74LVC1G14. Description. Pin Assignments. Features. Applications SINGLE SCHMITT-TRIGGER INVERTER 74LVC1G14

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1 SINGLE SCHMITT-TRIGGER INVERTER Description Pin ssignments The is a single 1-input Schmitt-trigger inverter with a standard push-pull output. The device is designed for operation with a power supply range of 1.65V to 5.5V. The inputs are tolerant to 5.5V allowing this device to be used in a mixed voltage environment. The device is fully specified for partial power down applications using I OFF. The I OFF circuitry disables the output preventing damaging current backflow when the device is powered down. The gate performs the positive Boolean function: NC GND SOT25 / SOT353 NC GND Top View Top View Vcc NC X2-DFN Bottom View GND3 4 X2-DFN Chip Scale lternative NC NC1 6 Vcc Vcc NC 1 2 GND 3 NC GND Top View Future Product SOT553 Top View X1-DFN Top View X2-DFN Vcc 4 NC 1 6 Vcc Future 2 5 Product NC GND 3 4 Vcc NC NC Top View 1 5 Vcc 3 GND 2 4 X2-DFN Packages not to scale Features pplications Wide Supply Voltage Range from 1.65V to 5.5V ± 24m Output Drive at 3.3V CMOS low power consumption IOFF Supports Partial-Power-Down Mode Operation Inputs accept up to 5.5V ESD Protection Exceeds JESD 22 o 200-V Machine Model 115 o 2000-V Human Body Model 114 Latch-Up Exceeds 100m per JESD 78, Class I Range of Package Options Totally Lead-Free & Fully RoHS Compliant Notes 1 & 2 Halogen and ntimony Free. Green Device Note 3 Voltage Level Shifting General Purpose Logic Power Down Signal Isolation Wide array of products such as: o PCs, networking, notebooks, netbooks, PDs o Computer peripherals, hard drives, CD/DVD ROM o TV, DVD, DVR, set top box o Cell Phones, Personal Navigation / GPS o MP3 players,cameras, Video Recorders Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC RoHS & 2011/65/EU RoHS 2 compliant. 2. See for more information about Diodes Incorporated s definitions of Halogen- and ntimony-free, "Green" and Lead-free. 3. Halogen- and ntimony-free "Green products are defined as those which contain <900ppm bromine, <900ppm chlorine <1500ppm total Br + Cl and < 1000 ppm antimony compounds. 1 of 16

2 Ordering Information 74 LVC1G 14 XXX -7 Logic Device Function Package Packing 74 : Logic Prefix 14 : 1-Input W5 : SOT25-7 : 7 Tape & Reel LVC : 1.65 to 5.5 V Schmitt Trigger SE : SOT353 Logic Family Inverter Z : SOT553 1G : One Gate FS3 : X2-DFN FW5 : X1-DFN FW4 :X2-DFN FX4 : X2- DFN FZ4 : X2- DFN Notes: Device Package Code Package Notes 4,5 W5-7 W5 SOT25 SE-7 SE SOT353 Z-7 Future Product Z SOT553 Future Product FS3-7 FS3 X2-DFN FW5-7 Future Product FW5 X1-DFN Future Product FW4-7 FW4 X2-DFN FX4-7 FX4 X2-DFN Chip scale alternative FZ4-7 FZ4 X2-DFN Package Size 3.0mm X 2.8mm X 1.2mm 0.95mm lead pitch 2.0mm X 2.0mm X 1.1mm 0.65mm lead pitch 1.6mm X 1.6 mm X 0.62mm 0.5mm lead pitch 0.9mm X 0.9 mm X 0.35mm 0.5mm pad pitch diamond 1.0mm X 1.0mm X 0.5mm 0.35mm pad pitch 1.0mm X 1.0mm X 0.4mm 0.35mm pad pitch 1.4mm X 0.9mm X 0.4mm 0.5mm pad pitch 1.4mm X 1.0mm X 0.4mm 0.5mm pad pitch Quantity 4. Pad layout as shown on Diodes Inc. suggested pad layout document P02001, which can be found on our website at 5. The taping orientation is located on our website at 7 Tape and Reel Part Number Suffix 3000/Tape & Reel /Tape & Reel /Tape & Reel /Tape & Reel /Tape & Reel /Tape & Reel /Tape & Reel /Tape & Reel -7 Pin Descriptions Logic Diagram Pin Name GND V CC Description Data Input Ground Data Output Supply Voltage Function Table Inputs H L Output L H 2 of 16

