Standards for ESD Design Methodology

Size: px
Start display at page:

Download "Standards for ESD Design Methodology"

Transcription

1 Standards for ESD Design Methodology Mujahid Muhammad OPDKC ESD WG Chair & ESD Design Engineer Systems and Technology Group, IBM

2 Outline ESD Basics Overview ESD protection design ESD design/verification typical tools, proposed standardized methodology and newer tools Si2 OPDKC ESD WG ongoing activities Conclusion 2

3 What is Electrostatic Discharge (ESD)? Electrostatic Discharge (ESD) is a single-event, rapid transfer of electrostatic charge between two objects, usually resulting when two objects at different potentials come into direct contact with each other. Lightning Zap from a door 3

4 Introduction to ESD Models: HBM, MM, CDM ESD models: used to model Electrostatic Discharge events HBM: Human Body Model MM: Machine Model CDM: Charged Device Model 2A 3.8A 30ns 10A 1ns 800ns 2kV HBM Current waveform (~1.3A) 200V MM Current waveform (~3.8A) 500V CDM Current waveform (5-10A) 4

5 ESD Target Values ESD Model Human Body Model (HBM) Machine Model (MM) Charged Device Model (CDM) Historical Industry Standard Targets Alternate Target Set #1 Alternate Target Set #2 (ESD Industry Council recommended levels) 2000V 2000V 1000V (1000V ESD Industry Council) 200V 100V 50V (30V ESD Industry council) 500V 250V 250V (250V ESD Industry council) ESD targets in orders of difficulty MM 200V -> need to reduce to 100V or less 500V CDM -> need to reduce to 250V or less HBM 2000V not an issue. 5

6 Full chip ESD Protection Requirements Logic Vdd Optional ESD Device Analog Vcc Signal Pad #1 Logic Circuit ESD Power Clamp ESD Power Clamp Analog Circuit Signal Pad #2 Logic Gnd Desired Path Undesired Path Required ESD Device Analog Gnd Robust current handling, low resistance path for conduction of ESD current between any two pads Ensure that during an ESD event, the voltage drops across any internal device should not lead to the failure of the device 6

7 ESD Design Window ESD Design window shrinks with each successive technology advancement! 7

8 Typical ESD tools and limitations ESD Design Rule Checker (DRC) Limited ESD path-only checking - Impact on internal devices ignored Problems with this approach DRC cannot be used until layout level ESD FEOL and BEOL rules too complex for DRC decks ESD DRC rules limited by the number of testcases used Rigid, non-flexible ESD solutions Example of a complex case when using DRC to check for minimum BEOL wire width from pad to ESD device 8

9 ESD Design Methodology/Flow Cell Schematic Level Schematic Checking Tool Cell Layout Level Design Rule Checker Tool BEOL Current density/ resistance Tool Full Chip Floor planning Level Existence of sufficient powercells I / O ring placement checker Cross- boundary checks (flipchip) Full Chip Schematic Level Package Schematic Level Schematic Checking Tool CDM & system level checks Verification with package info incl.. Full Chip Layout Level Design Rule Checker Tool BEOL Current density Tool Power Bus resistance Extraction Tool Smart cap extraction to substrate 9

10 ESD Schematic Checking Back-to-Back diodes required between various domains to ensure a robust ESD path Netlist based checking able to check requirement at chip schematic level Check was problematic for Shapes-Based DRC checking 10

11 ESD Current Density Checking BEOL connection from pad to ESD devices need to be robust Static verification using known current density limits is used to analyze current flow from pad to ESD device 11

12 Si2 OPDK ESD WG Working Group formed in October 2011, moved under Si2 OPDKC in March 2012 Members include IBM, GlobalFoundries, ST, NXP, Intel and Samsung (others under discussion) Proposal includes a standardized ESD design methodology/tool flow for effective ESD protection design at all levels of a typical chip design Methodology indentifies the right ESD design/verification needs at each level of hierarchy in the design flow Methodology includes a basic set of requirements for each type of tool for utilization by the various EDA vendors Specific runset for each type of tool is envisioned at this point to be company specific Proposed design methodology creates a standardized high level flow for ESD design but allows for runset flexibility in each companies deck implementation of each tool. 12

13 ESD Methodology Standardization Extensive collaboration on the document, feedback incorporated from all members First version of the document is now ready to start the approval process 13

14 Conclusion Successful implementation of ESD protection is getting more difficult at each technology node Technology scaling implications on ESD protection drives the business justification to invest in ESD design methodologies and supporting tools Standardization of ESD design methodology needed to allow vendors to focus on the right design aids and verification tools for successful on-chip ESD protection Proposed ESD design methodology with supporting ESD verification tool requirements presented Sub-committee formed and work proceeding to come up with standardized final methodology to be released as an Si2 standard 14

Module 7 : I/O PADs Lecture 33 : I/O PADs

Module 7 : I/O PADs Lecture 33 : I/O PADs Module 7 : I/O PADs Lecture 33 : I/O PADs Objectives In this lecture you will learn the following Introduction Electrostatic Discharge Output Buffer Tri-state Output Circuit Latch-Up Prevention of Latch-Up

More information

IL2225 Physical Design

IL2225 Physical Design IL2225 Physical Design Nasim Farahini farahini@kth.se Outline Physical Implementation Styles ASIC physical design Flow Floor and Power planning Placement Clock Tree Synthesis Routing Timing Analysis Verification

