Eurocircuits.com. From idea to professional Online PCB platform

Transcription

1 Eurocircuits.com From idea to professional Online PCB platform

2 Eurocircuits 23 years Europrint NV trade of PCBs owner Hungarian factory - sales of own products Second factory in Aachen Germany first franchise site elektorpcbservice.com new website new services TECH pool and IMS pool Group TO > orders and +/- 15M ec-equipment - SMD prototype soldering second franchise site element14.com 2012 new factory in Eger Hungary Group TO > 10M all group services online on eurocircuits.com move head office to the new building first foreign sales office Germany first over seas activity India (CAM) first version of the Eurocircuits e-business platform Go social engineering community BLOGs, LinkedIn, Twitter, Facebook, Google+ Go visual talk with images: PCB Image PCB Visualizer 2013 Goes visual PCB Checker PCB Configurator layout editor buildup wizard - PCB PIXture - Third factory in Ghandinagar India Serving +/ ,- customers => +/ ,- users and +/ orders

3 Eurocircuits - today Eurocircuits Group Luc Smets 50% partner Dirk Stans 50% partner Production and logistics 4 logistic centers: B D HU - IN 3 factories: HU D - IN Sales & marketing 7 subsidiaries: B D F CH HU USA - IN 2 local sales: UK - I CAM (front end preparation) PCB Planet Ltd India Eurocircuits own software teams Website development & maintenance (India) CAM-tools & database mgt (B) ERP Traceability shop floor mgt (HU)

4 Eurocircuits Group PCB Sales YTD ,000,000 14,000,000 12,000,000 10,000,000 8,000,000 6,000,000 4,000,000 2,000, B.13 Sales 4

5 Eurocircuits Group PCB Orders YTD ,000 60,000 50,000 40,000 30,000 20,000 10, B.13 Orders 5

6 Eurocircuits offer PCB proto s & small series From 2 working days onwards On-line minimal administration Open 24/24-7/7D Free DFM-tools: PCB Visualizer, PCB Checker, PCB Configurator Pooling until 8 layers Services PCB proto, STANDARD pool, BINDI pool, RF pool and IMS pool Non-pooling until 16 layers Services STANDARD- and RF pool Stencil service for prototypes ec-solutions ec-equipment and ec-consumables for prototype soldering EAGLE CAD software ec-workshops & trainings

7 Next Generation Base Materials High Reliability in Low Loss applications Alun Morgan 7

8 Global Product Development and Manufacturing Footprint 1. Brugherio facility is a glass fabric operation only

9 PCB Laminate Production Schematic

10 Lead free soldering- Migration from dicy to Phenolic Curing Property Units Curing Chemistry Std Tg High Tg High Tg Dicy Dicy Phenolic Tg, ( DSC ) o Td, ( TGA - ASTM) o C T-260 ( TMA ) minutes 15 8 > 60 T-288 ( TMA ) minutes <1 <1 > 15 C

11 Comparison dicyandiamide cured and phenolic cured after thermal cycle Colour changes after heat stress (up to 10 x C solder dips)

12 Mechanical and Electrical properties Property Units Curing Chemistry Std Tg High Tg High Tg Next Generation Dicy Dicy Phenolic Non dicy /non phenolic Tg, ( DSC ) o Td, ( TGA - ASTM) o C T-260 ( TMA ) minutes 15 8 > 60 > 60 T-288 ( TMA ) minutes <1 <1 > 15 > 20 Dk, 2 Ghz Dk, 5 Ghz Dk, 10 Ghz Df, 2 Ghz Df, 5 Ghz Df, 10 Ghz C

13 Where are the Losses? All PCB materials exhibit both conduction and dielectric loss. The conduction losses are primarily resistive (i2r) losses in the conduction layers and leakage of charge through the dielectric. The dielectric losses result from the varying field produced from the alternating electric field causing movement of the material s molecular structure generating heat.

14 Skin Effect Induced magnetic fields in a conductor affect the distribution of current forcing it to flow nearer and nearer the surface as frequency increases. This effectively reduces the current carrying cross section and hence increases the effective resistance Frequency δ = 2 ωµσ δ= skin depth (m) µ= permeability (4π* 10-7 H/m) π= pi ρ= resistivity (Ω*m) ω= radian frequency = 2π*f (Hz) σ= conductivity (mho/m), 50 Hz 10 MHz 100 MHz 1 GHz 10 GHz Skin Depth (Copper) 9.3 mm 21 µm 6.6 µm 2.1 µm 0.66 µm

15 Copper Surface Profile Resist side Bonding side Standard foil ~10 µm Frequency 10 MHz Skin Depth 21 µm Frequency 100 MHz Skin Depth 6.6 µm Signal Path The current is able to tunnel below the surface profile and through the bulk of the conductor The current is forced to follow every peak and trough of the surface profile increasing path length and resistance

