C W COB Series

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1 High Performance LED Module SemiLEDs C W COB is a high performance LED module with high thermal conductivity and reliability for demanding lighting applications. It is an easy to assemble light source for downlighting, high bay, spot lighting and retrofit bulb applications. Table of Contents Features... 1 Characteristics. 1 Chromaticity Coordinate Groups 3 Relative Spectral Power Distribution.. 5 Typical Polar Radiation Pattern.. 6 Mechanical Dimensions 7 Shipping Package Information. 8 Assembly Note 9

2 Features Forward Voltage: 33V Drive Current: 3600mA Max. Drive Current: 4000mA View Angle: 120 Die Direct bonding to copper High thermal conductivity: 401W/(m.K) Thermocouple attach point Easy assembly Characteristics Parameter Typical Maximum DC Forward Current (ma) Reverse Current (ma) 0.1 Forward Voltage (V) 33 Maximum LED Junction Temperature 120 1

3 Flux Characteristics, Standard Codes and BINs Tj=25 ) Part number Color Min. CRI C CE Daylight 70 Performance at Test Current (3600mA) ( Tj=25 ) Group Min. Flux (lm/w) Max. Flux (lm/w) Q Q R R Total Luminous Flux (lm) Correlated Color Temperature, CCT (K) Min. 5300K Max. 6000K Chromaticity 57A, 57B, 57C, 57D Notes: 1. SemiLEDs maintains a tolerance of ±7% on flux and power measurements and a tolerance of ±2 on CRI measurements. 2. Minimum CRI for chromaticity kits 57A, 57B, 57C, 57D is Above CCT and CRI specifications are for SemiLEDs standard products. Different CCT and CRI are available upon request. 2

4 Chromaticity Coordinate Groups 3

5 Color Bin: Bin Code x y Typical CCT(K) A K B K C K D K

6 Relative Spectral Power Distribution, Ta=25 C Daylight: 5

7 Typical Polar Radiation Pattern 6

8 Mechanical Dimensions Notes: 1. Drawing is not to scale 2. All dimensions are in millimeter 3. Tolerances unless on dimensions ±0.2mm 7

9 Shipping Package Information PET Tray Put COB onto tray 12 trays per box 4 box per carton All dimensions are in millimeter 8

10 Assembly Note 1. Do not touch the emitting area. 2. Assembly guideline Attach wires to emitter s anode/cathode pads first, and then fix emitter onto heat sink with screws. 3. Soldering method Cathode / Anode PAD soldering condition Set up the temperature of solder head to 400±10 when soldering Put emitter on a 100±10 hot plate and set up welding head temperature to 300±10 (either is ok) 4. Suggest using strand wires (softer) to connect power (don t use solid wires.) 9

11 About Us SemiLEDs Corporation is a US based manufacturer of ultra high brightness LED chips with state of the art fabrication facilities in Hsinchu Science Park, Taiwan. SemiLEDs specializes in the development and manufacturing of vertical LED chips in blue (white), green, and UV using a patented copper alloy base. This unique design allows for higher performance and longer lumen maintenance. In December 2008, The World Economic Forum recognized SemiLEDs innovations with the 2009 Technology Pioneer Award. SemiLEDs is fully ISO 9001:2008 Certified SemiLEDs is a publicly traded company on NASDAQ Global Select Market (stock symbol LEDS ). For investor information, please contact us at For further company or product information, please visit us at or please contact semileds.com. ASIA PACIFIC 3F, No. 11, KeJung Rd. Chu Nan Site Hsinchu Science Park Chu Nan 350, Miao Li County Taiwan, ROC Tel: Fax: SemiLEDs. All Right Reserved 10

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