More information

IEC 1000-4-2 ESD Immunity and Transient Current Capability for the SP72X Series Protection Arrays

IEC 1000-4-2 ESD Immunity and Transient Current Capability for the SP72X Series Protection Arrays IEC 00-4-2 ESD Immunity and Transient Current Capability for the SP72X Series Protection Arrays Application Note July 1999 AN9612.2 Author: Wayne Austin The SP720, SP721, SP723, and SP724 are protection

More information

Influence of the Socket on Chip-level ESD Testing

Influence of the Socket on Chip-level ESD Testing 266 PIERS Proceedings, Guangzhou, China, August 25 28, 2014 Influence of the Socket on Chip-level ESD Testing Yu Xiao 1, Jiancheng Li 2, Jianfei Wu 2, Yunzhi Kang 3, and Jianwei Su 1 1 P. O. Box 9010,

More information

Cable Discharge Event

Cable Discharge Event Cable Discharge Event 1.0 Introduction The widespread use of electronic equipment in various environments exposes semiconductor devices to potentially destructive Electro Static Discharge (ESD). Semiconductor

More information

Alpha CPU and Clock Design Evolution

Alpha CPU and Clock Design Evolution Alpha CPU and Clock Design Evolution This lecture uses two papers that discuss the evolution of the Alpha CPU and clocking strategy over three CPU generations Gronowski, Paul E., et.al., High Performance

More information

CAN bus ESD protection diode

CAN bus ESD protection diode Rev. 04 15 February 2008 Product data sheet 1. Product profile 1.1 General description in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package designed to protect two automotive Controller

More information

8-bit binary counter with output register; 3-state

8-bit binary counter with output register; 3-state Rev. 3 24 February 2016 Product data sheet 1. General description The is an 8-bit binary counter with a storage register and 3-state outputs. The storage register has parallel (Q0 to Q7) outputs. The binary

More information

Analog outputs. Public Document. VS10XX AppNote: Connecting analog outputs

Analog outputs. Public Document. VS10XX AppNote: Connecting analog outputs : Connecting analog outputs Description This document describes how to protect the analog outputs of VS10XX series devices from ESD and how to make a prtoected line-out connection. It shows an example

More information

How To Design A Chip Layout

How To Design A Chip Layout Spezielle Anwendungen des VLSI Entwurfs Applied VLSI design (IEF170) Course and contest Intermediate meeting 3 Prof. Dirk Timmermann, Claas Cornelius, Hagen Sämrow, Andreas Tockhorn, Philipp Gorski, Martin

More information

74HC02; 74HCT02. 1. General description. 2. Features and benefits. Ordering information. Quad 2-input NOR gate

74HC02; 74HCT02. 1. General description. 2. Features and benefits. Ordering information. Quad 2-input NOR gate Rev. 5 26 November 2015 Product data sheet 1. General description 2. Features and benefits The is a quad 2-input NOR gate. Inputs include clamp diodes. This enables the use of current limiting resistors

More information

74HC154; 74HCT154. 4-to-16 line decoder/demultiplexer

74HC154; 74HCT154. 4-to-16 line decoder/demultiplexer Rev. 7 29 February 2016 Product data sheet 1. General description 2. Features and benefits 3. Ordering information The is a. It decodes four binary weighted address inputs (A0 to A3) to sixteen mutually

More information

74HC238; 74HCT238. 3-to-8 line decoder/demultiplexer

74HC238; 74HCT238. 3-to-8 line decoder/demultiplexer Rev. 4 27 January 2016 Product data sheet 1. General description 2. Features and benefits 3. Ordering information The decodes three binary weighted address inputs (A0, A1 and A2) to eight mutually exclusive

More information

74HC4067; 74HCT4067. 16-channel analog multiplexer/demultiplexer

74HC4067; 74HCT4067. 16-channel analog multiplexer/demultiplexer Rev. 6 22 May 2015 Product data sheet 1. General description The is a single-pole 16-throw analog switch (SP16T) suitable for use in analog or digital 16:1 multiplexer/demultiplexer applications. The switch

More information

Hex buffer with open-drain outputs

Hex buffer with open-drain outputs Rev. 5 27 October 20 Product data sheet. General description The provides six non-inverting buffers. The outputs are open-drain and can be connected to other open-drain outputs to implement active-low

More information

PESDxU1UT series. 1. Product profile. Ultra low capacitance ESD protection diode in SOT23 package. 1.1 General description. 1.

PESDxU1UT series. 1. Product profile. Ultra low capacitance ESD protection diode in SOT23 package. 1.1 General description. 1. Rev. 02 20 August 2009 Product data sheet 1. Product profile 1.1 General description Ultra low capacitance ElectroStatic Discharge (ESD) protection diode in a SOT23 (TO-236AB) small SMD plastic package

More information

ESD Design Rule Verification

ESD Design Rule Verification ESD Design Rule Verification Roland Reitbauer 1, Wolfgang Reinprecht 1, Thomas Mörth 1 (1) austriamicrosystems AG, A-8141 Unterpremstätten, Austria Zusammenfassung In den vergangenen Jahren haben sich

More information

Figure 1 FPGA Growth and Usage Trends

Figure 1 FPGA Growth and Usage Trends White Paper Avoiding PCB Design Mistakes in FPGA-Based Systems System design using FPGAs is significantly different from the regular ASIC and processor based system design. In this white paper, we will

