ANSYS HFSS 3D Layout 侯 明 刚

ANSYS HFSS 3D Layout 侯 明 刚

Introducing the New Layout Flow with HFSS

Two Design Interfaces Mechanical CAD (MCAD) Both Require Electrical the Accuracy Layout (ECAD) of 3D and HFSS

HFSS: 3D Parametric Design Entry (MCAD) Arbitrary 3D HFSS Desktop Parametric Variations Toolkits Script Customization Geometry 3 rd Party 3D CAD Bi-Directional 3D Editor Native 3D Component Library Design Flow Integration Customization

HFSS: Layout Parametric Design Entry (EDA) Geometry 3 rd Party Layout Translation Layout Editor Native Scripted Footprints 3D Layout Designer Desktop Parametric Variations Toolkits Script Customization Design Flow Integration Customization

HFSS v2014: Arbitrary 3D or 3D Layout No change to 3D product, licenses added to enable layout ensemble_gui nexxim_gui Arbitrary 3D Parametric Variations Toolkits Script Customization 3 rd Party 3D CAD Bi-Directional 3D Editor Native 3D Component Library 3 rd Party Layout Translation Layout Editor Native Scripted Footprints Required Installs HFSS v2014 Designer v2014 3D Layout Parametric Variations Toolkits Script Customization

Additional Capability for HFSS v2014 1. HFSS with Layout Editor (Included) Automated Interface for Package, PCB, or IC passive design Layout with Integrated 3D HFSS solve» DC Solver» Passive/Causal Frequency Sweeps» Embedded S-Parameters» Native HFSS solves from Cadence Allegro, APD, SiP, and Virtuoso Schematic Capture (Circuit Analysis enabled with optional license) Full-wave SPICE circuit generation 2. PlanarEM (2.5D Method of Moments, Included) Enabled with the HFSS solve license 3. Phi Mesher

HFSS from Layout Features for HFSS from Layout Integrated HFSS for layout geometry Parametric Layout Editor Stackup Etch Factor/Layer Offset Padstacks Trace parameters HFSS Extents Finite Dielectrics Sub-region Hierarchy Solver Integrated HFSS solver DC Solver Embedded RLC and/or S-Parameters for HFSS Post-Processing Network Data Explorer Full-Wave SPICE/HSPICE broadband ROM export Integration with industry: Cadence, Zuken, Mentor and Altium

Now included with HFSS Fast solve 2D conductors Infinite GND Early in the design process Leverage HFSS and 3D FEM with adaptive meshing in the later stages PlanarEM 2.5D Method of Moments

Ease of Use: Ports 3. Right click on Excitations, then click on Couple Edge Ports 1. Click on the Select Elements button 2. While pressing the Ctrl button, select both lumped ports

Convert to Differential Waveport in One Click Newly created coupled Waveport

Easily Size Waveport in a Few Clicks Port with a Horizontal Extent Factor = 3 If the newly generated coupled waveport can be changed by editing the Horizontal Extent Factor Port with a Horizontal Extent Factor = 5

HFSS Solve from SIwave

HFSS within Cadence Create and Solve HFSS models from within Allegro Package Designer Allegro PCB Designer SiP Digital Layout Virtuoso Analog Design Environment Set-up and solve HFSS simulations without leaving the Cadence environment

HFSS 3D Layout and the Phi Mesher

Classic HFSS Meshing Techniques Approach: Starts with a 3D surface triangular mesh on all objects and generate a 3D volume mesh throughout simulation domain Availability: HFSS (traditional 3D interface) and HFSS 3D Layout Pro: Works for any arbitrary 3D geometry Con: For complex, many layered geometries can require a long time to generate Phi New Approach: From a layout, generate layer by layer 2D triangular mesh. Sweep mesh in stackup (+z) direction to generate tetrahedral mesh elements Advantage: Skips heavyweight ACIS and 3D surface mesh generation Availability: HFSS 3D Layout only Pro: Extremely fast relative to classic 3D mesh approach Con: Only works for stack-up or swept in Z geometries. IC components and packages, PCBs. etc.