3 bsolute Maximum Ratings Notes 6, 7 Symbol Description Rating Unit ESD HBM Human Body Model ESD Protection 2 kv ESD MM Machine Model ESD Protection 200 V V CC Supply Voltage Range -0.5 to 6.5 V V I Input Voltage Range -0.5 to 6.5 V V O Voltage pplied to Output in High Impedance or I OFF State -0.5 to 6.5 V V O Voltage pplied to Output in High or Low State -0.5 to V CC +0.5 V I IK Input Clamp Current V I < 0-50 m I OK Output Clamp Current -50 m I O Continuous Output Current ±50 m I CC, I GND Continuous Current Through V CC or GND ±100 m T J Operating Junction Temperature -40 to 150 C T STG Storage Temperature -65 to 150 C Notes: 6. Stresses beyond the absolute maximum may result in immediate failure or reduced reliability. These are stress values and device operation should be within recommend values. 7. Forcing the maximum allowed voltage could cause a condition exceeding the maximum current or conversely forcing the maximum current could cause a condition exceeding the maximum voltage. The ratings of both current and voltage must be maintained within the controlled range.. Recommended Operating Conditions Note 8 Symbol Parameter Min Max Unit V CC Operating Voltage Operating V Data retention only 1.5 V V I Input Voltage V V O Output Voltage 0 V CC V V CC = 1.65V -4 V CC = 2.3V -8 I OH High-Level Output Current V CC = 2.7V -12 V CC = 3V -16 m -24 V CC = 4.5V -32 V CC = 1.65V 4 V CC = 2.3V 8 I OL Low-Level Output Current V CC = 2.7V 12 V CC = 3V 16 m 24 V CC = 4.5V 32 T Operating Free-ir Temperature C Notes: 8. Unused inputs should be held at V CC or Ground. 3 of 16

4 Electrical Characteristics T = -40 C to +85 C ll typical values are at V CC = 3.3V, T = +25 C Symbol Parameter Test Conditions V CC Min Typ. Max Unit 1.65V V T+ 2.3V Positive-Going Input 3V Threshold Voltage 4.5V V V V T- 2.3V Negative- Going Input 3V Threshold Voltage 4.5V V V V Hysteresis V T 3V V T+ - V T- 4.5V V I OH = -100μ 1.65V to 5.5V V CC 0.1 I OH = -4m 1.65V 1.2 I OH = -8m 2.3V 1.9 V OH High Level Output Voltage I OH = -12m 2.7V 2.2 V I OH = -16m 2.4 3V I OH = -24m 2.3 I OH = -32m 4.5V 3.8 I OL = 100μ 1.65V to 5.5V 0.1 I OL = 4m 1.65V 0.45 I OL = 8m 2.3V 0.3 V OL Low-Level Output Voltage I OL = 12m 2.7V 0.4 V I OL = 16m 0.4 3V I OL = 24m 0.55 I OL = 32m I I Input Current V I = 5.5 V or GND 0 to 5.5V ± 5 μ I OFF Power Down Leakage Current V I or V O = 5.5V 0 ± 10 μ I CC Supply Current V I = 5.5V of GND I O = V to 5.5V 10 μ I CC dditional Supply Current Input at V CC 0.6V 3V to 5.5V 500 μ 4 of 16

