TB-2296 Advance Plating Process (APP) Telcordia GR-1217-CORE CO Qualification XCede HD 4 Pair 85 Ohm. Revision A

Transcription

1 TB-2296 Advance Plating Process (APP) Telcordia GR-27-CORE CO Qualification XCede HD 4 Pair 8 Ohm Revision A Specification Revision Status Revision SCR No. Description Initial Date A S22 APP plating qualification initial release M. Osbourne //3 Amphenol TCS 2 Innovative Way, Suite 2 Nashua, NH

2 TABLE OF CONTENTS. Purpose 2. Reference documents 3. Equipment 4. Qualification test plan. Test samples 6. Qualification results 6. Group Mechanical shock and random vibration 6.2 Group 2 Thermal shock, durability, dust, and humidity cycling 6.3 Group 3 Temperature life 6.4 Group 4 Mixed flowing gas 6. Group 6 Compliant pin insertion and retention force 6.6 Group 7 Plating evaluation 7. Test results summary and discussions 8. Conclusions Copyright Amphenol Corporation 23 All rights reserved Page 2 of 2

3 . Purpose. The purpose of this test is to qualify the XCede HD product with the Advance Plating Process (APP) plating (Nanocrystalline barrier layer). The APP plating system is defined as µin minimum gold thickness plated over 2µin to 4µin thick Nanocrystalline nickel. The standard plating system is 3µin minimum gold thickness over µin to µin thick Nickel Sulfamate. As part of the qualification testing, standard plating process (Nickel Sulfamate barrier layer) plated components will be included in the mixed flowing gas sequence to test intermateability and to use as a control group to compare the results to the APP plated components. The qualification will be performed in accordance with Telcordia GR-27-CORE Central Office requirements. 2. Reference documents 2. Telcordia GR-27-COREi2 Generic Requirements for Separable Electrical Connectors Used in Telecommunication Hardware 2.2 EIA-364-TP Test Standards and Procedures for Electrical Connectors 2.3 QQ-N-29A Federal Specification Nickel Plating 2.4 MIL-G-424C Military Specification Gold Plating Electrodeposited 2. TB-223 Connector Qualification Plan 2.6 TB-223 General Product Specification for XCede HD Backplane and Daughtercard Interconnect System 3. Equipment 3. Instron 3.2 Thermotron temperature chamber 3.3 Cincinnati Sub-Zero thermal shock chamber 3.4 Blue M. Temp-Humidity chamber 3. DEC Dust chamber 3.6 MB Elect. Vibration table 3.7 Mixed flowing gas chamber 3.8 Keithley Micro-Ohm meter 3.9 Fischer X-R-F Copyright Amphenol Corporation 23 All rights reserved Page 3 of 2

4 4. Qualification test plan and test conditions - The qualification test plan contains 6 test sequences 4. Group Mechanical shock and random vibration 4.. Mechanical shock test conditions EIA-364-TP G Level : 3 G s Duration : Milliseconds Wave form : Half Sine No. of shocks : 3 axis and 3 each direction (8 total) 4..2 Random vibration test conditions EIA-364-TP Frequency : to 2 Hz PSD :.2 G² /Hz G Level :.3 RMS Duration : 2 hrs/axis, 3 axis (6 hrs total) 4.2 Group 2 Thermal shock, durability, dust, and humidity cycling ( this group also includes dielectric withstanding voltage and insulation resistance) 4.2. Thermal shock test conditions EIA-364-TP Number of cycles : cycles Hot temp extreme : + C (+3 C, - C) Cold temp extreme : -6 C (+ C, -3 C) Exposure at temperature : 3 minutes Transfer time : <. minute X test conditions EIA-364-TP Number of cycles : 2X Rate : 3 cycles/hour Dust test conditions EIA-364-TP Chamber size : cu. ft Amount of dust : 9. grams/ cu. ft Exposure time :. hours Fan speed : 36 cfm Humidity test conditions EIA-364-TP3 Procedure II Relative humidity : 9% to 9% Temperature conditions : 2 C to 6 C Copyright Amphenol Corporation 23 All rights reserved Page 4 of 2

5 Duration : hours Cycle time : 8 hours per cycle 4.3 Group 3 Temperature life 4.3. Temperature life test conditions EIA-364-TP Temperature : C +/- 2 C Duration : hours 4.4 Group 4 Mixed flowing gas 4.4. Temperature pre-conditioning test conditions EIA-364-TP Temperature : C +/- 2 C Duration : 3 hours Pre and post durability test conditions EIA-364-TP Number of cycles : X pre and post durability Rate : 3 cycles/hour Mixed flowing gas test conditions EIA-364-TP Temperature : 3 C +/- C Relative humidity : 7% +/- 2% Exposure time : 2 days ( days unmated/ days mated) Gases and concentrations see Table. Gas Concentration NO 2 2 ppb ± ppb Cl 2 ppb ±3 ppb H 2 S ppb ± ppb SO 2 ppb ±2 ppb Table : MFG gas concentrations 4. Group Compliant pin insertion and retention force with temperature life 4.. Compliant pin insertion and retention force test conditions EIA-364- TS Number of insertions : Number of retentions : Temperature : C Duration : hours 4.6 Group 6 Plating Evaluation Copyright Amphenol Corporation 23 All rights reserved Page of 2

