How is a PCB made? What determines impedance? John Steinar Johnsen ( Josse ) Sept 2009
|
|
- Antony James
- 7 years ago
- Views:
Transcription
1 How is a PCB made? What determines impedance? John Steinar Johnsen ( Josse ) Sept 2009
2 Vi kan se hvor Bugatti har hentet inspirasjon fra Denne forsøkte å stikke av, men jeg hang meg på. JossePhoto
3 Manufacturing Processes for a Multi-layer PCB The following presentation covers the main processes during the production of a multi-layer PCB. Tracks under solder mask Via hole The diagrams which follow represent a section through a 6 layer PCB, as indicated in red. SMD Pad Section through PCB
4 Typical Layer Construction - 6 Layer PCB Copper Laminate Layer 1 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) Layer 6 (Outer) Layer build / stackup is one of the most important aspects of controlled impedance Many combinations of material thickness and copper weights can be used. PCB Fabricators manufacturing techniques vary
5 Inner Layer Processing Material Selection Copper Laminate (Dielectric) Layer 2 (Inner) Layer 3 (Inner) Core Selecting inner layer Core materials is very important when using embedded microstrip and offset stripline structures Inner layer Core materials are usually processed as Layer pairs
6 Laminating and Imaging of Internal Layers UV sensitive film is laminated over top and bottom surfaces of the Core Areas of the Core where no copper is required are left exposed Layer 2 (Inner) Core Does not effect impedance Layer 3 (Inner) The inner layer artwork is placed over the UV sensitive film and the film is exposed. Film is developed and the area where no copper is required is left exposed.
7 Etch Process - Remove Exposed Copper Copper Removed Layer 2 (Inner) Layer 3 (Inner) Core The etch process produces an etch back or undercut of the tracks. This can be specified by the W 1 / W 2 parameters This means that tracks will end up approximately mm (0.001 ) thinner than the original design.
8 Remove Laminating Film Layer 2 (Inner) Core Does not effect impedance Layer 3 (Inner)
9 Completed Inner Layer Core All inner layer Core materials are processed as Layer Pairs prior to Bonding At this stage the Cores are inspected visually (AOI) and defective Cores rejected Sometimes a surface treatment is applied to the Cores to aid with the Bonding process Layer 2 (Inner) Core Does not effect impedance Layer 3 (Inner) The previous process is repeated on ALL innerlayers prior to final bonding.
10 Layer stackup Layer 1 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) Layer 6 (Outer) Layer 1 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) Layer 6 (Outer) During the Bonding process press temperature and pressure have a great influence on substrate heights, which greatly affects impedance. It is important to use the Finished Post-Processed height when calculating Impedance
11 Layer stackup Layer 1 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) Layer 6 (Outer) Layer 1 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) Layer 6 (Outer) During the Bonding process, press temperature and pressure have a great influence on substrate heights, which greatly affects impedance. It is important to use the Finished Post-Processed height when calculating Impedance
12 Layer stackup Layer 1 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) Layer 6 (Outer) Layer 1 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) Layer 6 (Outer) During the Bonding process, press temperature and pressure have a great influence on substrate heights, which greatly affects impedance. It is important to use the Finished Post-Processed height when calculating Impedance
13 Layer stackup Layer 1 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) Layer 6 (Outer) Layer 1 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) Layer 6 (Outer) During the Bonding process, press temperature and pressure have a great influence on substrate heights, which greatly affects impedance. It is important to use the Finished Post-Processed height when calculating Impedance
14 Layer stackup Layer 1 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) Layer 6 (Outer) Layer 1 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) Layer 6 (Outer) During the Bonding process, press temperature and pressure have a great influence on substrate heights, which greatly affects impedance. It is important to use the Finished Post-Processed height when calculating Impedance
15 Layer stackup Layer 1 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) Layer 6 (Outer) Layer 1 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) Layer 6 (Outer) During the Bonding process, press temperature and pressure have a great influence on substrate heights, which greatly affects impedance. It is important to use the Finished Post-Processed height when calculating Impedance
16 Layer stackup Layer 1 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) Layer 6 (Outer) Layer 1 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) Layer 6 (Outer) During the Bonding process, press temperature and pressure have a great influence on substrate heights, which greatly affects impedance. It is important to use the Finished Post-Processed height when calculating Impedance
17 Layer stackup Layer 1 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) Layer 6 (Outer) Layer 1 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) Layer 6 (Outer) During the Bonding process, press temperature and pressure have a great influence on substrate heights, which greatly affects impedance. It is important to use the Finished Post-Processed height when calculating Impedance
18 Layer stackup Layer 1 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) Layer 6 (Outer) Layer 1 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) Layer 6 (Outer) During the Bonding process, press temperature and pressure have a great influence on substrate heights, which greatly affects impedance. It is important to use the Finished Post-Processed height when calculating Impedance