5 Electrical Characteristics T = -40 C to +125 C ll typical values are at V CC = 3.3V, T = +25 C Symbol Parameter Test Conditions V CC Min Typ. Max Unit 1.65V V T+ 2.3V Positive- Going Input 3V Threshold Voltage 4.5V V V V T- 2.3V Negative- Going Input 3V Threshold Voltage 4.5V V V V Hysteresis V T 3V V T+ - V T- 4.5V V I OH = -100μ 1.65V to 5.5V V CC 0.1 I OH = -4m 1.65V 0.95 I OH = -8m 2.3V 1.7 V OH High Level Output Voltage I OH = -12m 2.7V 1.9 V I OH = -16m 1.9 3V I OH = -24m 2.0 I OH = -32m 4.5V 3.4 I OL = 100μ 1.65V to 5.5V 0.1 I OL = 4m 1.65V 0.7 I OL = 8m 2.3V 0.45 V OL Low-Level Output Voltage I OL = 12m 2.7V 0.6 V I OL = 16m 0.6 3V I OL = 24m 0.8 I OL = 32m 4.5V 0.8 I I Input Current V I = 5.5V or GND 0 to 5.5V ± 100 μ I OFF Power Down Leakage Current V I or V O = 5.5V 0 ± 200 μ I CC Supply Current V I = 5.5V of GND I O = V to 5.5V 200 μ I CC dditional Supply Current Input at V CC 0.6V 3V to 5.5V 5000 μ 5 of 16

6 Package Characteristics ll typical values are at V CC = 3.3V, T = +25 C Symbol Parameter Test Conditions V CC Min Typ. Max Unit SOT SOT SOT θ J Thermal Resistance X2-DFN Note 9 Junction-to-mbient X1-DFN C/W X2-DFN X2-DFN X2-DFN SOT25 52 SOT SOT θ JC Thermal Resistance X2-DFN Note 9 Junction-to-Case X1-DFN C/W X2-DFN X2-DFN X2-DFN Note: 9. Test condition for each of the 8 package types: Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout. Switching Characteristics T = -40 C to +85 C, C L = 15pF as noted see Figure 1 V CC = 1.8V V CC = 2.5V V CC = 3.3V V CC = 5V Parameter From To ± 0.15V ± 0.2V ± 0.3V ± 0.5V Input Output Min Max Min Max Min Max Min Max Unit t pd ns T = -40 C to +85 C, C L = 30 or 50pF as noted see Figure 2 V CC = 1.8V V CC = 2.5V V CC = 3.3V V CC = 5V Parameter From To ± 0.15V ± 0.2V ± 0.3V ± 0.5V Input Output Min Max Min Max Min Max Min Max Unit t pd ns T = -40 C to +125 C, C L = 15pF as noted see Figure 1 V CC = 1.8V V CC = 2.5V V CC = 3.3V V CC = 5V Parameter From To ± 0.15V ± 0.2V ± 0.3V ± 0.5V Input Output Min Max Min Max Min Max Min Max Unit t pd ns T = -40 C to +125 C, C L = 30 or 50pF as noted see Figure 2 V CC = 1.8V V CC = 2.5V V CC = 3.3V V CC = 5V Parameter From To ± 0.15V ± 0.2V ± 0.3V ± 0.5V Input Output Min Max Min Max Min Max Min Max Unit t pd ns 6 of 16

7 Operating Characteristics T = +25 C C pd Parameter Power Dissipation Capacitance Test V CC = 1.8V V CC = 2.5V V CC = 3.3V V CC = 5V Unit Conditions Typ. Typ. Typ. Typ. f = 10 MHz pf Parameter Measurement Information V CC Inputs V M C L R L V I t r /t f 1.8V±0.15V V CC 2ns V CC /2 15pF 1MΩ 2.5V±0.2V V CC 2ns V CC /2 15pF 1MΩ 3.3V±0.3V 3V 2.5ns 1.5V 15pF 1MΩ 5V±0.5V V CC 2.5ns V CC /2 15pF 1MΩ Voltage Waveform Pulse Duration Voltage Waveform Propagation Delay Times Inverting and Non Inverting Outputs Figure 1. Load Circuit and Voltage Waveforms Notes:. Includes test lead and test apparatus capacitance. B. ll pulses are supplied at pulse repetition rate 10MHz. C. Inputs are measured separately one transition per measurement. D. t PLH and t PHL are the same as t PD. 7 of 16

