PCi Valu Builds for Rigid Flex

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Kory Riley
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1 PCi Valu Builds for Rigid Flex Stable, robust builds for cost effective rigid flex.

2 PCi Valu Builds Overview Valu Builds are a set of low cost materials, with yield friendly design guidelines, to produce a cost effective rigid flex solution for PWB designers who are new to rigid flex, or need a value solution to their electronic packaging needs.

cost effective rigid flex solution for PWB designers who are new

3 PCi Valu Builds Overview Valu Builds offer you: Low cost rigid flex nominal 37, or less, per square inch per layer, versus 45 Simple solution High reliability Better manufacturing yield Thinner, less weight, form fitting electronics Shorter lead times Easy entry point for those new to rigid flex Stepping stone to more advanced rigid flex design Comprehensive solution RA wrought foil, rather than ED, for maximum flex endurance life UL 94 V-0 approved RoHS compliant Polyimide for lead free assembly One solution dynamic or flex to install applications

for those new to rigid flex Stepping stone to more advanced rigid flex design Comprehensive solution RA wrought foil, rather than ED, for

4 PCi Valu Builds Overview Seven Layups Available: Certifications: 4 Layer IPC Class II and III 6 Layer UL 94 V-0 6 Layer with quad flex RoHS 6 Layer with 2 doublets Mil-PRF-31032, Mil-P Layer 8 Layer with quad flex 8 Layer with 2 doublets 10 Layer 10 Layer with quad flex 10 Layer with 2 doublets

with 2 doublets Mil-PRF-31032, Mil-P-50884 8 Layer 8 Layer with quad flex 8

5 PCi Valu Builds Design Rules Thickness tolerance: ± 10% Line spacing: / and greater on innerlayers Line spacing /0.004 and greater on outerlayers Conventional Vias: drilled and greater Pad size: drilled via Copper plate: minimum in hole Mechanical dimension tolerance: ± Feature to edge distance: min Feature to rigid/flex transition: min Feature e to routed profile tol.: ± Feature to flex profile laser tol.: ± All flex arms must terminate in rigid area (no scribe and break) No fillets (beading at rigid/flex interface) Hole prep: desmear no 3 point etchback 25% or less X outs per array Pad finish: ENIG, HASL Soldermask: Taiyo PSR 4000 green Electrically tested and certified DRC run on your data prior to build Cost adders: Controlled impedance Laser, blind or buried vias Button plating High pot testing One time tooling charges: NRE Electrical Test Fixture

6 PCi Valu Build 4 Layer Rigid Flex Copyright 2010 Printed Circuits, Incorporated Photoimagable Soldermask 2 Plated Copper / 2 oz copper foil 4 Layer Valu Build no flow prepreg - 2 plies / 2 oz copper foil DuPont AP / 2 oz copper foil no flow prepreg - 2 plies / 2 oz copper foil 2 Plated Copper Photoimagable Soldermask Total Thickness With ½ oz Copper Flexible composite thickness X6 "Rule of thumb" for min bend radius - see IPC Adder for 1 oz copper M inimum bend radius for 1/2 oz flex area Total Thickness With 1 oz Copper M inimum bend radius for 1 oz flex area

005 1080 no flow prepreg - 2 plies 0.0007 1/ 2 oz copper foil 2 Plated Copper 0.0007 Photoimagable Soldermask 0.0226 Total Thickness With ½ oz Copper 0.

7 PCi Valu Build 6 Layer Rigid Flex Copyright 2010 Printed Circuits, Incorporated 2 Plated Copper 6 Layer Valu Build 2 Plated Copper 0.034Total Thickness With ½ oz Copper Adder for 1 oz copper Total Thickness With 1 oz Copper Flexible composite thickness X 6"Rule of thumb" for minimum bend radius - see IPC Minimum bend radius for 1/2 oz flex area Minimum bend radius for 1 oz flex area

8 PCi Valu Build 6 Layer Quad Flex Copyright 2010 Printed Circuits, Incorporated 2 Plated Copper 6 Laye er Quad Flex Valu Build DuPont FR0111 Bondply no flow prepreg p -2 plies 2 Plated Copper 0.029Total Thickness With ½ oz Copper Adder for 1 oz copper Total Thickness With 1 oz Copper Flexible composite thickness X 12"Rule of thumb" for minimum bend radius - see IPC Minimum bend radius for 1/2 oz flex area Minimum bend radius for 1 oz flex area

0056Adder for 1 oz copper 0.0346Total Thickness With 1 oz Copper 0.