19 Layer stackup Layer 1 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) Layer 6 (Outer) Layer 1 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) Layer 6 (Outer) During the Bonding process, press temperature and pressure have a great influence on substrate heights, which greatly affects impedance. It is important to use the Finished Post-Processed height when calculating Impedance
20 Layer stackup Layer 1 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) Layer 6 (Outer) Layer 1 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) Layer 6 (Outer) During the Bonding process, press temperature and pressure have a great influence on substrate heights, which greatly affects impedance. It is important to use the Finished Post-Processed height when calculating Impedance
21 The press Cycle 1 -Resin melt and flow 2 -Resin cure 3 -Cool down
22 Bonding Heat Layer 1 (Outer) 1 -Resin melt and flow Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) Layer 6 (Outer) Layer 1 (Outer) Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) Layer 6 (Outer) During the Bonding process, press temperature and pressure have a great influence on substrate heights, which greatly affects impedance. It is important to use the Finished Post-Processed height when calculating Impedance
23 Bonding Multilayer Press Layer 1 (Outer) 2 -Resin cure Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) Layer 6 (Outer) During the Bonding process, press temperature and pressure have a great influence on substrate heights, which greatly affects impedance. It is important to use the Finished Post-Processed height when calculating Impedance
24 3 -Cool down Bonding Multilayer Press Layer 2 (Inner) Layer 3 (Inner) Layer 4 (Inner) Layer 5 (Inner) Layer 6 (Outer) During the Bonding process, press temperature and pressure have a great influence on substrate heights, which greatly affects impedance. It is important to use the Finished Post-Processed height when calculating Impedance
25 Bonding Multilayer Press After Bonding, the thickness of the pressed laminat is controlled. If the thickness is not as expected, further process is stopped. Photo Robert Bürkle GmbH
26 Drilling of Bonded Panel Copper Laminate Drilled Hole Layer 1 Layer 2 Layer 3 Layer 4 Drilling itself does not effect impedance Layer 5 Layer 6
27 Electroless Copper Process Addition of Copper to all Exposed Surfaces Copper Drilled Hole Layer 1 Layer 2 Layer 3 Layer 4 Layer 5 Electroless copper effects copper thickness on outer layers (T 1 ) Sometimes other solutions are used containing carbon, etc. Layer 6
28 Laminating and Imaging of External Layers UV sensitive film is laminated over top and bottom surfaces of PCB It is then exposed and developed, leaving an exposed image of the PCB pattern Layer 1 Layer 2 Layer 3 Does not effect impedance Layer 4 Layer 5 Layer 6 Copper
29 Electro-plating Process 1 Additional Copper to all Exposed Surfaces Laminated Film Plate Additional Copper Layer 1 Layer 2 Layer 3 Layer 4 Layer 5 Layer 6 Electro-plating increases the copper thickness on outer layers (T 1 ) There will always be variations in the amount of copper added. This finished copper thickness should be used in structure calculations
30 Electro-plating Process 2 Add Tin over Exposed Copper Areas Laminated Film Additional Copper Tin Plating Layer 1 Layer 2 Layer 3 Does not effect impedance Layer 4 Layer 5 Layer 6
31 Electro-plating Process 3 Remove Laminated Film Laminated Film Removed Tin Plating Layer 1 Layer 2 Layer 3 Does not effect impedance Layer 4 Layer 5 Layer 6
32 Etch Process - Remove Exposed Copper Copper Removed Tin Plating Layer 1 Layer 2 Layer 3 Layer 4 Layer 5 Layer 6 The etch process produces an etch back or undercut of the tracks. This can be specified by the W 1 / W 2 parameters This means that tracks will end up approximately mm (0.001 ) thinner than the original design.
33 Tin Strip - Remove Tin Plating Tin Plating Removed Layer 1 Layer 2 Layer 3 The removal of tin will slightly reduce the copper thickness (T 1 ) on the outer layers Layer 4 Layer 5 Layer 6
34 PCB is now complete except for surface finishes and panel routing Tracks Via Hole SMD Pad Layer 1 Layer 6 Tracks
35 Solder Mask Application - Curtain Coated Method Layer 1 Apply Liquid Photo-Imageable Resist, then dry Layer 6 Some PCB fabricators chose to check the impedance before the solder mask is added Structures can be checked in Normal and Coated mode Thickness of solder mask should be specified using C 1 and C 2
36 Solder Mask Application Image, Develop and Cure Layer 1 UV Image, Develop and Cure Does not effect impedance Layer 6
37 Surface Finish Process Layer 1 Apply Solder to Exposed Copper Areas Layer 6 Surface Finish (Tin / Lead / Gold / Silver) is usually only added to pads If board has no solder mask the thickness of finish should be added to T 1.
38 Component Notation SCL Does not effect impedance
39 Routing (includes second stage drilling) Controlled Impedance coupons are routed from the panel Good controls are necessary to ensure that coupons can be matched to manufacturing panels
40 Process finished PCB and coupons for testing Coupons It is good practice to place TDR coupons in the X and Y axis of the manufacturing panel to ascertain any process variations due to spray patterns when using horizontal conveyorised equipment.
41
42
43
44 Process finished PCB and coupon for testing Controlled Impedance coupons are routed from the panel Controls are necessary to ensure that coupons can be matched to manufacturing panels this should be performed on trial panels prior to production ramp up.
45 Why as a designer do you need to discuss your design with your PCB fabricator? PCB manufacture is a process, it uses materials which are not ideal FR4 for example is a glass resin mix made of two substances with differing electrical properties. ( Er 4.2 ) Glass Er 6 Resin Er 3 (FR4) Resin Er < 3 (High performance laminates) PCB Manufacturers need to make small adjustments to designs to maximise yields
46 Why as a designer do you need to discuss your design with your PCB fabricator? Process varies from one fabricator to another. Press pressures temperatures may vary Supplier variations Prepreg and core may vary from one supplier to another.