More information

University of Texas at Dallas. Department of Electrical Engineering. EEDG 6306 - Application Specific Integrated Circuit Design

University of Texas at Dallas. Department of Electrical Engineering. EEDG 6306 - Application Specific Integrated Circuit Design University of Texas at Dallas Department of Electrical Engineering EEDG 6306 - Application Specific Integrated Circuit Design Synopsys Tools Tutorial By Zhaori Bi Minghua Li Fall 2014 Table of Contents

More information

74HCU04. 1. General description. 2. Features and benefits. 3. Ordering information. Hex unbuffered inverter

74HCU04. 1. General description. 2. Features and benefits. 3. Ordering information. Hex unbuffered inverter Rev. 7 8 December 2015 Product data sheet 1. General description The is a hex unbuffered inverter. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to

More information

74HC138; 74HCT138. 3-to-8 line decoder/demultiplexer; inverting

74HC138; 74HCT138. 3-to-8 line decoder/demultiplexer; inverting Rev. 6 28 December 2015 Product data sheet 1. General description 2. Features and benefits 3. Ordering information The decodes three binary weighted address inputs (A0, A1 and A2) to eight mutually exclusive

More information

PRTR5V0U2F; PRTR5V0U2K

PRTR5V0U2F; PRTR5V0U2K Rev. 02 19 February 2009 Product data sheet 1. Product profile 1.1 General description Ultra low capacitance double rail-to-rail ElectroStatic Discharge (ESD) protection devices in leadless ultra small

More information

74HC4040; 74HCT4040. 12-stage binary ripple counter

74HC4040; 74HCT4040. 12-stage binary ripple counter Rev. 5 3 February 2016 Product data sheet 1. General description 2. Features and benefits 3. Applications 4. Ordering information The is a with a clock input (CP), an overriding asynchronous master reset

More information

SMS7630-061: Surface Mount, 0201 Zero Bias Silicon Schottky Detector Diode

SMS7630-061: Surface Mount, 0201 Zero Bias Silicon Schottky Detector Diode DATA SHEET SMS7630-061: Surface Mount, 0201 Zero Bias Silicon Schottky Detector Diode Applications Sensitive RF and microwave detector circuits Sampling and mixer circuits High volume wireless systems

More information

74HC4051; 74HCT4051. 8-channel analog multiplexer/demultiplexer

74HC4051; 74HCT4051. 8-channel analog multiplexer/demultiplexer Rev. 8 5 February 2016 Product data sheet 1. General description The is a single-pole octal-throw analog switch (SP8T) suitable for use in analog or digital 8:1 multiplexer/demultiplexer applications.

More information

Printed Circuit Boards. Bypassing, Decoupling, Power, Grounding Building Printed Circuit Boards CAD Tools

Printed Circuit Boards. Bypassing, Decoupling, Power, Grounding Building Printed Circuit Boards CAD Tools Printed Circuit Boards (PCB) Printed Circuit Boards Bypassing, Decoupling, Power, Grounding Building Printed Circuit Boards CAD Tools 1 Bypassing, Decoupling, Power, Grounding 2 Here is the circuit we

More information

LIN-bus ESD protection diode

LIN-bus ESD protection diode Rev. 3 31 May 2011 Product data sheet 1. Product profile 1.1 General description in a very small SOD323 (SC-76) Surface-Mounted Device (SMD) plastic package designed to protect one automotive Local Interconnect

More information

74HC4066; 74HCT4066. Quad single-pole single-throw analog switch

74HC4066; 74HCT4066. Quad single-pole single-throw analog switch Rev. 8 3 December 2015 Product data sheet 1. General description The is a quad single pole, single throw analog switch. Each switch features two input/output terminals (ny and nz) and an active HIGH enable

More information

ESDLIN1524BJ. Transil, transient voltage surge suppressor diode for ESD protection. Features. Description SOD323

ESDLIN1524BJ. Transil, transient voltage surge suppressor diode for ESD protection. Features. Description SOD323 Transil, transient voltage surge suppressor diode for ESD protection Datasheet production data Features Max peak pulse power 160 W (8/0 µs) Asymmetrical bidirectional device Stand-off voltage: 15 and 4

More information

74HC165; 74HCT165. 8-bit parallel-in/serial out shift register

74HC165; 74HCT165. 8-bit parallel-in/serial out shift register Rev. 4 28 December 2015 Product data sheet 1. General description 2. Features and benefits 3. Applications 4. Ordering information The is an 8-bit serial or parallel-in/serial-out shift register. The device

More information

Clamp Filters that Suppress Emission Noise Provide Immunity Against Surge Noise

Clamp Filters that Suppress Emission Noise Provide Immunity Against Surge Noise TDK EMC Technology Product Section Clamp Filters that Suppress Emission Noise Provide Immunity Against Surge Noise TDK Shonai Corporation Satoru Saito Reduce Emission Noise from Cables Even if an electronic

More information

3-to-8 line decoder, demultiplexer with address latches

3-to-8 line decoder, demultiplexer with address latches Rev. 7 29 January 2016 Product data sheet 1. General description The is a high-speed Si-gate CMOS device and is pin compatible with low-power Schottky TTL (LSTTL). The is specified in compliance with JEDEC

More information

IP4234CZ6. 1. Product profile. Single USB 2.0 ESD protection to IEC 61000-4-2 level 4. 1.1 General description. 1.2 Features. 1.

