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1 Fingerprint Cards FPC1155 Basic Package Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: chipworks.com
2 Basic Package Analysis 2 Some of the information in this report may be covered by patents, mask and/or copyright protection. This report should not be taken as an inducement to infringe on these rights. Chipworks Inc all rights reserved. Chipworks and the Chipworks logo are registered trademarks of Chipworks Inc. This report is provided exclusively for the use of the purchasing organization. It can be freely copied and distributed within the purchasing organization, conditional upon the accompanying Chipworks accreditation remaining attached. Distribution of the entire report outside of the purchasing organization is strictly forbidden. The use of portions of the document for the support of the purchasing organization's corporate interest (e.g., licensing or marketing activities) is permitted, as defined by the fair use provisions of the copyright act. Accreditation to Chipworks must be attached to any portion of the reproduced information. PKG CYPJ Revision 1.0 Published: September 16, 2015
3 Basic Package Analysis 3 Table of Contents 1 Introduction 1.1 Device Naming Conventions Used in this Report 1.2 Device Samples Used for Analysis 1.3 Company Profile 1.4 Executive Summary 2 Device Identification 2.1 Meizu M575M Smartphone Downstream Product 2.2 FPC1155 Package 2.3 FPC1155 Die 3 FPC1155 Package Cross-Sectional Analysis 3.1 FPC1155 Package Cross-Sectional Analysis Overview 3.2 FPC1155 Package Structure Overview 3.3 FPC1155 Die Assembly 3.4 FPC1155 Package PWB Substrate and Ribbon Cable Interface 3.5 FPC1155 Package Materials Elemental Composition and Vertical Dimensions 4 References 5 Statement of Measurement Uncertainty and Scope Variation About Chipworks
4 Basic Package Analysis 4 List of Figures Figure Meizu M575M Smartphone Front Figure Meizu M575M Smartphone Rear Figure Meizu M575M Smartphone Inside Front Cover Figure FPC1155 Sensor in Meizu M575M Smartphone Front Cover Figure FPC1155 Sensor Module Top Figure FPC1155 Sensor Module Bottom Figure FPC1155 Package Photograph Top Figure FPC1155 Package Photograph Bottom Figure FPC1155 Package X-Ray Top View Figure FPC1155 Package X-Ray Side View Figure FPC1155 Die Photograph Figure FPC1155 Die Corner A Figure FPC1155 Die Corner B Figure FPC1155 Die Corner C Figure FPC1155 Die Corner D Figure FPC1155 Die Bond Pads Figure FPC1155 Package Cross-Section Location X-Ray Bottom View Figure FPC1155 Package Overview Cross-Sectional Image Optical Figure FPC1155 Package Layers Optical Dark Field Figure FPC1155 Package Edge Region Optical Figure FPC1155 Package Die Edge SEM Figure FPC1155 Package Wire Bond Interconnect Optical Figure FPC1155 Package On-Die Wire Bond SEM Figure FPC1155 Package On-Substrate Wire Bond SEM Figure FPC1155 Package PWB Substrate and Ribbon Cable Contact Pads SEM Figure FPC1155 Package Contact Bead SEM Figure FPC1155 Package Ribbon Cable and Contact Bead Interface SEM List of Tables Table FPC1155 Component Summary Table FPC1155 Package Materials Elemental Composition and Vertical Dimensions
5 Basic Package Analysis About Chipworks Patent and Technology Partner to the World s Most Successful Companies For over 20 years, Chipworks has been a trusted patent and technology partner to the world s largest and most successful companies. Business leaders rely on us to help them identify and fully leverage their most valuable patents and provide crucial analysis of high-revenue products in the most competitive, fastest changing technology markets. By combining deep patent and market knowledge with an unmatched ability to analyze the broadest range of technology products we are able to provide the most insightful Patent Intelligence and Competitive Technical Intelligence services in the industry. Contact Chipworks To find out more information about this report, or any other reports in our library, please contact Chipworks at Chipworks 1891 Robertson Road, Suite 500 Ottawa, Ontario K2H 5B7 Canada T F Web site: info@chipworks.com Please send any feedback to feedback@chipworks.com
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