47 DESIGN RULES Layer stack-up (Balanced build): In order to review for the balanced build, consider an imaginary line in the middle of the board. This will divide the board into upper and lower half. The copper layers in the top half of the board should match with the bottom half of the circuit board. The layer to layer spacing in the top half of the board should match with the bottom half of the board. The material used in the upper and lower half of the board should be the same to avoid warpage. The stack-up for hybrid circuits should be reviewed by design to design basis.
48
49
50
51
52 4-layer Originally 4-layer boards were constructed simply by bonding two doublesided laminates together. This method however is prone to bow and twist and, while the laminate costs are relatively cheap, processing costs are expensive and a tooling system is required for good registration at bonding. A natural follow on to this was the use of cap layers where a central core of laminate was used for the two inner layers and a single sided laminate was bonded each side of this to form the outer layers. The laminate costs of this construction are higher than the double-sided construction but the processing costs are less, and the need for tooling pins is reduced. The next stage in the evolution of 4-layer manufacture was to do away with the resin on the capping layers and to use copper foil. This meant that the core could be thicker, giving less possibility of bow and twist, and also resulted in a reduction in material cost. A further reduction in cost can be achieved by using a single ply of high resin content prepreg each side of the core. This will typically give a material cost reduction of more than 50% over the capping layer build, and a reduction of almost 20% over a typical build using two layers of prepreg on each side of the core.
53 The information on construction of 4-layers also holds true for 6-layer and above, a selection of possible builds for a 1.6 mm finished thickness and typical pricing is included for interest. The cost factors are for each layer type and are typical material costs only.
54
55 What to do when you need a stack up with impedance requirements: Additional information: - Final thickness 1.6mm Size: 110 x 70mm - Single ended 50 ohms, routing on L1, 2, 4, 7, 9 & ohms differential routing on lay L4 and 7. - Prefered min track width is 0.127mm. Your Manufacturer will supply you a build.
56 What to do when you need a stack up with impedance requirements: (Cont d) Feed back from manufacturer should be: - Complete stack up, BOM. - Track width to use on the impedance traces - Space to use between the impedance traces - Calculation result Make your critical tracks visible and easy to find - Use a dedicated D-Code for these traces
57 What to do when you need a stack up with impedance requirements: (Cont d) On PCBs with critical signaling, you should know what you are doing when changing materials in a defined stack up. Technical on process: Electrical: Manufacturer will handle these issues As a designer you shall be aware of differences in the content (wowen glass and resin).
58 Effect of variables on impedance value. We can take a simple strip-line configuration, vary one element at a time, and calculate the resulting value.
59 Calculating impedance in PCBs with a mix of materials is nearly impossible. Please note that coverfilm on flex areas shall stopp 1-2mm inside the rigid area. This is due to risk for delamination, See next slide.
60 LAYER SPECIFICATION Tickness 1L Copper foil 35,0 Total 5 (7) rigid layers And 3 flex layers FR-4 CORE No flow 500,0 65,0 Coverlay 37,5 2L Base Cu 17,5 Base PI (Polyimide Adhesive) 41,0 Bonding Sheet 25,0 Coverlay 37,5 3L Base Cu 17,5 Base PI (Polyimide Adhesive) 94,0 4L Base Cu 17,5 Coverlay 37,5 No flow 65,0 FR-4 CORE 500,0 5L Copper foil 35,0
61 Calculated Impedance between L1-3 Er 3,5 & ,4 ohms
62 Calculated Impedance between L2-3 Er 3,5 107,4 ohms
63 Calculated Impedance between L3-4 Er 3,5 & ohms
64 Polar tools to assist in layer stackup: SB200a PCB Stackup design system
65 Polar tools to assist in impedance prediction: Si8000m Controlled impedance design system
66 Thanks to PolarInstruments Ltd
67 END OF Mini Board Walk
68 PAUSE JossePhoto
69
70
How to Build a Printed Circuit Board. Advanced Circuits Inc 2004
How to Build a Printed Circuit Board 1 This presentation is a work in progress. As methods and processes change it will be updated accordingly. It is intended only as an introduction to the production
More informationAuditing a Printed Circuit Board Fabrication Facility Greg Caswell
Auditing a Printed Circuit Board Fabrication Facility Greg Caswell Introduction DfR is often requested to audit the PCB fabrication process of a customer s supplier. Understanding the process variations
More informationGood Boards = Results
Section 2: Printed Circuit Board Fabrication & Solderability Good Boards = Results Board fabrication is one aspect of the electronics production industry that SMT assembly engineers often know little about.
More informationFLEXIBLE CIRCUITS MANUFACTURING
IPC-DVD-37 FLEXIBLE CIRCUITS MANUFACTURING Below is a copy of the narration for DVD-37. The contents of this script were developed by a review group of industry experts and were based on the best available
More informationDRIVING COST OUT OF YOUR DESIGNS THROUGH YOUR PCB FABRICATOR S EYES!