16 Copper Profile Specifications 10 microns Standard Foil STD HTE microns Low Profile LP < 5 microns Very Low Profile DSTF/RTF evlp/h-vlp

17 Dielectric Loss Dielectrics are materials which are poor conductors of electric current. They are insulators because they have few free electrons available to carry current. However, when subjected to an electric field polarisation occurs whereby positive and negative charges are displaced relative to the electric field. This polarisation reduces the electric field in the dielectric thus causing part of the applied field to be lost Unpolarised Polarised by electric field

18 Dipole Moment The amount of polarisation that can occur in a dielectric material depends on the symmetry of the molecular structure and can be quantified by the Dipole Moment. Within most molecular structures, although the overall charge is zero, the positive and negative charges do not overlap completely thus giving rise to a permanent Dipole Moment. A good example of how this works is exhibited by water molecules in a microwave oven. As the field oscillates the molecules continuously rotate releasing kinetic energy as they collide with neighbouring molecules. The microwave frequency is 2.45GHz as this frequency allows the optimal time needed for the molecules to rotate exactly 180º. 105 H O H H δ+ 105 δ+ O δ- H The time delay is crucial to the process and explains why the dielectric loss reduces at higher frequencies for some advanced dielectrics where there isn t enough time for the molecules to polarise before the charge reverses. δ-

19 Loss Factor The effect of the dipole moment in a dielectric is quantified as loss tangent and describes the dielectric s inherent dissipation of an applied electric field. The loss tangent derives from the tangent of the phase angle between the resistive and reactive components of a system of complex permittivity. The property is dimensionless and is often referred to by the following synonyms; Loss Factor Dissipation Factor Dielectric Loss Loss angle Tan δ

20 Indicative Loss Factor Values Material Loss factor (1GHz) Air ~0 Alumina Water 0.06 E-glass NE-glass Standard FR Phenolic cured FR Ceramic filled low loss substrate PTFE based PCB substrate New Generation PCB substrate I-Tera MT PTFE materials and more recently highly ceramic filled materials have been the standard choice for designers of high speed circuits With the market growth and technological demands for multilayer circuits, new unfilled, non PTFE substrates have been developed enabling greater complexity, improved processability and offering a lower cost alternative to traditional solutions.

21 Eye Diagram Noise One Bit Length Noise Margin The Eye Signal with Noise Good Sampling Period Reference: Handbook of Fiber Optics Jitter

22 Simulated Eye Diagrams At Source FR408 DF =.012 Zero Dielectric Loss IS620 DF =.008 Standard FR4 DF =.020 I=Tera MT =.003 Simulated Eye 5 Gbps -1 M -50 Ohms impedance 5 Mil Track width PRBS 35 PS Rise time

23 I-Tera MT Applications High Speed Digital Long Backplanes Gbps/Channel Daughter cards Gbps/Channel RF/Microwave Automotive Radars and Sensors Antennas Low noise block down converters (LNB) for Direct Broadcast Systems Base Stations Power Amplifiers Point to Point Links RFID s Competitive products High Speed Digital Megtron-6 RF/MW Rogers 4350 Taconic RF 35

24 Thermal Coefficient of Dielectric Constant I-Tera TC Dielectric Constant Dielectric Constant Temperature C Dielectric Constant

25 I-Tera MT and IS680 vs competitive products IS680 vs Competition db/inch Frequency in GHz RO4350B AR 25N IS I-Tera IS % Improved performance over competitive products

26 I-Tera MT Product Strengths I-Tera MT uses Standard E-Glass Standard Thicknesses Available (nominal ± 5% for and above) Full Thin core offering from ( non ZBC ) to for multilayer designs Square and MS Spread glass weaves used , 1067, 1086, 1078 Very low loss material for backplane, high data rate daughter cards, hybrid applications Superior Drilling Performance I-Tera MT does not contain a ceramic filler Processing to date - Plasma desmear not required I-Tera has passed 10x 370 C re-work simulation testing. Compatible with Isola 185HR, 370HR and IS415 for hybrid constructions I-Tera MT prepreg can be stored at standard FR4 conditions I-Tera MT = UL 94 V- 0 UL MOT 130 C, I-Tera MT is the UL designation

27 I-Tera MT IST Testing IST Test Structure L1 Copper Foil 2 x % L2 0.1 mm 18/18 L3 2 x % L4 0.1 mm 18/18 L5 2 x % L6 0.1 mm 18/18 L7 2 x % L8 0.1 mm 18/18 L9 2 x % L mm 18/18 L11 2 x % L mm 18/18 L13 2 x % L mm 18/18 L15 IST Test Structure 16 Layers, 2 mm thick PTH = 300 um drilled dia. Buried Via = 250 µm mm drilled dia. Microvia = 125 µm drilled dia. IST Test Pre-Condition 5 x 230 C PTH = RT to 150 C Buried Via s = RT to 150 C 2 x % L16 Copper Foil 27

28 I-Tera MT IST Testing IST Test Results Initial test results indicated exceptional thermal performance of ITera. Six initial IST test coupons were tested : PTH Holes (indicative of material performance) The IST test was stopped after 2,800 cycles of the PTH with no failures and no real sign of resistance increase being measured. Customer commented that this type of performance was what would be typically expected of a Polyimide material. In comparison, 370HR (Customer s standard FR4 material) would have been expected to fail at 1,000 to 1,500 cycles on such a PCB structure.