IP4234CZ6. 1. Product profile. Single USB 2.0 ESD protection to IEC 61000-4-2 level 4. 1.1 General description. 1.2 Features. 1. Rev. 01 16 April 2009 Product data sheet 1. Product profile 1.1 General description The is designed to protect Input/Output (I/O) USB 2.0 ports, that are sensitive to capacitive loads, from being damaged

More information

MADR-009443-0001TR. Quad Driver for GaAs FET or PIN Diode Switches and Attenuators. Functional Schematic. Features. Description. Pin Configuration 2

MADR-009443-0001TR. Quad Driver for GaAs FET or PIN Diode Switches and Attenuators. Functional Schematic. Features. Description. Pin Configuration 2 Features Functional Schematic High Voltage CMOS Technology Four Channel Positive Voltage Control CMOS device using TTL input levels Low Power Dissipation Low Cost 4x4 mm, 20-lead PQFN Package 100% Matte

More information

74HC377; 74HCT377. 1. General description. 2. Features and benefits. 3. Ordering information

74HC377; 74HCT377. 1. General description. 2. Features and benefits. 3. Ordering information Rev. 4 24 February 2016 Product data sheet 1. General description 2. Features and benefits 3. Ordering information The is an octal positive-edge triggered D-type flip-flop. The device features clock (CP)

More information

CAN Bus Transceivers Operate from 3.3V or 5V and Withstand ±60V Faults

CAN Bus Transceivers Operate from 3.3V or 5V and Withstand ±60V Faults CAN Bus Transceivers Operate from 3.3V or 5V and Withstand ±6 Faults Ciaran Brennan design features The LTC2875 is a robust CAN bus transceiver that features ±6 overvoltage and ±25kV ESD tolerance to reduce

More information

PCB Design. Gabe A. Cohn. May 2010. Using Altium Designer/DXP/Protel. Electrical Engineering University of Washington

PCB Design. Gabe A. Cohn. May 2010. Using Altium Designer/DXP/Protel. Electrical Engineering University of Washington PCB Design Using Altium Designer/DXP/Protel Gabe A. Cohn May 2010 Electrical Engineering University of Washington Printed Circuit Board Steps 1. Draw schematics 2. Attach footprints for all components

More information

CLA4607-085LF: Surface Mount Limiter Diode

CLA4607-085LF: Surface Mount Limiter Diode DATA SHEET CLA4607-085LF: Surface Mount Limiter Diode Applications Low-loss, high-power limiters Receiver protectors Anode (Pin 1) Anode (Pin 3) Features Low thermal resistance: 55 C/W Typical threshold

More information

74HC175; 74HCT175. Quad D-type flip-flop with reset; positive-edge trigger

74HC175; 74HCT175. Quad D-type flip-flop with reset; positive-edge trigger Rev. 5 29 January 2016 Product data sheet 1. General description 2. Features and benefits 3. Ordering information The is a quad positive-edge triggered D-type flip-flop with individual data inputs (Dn)

More information

How To Make An Electric Static Discharge (Esd) Protection Diode

How To Make An Electric Static Discharge (Esd) Protection Diode Rev. 01 0 October 2008 Product data sheet 1. Product profile 1.1 General description Ultra low capacitance bidirectional ElectroStatic Discharge (ESD) protection diodes in small Surface-Mounted Device

More information

Femtofarad bidirectional ESD protection diode

Femtofarad bidirectional ESD protection diode Rev. 3 24 October 2011 Product data sheet 1. Product profile 1.1 General description Femtofarad bidirectional ElectroStatic Discharge (ESD) protection diode in a leadless ultra small SOD882 Surface-Mounted

More information

LM 358 Op Amp. If you have small signals and need a more useful reading we could amplify it using the op amp, this is commonly used in sensors.

LM 358 Op Amp. If you have small signals and need a more useful reading we could amplify it using the op amp, this is commonly used in sensors. LM 358 Op Amp S k i l l L e v e l : I n t e r m e d i a t e OVERVIEW The LM 358 is a duel single supply operational amplifier. As it is a single supply it eliminates the need for a duel power supply, thus

More information

A p p l i c a t i o n N o t e

A p p l i c a t i o n N o t e USB Port Protection The USB-Interface might be the most distributed PC interface in the world. The usage in industryapplications is more and more common. Let s have a closer look to the special environmental

More information

MADR-009269-0001TR. Single Driver for GaAs FET or PIN Diode Switches and Attenuators Rev. V1. Functional Schematic. Features.

MADR-009269-0001TR. Single Driver for GaAs FET or PIN Diode Switches and Attenuators Rev. V1. Functional Schematic. Features. Features High Voltage CMOS Technology Complementary Outputs Positive Voltage Control CMOS device using TTL input levels Low Power Dissipation Low Cost Plastic SOIC-8 Package 100% Matte Tin Plating over

More information

TAN-058 Application Note Sept 7, 2006

TAN-058 Application Note Sept 7, 2006 INTRODUCTION Physical layer devices, such as DS-/E LIU (Line Interface Units) and Framer Combo devices with integrated LIU, are responsible for the interconnection between network elements. These devices,

More information

StarRC Custom: Next-Generation Modeling and Extraction Solution for Custom IC Designs

StarRC Custom: Next-Generation Modeling and Extraction Solution for Custom IC Designs White Paper StarRC Custom: Next-Generation Modeling and Extraction Solution for Custom IC Designs May 2010 Krishnakumar Sundaresan Principal Engineer and CAE Manager, Synopsys Inc Executive Summary IC