4/3/2013 S THROUGH YOUR PCB FABRICATOR S EYES! Brett McCoy Eagle Electronics Schaumburg IL. New England Design and Manufacturing Tech Conference Brett McCoy: Vice President / Director of Sales Circuit
More informationCHAPTER 5. OVERVIEW OF THE MANUFACTURING PROCESS
CHAPTER 5. OVERVIEW OF THE MANUFACTURING PROCESS 5.1 INTRODUCTION The manufacturing plant considered for analysis, manufactures Printed Circuit Boards (PCB), also called Printed Wiring Boards (PWB), using
More informationRogers 3003, 3006, 3010, 3035, 3203, 3206, 3210
Stocked Materials: RIGID STANDARD FR4 High Tg 170c Black FR4 Polyclad 370HR (Lead Free) HIGH RELIABILITY Polyimide (Arlon 85N, Isola P96) BT (G200) HIGH FREQUENCY: Park Nelco 4000-13, 4000-13si Getek Gore
More informationFlexible Circuit Simple Design Guide
Flexible Circuit Simple Design Guide INDEX Flexible Circuit Board Types and Definitions Design Guides and Rules Process Flow Raw Material Single Side Flexible PCB Single Side Flexible PCB (Cover layer
More informationMicrowave Multi-layer Printed Circuit Boards
Microwave Multi-layer Printed Circuit Boards MicroAPS at IEEE MTT-S IMS in Fort Worth, TX Ed Sandor, Manager of Application Engineering, Taconic Advanced Dielectric Division June 9, 2004 Abstract Over
More informationBalancing the Electrical and Mechanical Requirements of Flexible Circuits. Mark Finstad, Applications Engineering Manager, Minco
Balancing the Electrical and Mechanical Requirements of Flexible Circuits Mark Finstad, Applications Engineering Manager, Minco Table of Contents Abstract...............................................................................................
More informationHistorical production of rigid PCB s
Historical production of rigid PCB s The Printed Circuit Board (PCB) The PCB What is a Printed Circuit Board? Green plastic thing with holes!! (green plastic syndrome) Platform for components Image with
More informationFlex Circuit Design and Manufacture.
Flex Circuit Design and Manufacture. Hawarden Industrial Park, Manor Lane, Deeside, Flintshire, CH5 3QZ Tel 01244 520510 Fax 01244 520721 Sales@merlincircuit.co.uk www.merlincircuit.co.uk Flex Circuit
More informationTable of Contents. Flex Single-Side Circuit Construction. Rigid Flex Examples. Flex Double-Side Circuit Construction.
Table of Contents Flex Single-Side Circuit Construction Flex Double-Side Circuit Construction Multilayer Flex Circuit Construction Rigid Flex Examples IPC Information Glossary Rigid-Flex Construction Base
More informationThis presentation is courtesy of PCB3D.COM
Printed Circuit Board Design, Development and Fabrication Process This presentation is courtesy of PCB3D.COM Steve Rose Printed Circuit Board Design Engineer Slide 1 Introduction PCB 101 This presentation
More informationFABRICATION 2011 SERVICES TECHNOLOGIES CAPABILITIES INDUSTRY
FABRICATION 2011 SERVICES 24HRS - 5 DAYS ON QUICK TURN PROTOTYPE Dear Customer, We would like to take this opportunity to welcome you and thank you for looking to ASA PCB as your Printed Circuit Manufacturing
More informationWhite Paper. Recommendations for Installing Flash LEDs on Flex Circuits. By Shereen Lim. Abstract. What is a Flex Circuit?
Recommendations for Installing Flash LEDs on Circuits By Shereen Lim White Paper Abstract For the mobile market some PCB assemblies have been converted to flex circuit assemblies, in part because flex
More informationBending, Forming and Flexing Printed Circuits
Bending, Forming and Flexing Printed Circuits John Coonrod Rogers Corporation Introduction: In the printed circuit board industry there are generally two main types of circuit boards; there are rigid printed
More informationFlexible Solutions. Hubert Haidinger Director PE/CAM BU Industrial & Automotive 5.June 2013. www.ats.net
Flexible Solutions Hubert Haidinger Director PE/CAM BU Industrial & Automotive 5.June 2013 www.ats.net Austria Technologie & Systemtechnik Aktiengesellschaft Fabriksgasse13 A-8700 Leoben Tel +43 (0) 3842
More informationExtending Rigid-Flex Printed Circuits to RF Frequencies
Extending -Flex Printed Circuits to RF Frequencies Robert Larmouth Teledyne Electronic Technologies 110 Lowell Rd., Hudson, NH 03051 (603) 889-6191 Gerald Schaffner Schaffner Consulting 10325 Caminito
More informationDesign for Manufacturing
2 Design for Manufacturing This chapter will address the fabrication process of the PCB and the requirements of the manufacturer. Manufacturers are separated by their limitations or constraints into categories
More informationWebinar HDI Microvia Technology Cost Aspects
Webinar HDI Microvia Technology Cost Aspects www.we-online.com HDI - Cost Aspects Seite 1 1 July, 2014 Agenda - Webinar HDI Microvia Technology Cost Aspects Reasons for the use of HDI technology Printed
More informationMulti-Flex Circuits Aust.
Contents: Base Materials Laminate Prepreg Panel Size (Utilization) Multilayer Layup N.C. Drilling Pattern design Impedance control Solder mask type Legend PCB Finishing Gold Plating Profiling Final testing
More informationThermal Management Solutions for Printed Circuit Boards used in Digital and RF Power Electronics and LED assemblies
Thermal Management Solutions for Printed Circuit Boards used in Digital and RF Power Electronics and LED assemblies Sandy Kumar, Ph.D. Director of Technology American Standard Circuits, Inc 3615 Wolf Road
More informationModule No. # 06 Lecture No. # 31 Conventional Vs HDI Technologies Flexible Circuits Tutorial Session
An Introduction to Electronics Systems Packaging Prof. G. V. Mahesh Department of Electronic Systems Engineering Indian Institute of Science, Bangalore Module No. # 06 Lecture No. # 31 Conventional Vs
More informationSan Francisco Circuits, Inc.