29 I-Tera MT Via Filling I-Tera % prepreg I-Tera core I-Tera % prepreg I-Tera Prepreg has shown the ability to fill vias I-Tera H/H 3.45 Dk and 1 x % both sides Competitive Product would not fill the via, pre-fill had to be used Isola continues to work on hybrid applications with 185HR, IS400, 370HR and IS415

30 I-Tera MT TV with 2 oz planes 10X Lead Free 260 C shows complete fill of the 2oz copper areas and no de-lamination.

31 I-Tera MT TV with 2 oz planes 10X reflow at 260 C 2 oz planes. Cross sections show fill area of 2 oz copper noting no glass stop on copper surface and no de-lamination

32 I-Tera MT Hybrid PWB Processing Data

33 I-Tera MT Hybrid Processing

34 I-Tera MT MT Hybrid Processing Desmear In Hybrid processing it is recommended to use the current process of the FR-4 component. I-Tera does very well with both chemical or plasma desmear processes with a weight loss similar to that seen with FR4 180 Tg type products. In the case where a hybrid using a more chemically resistant material you will expect to see an increased etch back on the I-Tera creating a stepped difference in the two materials.

35 I-Tera MT plasma vs chemical desmear Plasma Even toward outer edge of board there is no sign of positive etch back. Dielectric surface looks improved Glass looks cleaner. Chemical Desmear Outer regions of holes show increased resin removal. Positive etch-back more apparent. Glass is very clean. Resin shows some texturing. 800 X

36 I-Tera MT Dk Data Core Core Standard Resin Dk Dk Dk Dk Dk Dk Thickness ( in ) Thickness ( mm ) Constructions Content at 100 MHz at 500 MHz at 1 GHz at 2.0 GHz at 5.0 GHz at 10.0 GHz ( non-zbc) x x x x x x x x x x x x x x x x x x x x x x x x / x x / / / / / / / /

37 I-Tera MT Df Data Core Core Standard Resin Df Df Df Df Df Df Thickness Thickness ( mm ) Constructions Content at 100 MHz at 500 MHz at 1 GHz at 2.0 GHz at 5.0 GHz at 10.0 GHz ( non-zbc ) x x x x x x x x x x x x x x x x x x x x x x x x / x x / / / / / / / /

38 I-Tera MT Dk Df - Prepreg Prepreg Resin Thickness Thickness Dk Dk Dk Dk Dk Dk Content ( in ) ( mm ) at 100 MHz at 500 MHz at 1 GHz at 2.0 GHz at 5.0 GHz at 10.0 GHz Prepreg Resin Thickness Thickness Df Df Df Df Df Df Content ( in ) ( mm ) at 100 MHz at 500 MHz at 1 GHz at 2.0 GHz at 5.0 GHz at 10.0 GHz

39 Product positioning map T Min. Lead Free Assembly Compatible 370HR 180 Tg Low CTE High Reliability 185HR > 170 Tg Lead Free Assbly Std Dk Df I-Tera MT -High Tg Very Low Loss Df 10 GHz I-Speed Tg Df 10 GHz GreenSpeed 175 Tg Halogen Free IS Tg Mid Dk/Df FR408HR 200 Tg Low Df, Low CTE I-Speed IS Tg I-Speed on Low Dk glass FR408HRIS 200 Tg FR408HR Low Dk Glass DE Tg Halogen Free FR Tg Low Dk & Df Auto-HR 170 Tg 0.014, 0.028, & Thick cores More reliable Improving Thermal Performance T 260 / Td / IST Td 400C** IS620i Tg 225 Low Loss Df GHz G200 BT / Epoxy GETEK 180Tg Mid Dk & Df T min. Td 300C** FR406 High Tg 170 Epoxy Tin / Lead Assembly Compatible New Products Higher Speeds 1 GHz Improving Electrical Performance Lower Dk/Df Higher Speed Speed is a function of design such as line length etc. ** Laminate Data - IST performance is a function of Hole diameter, board thickness, plating parameters and laminate attributes. DSTF, DSRFoil, DSRFoil, GETEK, I-Fill, I-Speed, I-Tera, IsoDesign, Isola, IsoStack, Norplex, Polyclad, RCC, Lo-Flo and TURBO are registered trademarks of Isola USA Corp. in the U.S.A. and other countries. The Isola logo is a trademark of Isola USA Corp. in the U.S.A. and other countries. All other trademarks mentioned herein are property of their respective companies. Copyright 2013 Isola Group, S.à.r.l. All rights reserved. 20 GHz