 C h =25 W m -2 K -1 T =?? T h =?? ASSUMPTIONS

Q ' ' Q = κ (2πrL) dt dr ' dr Q = κ (2πL) dt r Q Q b ' ' a dr r = κ (2πL) T 0 T i dt b ln( ) = κ 2πL( Ti T0 ) a κ 2πL( Ti T0 ) = b ln( ) a Θ = T i T ' Q 0 = b ln( ) a 2πκL a = 5 mm b = 3 mm ρ = 27 nω m aluminum κ = 0.3 W m -1 K -1 polyethylene I = 500 A L = 1 m ' 2 ρl Q = I = 85. 9W 2 πa ΔT ' = Q Θ = 21.5 0 C b ln( ) Θ = a 2πκL = 0.25 0 T i = 41.5 C 0 C / W

Θ = b ln( ) a 2πκL ρ =18 nω m I =700 A a = 5 mm b-a = 1.5 mm c-b = 2 mm κ 1 = 0.3 W m -1 0 C -1 κ 2 = 0.25 W m -1 0 C -1 T 0 = 20 0 C h = T =?? T h =?? Thermal Resistance T i = 58.9 0 C

ρ =18 nω m I =700 A a = 5 mm b-a = 1.5 mm c-b = 2 mm κ 1 = 0.3 W m -1 0 C -1 κ 2 = 0.25 W m -1 0 C -1 T 0 = 20 0 C h =25 W m -2 K -1 T = 58.9 0 C T h =?? h = h =25 W m -2 K -1

T C T0 ρ =18 nω m I =700 A a = 5 mm b-a = 1.5 mm c-b = 2 mm κ 1 = 0.3 W m -1 0 C -1 κ 2 = 0.25 W m -1 0 C -1 T 0 = 20 0 C h =25 W m -2 K -1 T = 58.9 0 C T h =??!!!

T 0 = 25 0 C T j = 100 0 C S = 100 cm 2 =0.01 m 2 ε =0.75 h = 10 W m -2 K -1 Θ jc = 15 0 C/W Θ cs = 1 0 C/W P d =?? Θ radiation = 15.4 0 C/W convective transfer is more important > Θ convection = 10 0 C/W Θ sink 6.0 0 C/W = 5W