VJ 6040 UHF Chip Antenna for Mobile Devices



Similar documents
Preliminary Data Sheet

Surface Mount Ceramic Chip Antennas for 868 MHz

SMD Aluminum Solid Capacitors with Conductive Polymer

Silicon PIN Photodiode

Silicon PIN Photodiode

Ambient Light Sensor

High Power Infrared Emitting Diode, 940 nm, GaAlAs, MQW

High Speed Infrared Emitting Diode, 940 nm, GaAlAs, MQW

Silicon NPN Phototransistor

Silicon PIN Photodiode

Aluminum Electrolytic Capacitors Power Economic Printed Wiring

Small Signal Fast Switching Diode

AC Line Rated Ceramic Disc Capacitors Class X1, 760 V AC / Class Y1, 500 V AC

ESCC 4001/026 Qualified ( ) High Stability Thick Film Resistor Chips

Surface Mount Multilayer Ceramic Chip Capacitor Solutions for High Voltage Applications

High Performance Schottky Rectifier, 3.0 A

Metal Film Resistors, Industrial, Flameproof

Aluminum Electrolytic Capacitors Power Eurodin Printed Wiring

Electrical Double Layer Energy Storage Capacitors Power and Energy Versions

SMD PTC - Nickel Thin Film Linear Thermistors

High Performance Schottky Rectifier, 1.0 A

Schottky Rectifier, 1.0 A

Knob Potentiometer with Switch

50 W Power Resistor, Thick Film Technology, TO-220

Knob Potentiometer FEATURES. P16NP P16NM Panel Cutout. Thickness nut 2 mm washer 1.5 mm. Panel sealing ring 12 wrench Thread M10 x

Small Signal Fast Switching Diode FEATURES PART ORDERING CODE INTERNAL CONSTRUCTION TYPE MARKING REMARKS

Reflective Optical Sensor with Transistor Output

P6KE6.8A thru P6KE540A. TRANSZORB Transient Voltage Suppressors. Vishay General Semiconductor. FEATURES PRIMARY CHARACTERISTICS

Metal Film Resistors, Non-Magnetic, Industrial, Precision

Photovoltaic MOSFET Driver with Integrated Fast Turn-Off, Solid-State Relay

Power Resistor Thick Film Technology

Aluminum Electrolytic Capacitors Axial Miniature, Long-Life

Schottky Rectifier, 1.0 A

Metal Film Resistors, Industrial, Precision

High Power Infrared Emitting Diode, 940 nm, GaAlAs/GaAs

Pulse Proof Thick Film Chip Resistors

Power Resistor for Mounting onto a Heatsink Thick Film Technology

Thick Film Resistor Networks, Dual-In-Line, Molded DIP

Pulse Proof, High Power Thick Film Chip Resistors

UV SMD LED PLCC-2 FEATURES APPLICATIONS. at I F (ma) (ma) MIN. TYP. MAX. MIN. TYP. MAX. MIN. TYP. MAX.

Silicon NPN Phototransistor

High Speed Infrared Emitting Diode, 870 nm, GaAlAs Double Hetero

High Performance Schottky Rectifier, 1 A

Standard Thick Film Chip Resistors

Solid Tantalum Surface Mount Capacitors TANTAMOUNT, Molded Case, Low ESR

SuperTan Extended (STE) Capacitors, Wet Tantalum Capacitors with Hermetic Seal

Metal Film Resistors, Pulse Withstanding Protective

Aluminum Electrolytic Capacitors Radial Miniature, Low Impedance, High Vibration Capability

Optocoupler, Phototransistor Output, AC Input

Optocoupler, Phototransistor Output, 4 Pin LSOP, Long Creepage Mini-Flat Package

NTC Thermistors, Mini Lug Sensors

Reflective Optical Sensor with Transistor Output

Precision Surface Mount Resistors Wirewound or Metal Film Technologies

Aluminum Capacitors Solid Axial

IR Receiver Module for Light Barrier Systems

1 Form A Solid State Relay

Ultrabright White LED, Ø 3 mm

Optocoupler, Phototransistor Output, with Base Connection, 300 V BV CEO

High Stability - High Temperature (230 C) Thin Film Wraparound Chip Resistors, Sulfur Resistant

VJ 6040 Mobile Digital TV UHF Antenna Evaluation Board

Optocoupler, Phototransistor Output, Dual Channel, SOIC-8 Package

Power MOSFET FEATURES. IRFZ44PbF SiHFZ44-E3 IRFZ44 SiHFZ44 T C = 25 C

1/2" (12.7 mm) Conductive Plastic and Cermet Potentiometer

Schottky Rectifier, 100 A

1.5KE6.8A thru 1.5KE540A, 1N6267A thru 1N6303A. TRANSZORB Transient Voltage Suppressors. Vishay General Semiconductor.