More information

74HC574; 74HCT574. Octal D-type flip-flop; positive edge-trigger; 3-state

74HC574; 74HCT574. Octal D-type flip-flop; positive edge-trigger; 3-state Rev. 7 4 March 2016 Product data sheet 1. General description 2. Features and benefits 3. Ordering information The is an 8-bit positive-edge triggered D-type flip-flop with 3-state outputs. The device

More information

Class 18: Memories-DRAMs

Class 18: Memories-DRAMs Topics: 1. Introduction 2. Advantages and Disadvantages of DRAMs 3. Evolution of DRAMs 4. Evolution of DRAMs 5. Basics of DRAMs 6. Basics of DRAMs 7. Write Operation 8. SA-Normal Operation 9. SA-Read Operation

More information

AP331A XX G - 7. Lead Free G : Green. Packaging (Note 2)

AP331A XX G - 7. Lead Free G : Green. Packaging (Note 2) Features General Description Wide supply Voltage range: 2.0V to 36V Single or dual supplies: ±1.0V to ±18V Very low supply current drain (0.4mA) independent of supply voltage Low input biasing current:

More information

74HC595; 74HCT595. 1. General description. 2. Features and benefits. 3. Applications

74HC595; 74HCT595. 1. General description. 2. Features and benefits. 3. Applications 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state Rev. 8 25 February 2016 Product data sheet 1. General description The is an 8-bit serial-in/serial or parallel-out shift

More information

AN11243. Failure signature of electrical overstress on power MOSFETs. Document information

AN11243. Failure signature of electrical overstress on power MOSFETs. Document information Rev. 01 29 October 2012 Application note Document information Info Keywords Abstract Content Power MOSFETs, Electrical Overstress (EOS), Unclamped Inductive Switching (UIS) When Power MOSFETs fail, there

More information

ECE410 Design Project Spring 2008 Design and Characterization of a CMOS 8-bit Microprocessor Data Path

ECE410 Design Project Spring 2008 Design and Characterization of a CMOS 8-bit Microprocessor Data Path ECE410 Design Project Spring 2008 Design and Characterization of a CMOS 8-bit Microprocessor Data Path Project Summary This project involves the schematic and layout design of an 8-bit microprocessor data

More information

ESD7484. 4-Line Ultra-Large Bandwidth ESD Protection

ESD7484. 4-Line Ultra-Large Bandwidth ESD Protection 4-Line Ultra-Large Bandwidth ESD Protection Functional Description The ESD7484 chip is a monolithic, application specific discrete device dedicated to ESD protection of the HDMI connection. It also offers

More information

74HC2G02; 74HCT2G02. 1. General description. 2. Features and benefits. 3. Ordering information. Dual 2-input NOR gate

74HC2G02; 74HCT2G02. 1. General description. 2. Features and benefits. 3. Ordering information. Dual 2-input NOR gate Rev. 5 27 September 2013 Product data sheet 1. General description 2. Features and benefits 3. Ordering information The is a dual 2-input NOR gate. Inputs include clamp diodes. This enables the use of

More information

SiGe:C Low Noise High Linearity Amplifier

SiGe:C Low Noise High Linearity Amplifier Rev. 2 21 February 2012 Product data sheet 1. Product profile 1.1 General description The is a low noise high linearity amplifier for wireless infrastructure applications. The LNA has a high input and

More information

TGP-751 TGP-651. ThermoGenerator-Package (TGP) Thin Film Thermogenerator inside standard package. Preliminary Datasheet

TGP-751 TGP-651. ThermoGenerator-Package (TGP) Thin Film Thermogenerator inside standard package. Preliminary Datasheet TGP-751 TGP-651 (TGP) Thin Film Thermogenerator inside standard package Preliminary Datasheet Important Notices Please read carefully prior to use Micropelt Products are prototypes Micropelt supplies thermoelectric

More information

74HC393; 74HCT393. Dual 4-bit binary ripple counter

74HC393; 74HCT393. Dual 4-bit binary ripple counter Rev. 6 3 December 2015 Product data sheet 1. General description 2. Features and benefits 3. Ordering information The 74HC393; 7474HCT393 is a dual 4-stage binary ripple counter. Each counter features

More information

74HC123; 74HCT123. Dual retriggerable monostable multivibrator with reset

74HC123; 74HCT123. Dual retriggerable monostable multivibrator with reset Rev. 9 19 January 2015 Product data sheet 1. General description The are high-speed Si-gate CMOS devices and are pin compatible with Low-power Schottky TTL (LSTTL). They are specified in compliance with

More information

74HC32; 74HCT32. 1. General description. 2. Features and benefits. Quad 2-input OR gate

74HC32; 74HCT32. 1. General description. 2. Features and benefits. Quad 2-input OR gate Rev. 5 4 September 202 Product data sheet. General description The is a quad 2-input OR gate. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages

More information

ISSCC 2003 / SESSION 10 / HIGH SPEED BUILDING BLOCKS / PAPER 10.5

ISSCC 2003 / SESSION 10 / HIGH SPEED BUILDING BLOCKS / PAPER 10.5 ISSCC 2003 / SESSION 10 / HIGH SPEED BUILDING BLOCKS / PAPER 10.5 10.5 Broadband ESD Protection Circuits in CMOS Technology Sherif Galal, Behzad Razavi Electrical Engineering Department, University of

