Inertial Combo Sensors for Consumer & Automotive

Transcription

1 Inertial Combo Sensors for Consumer & Automotive Sample Windows 8 Sensor Fusion Driver Accelero meter Driver Gyro Driver Magneto meter Driver 3D 3D Accelero 3D Gyro Magneto SensorDynamics Source Freescale meter System Plus Consulting meter Continental InvenSense 2011

2 Inertial Combo Sensors for Consumer & Automotive Table of contents Introduction, Definitions & Methodology 3 Executive Summary combo market overview global market for accelerometers, gyroscopes and magnetometers 62 Mobile phone & consumer electronics applications Automotive applications 3. Penetration of combo sensors: market forecasts Competitive landscape 162 Market shares and major OEM contracts in consumer Market shares and major OEM contracts in automotive 5. System integration challenges and penetration of combo sensors 185 System integration challenges for motion sensor combos in consumer System integration challenges for motion sensor combos in Auto 6. Software challenges for motion sensor combos 218 Challenges for sensor fusion From a sensor to a function: OS compliance, APIs, functionality integration Key motion sensing solution providers Key motion sensor manufacturers with strong software involvment Inertial processing trends in automotive 7. Evolution of the supply chain and business models 253 Supply chain analysis: divergence of models and strategic partnerships Evolution of the inertial sensor industry and expected competitive changes Strategic analysis for each key player of the inertial combo market AKM, Analog Devices, Bosch, Denso, Epson Toyocom, Freescale, InvenSense, Kionix, Memsic, Murata, Panasonic, Qualtre, SensorDynamics, Silicon Sensing, ST Microelectronics, VTI Conclusion and perspectives

3 Definitions Types of combos Consumer combo acronyms used in this report: A+G combo Single package with 3-axis accelerometer and 3-axis gyroscope (+ 1 ASIC die in general) A+M combo Single package with 3-axis accelerometer and 3-axis magnetometer (+ 1 or several ASIC dies) A+G+M combo Single package with 3-axis accelerometer, 3-axis gyroscope and 3-axis magnetometer (+ 1 or several ASIC dies) Also called 9DOF combo (9 degrees of freedom) Automotive combo acronyms used in this report: ESC combo: Single package with MEMS gyroscope die (1-axis), MEMS accelerometer die (1 or 2 axis) and 1 or 2 ASIC dies Used for ESC function ESC / Rollover combo: Single package with MEMS gyroscope die (2 or 3 axis), MEMS accelerometer die (2 or 3 axis) and 1 or 2 ASIC dies Used for both ESC and rollover function (+ sometimes other functions) ESC / Airbag combo Single package with MEMS gyroscope die (1, 2 or 3 axis), MEMS accelerometer die (low-g 1 to 3 axis + high g 2 axis) and 1 or several ASIC dies Used for both ESC, main airbag crash sensor functions (+ additional functions such as rollover ) Does not exist today but this may exist within a few years. Sometimes called «Automotive IMU» or «General sensor cluster»

4 Executive summary Inertial Combo Sensors in Consumer and Automotive Scope of the study VTI A +G ESC BMW Rollover ST Microelectronics A+M Combos in CONSUMER ELECTRONICS Combos in AUTOMOTIVE ESC / TRW A+G+M ESC / Airbag Rollover PointInside SensorDynamics InvenSense Bosch Freescale Continental

5 Executive summary Complexity of sensor fusion One clear motivation for combo sensors is the possibility to reduce both cost and footprint by combining the two sensors into one package with a single ASIC However this cost benefit is not yet obvious with the dynamism of the evolution of each individual sensor. Such benefit will be very application dependent Lower cost units combining multiple MEMS sensors are poised for healthy growth, starting with ESCs, bringing opportunity for new players and demands for sensor management solutions. This trend is showing up first in the more mature automotive MEMS sector, where the price of the sensor unit for the electronic stability control system (ESC) can now be significantly reduced, by combining the accelerometer and the gyroscope in one package with one ASIC Adoption is a little slower on the consumer side, where the fast changing technology means discrete device prices are still falling rapidly, so products from even six months before have less of a cost advantage. But the consumer market s fast model turnover and short replacement cycles means that once the economics become compelling and adoption starts in , market penetration will be faster and deeper than on the automotive side. The second key motivation from combo sensors relies on sensor fusion New functionality can now be offered using multiple sensing elements We see a strong evolution from sensors to solutions This is an opportunity for players in the MEMS industry to compensate for the drastic decrease in price by selling high value solutions that include more software content Who will capture the added value of these smart sensor systems? There is likely room for multiple alternatives, with the sensor makers supplying the algorithms to combine and cross-calibrate the sensor data and do some standard applications, while the software and chipset makers supply the higher level, specialty functions Combo sensors require more complex software for the sensor fusion calculations, and those will likely need to be done on an MCU, not just the usual ASIC This is driving changes in the supply chain, as makers of microcontrollers, software, and subsystems start to take over more of the sensor management