9 PCi Valu Build 6 Layer 2 Doublets Copyright 2010 Printed Circuits, Incorporated 2 Plated Copper 6 Layer Two Doublet Flex Valu Build 2 Plated Copper 0.035Total Thickness With ½ oz Copper Adder for 1 oz copper Total Thickness With 1 oz Copper Flexible composite thickness X 6"Rule of thumb" for minimum bend radius - see IPC Minimum bend radius for 1/2 oz flex area Minimum bend radius for 1 oz flex area

10 PCi Valu Build 8 Layer Rigid Flex Copyright 2010 Printed Circuits, Incorporated 2 Plated Copper Build 8 Layer Valu 2 Plated Copper Photoimagable 0007Photoimagable Soldermask Total Thickness With ½ oz Copper Adder for 1 oz copper Total Thickness With 1 oz Copper Flexible composite thickness X 6"Rule of thumb" for minimum bend radius - see IPC Minimum bend radius for 1/2 oz flex area Minimum bend radius for 1 oz flex area

0056Adder for 1 oz copper 0.0510Total Thickness With 1 oz Copper 0.

11 PCi Valu Build 8 Layer Quad Flex Copyright 2010 Printed Circuits, Incorporated 2 Plated Copper no flow prepreg - 2 plies 8 Layer Quad Flex Valu Build /2 oz copper foil DuPont FR0111 Bondply /2 oz copper foil 2 Plated Copper Total Thickness With ½ oz Copper Adder for 1 oz copper Total Thickness With 1 oz Copper Flexible composite thickness X 12"Rule of thumb" for minimum bend radius - see IPC Minimum bend radius for 1/2 oz flex area Minimum bend radius for 1 oz flex area

00070007 1/2 oz copper foil 2 Plated Copper 0.0404Total Thickness With ½ oz Copper 0.0056Adder for 1 oz copper 0.

12 PCi Valu Build 8 Layer 2 Doublets Copyright 2010 Printed Circuits, Incorporated 2 Plated Copper 8 Laye er Two Doublet Flex Valu Build 2 Plated Copper Photoimagable 0007Ph Soldermask Total Thickness With ½ oz Copper Adder for 1 oz copper Total Thickness With 1 oz Copper Flexible composite thickness X 6"Rule of thumb" for minimum bend radius - see IPC Minimum bend radius for 1/2 oz flex area Minimum bend radius for 1 oz flex area

0056Adder for 1 oz copper 0.0520Total Thickness With 1 oz Copper 0.

13 PCi Valu Build 10 Layer Rigid Flex Copyright 2010 Printed Circuits, Incorporated 2 Plated Copper ild 10 Layer Valu Bui 2 Plated Copper Total Thickness With ½ oz Copper 0.007Adder for 1 oz copper Total Thickness With 1 oz Copper Flexible composite thickness X 6"Rule of thumb" for minimum bend radius - see IPC Minimum bend radius for 1/2 oz flex area Minimum bend radius for 1 oz flex area

14 PCi Valu Build 10 Layer Quad Flex Copyright 2010 Printed Circuits, Incorporated 2 Plated Copper 10 Layer Quad Flex Va alu Build DuPont FR0111 Bondply 1/2 oz copper foil 2 Plated Copper Total Thickness With ½ oz Copper 0.007Adder for 1 oz copper Total Thickness With 1 oz Copper Flexible composite thickness X 12"Rule of thumb" for minimum bend radius - see IPC Minimum bend radius for 1/2 oz flex area Minimum bend radius for 1 oz flex area

007Adder for 1 oz copper 0.0581Total Thickness With 1 oz Copper 0.

15 PCi Valu Build 10 Layer 2 Doublets Copyright 2010 Printed Circuits, Incorporated 2 Plated Copper no flow prepreg - 2 plies 10 Laye er Two Doublet Flex Valu Build 1/2 oz copper foil 2 Plated Copper Total Thickness With ½ oz Copper 0.007Adder for 1 oz copper Total Thickness With 1 oz Copper Flexible composite thickness X 6"Rule of thumb" for minimum bend radius - see IPC Minimum bend radius for 1/2 oz flex area Minimum bend radius for 1 oz flex area

0571Total Thickness With ½ oz Copper 0.007Adder for 1 oz copper 0.0641Total Thickness With 1 oz Copper 0.

Valu Builds for Rigid Flex

Valu Builds for Rigid Flex s for Rigid Flex Stable, robust builds for cost effective rigid flex We have gathered a set of low cost standard materials, with yield friendly design guidelines, to produce a cost effective rigid flex