Why Phi? Phi vs Classic Always wins initial mesh generation Including Lambda + Port Adapt Initial mesh size is comparable R14.5: 5hrs - Initial Mesh 2014.0: 11min - Initial Mesh Can mesh bigger designs When combined with distributed memory solver and hardware can solve very large and complex designs Summary: Initial Mesh is orders of magnitudes faster, Solver is the same

Accurate Solution Industry leading meshing capacity Causal/Passive s-parameters True DC solution Embedded RLC or s-parameter components Benefits of HFSS for 3D Layout Fast Simulations Reduces multi-day long simulations to a few hours or less Ease of use 3D Layout Easy translation, import and setup Maintains trace characteristics and nets from layout Hierarchical design Chip/Package/Board Embedded dielectric layers Parameterized model for Design Optimization Trace width, layer thickness, via dimensions etc. Manufacturing tolerances (etching factor) Materials

Enhanced Meshing in HFSS 3D Layout HFSS 3D Layout meshing advantages Mesh and solve non-manifold geometry Mesh geometries with large aspect ratios Layer-based geometry is easier to edit, modify, clean up etc. ¼ of multilayer flip-chip package 20 nets (40 ports) HFSS 3D Classic 5hrs 15min HFSS 3D Layout w Classic v15 3hrs 41 min HFSS 3D Layout w Phi 11 min

Is there a difference between HFSS 3D and HFSS 3D Layout? Solve a model in both HFSS 3D and HFSS 3D Layout and compare Note easy export from HFSS 3D layout to HFSS 3D

Multilayer complex package layout HFSS 3D compared to HFSS 3D Layout HFSS 3D CAD HFSS 3D Layout

Initial Meshing Comparison Extremely fast initial Phi meshing. Phi is 20X faster! 4min vs. 1hr 20min HFSS 3D - Classic HFSS 3D Layout - PHI

HFSS 3D Run Time Total: 6hrs 33min Adaptive Part: 4hr 1min Interpolating Sweep: 2hrs 32 min

HFSS 3D Layout Run Time Total: 3hrs 3min Adaptive Part: 1hr 05min Interpolating Sweep: 1hr 58 min

HFSS 3D vs. HFSS 3D Layout Virtually identical results from adaptive meshing Solid HFSS 3D Dashed - - - - - - - HFSS 3D Layout

Summary HFSS 3D CAD HFSS 3D Layout Initial Mesher Classic Phi Initial Mesh Size (tets) 763, 953 712, 536 Initial Mesh Time 1hr 20min 4min Number of Adaptive Passes 6 7 Number of Tets - Final 1, 617, 954 1, 620, 969 Adaptive Passes Run Time 4hrs 1min 1hr 5min (3.7X faster) RAM 47.6 GB 49.6 GB

Is there a difference between HFSS 3D and HFSS 3D Layout? Example #2: Multi-layer PCB with end to end SMA connectors 3D components drawn as stacked up geometry can be modeled in HFSS 3D Layout

HFSS 3D Solid Model Design Creation HFSS 3D Geometry Include SMA connector body with stands (serve as ground pins) Account for true 3D SMA transition to PCB Lumped Port dimensions equal to connector pin dimensions

HFSS 3D Layout Design Creation Added SMA body geometry to a layout stackup Port properties created automatically Stackup Editor Layout View Port/pin settings EM Design 3D View

Results Comparison HFSS 3D compared to HFSS 3D Layout Solid HFSS 3D Dashed - - - - - - - HFSS 3D Layout

总 结 Phi meshing 是 突 破 性 的 有 限 元 网 格 生 成 技 术 为 IC IC 封 装 和 PCB 设 计 者 提 供 了 电 路 工 程 师 熟 悉 的 操 作 界 面 和 快 速 初 始 网 格 刨 分 和 快 速 仿 真 技 术 结 合 ANSYS HPC 技 术 增 加 求 解 规 模 的 可 扩 展 性, 支 持 求 解 更 大 更 复 杂 的 层 叠 结 构 分 布 式 直 接 矩 阵 求 解 器 (Distributed direct matrix solver) 使 用 多 机 分 布 式 内 存 方 式 求 解 及 其 消 耗 内 存 的 超 大 型 复 杂 设 计 频 域 分 解 算 法 (Spectral decomposition method) 进 行 多 频 点 并 行 求 解, 加 快 扫 频 速 度