6 Executive Summary Typology of Combo Sensors Gyros combined with accelerometers make sense for some functions such as gaming and navigation Similar manufacturing platforms and constraints for integration potentially real cost and size benefit => expected to surge quickly 2010: about 5% of magnetometers are embedded in such Accel / Magneto modules Challenges: compass location (interferences ), cost, footprint Should gain success for tablets and mobile phones in the next few years 3-axis accelerometer IMU: 3A + 3M 3A + 3G 3A + 3G + 3M 3-axis gyroscope 3-axis digital compass Overcome the problems of 3A+3G (loose absolute orientation over time) and 3A+3M (corruption of data if external magnetic field and slow detection of change in heading) Long term view: limited number of functions using those 3 sensors at the same time Monolithic integration should be developed to reach the cost and size targets

7 Executive Summary Different possibilities to process motion sensing E.g. Mobile phone architecture: Motion data processing at the sensor ASIC / CMOS level Motion data processing at the baseband level Motion data processing in GPS chipset, Audio processor, PMU Motion data processing at the main CPU / application processor level Compass Motion data processing in a low power MCU

8 Executive Summary Structure of passager vehicles with current integration of inertial sensors Front crash sensor Rollover sensors ESC accelerometer ESC gyro (possibly) Standalone sensor ESC gyro (possibly) Navigation gyroscope ESC unit (processing) ESC gyroscope (possibly) ESC accelerometer (possibly) GPS Standalone sensor Standalone peripharal module ABS / Brake ECU Airbag ECU TPMS module BMW Standalone peripharal module TPMS module Motion detection sensor Standalone peripharal module Satellite crash sensors

9 MEMSIC 3.7% Analog Devices 6.2% Freescale 7.1% Market Shares 2009 & 2010 revenues - Accelero & Gyro 2009 MEMS Accelerometer market shares in value Consumer (total: $506.5M) VTI 0.3% Kionix 10.9% Others 13% Bosch Sensortec 17.4% ST Microelectr onics 41.5% MEMSIC 2.2% Yole Developpement Oct Analog Devices 4.3% Freescale 5.0% Kionix 9.5% 2010 MEMS Accelerometer market shares in value - Consumer (total: $615.6M) VTI 0.3% Others 13.9% Bosch Sensortec 17.4% ST Microelectr onics 47.5% 2009 MEMS Gyroscope market shares in value - Consumer (total: $250.9M) Yole Developpement Feb Murata 14,8% Sony 0,1% Others 2,9% InvenSense 29,1% 2010 MEMS Gyroscope market shares in value Consumer (total: $402.3M) Murata 4.0% Others 7.4% Sony 10.6% InvenSense 23.6% Panasonic 19,0% ST Microelectroni cs 2,2% Epson Toyocom 32,0% Panasonic 15.0% ST Microelectr onics 19.2% Epson Toyocom 20.2%

10 Impact of the new business models in the supply chain As the industry maturates and as combo sensors are developed, new business models appear: Some players specialize in MEMS die / wafer manufacturing Leading players specialize in supplying sensor solutions MEMS player A MEMS player B MEMS player A MEMS player B MEMS die A MEMS die B MEMS sensor A MEMS sensor B ASIC, packaging, assembly, calibration, test Combo sensor Exemple: ST (Accelerometer / Magnetometer combo) Honeywell (Magnetometer wafers)

11 New ways for motion sensing integration GPS chipset CSR SIRFstarIV GSD4e (GPS RF and baseband + ARM7 on a single die) Power management unit Maxim Power SoC Motion processing possibilities Audio processor Wolfson WM0010 HD Audio DSP

12 Inertial sensors value chain in 2011 For consumer and automotive ~ $450M ~ $350M ~ $420M ~ $270M ~ $30M MEMS Front-end ASIC Front-end ~ $2.6B industry! (consumer + auto) Back-end / Packaging Test & Calibration Software (independent sale of IP) SMDK + $1.1B gross margin (Cost of sales, G&A, R&D, Operational margin) In 2011, the inertial sensor industry is now a $2.6 Billion business! ~ $450M is related to the MEMS Front-end. This area is stable because the MEMS die cost is being strongly reduced ~ $350M is related to the ASIC Front-end. This is growing because although the technology nodes are more and more advanced, the need for larger processing capabilities (sometimes with MCUs) increase with combo sensors ~ $420M is related to the Back-end / Packaging. This area will grow a lot thanks to increasing expertise needed for combo sensors ~ $270M is linked to Test & Calibration. It is strongly growing, driven by 3-axis gyroscopes and combo sensors ~ $30M is linked to Software features. It is small today but definitively poised for important growth in the future, especially for combo sensors (for sensor fusion )

13 Strategy of each key player on combo sensors Detailed for each player in the report XXX position related to combo sensors Product portfolio 5 4 Offer of multi axis sensors, control of different type of sensing elements, different market segments targeted Industry partnerships Strategic partnerships and network to control more sensing elements, to offer software, to be part of a large and powerful supplier (weight of the company), or to have close connection with OEMs and platform designers End-markets Market shares, diversity of customers, diversity of applications Capacity to sustain low costs Production infrastructure optimized for low cost Invovment in combos Combos in the portfolio, or in development, or capability to do it, variety of combo types Capability of technology integration Ability to integrate closely different sensing elements in a size and / or cost-effective way (similar front-end technologies, WLP ) Involvment on software Offer of specific software libraries, of sensor fusion solutions Conclusion