More information

AVX EMI SOLUTIONS Ron Demcko, Fellow of AVX Corporation Chris Mello, Principal Engineer, AVX Corporation Brian Ward, Business Manager, AVX Corporation

AVX EMI SOLUTIONS Ron Demcko, Fellow of AVX Corporation Chris Mello, Principal Engineer, AVX Corporation Brian Ward, Business Manager, AVX Corporation AVX EMI SOLUTIONS Ron Demcko, Fellow of AVX Corporation Chris Mello, Principal Engineer, AVX Corporation Brian Ward, Business Manager, AVX Corporation Abstract EMC compatibility is becoming a key design

More information

AN96-07. Surging Ideas TVS Diode Application Note PROTECTION PRODUCTS. TRANSIENT IMMUNITY STANDARDS: IEC 61000-4-x

AN96-07. Surging Ideas TVS Diode Application Note PROTECTION PRODUCTS. TRANSIENT IMMUNITY STANDARDS: IEC 61000-4-x TRANSIENT IMMUNITY STANDARDS: IEC 61000-4-x On January 1, 1996, exports into Europe began facing some tough transient immunity standards. The International Electrotechnical Commission (IEC), a worldwide

More information

SM712 Series 600W Asymmetrical TVS Diode Array

SM712 Series 600W Asymmetrical TVS Diode Array SM712 Series 6W Asymmetrical TVS Diode Array RoHS Pb GREEN Description The SM712 TVS Diode Array is designed to protect RS-485 applications with asymmetrical working voltages (-7V to from damage due to

More information

Wireless Sensor Networks

Wireless Sensor Networks Edgar H. Callaway, Jr. Wireless Sensor Networks Architectures and Protocols A AUERBACH PUBLICATIONS A CRC Press Company Boca Raton London New York Washington, D.C. Chapter 1 Introduction to Wireless Sensor

More information

Reconfigurable ECO Cells for Timing Closure and IR Drop Minimization. TingTing Hwang Tsing Hua University, Hsin-Chu

Reconfigurable ECO Cells for Timing Closure and IR Drop Minimization. TingTing Hwang Tsing Hua University, Hsin-Chu Reconfigurable ECO Cells for Timing Closure and IR Drop Minimization TingTing Hwang Tsing Hua University, Hsin-Chu 1 Outline Introduction Engineering Change Order (ECO) Voltage drop (IR-DROP) New design

More information

Design Fundamentals Protecting Set Top Boxes from ESD and Cable Discharge Threats

Design Fundamentals Protecting Set Top Boxes from ESD and Cable Discharge Threats Design Fundamentals Protecting Set Top Boxes from ESD and Cable Discharge Threats By Grace Yang and Timothy Puls, (To appear in April 09 Issue of Conformity Magazine) Serving a consumer market hungry for

More information

74HC573; 74HCT573. 1. General description. 2. Features and benefits. Octal D-type transparent latch; 3-state

74HC573; 74HCT573. 1. General description. 2. Features and benefits. Octal D-type transparent latch; 3-state Rev. 7 4 March 2016 Product data sheet 1. General description The is an 8-bit D-type transparent latch with 3-state outputs. The device features latch enable (LE) and output enable (OE) inputs. When LE

More information

Charged cable event. 1 Goal of the ongoing investigation. 2 Energy sources for the CDE. Content

Charged cable event. 1 Goal of the ongoing investigation. 2 Energy sources for the CDE. Content Charged cable event David Pommerenke, david_pommerenke@hp.com, 916 785 4550 Last update: Feb.23, 2001 Content Goal Energy sources, which may lead to CDE. Complexity of the different discharge modes. Possible

More information

74HC107; 74HCT107. Dual JK flip-flop with reset; negative-edge trigger

74HC107; 74HCT107. Dual JK flip-flop with reset; negative-edge trigger Rev. 5 30 November 2015 Product data sheet 1. General description 2. Features and benefits 3. Ordering information The is a dual negative edge triggered JK flip-flop featuring individual J and K inputs,

More information

74HC74; 74HCT74. 1. General description. 2. Features and benefits. 3. Ordering information

74HC74; 74HCT74. 1. General description. 2. Features and benefits. 3. Ordering information Rev. 5 3 December 2015 Product data sheet 1. General description 2. Features and benefits 3. Ordering information The 74HC74 and 74HCT74 are dual positive edge triggered D-type flip-flop. They have individual

More information

Impact of Signal Integrity on System-On-Chip Design Methodologies

Impact of Signal Integrity on System-On-Chip Design Methodologies EDP 2004 Impact of Signal Integrity on System-On-Chip Methodologies Juan-Antonio Carballo jantonio@us.ibm.com VSIA IMP co-chair Raminderpal Singh IBM Systems and Technology raminder@us.ibm.com VSIA IMP

More information

Clocking. Figure by MIT OCW. 6.884 - Spring 2005 2/18/05 L06 Clocks 1

Clocking. Figure by MIT OCW. 6.884 - Spring 2005 2/18/05 L06 Clocks 1 ing Figure by MIT OCW. 6.884 - Spring 2005 2/18/05 L06 s 1 Why s and Storage Elements? Inputs Combinational Logic Outputs Want to reuse combinational logic from cycle to cycle 6.884 - Spring 2005 2/18/05

More information

MFRD52x. Mifare Contactless Smart Card Reader Reference Design. Document information