Optocoupler, Phototransistor Output, with Base Connection

Preamplifier Circuit for IR Remote Control

Insulated Precision Wirewound Resistors Axial Leads

Standard 0603 SMD LED

Surface Mount Multilayer Ceramic Chip Capacitors for Automotive Applications

Power MOSFET FEATURES. IRL540PbF SiHL540-E3 IRL540 SiHL540

Power MOSFET. IRF510PbF SiHF510-E3 IRF510 SiHF510. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS 100 V Gate-Source Voltage V GS ± 20

Low Current SMD LED PLCC-2

Optocoupler, Phototransistor Output, with Base Connection

Thick Film Chip Resistors, Military/Established Reliability MIL-PRF Qualified, Type RM

P-Channel 20-V (D-S) MOSFET

AC Line Rated Ceramic Disc Capacitors Class X1, 760 V AC, Class Y1, 500 V AC

P-Channel 20 V (D-S) MOSFET

NTC Thermistors, Radial Leaded and Coated

AC and Pulse Film Foil Capacitors KP Radial Potted Type

Power MOSFET FEATURES. IRF610PbF SiHF610-E3 IRF610 SiHF610. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS 200 V Gate-Source Voltage V GS ± 20

Standard Recovery Diodes, Generation 2 DO-5 (Stud Version), 95 A

700 MHz, -3 db Bandwidth; Dual SPDT Analog Switch

1 Form A Solid State Relay

Standard Recovery Diodes (Hockey PUK), 2100 A

Power MOSFET FEATURES. IRF740PbF SiHF740-E3 IRF740 SiHF740. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS 400 V Gate-Source Voltage V GS ± 20

Custom Products. Magnetic Components. Vishay Dale.

IR Sensor Module for Reflective Sensor, Light Barrier, and Fast Proximity Applications

Project Documentation EKTSDG Target Simulator Doppler Generator

N-Channel 100 V (D-S) MOSFET

SKY LF: GHz Two-Way, 0 Degrees Power Divider

Antenna Part Number: FR05-S1-R-0-105

Power SMD LED PLCC-2 Plus

Automotive P-Channel 60 V (D-S) 175 C MOSFET

P-Channel 60 V (D-S) MOSFET

Wirewound Resistors, Industrial Power, Aluminum Housed, Chassis Mount

Thick Film Resistor Networks, Military, MIL-PRF Qualified, Type RZ010 and RZ020 Dual-In-Line, Molded DIP

Optocoupler, Photodarlington Output, Dual Channel, SOIC-8 Package

Standard Recovery Diodes, (Stud Version), 40 A

Optocoupler, Phototransistor Output, High Reliability, 5300 V RMS, Low Input Current

Transcription:

VJ 64 UHF Chip Antenna for Mobile Devices VJ 64 The company s products are covered by one or more of the following: WO2862 (A1), US2833 (A1), US283575 (A1), WO281173 (A1). Other patents pending. DESCRIPTION The VJ 64 multi-layer ceramic chip antenna is a small form-factor, high-performance, chip-antenna designed for TV reception in mobile devices in the UHF band. It allows mobile TV device manufacturers to design high quality products that do not bear the penalty of a large external antenna. Utilizing Vishay's unique materials and manufacturing technologies, this product complies with the MBRAI standard while maintaining a small outline. Focusing on consumer applications, the antenna is designed to be assembled onto a PC board in the standard reflow process. Target customers of the VJ 64 are mobile phone makers, portable multimedia device makers, notebook OEMs and ODMs, and accessory card OEMs and ODMs. The VJ 64 is the first of a family of products developed by Vishay, a world leader in manufacturing of discrete and passive components. FEATURES Small outline (1.5 mm x 15.5 mm x 1.2 mm) Omni-directional, linear polarization Complies with MBRAI standard Complete UHF band coverage (47 MHz to 86 MHz) up to 1.1 GHz Requires a tuning circuit and ground plane for optimal performance Standard SMT assembly 5 unbalanced interface Operating temperature range (-4 C to +85 C) Reference design and evaluation boards available upon request Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS Mobile UHF TV receivers including DVB-T, DVB-H, ISDB-T, CMMB, ATSC, and MediaFLO devices ANTENNE PERFORMANCE Peak Gain The antenna radiation characteristics are influenced by several factors including ground plane dimensions and impedance matching network. The antenna parameters presented hereafter were measured according to the configuration suggested by the VJ 64 evaluation board, utilizing its four channel active digital tuning circuit. The evaluation board ground plane is 4 mm by 8 mm large. Fig. 1 shows peak gain over frequency throughout the UHF band, compared with the MBRAI requirements. -2 Peak Gain (dbi) -4-6 -8 Measured Simulated Standard -1-12 45 5 55 6 65 7 75 8 85 9 Frequency (MHz) Fig. 1 - Peak Gain vs. Frequency Revision: 3-Mar 1 Document Number: 45157 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91