8 Parameter Measurement Information Cont. V CC Inputs V I t r /t f V M C L R L 1.8V±0.15V V CC 2ns V CC /2 30pF 1kΩ 2.5V±0.2V V CC 2ns V CC /2 30pF 500Ω 3.3V±0.3V 3V 2.5ns 1.5V 50pF 500Ω 5V±0.5V V CC 2.5ns V CC /2 50pF 500Ω Voltage Waveform Pulse Duration Voltage Waveform Propagation Delay Times Inverting and Non Inverting Outputs Figure 2. Load Circuit and Voltage Waveforms Notes:. Includes test lead and test apparatus capacitance. B. ll pulses are supplied at pulse repetition rate 10MHz. C. Inputs are measured separately one transition per measurement. D. t PLH and t PHL are the same as t PD. 8 of 16

9 Marking Information 1 1 SOT25, SOT353 and SOT553 Part Number Package Identification Code W5-7 SOT25 UP SE-7 SOT353 UP Z-7 SOT553 UP 2 DFN packages Top View XX WX XX : Identification Code : ear 0~9 W : Week : ~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : ~Z : Internal Code Part Number Package Identification Code FS3-7 X2-DFN WP FW5-7 X1-DFN V8 FW4-7 X2-DFN UP FX4-7 X2-DFN MG FZ4-7 X2-DFN UP 9 of 16

10 7 Package Outline Dimensions ll Dimensions in mm 1 Package Type: SOT25 K J H D B C N L M SOT25 Dim Min Max Typ B C D 0.95 H J K L M N ll Dimensions in mm 2 Package Type: SOT353 K J H D F B C L M SOT353 Dim Min Max B C D 0.65 Typ F H J K L M ll Dimensions in mm 3 Package Type: SOT553 E1 E1/2 R0.1 MX. TP. F e D e1 E/2 E b 5x a c L 5x SOT553 Dim Min Max Typ b c D E E e 0.50 BSC e BSC F L a ll Dimensions in mm TP. 10 of 16

11 Package Outline Dimensions cont. 4 Package Type X2-DFN X2-DFN E L 1 Pi n #1 I D R0. 05 TP 4x E2 D e K D2 3 Seati ng Plane L1 4x Dim Min Max Typ b D D E E e K L L Z ll Dimensions in mm Z 4x b 4x 5 Package Type: X1-DFN E 1 L1 Pi n #1 I D e1 D L e Seati ng Pl ane 5x X1-DFN Dim Min Max Typ b D E e 0.55 BSC e BSC L L ll Dimensions in mm b 11 of 16

12 Package Outline Dimensions cont. 6 Package Type X2-DFN Pin #1 ID b1 E L6x e D 3 K X2-DFN Dim Min Max Typ b b D E e 0.35 L K 0.15 Z ll Dimensions in mm Z4x b6x 7 Package Type: X2-DFN CHIP SCLE LTERNTIVE E Pi n #1 I D D e1 Z1 4x Z2 4x 1 Ø e2 3 Seati ng Pl ane 6x X2-DFN Dim Min Max Typ Ø D E e e Z Z ll Dimensions in mm 8 Package Type: X2-DFN Pin #1 ID E e D 3 1 Seating Plane L6x Z14x X2-DFN Dim Min Max Typ b D E e 0.50 L Z 0.10 Z ll Dimensions in mm Z4x b6x 12 of 16

13 Suggested Pad Layout 1 Package Type: SOT25 C2 C2 Z G X C1 Dimensions Value in mm Z 3.20 G 1.60 X C C Package Type: SOT353 C2 C2 Z G C1 Dimensions Value in mm Z 2.5 G 1.3 X C1 1.9 C X 3 Package Type: SOT553 Z G C2 C2 C1 Dimensions Value in mm Z 2.2 G 1.2 X C1 1.7 C2 0.5 X 13 of 16

14 X1 Suggested Pad Layout cont. 4 Package Type X2-DFN X2 C 1 2 Dimensions Value in mm C X X X x X 4x 5Package Type X1-DFN X1 C 5x G 2 1 G1 3 Value Dimensions in mm C G G X X Pi n1 X 14 of 16

15 Suggested Pad Layout cont. 6Package Type X2-DFN X1 C 1 1 6x Value Dimensions in mm C G X X G4x X6x 7 Package Type: X2-DFN C D 6x Dimensions Value in mm C C1 C D G Pin1 G1 G X X G Package Type: X2-DFN C X1 1 1 G4x 6x X6x Value Dimensions in mm C G X X of 16

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