MFRD52x. Mifare Contactless Smart Card Reader Reference Design. Document information Rev. 2.1 17. April 2007 Preliminary Data Sheet Document information Info Keywords Content MFRC522, MFRC523, MFRC52x, MFRD522, MFRD523, Mifare Contactless Smart Card Reader Reference Design, Mifare Reader

More information

Gi-Joon Nam, IBM Research - Austin Sani R. Nassif, Radyalis. Opportunities in Power Distribution Network System Optimization (from EDA Perspective)

Gi-Joon Nam, IBM Research - Austin Sani R. Nassif, Radyalis. Opportunities in Power Distribution Network System Optimization (from EDA Perspective) Gi-Joon Nam, IBM Research - Austin Sani R. Nassif, Radyalis Opportunities in Power Distribution Network System Optimization (from EDA Perspective) Outline! SmartGrid: What it is! Power Distribution Network

More information

Automotive Electronics Council Component Technical Committee

Automotive Electronics Council Component Technical Committee AEC - Q101-005 - REV- ATTACHMENT 5 AEC - Q101-005 Rev- CAPACITIVE DISCHARGE MODEL (CDM) ELECTROSTATIC DISCHARGE (ESD) TEST METHOD - 005 DISCRETE COMPONENT CHARGED DEVICE MODEL (CDM) ELECTROSTATIC DISCHARGE

More information

MADR-009190-0001TR. Quad Driver for GaAs FET or PIN Diode Switches and Attenuators Rev. 4. Functional Schematic. Features.

MADR-009190-0001TR. Quad Driver for GaAs FET or PIN Diode Switches and Attenuators Rev. 4. Functional Schematic. Features. Features High Voltage CMOS Technology Four Channel Positive Voltage Control CMOS device using TTL input levels Low Power Dissipation Low Cost Lead-Free SOIC-16 Plastic Package Halogen-Free Green Mold Compound

More information

Design Tips for Low Noise Readout PCBs Or: How black magic can lead to success

Design Tips for Low Noise Readout PCBs Or: How black magic can lead to success Design Tips for Low Noise Readout PCBs Or: How black magic can lead to success Tim Armbruster tim.armbruster@ziti.uni-heidelberg.de SuS Monday Meeting Schaltungstechnik Schaltungstechnik und und April

More information

An Advanced Behavioral Buffer Model With Over-Clocking Solution. Yingxin Sun, Joy Li, Joshua Luo IBIS Summit Santa Clara, CA Jan.

An Advanced Behavioral Buffer Model With Over-Clocking Solution. Yingxin Sun, Joy Li, Joshua Luo IBIS Summit Santa Clara, CA Jan. An Advanced Behavioral Buffer Model With Over-Clocking Solution Yingxin Sun, Joy Li, Joshua Luo IBIS Summit Santa Clara, CA Jan. 31, 2014 Agenda 1. SPICE Model and Behavioral Buffer Model 2. Over-Clocking

More information

NUP2105L, SZNUP2105L. Dual Line CAN Bus Protector SOT 23 DUAL BIDIRECTIONAL VOLTAGE SUPPRESSOR 350 W PEAK POWER

NUP2105L, SZNUP2105L. Dual Line CAN Bus Protector SOT 23 DUAL BIDIRECTIONAL VOLTAGE SUPPRESSOR 350 W PEAK POWER Dual Line CAN Bus Protector The SZ/NUP215L has been designed to protect the CAN transceiver in high speed and fault tolerant networks from ESD and other harmful transient voltage events. This device provides

More information

ESP-CV Custom Design Formal Equivalence Checking Based on Symbolic Simulation

ESP-CV Custom Design Formal Equivalence Checking Based on Symbolic Simulation Datasheet -CV Custom Design Formal Equivalence Checking Based on Symbolic Simulation Overview -CV is an equivalence checker for full custom designs. It enables efficient comparison of a reference design

More information

RTS5401. USB 3.0 Super-Speed HUB Controller DATASHEET. Doc Rev. 0.90 11 th Apr 2012. i Rev 0.90

RTS5401. USB 3.0 Super-Speed HUB Controller DATASHEET. Doc Rev. 0.90 11 th Apr 2012. i Rev 0.90 USB 3.0 Super-Speed HUB Controller DATASHEET Doc Rev. 0.90 11 th Apr 2012 i Rev 0.90 TRADEMARKS Realtek is a trademark of Realtek Semiconductor Corporation. All other names mentioned in this document are

More information

3-input EXCLUSIVE-OR gate. The 74LVC1G386 provides a 3-input EXCLUSIVE-OR function.

3-input EXCLUSIVE-OR gate. The 74LVC1G386 provides a 3-input EXCLUSIVE-OR function. Rev. 02 3 September 2007 Product data sheet 1. General description The provides a 3-input EXCLUSIVE-OR function. The input can be driven from either 3.3 or 5 V devices. This feature allows the use of these

More information

Total Hot Spot Management from Design Rule Definition to Silicon Fabrication

Total Hot Spot Management from Design Rule Definition to Silicon Fabrication Total Management from Rule Definition to Silicon Fabrication Soichi Inoue, Toshiya Kotani, Shigeki Nojima, Satoshi Tanaka, Kohji Hashimoto, and Ichiro Mori & Manufacturing Engineering Center, Toshiba Corporation,