VJ 64 Fig. 2 displays the measured and simulated radiation efficiency of VJ 64 over frequency. 4 35 Simulated value Efficiency (%) 3 25 2 15 1 5 Measured value 46 51 56 61 71 76 81 86 Frequency (MHz) Fig. 2 - Radiation Efficiency vs. Frequency Applications that do not require full coverage of the UHF band can gain an additional two to three dbi by removing the tuning circuit. In this case the antenna can be fixed to any 15 MHz band within the UHF range. QUICK REFERENCE DATA SERIES RADIATION PATTERN The 3D planes of VJ 64 are defined in Fig. 3. FREQUENCY (MHz) MAX. GAIN (dbi) AVERAGE GAIN (dbi) VJ64M11SXISRA 47 to 86-2 -3 Z X Y Fig. 3 - VJ 64 3D Plane Definition Revision: 3-Mar 2 Document Number: 45157 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91

VJ 64 Fig. 4 displays the simulated 3D radiation pattern at 65 MHz. Fig. 4 - Simulated Radiation Pattern Fig. 5 displays the measured radiation patterns of VJ 64 evaluation board in the YZ plane as defined in Fig. 3. Zero degrees is defined at the Z axis, stepping counter clockwise. 5 MHz - Gain (dbi) vs. Angle ( ) 3 6 9 12 12 15 156 162 12 6-1 -2-3 -4 168 174 6 3 3 3 3 192 198 33 3 3 21 7 MHz - Gain (dbi) vs. Angle ( ) 3 6 9 12 12 15156 12 6-1 -2-3 -4 3 162 168 174 6 3 3 3 33 3 3 21 192198 3 3 6 6 27 27 6 MHz - Gain (dbi) vs. Angle ( ) 6 12 3-1 -2 6-3 -4 9 12 12 15 156 162 168 174 3 3 3 6 192 198 3 33 3 3 21 8 MHz - Gain (dbi) vs. Angle ( ) 12 3 6 9 12 12 15 156 162 168 3 6 27 6 3 3 3 3 33 3-1 3-2 3-3 -4 G 27 174 6 192 198 21 6 Fig. 5 - Measured Radiation Pattern Revision: 3-Mar 3 Document Number: 45157 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91

VJ 64 FOOTPRINT AND MECHANICAL DIMENSIONS The antenna footprint and mechanical dimensions are presented in Fig. 6. For mechanical support, it is recommended to add one or two drops of heat curing epoxy glue. The glue dot should not overlap with any of the soldering pads. It is recommended to apply the glue dot at the center of the antenna, as shown by the diagonal pattern. For more details see VJ 64 Assembly Guidelines section below..35.35.5.5.35 3.6 4.6 3.6 1. 1. `.35 1. 4.65.5 Glue dot area 4.65.35 1. All dimensions in mm Figure not in scale 1..35 RF feed connects here Fig. 6 - VJ 64 Footprint VJ 64 ASSEMBLY GUIDELINES 1. Mounting of antennas on a printed circuit board should be done by reflow soldering. The reflow soldering profiles are shown below. 2. In order to provide the adequate strength between the antenna and the PCB the application of a dot of heat cured epoxy glue in the center of the footprint of the antenna prior to the antenna s soldering to the board should be done. An example for such glue could be Heraeus PD 862 SA. The weight of the dot should be 5 mg to 1 mg. 3 T ( C) 25 2 > 215 C: 2 s to 4 s Max. temperature 15 1 Min. temperature Sn-Pb eutectic solder paste 5 3 s to 6 s 3 s to 6 s 3 s to 6 s Time Fig. 7 - Soldering IR Reflow with SnPb Solder Revision: 3-Mar 4 Document Number: 45157 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91

VJ 64 3 T ( C) 26 C 25 5 C 215 C 2 C 1 s 1 s 4 s 15 13 C 1 5 2 K/s 5 1 15 2 t (s) 25 Fig. 8 - Soldering Reflow with Sn Solder 3 T ( C) 25 Max. temperature 2 Sn-Ag-Cu solder paste 15 1 Min. temperature 5 6 s to 12 s 3 s to 6 s 6 s to 12 s 6 s to 12 s Time Fig. 9 - Soldering IR Reflow with SnAgCu Solder ORDERING INFORMATION VISHAY MATERIAL PACKAGING QUANTITY VJ 64 VJ64M11SXISRA 1 pieces Revision: 3-Mar 5 Document Number: 45157 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91

Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, Vishay ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer s technical experts. Product specifications do not expand or otherwise modify Vishay s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. Revision: 13-Jun-16 1 Document Number: 91