Your Doorway to Innovation San Francisco Circuits, Inc. Bridging Concepts with Reality Flex PCB Introduction to Flex Circuits What is Flex Circuits? From Wikipedia - a technology for assembling electronic
More informationUse of Carbon Nanoparticles for the Flexible Circuits Industry
Use of Carbon Nanoparticles for the Flexible Circuits Industry Ying (Judy) Ding, Rich Retallick MacDermid, Inc. Waterbury, Connecticut Abstract FPC (Flexible Printed Circuit) has been growing tremendously
More informationUsing Flex in High-Speed Applications
feature Figure 1: An automotive flex circuit designed to fit into a tight form factor. Using Flex in High-Speed Applications by Glenn Oliver DuPont Electronics and Communications Copper clad circuits in
More informationDynamic & Proto Circuits Inc. Corporate Presentation
Dynamic & Proto Circuits Inc. Corporate Presentation 1 DAPC Facility 54,000 Sq.ft./6,000 Sq.M 2 Multilayer Process 3 Solder Mask Options BLUE BLACK RED GREEN DRY FILM CLEAR 4 Investing in Technology New
More informationCOPPER FLEX PRODUCTS
COPPER FLEX PRODUCTS WHY FLEX? Molex ible Printed Circuit Technology is the answer to your most challenging interconnect applications. We are your total solution for ible Printed Circuitry because we design
More informationQ&A. Contract Manufacturing Q&A. Q&A for those involved in Contract Manufacturing using Nelco Electronic Materials
Q&A Q&A for those involved in Contract Manufacturing using Nelco Electronic Materials 1. Do Nelco laminates have any discoloration effects or staining issues after multiple high temperature exposures?
More information3 Embedded Capacitor Material
3 Embedded Capacitor Material Design and Processing Guidelines for Printed Circuit Board Fabricators Effective date: March 2004 Contents Overview Material Handling Process Compatibility Standard vs. Sequential
More informationPRINTED CIRCUIT BOARD DESIGN AND MANUFACTURING CORP.
PRINTED CIRCUIT BOARD DESIGN AND MANUFACTURING CORP. Corporate Information Established in 2004 Headquarter office in San Jose, CA Production factory located in Binh Duong, Vietnam - Center of hi-tech industrial
More informationKey Processes used to Build a Quality Printed Circuit Board
used to uild a Quality rinted ircuit oard 3-1 hototooling hototooling is an essential part of a number of processes including: nner layer printing, hardboard printing, soldermask, nomenclature, deep and
More informationFlexible Circuit Design Guide
Flexible Circuit Design Guide Benefits of Flexible Circuitry A solution to a packaging problem Placement around edges and folds Ability to be used in 3 axes connections Reduce assembly costs Very little
More informationDFX - DFM for Flexible PCBs Jeremy Rygate
DFX - DFM for Flexible PCBs Jeremy Rygate 1 Jeremy Rygate 30 years experience with Front End in the Electronics industry and PCB manufacturing. Experience in advanced PCBs, particularly Flex, Flex-rigid
More informationMULTI-FLEX CIRCUITS AUSTRALIA. International Suppliers of PRINTED CIRCUIT BOARDS
MULTI-FLEX CIRCUITS AUSTRALIA International Suppliers of PRINTED CIRCUIT BOARDS AUSTRALIA Multi-Flex Circuits Australia Leading suppliers of HIGH QUALITY PRINTED CIRCUIT BOARDS for every purpose OUR COMMITMENT
More informationWELCOME TO VIASION. www.viasion.com
WELCOME TO VIASION www.viasion.com BRIEF INTRODUCTION Viasion Technology Co., Ltd is a professional Printed Circuit Board (PCB) manufacturer in China. With around 1500 employees totally in 2 different
More informationCount on Optima Technology Associates to meet your requirements
Since 1995, Global Resources, Local Support When you need quality Printed Circuit Boards To Spec On Time On Budget Count on Optima Technology Associates to meet your requirements Optima Technology Associates,
More informationPrinted Circuits. Danilo Manstretta. microlab.unipv.it/ danilo.manstretta@unipv.it. AA 2012/2013 Lezioni di Tecnologie e Materiali per l Elettronica
Lezioni di Tecnologie e Materiali per l Elettronica Printed Circuits Danilo Manstretta microlab.unipv.it/ danilo.manstretta@unipv.it Printed Circuits Printed Circuits Materials Technological steps Production
More informationRigid-Flex Technology: Mainstream Use but More Complex Designs by John Isaac October 1, 2007
Rigid-Flex Technology: Mainstream Use but More Complex Designs by John Isaac October 1, 2007 In the past, flex and rigid-flex technology was typically used in applications that could tolerate long design
More informationKeeping Current to Stay Competitive in Flex PCB Laser Processing
White Paper Keeping Current to Stay Competitive in Flex PCB Laser Processing Market Drivers, Trends and Methodologies ESI by Patrick Riechel, PCB Product Manager The push for smaller, cheaper and more
More informationPrinted Circuit Boards
Printed Circuit Boards Luciano Ruggiero lruggiero@deis.unibo.it DEIS Università di Bologna Flusso di progetto di un circuito stampato 1 Specifications Before starting any design, you need to work out the
More informationHDI. HDI = High Density Interconnect. Kenneth Jonsson Bo Andersson. NCAB Group
HDI HDI = High Density Interconnect Kenneth Jonsson Bo Andersson NCAB Group Definitions / Standards (IPC) Pros & Cons Key equipment Build-ups Choice of material Design rules IPC HDI reliability (µvia stacked
