Intel IT Redefines the High Density Data Center: 1,100 Watts/Sq. Ft

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1 Intel IT Redefines the High Density Data Center: 1,100 Watts/Sq. Ft John Musilli- SR Data Center Architect Paul Vaccaro Data Center Solutions Architect

2 Legal Notices This presentation is for informational purposes only. INTEL MAKES NO WARRANTIES, EXPRESS OR IMPLIED, IN THIS SUMMARY. Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and/or other countries The information contained in this presentation is based on results from Intel s data center design. Intel s design is specific to our environmental needs. Other data center requirements may differ. * Other names and brands may be claimed as the property of others. 2

3 Business Challenge Increasing Compute is key to getting new product designs Especially SoC (System on a Chip) to market. Intel IT s challenge is to deliver more compute to our design engineers, achieving industry best Cap-X, and industry best Op-X cost models. 3

4 Key Innovation DC 2 90nM* Key Innovation in HDDC: High density power design lowers construction cost inside the room. <22nM* New Density Model >2014 ~5MW in 43 KSF DC 3 Old Density Model = HDDC 5MW 5KSF DC1 Cost Advantages/Economies of Density roughly works like Moore s Law As you put more kw into each SqFt of computer room the cost per KW goes down * New density model is the equivalent ratio of space reduction of a 90nM die as compared to a 10nM die. 4

5 1.1 MW in 40 Rack per Cold Aisle 240 Servers and 960 Cores per Rack 35% more EDA performance, 46% less power, 60% more density Up to 43 kw/rack (1.5x previous high density) Free air cooling (a<95f Intake, except 39 hours/yr.) 1100 W/sq. ft. Density Design PUE 1.1; Actual PUE

6 800A- 415/240vac Bus Power Distribution 575kW per bus 3 phase 60amp branch circuits Ease of use Flexibility Reliability 11

7 provide efficient air segregation 7

8 Cross section airflow and heat map 10

9 Exhaust air louvers 8

10 Exhaust to outside Top of Server rack Inside Hot Aisle 10

11 Reliability: Power Quality Data From June 2011 December 2013 Total Power Quality Incidents Incidents with Multi Phase Impact Longest Duration (Sec) Description Outside IT Equipment Design Specifications Within IT Equipment Designed Operating Specifications Within IT Recommended Operating Specifications SAG Voltage (VAC) Actual Number of Incidents Percentage of Power Quality Incidents by Type 59% 22% 19% Outside IT Equipment Design Specificati ons Within IT Equipment Design Operating Specificati ons Within IT Equipment Recommen ded Operating Specificati ons 11

12 PUE AUG/SEP/OCT

13 Results/Conclusions Key Opportunity: Respond to computing demand with a retrofit of decommissioned Wafer Fab Key Innovation: High density power design lowers construction cost inside the room. o o o Inside DC Fit Up at $2,832/kw or $3,625/SqFt 43 kw/rack is 1.5 X greater than previously delivered 1,100 W/SqFt. is 10 times the industry average Key Behavior: Designed with a business appropriate level of facility hardening and redundancy (Tier 1) o o The design from the start used the local Utility power quality and reliability as a specific design assumption The utility power quality and reliability met the customer up time requirements for the intended compute for the data center PUE Trends are exceeding the Design Goal of 1.1 o Ability to rely on cost-effective 100 percent free air cooling for all but 39 hours per year 13

14 Sharing Intel IT Best Practices With the World Learn more about Intel IT s Initiatives at 14

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16 More Information Contact Info Links to Additional White Papers White Paper: Intel IT Redefines the High-Density Data Center White Paper: Date Center Efficiency and Retrofit Best Practices White Paper: Intel IT's Data Center Strategy for Business Transformation White Paper: Selecting a Data Center Site: Intel's Approach White Paper: Exploring DCIM for Intel's Data Centers 16