More information

RClamp0504P RailClamp Low Capacitance TVS Array

RClamp0504P RailClamp Low Capacitance TVS Array - RailClamp Description RailClamps are low capacitance TVS arrays designed to protect high speed data interfaces. This series has been specifically designed to protect sensitive components which are connected

More information

SDC15. TVS Diode Array for ESD Protection of 12V Data and Power Lines. PROTECTION PRODUCTS Description. Features. Mechanical Characteristics

SDC15. TVS Diode Array for ESD Protection of 12V Data and Power Lines. PROTECTION PRODUCTS Description. Features. Mechanical Characteristics Description The SDC15 transient voltage suppressor (TVS) is designed to protect components which are connected to data and transmission lines from voltage surges caused by electrostatic discharge (ESD),

More information

Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED

Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK Typical Applications The HMC547LP3

More information

Evaluating AC Current Sensor Options for Power Delivery Systems

Evaluating AC Current Sensor Options for Power Delivery Systems Evaluating AC Current Sensor Options for Power Delivery Systems State-of-the-art isolated ac current sensors based on CMOS technology can increase efficiency, performance and reliability compared to legacy

More information

AN3353 Application note

AN3353 Application note Application note IEC 61000-4-2 standard testing Introduction This Application note is addressed to technical engineers and designers to explain how STMicroelectronics protection devices are tested according

More information

Data Sheet, V1.1, May 2008 SMM310. Silicon MEMS Microphone. Small Signal Discretes

Data Sheet, V1.1, May 2008 SMM310. Silicon MEMS Microphone. Small Signal Discretes Data Sheet, V1.1, May 2008 SMM310 Small Signal Discretes Edition 2008-05-28 Published by Infineon Technologies AG 81726 München, Germany Infineon Technologies AG 2008. All Rights Reserved. Legal Disclaimer

More information

Low-power configurable multiple function gate

Low-power configurable multiple function gate Rev. 7 10 September 2014 Product data sheet 1. General description The provides configurable multiple functions. The output state is determined by eight patterns of 3-bit input. The user can choose the

More information

1ED Compact A new high performance, cost efficient, high voltage gate driver IC family

1ED Compact A new high performance, cost efficient, high voltage gate driver IC family 1ED Compact A new high performance, cost efficient, high voltage gate driver IC family Heiko Rettinger, Infineon Technologies AG, Am Campeon 1-12, 85579 Neubiberg, Germany, heiko.rettinger@infineon.com

More information

Rigid-Flex Technology: Mainstream Use but More Complex Designs by John Isaac October 1, 2007

Rigid-Flex Technology: Mainstream Use but More Complex Designs by John Isaac October 1, 2007 Rigid-Flex Technology: Mainstream Use but More Complex Designs by John Isaac October 1, 2007 In the past, flex and rigid-flex technology was typically used in applications that could tolerate long design

More information

74AUP1G74. 1. General description. 2. Features and benefits. Low-power D-type flip-flop with set and reset; positive-edge trigger

74AUP1G74. 1. General description. 2. Features and benefits. Low-power D-type flip-flop with set and reset; positive-edge trigger Low-power D-type flip-flop with set and reset; positive-edge trigger Rev. 9 6 January 2014 Product data sheet 1. General description The provides a low-power, low-voltage single positive-edge triggered

More information

The 104 Duke_ACC Machine

The 104 Duke_ACC Machine The 104 Duke_ACC Machine The goal of the next two lessons is to design and simulate a simple accumulator-based processor. The specifications for this processor and some of the QuartusII design components

More information

AN1826 APPLICATION NOTE TRANSIENT PROTECTION SOLUTIONS: Transil diode versus Varistor

AN1826 APPLICATION NOTE TRANSIENT PROTECTION SOLUTIONS: Transil diode versus Varistor AN1826 APPLICATION NOTE TRANSIENT PROTECTION SOLUTIONS: Transil diode versus A. BREMOND / C. KAROUI Since the seventies, electronic modules are more and more present in our life. This is the case for our

More information

Application Note AN-1135

Application Note AN-1135 Application Note AN-1135 PCB Layout with IR Class D Audio Gate Drivers By Jun Honda, Connie Huang Table of Contents Page Application Note AN-1135... 1 0. Introduction... 2 0-1. PCB and Class D Audio Performance...

More information

74LVC1G14. Description. Pin Assignments. Features. Applications SINGLE SCHMITT-TRIGGER INVERTER 74LVC1G14

74LVC1G14. Description. Pin Assignments. Features. Applications SINGLE SCHMITT-TRIGGER INVERTER 74LVC1G14 SINGLE SCHMITT-TRIGGER INVERTER Description Pin ssignments The is a single 1-input Schmitt-trigger inverter with a standard push-pull output. The device is designed for operation with a power supply range

More information

On/Off Controller with Debounce and

On/Off Controller with Debounce and 19-4128; Rev ; 5/8 On/Off Controller with Debounce and General Description The is a pushbutton on/off controller with a single switch debouncer and built-in latch. It accepts a noisy input from a mechanical

More information

UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences

UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences Jan M. Rabaey Homework #1: Circuit Simulation EECS 141 Due Friday, January 30, 5pm, box in 240

More information

uclamp3301h Low Voltage μclamp TM for ESD and CDE Protection PRELIMINARY Features

uclamp3301h Low Voltage μclamp TM for ESD and CDE Protection PRELIMINARY Features PROTECTION PRODUCTS -MicroClamp Description The μclamp series of Transient Suppressors (TVS) are designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers,

More information