More informationAspocomp, PCBs for Demanding Applications
HDI PIIRILEVYT Aspocomp, PCBs for Demanding Applications Automotive Electronics Industrial Electronics Mobile Devices Base Station Photos ABB, Aspocomp, Vacon and Wabco PCBs for Base Stations and Other
More informationFlexible Printed Circuits Design Guide
www.tech-etch.com/flex Flexible Printed Circuits Design Guide Multilayer SMT Assembly Selective Plating of Gold & Tin-Lead Fine Line Microvias Cantilevered & Windowed Leads 1 MATERIALS CONDUCTOR Copper
More informationConnector Launch Design Guide
WILD RIVER TECHNOLOGY LLC Connector Launch Design Guide For Vertical Mount RF Connectors James Bell, Director of Engineering 4/23/2014 This guide will information on a typical launch design procedure,
More informationHow to Avoid Conductive Anodic Filaments (CAF)
How to Avoid Conductive Anodic Filaments (CAF) Ling Zou & Chris Hunt 22 January 20 1 Your Delegate Webinar Control Panel Open and close your panel Full screen view Raise hand for Q&A at the end Submit
More informationFabrication of Embedded Capacitance Printed Circuit Boards
Presented at IPC Printed Circuits EXPO 2001 www.ipcprintedcircuitexpo.org Fabrication of Embedded Capacitance Printed Circuit Boards Joel S. Peiffer 3M St. Paul, MN Abstract Embedding capacitor materials
More informationSCREEN PRINTING INSTRUCTIONS
SCREEN PRINTING INSTRUCTIONS For Photo-Imageable Solder Masks and Idents Type 5600 Two Part Solder Masks and Idents Mega Electronics Ltd., Mega House, Grip Industrial Estate, Linton, Cambridge, ENGLAND
More informationWhat is surface mount?
A way of attaching electronic components to a printed circuit board The solder joint forms the mechanical and electrical connection What is surface mount? Bonding of the solder joint is to the surface
More informationPCB Board Design. PCB boards. What is a PCB board
PCB Board Design Babak Kia Adjunct Professor Boston University College of Engineering Email: bkia -at- bu.edu ENG SC757 - Advanced Microprocessor Design PCB boards What is a PCB board Printed Circuit Boards
More informationPrinted Circuit Board Design, Prototyping, Production. Turning Ideas Into Reality
Printed Circuit Board Design, Prototyping, Production Turning Ideas Into Reality The Company MHA-Integrated Electronic Services Ltd is a total solutions company providing a time critical range of design,
More informationDevelopment of High-Speed High-Precision Cooling Plate
Hironori Akiba Satoshi Fukuhara Ken-ichi Bandou Hidetoshi Fukuda As the thinning of semiconductor device progresses more remarkably than before, uniformity within silicon wafer comes to be strongly required
More informationBASIC PRINTED CIRCUIT BOARD MANUFACTURE
BASIC PRINTED CIRCUIT BOARD MANUFACTURE Bob Willis Electronic Presentation Services 2 Fourth Avenue Chelmsford Essex CM1 4HA England Tel: (44) 01245 351502 Fax: (44) 01245 496123 Email: bob@bobwillis.co.uk
More informationBasic Designs Of Flex-Rigid Printed Circuit Boards
PCBFABRICATION Basic Designs Of Flex-Rigid Printed Circuit Boards Flex-rigid boards allow integrated interconnection between several rigid boards. This technology helps to reduce the number of soldered
More informationIntroduction to Photolithography Concepts via printed circuit board (PCB) manufacturing. PCB Background Information (courtesy of Wikipedia)
Introduction to Photolithography Concepts via printed circuit board (PCB) manufacturing Introduction As you saw on the video (http://www.youtube.com/watch?v=9x3lh1zfggm), photolithography is a way to nanomanufacture
More informationUL Recognition in the view of a PCB manufacturer
UL Recognition in the view of a PCB manufacturer J.Deutschmann, 11.02.2016 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Fabriksgasse 13 A-8700 Leoben Tel +43 (0) 3842 200-0 E-mail info@ats.net
More informationPrinted Circuit Board - PCB presentation
Printed Circuit Board - PCB presentation PCB application P&A supplies customer with Quick Turn Prototype, Small and Medium-volume PCBs. The PCBs can be widely used in communication product, eg. Bluetooth,
More informationControlled Impedance PCBs
Controlled Impedance PCBs An Introduction to the Design and Manufacture of Controlled Impedance PCBs polarinstruments.com Introduction We produced the first edition of this booklet several years ago in
More informationThe Don ts of Better Flexible Circuit Design and Manufacture By Mark Finstad Friday, 01 June 2007
The Don ts of Better Flexible Circuit Design and Manufacture By Mark Finstad Friday, 01 June 2007 Successful designs are soon forgotten but failures are remembered for years. Steering clear of these twelve
More informationPCB Fabrication Enabling Solutions
PCB Fabrication Enabling Solutions June 3, 2015 Notice Notification of Proprietary Information: This document contains proprietary information of TTM and its receipt or possession does not convey any rights
More informationReliability Performance of Very Thin Printed Circuit Boards with regard to Different any-layer Manufacturing Technologies
Reliability Performance of Very Thin Printed Circuit Boards with regard to Different any-layer Manufacturing Technologies Thomas Krivec Gerhard Schmid, Martin Fischeneder, Gerhard Stoiber AT&S Austria
More information1. Single sided PCB: conductors on only one surface of a dielectric base.
The Department of Electrical Engineering at IIT Kanpur has a variety of devices and machines to produce single layer, double layer plated through printed circuit boards (PCBs), multi layer (max 8 layers)
More informationT H A N K S F O R A T T E N D I N G OUR. FLEX-RIGID PCBs. Presented by: Nechan Naicker
T H A N K S F O R A T T E N D I N G OUR TECHNICAL WEBINAR SERIES FLEX-RIGID PCBs Presented by: Nechan Naicker We don t just sell PCBs. We sell sleep. Cirtech EDA is the exclusive SA representative of the
More informationBest Practices for Improving the PCB Supply Chain: Performing the Process Audit
Best Practices for Improving the PCB Supply Chain: Performing the Process Audit Cheryl Tulkoff, Greg Caswell, Dr. Craig Hillman DfR Solutions Beltsville, MD USA ctulkoff@dfrsolutions.com, gcaswell@dfrsolutions.com,
More informationComprehensive Analysis of Flexible Circuit Materials Performance in Frequency and Time Domains
Comprehensive Analysis of Flexible Circuit Materials Performance in Frequency and Time Domains Glenn Oliver and Deepu Nair DuPont Jim Nadolny Samtec, Inc. glenn.e.oliver@dupont.com jim.nadolny@samtec.com
More informationDesmear and Plating Through Hole Considerations and Experiences for Green PCB Production
Desmear and Plating Through Hole Considerations and Experiences for Green PCB Production Gerd Linka, (Neil Patton) Atotech Deutschland GmbH Berlin, Germany Abstract With the latest legislations from RoHS
More informationApplication Note. Soldering Methods and Procedures for 1st and 2nd Generation Power Modules. Overview. Analysis of a Good Solder Joint
Soldering Methods and Procedures for 1st and 2nd Generation Power Modules Overview This document is intended to provide guidance in utilizing soldering practices to make high quality connections of Vicor
More informationRedefining the Cost/Performance Curve for Rigid Flex Circuits
Presented at IPC Expo 99 Redefining the Cost/Performance Curve for Flex Circuits James Keating, Robert Larmouth and Greg Bartlett Teledyne Electronic Technologies 110 Lowell Road Hudson, NH 03051 Phone:
More informationDevelopment of Ultra-Multilayer. printed circuit board
Development of Ultra-Multilayer Printed Circuit Board Yasuyuki Shinbo Using the multilayer and characteristic impedance control technologies cultivated in the field of telecommunications, OKI Printed Circuits
More informationAutomating Inter-Layer In-Design Checks in Rigid-Flex PCBs
Automating Inter-Layer In-Design Checks in Rigid-Flex PCBs By Ed Hickey, Product Engineering Director, Cadence Flexible PCBs (flex/rigid-flex) make it possible to create a variety of products that require
More informationNew Materials for Flex- and Rigid/Flex-Circuitry From Sun Chemical. Productronica Munich Nov 2009. Quality - Service - Innovation
New Materials for Flex- and Rigid/Flex-Circuitry From Sun Chemical Productronica Munich Nov 2009 Quality - Service - Innovation 1 New Material for Flex- and Rigid/Flex Circuitry Content: Our Vision Common
More informationFlex-Rigid Design Guide Part 1
Flex-Rigid Design Guide Part 1 The trend to miniaturization in electronics continues. Integrated circuit board solutions are becoming more and more popular as a means of efficiently utilizing the even
More informationMiniaturizing Flexible Circuits for use in Medical Electronics. Nate Kreutter 3M
Miniaturizing Flexible Circuits for use in Medical Electronics Nate Kreutter 3M Drivers for Medical Miniaturization Market Drivers for Increased use of Medical Electronics Aging Population Early Detection
More informationCompany Overview Index History Organization Annual Revenue Vision Production Capacity Technical Capability Lead Time Quality System Management Strategy Advantage Main Customer Certification Quick Process
More informationPrinted Circuit Design Tutorial
Printed Circuit Design Tutorial By Gold Phoenix Technology Tech Center, sales@goldphoenixpcb.biz Gold Phoenix has been sale PCB board in North America since 2003, during these years we received a lot of
More informationManufacturing GEMs in India. Archana SHARMA Physics Department CERN CMS PH-CMX CH 1211 Geneva Switzerland
Manufacturing GEMs in India Archana SHARMA Physics Department CERN CMS PH-CMX CH 1211 Geneva Switzerland COMPANIES in INDIA Very interested in learning technology I visited KIED (Hyderabad) on Sep 24 2010
More informationA SURVEY AND TUTORIAL OF DIELECTRIC MATERIALS USED IN THE MANUFACTURE OF PRINTED CIRCUIT BOARDS.
A SURVEY AND TUTORIAL OF DIELECTRIC MATERIALS USED IN THE MANUFACTURE OF PRINTED CIRCUIT BOARDS. By Lee W. Ritchey, Speeding Edge, for publication in November 1999 issue of Circuitree magazine. Copyright
More informationPRINTED CIRCUIT BOARD SURFACE FINISHES - ADVANTAGES AND DISADVANTAGES
PRINTED CIRCUIT BOARD SURFACE FINISHES - ADVANTAGES AND DISADVANTAGES By Al Wright, PCB Field Applications Engineer Epec Engineered Technologies Anyone involved within the printed circuit board (PCB) industry
More informationMaking Sense of Laminate Dielectric Properties By Michael J. Gay and Richard Pangier Isola Group December 1, 2008
Making Sense of Laminate Dielectric Properties By Michael J. Gay and Richard Pangier Isola Group December 1, 2008 Abstract System operating speeds continue to increase as a function of the consumer demand
More informationAssessment and Solutions for Hole Wall Pull Away in High Tg and High Technology Laminate Materials
Assessment and Solutions for Hole Wall Pull Away in High Tg and High Technology Laminate Materials Neil Patton Atotech Deutschland GmbH Erasmusstrasse 20 10553 Berlin Germany ABSTRACT Today the use of
More informationThe Company. Nujay was established in 2001.
PRESENTATION The Company Nujay was established in 2001. We provide resources, expertise and global connections to the customers, who are seeking high quality products at competitive price. We have 35 years
More informationTAIYO PSR-4000 AUS703
TAIYO PSR-4000 AUS703 LIQUID PHOTOIMAGEABLE SOLDER MASK Designed for Flip Chip Packaging Applications Halogen-Free (300ppm) Excellent Thermal and Crack Resistance Low Water Absorption RoHS Compliant Excellent
More informationSafety Certification for Lead Free Flexible and Rigid-Flex PCBs
Safety Certification for Lead Free Flexible and Rigid-Flex PCBs Crystal Vanderpan Underwriters Laboratories Inc. March 27, 2007 Crystal Vanderpan Principal Engineer for Printed Circuit Technologies Joined
More informationECP Embedded Component Packaging Technology
ECP Embedded Component Packaging Technology A.Kriechbaum, H.Stahr, M.Biribauer, N.Haslebner, M.Morianz AT&S Austria Technologie und Systemtechnik AG Abstract The packaging market has undergone tremendous
More informationLead-Free Product Transition: Impact on Printed Circuit Board Design and Material Selection
Presented in the ECWC 10 Conference at IPC Printed Circuits Expo, SMEMA Council AP EX and Designers Summit 05 Lead-Free Product Transition: Impact on Printed Circuit Board Design and Material Selection
More informationChapter 14. Printed Circuit Board
Chapter 14 Printed Circuit Board A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using conductive pathways, or traces, etched from copper
More information24-hour turnaround Premier workmanship Value for money pricing Flexible response Skilled and Experienced Staff
PCB Manufacturer & Assembler In the same facility, under the same roof, by the same company. 24-hour turnaround Premier workmanship Value for money pricing Flexible response Skilled and Experienced Staff
More informationwww.pdffactory.com The T-lam System
The T-lam System T-lam..Where It All Begins.. T-preg The Heart of the T-lam System Three Main Functions Conducts Heat Insulate Electrically Adhesive Bonding Layer The T-lam System T-Preg Thermally Conductive
More informationDevelopment of a Design & Manufacturing Environment for Reliable and Cost-Effective PCB Embedding Technology
Development of a Design & Manufacturing Environment for Reliable and Cost-Effective PCB Embedding Technology Outline Introduction CAD design tools for embedded components Thermo mechanical design rules
More informationENIG with Ductile Electroless Nickel for Flex Circuit Applications
ENIG with Ductile Electroless Nickel for Flex Circuit Applications Yukinori Oda, Tsuyoshi Maeda, Chika Kawai, Masayuki Kiso, Shigeo Hashimoto C.Uyemura & Co., Ltd. George Milad and Donald Gudeczauskas
More informationWebinar: HDI 2 Perfection in HDI Optimal use of the HDI technology Würth Elektronik Circuit Board Technology
Webinar: HDI 2 Perfection in HDI Optimal use of the HDI technology Würth Elektronik Circuit Board Technology www.we-online.de Seite 1 04.09.2013 Agenda Overview Webinar HDI 1 Route out a BGA Costs Roadmap
More informationPrinted Circuit Board Quick-turn Prototyping and Production
Printed Circuit Board Quick-turn Prototyping and Production Who We Are Bay Area Circuits has been serving the Printed Circuit Board (PCB) manufacturing needs of high-tech electronics manufacturers, contract
More informationMake up Epoxy adhesive
Epoflex Base Materials series of MSC Polymer AG offers flexible base materials from simple single side flexible boards, flex-rigid applications up to highly complex multilayer boards. The dielectric is
More informationTSM-30. General Processing Guidelines
TSM-30 General Processing Guidelines Petersburgh, NY Tel: 800-833-1805 Fax: 518-658-3988 Europe Tel: +353-44-9395600 Fax: +353-44-9344369 Asia Tel: +82-31-704-1858 Fax: +82-31-704-1857 www.taconic-add.com
More informationPCi Valu Builds for Rigid Flex
PCi Valu Builds for Rigid Flex Stable, robust builds for cost effective rigid flex. PCi Valu Builds Overview Valu Builds are a set of low cost materials, with yield friendly design guidelines, to produce
More informationTTM Operations and Technology Updates. A to Z. 2013TTM Technologies: PCB Manufacturing From A-Z
TTM Operations and Technology Updates 2013TTM Technologies: PCB Manufacturing From A-Z Q2-2013 Global Leader in PCB Manufacturing Leading global PCB manufacturer - $1.3 billion in revenue* 15 specialized
More information