6 4.6. Plating thicknesses were measured using XRF method (X-Ray Fluorescence) Porosity evaluated using nitric acid vapor (NAV). 4.7 Test Sequences () GROUP Mate/Unmate force X Mechanical shock, x-axis, y-axis, z-axis Random vibration, x-axis, y-axis, z-axis X Mate/Unmate force GROUP 2 Mate/Unmate force Insulation resistance (IR) Dielectric withstanding voltage (DWV) 2X Dust Thermal Shock Insulation resistance (IR) Dielectric withstanding voltage (DWV) Humidity cycling Insulation resistance (IR) Dielectric withstanding voltage (DWV) Mate/Unmate force GROUP 3 Mate/Unmate force Temperature life C for hours Mate/Unmate force GROUP 4 Pre-Condition C for 3 hours x Mate/Unmate Force Mixed Flowing Gas () th day th day Mixed Flowing Gas (Mated) th day 2th day Mate/Unmate Disturbance x GROUP st insertion force CPIR st retention force 2 nd insertion force CPIR 2 nd retention force 3 rd insertion force Temperature life C for hours CPIR 3 rd retention force GROUP 6 Visual Exam XRF measurements Porosity (NAV) NOTES:. Low level contact resistance () 2. Compliant pin interface resistance (CPIR) Copyright Amphenol Corporation 23 All rights reserved Page 6 of 2

7 . Test samples. The test samples are XCede HD 4 Pair 8 ohm daughtercard and backplane connectors. The test connector configuration is five modules of six positions..2 Group 4 includes the inter-mateability test samples, see Table 2. Daughtercard Connector Nanocrystalline (APP) P/N: JX4-29 Date Code: 23 Nickel Sulfamate (NiS) P/N: AX4-8 Date Code: 28 Nanocrystalline (APP) P/N: JX4-29 Date Code: 23 Nickel Sulfamate (NiS) P/N: AX4-8 Date Code: 28 Backplane Connector Nanocrystalline (APP) P/N: 9234C4H Date Code: 2 Nickel Sulfamate (NiS) P/N: 9234C7D Date Code: 43 Nickel Sulfamate (NiS) P/N: 9234C7D Date Code: 43 Nanocrystalline (APP) P/N: 9234C4H Date Code: 2 Table 2: Inter-matability test matrix.3 Test samples were mounted onto ATCS standard qualification printed circuit boards (PCB), see Figure. There are 6 signal contacts and 6 ground contacts which were setup to measure low level contact resistance () per PCB. Copyright Amphenol Corporation 23 All rights reserved Page 7 of 2

8 Figure : Qualification test samples. 6. Qualification results () 6. Group : Mechanical shock and random vibration 6.. Three test boards were exposed to mechanical shock and random vibration (38 signal and 8 ground contacts were monitored for ). The connectors were mechanically shocked to 3g s in all three axes and exposed to.3g s random vibration in all three axes with pre and postdurability cycles, see Figure 2-4 for the test results. Copyright Amphenol Corporation 23 All rights reserved Page 8 of 2

9 XHD Group - Sample Mechnical Shock and Vibration - Signal Contacts X_ MechZ_ MechX_ MechY_ VibY_ VibX_ VibZ_ Final X_ XHD Group - Sample Mechanical Shock and Vibration - Ground Contacts XGnd_ MechZ_GND_ MechX_GND_ MechY_GND_ VibY_GND_ VibX_GND_ VibZ_GND_ Final X GND_ Figure 2: Group sample mechanical shock and random vibration results for signal and ground contacts. XHD Group - Sample 2 Mechnical Shock and Vibration - Signal Contacts X_2 MechZ_2 MechX_2 MechY_2 VibY_2 VibX_2 VibZ_2 Final X_2 XHD Group - Sample 2 Mechnical Shock and Vibration - Ground Contacts XGnd_2 MechZ_GND_2 MechX_GND_2 MechY_GND_2 VibY_GND_2 VibX_GND_2 VibZ_GND_2 Final X GND_ Figure 3: Group sample 2 mechanical shock and random vibration results for signal and ground contacts. XHD Group - Sample 3 Mechanical Shock and Vibration - Signal Contacts X_3 MechZ_3 MechX_3 MechY_3 VibY_3 VibX_3 VibZ_3 Final X_3 XHD Group - Sample 3 Mechnical Shock and Vibration - Ground Contacts XGnd_3 MechZ_GND_3 MechX_GND_3 MechY_GND_3 VibY_GND_3 VibX_GND_3 VibZ_GND_3 Final X GND_ Figure 4: Group sample 3 mechanical shock and random vibration results for signal and ground contacts. NOTES:. The Telcordia GR-27-CORE delta requirement is less than milli-ohms increase after exposure to test environments. Copyright Amphenol Corporation 23 All rights reserved Page 9 of 2

10 6.2 Group 2: Thermal shock, durability, dust, and humidity cycling (this group also includes dielectric withstanding voltage and insulation resistance) 6.2. Three test boards were exposed to thermal shock, 2 durability cycles, dust, and humidity cycling (38 signal and 8 ground contacts were monitored for ), see Figure -Figure 7 for the test results. Dielectric withstanding voltage and insulation resistance was measured for each mated connector. XHD Group 2 - Sample Dust, Thermal Shock, and Humidity - Signal Contacts Sig 2X_ Sig Dust_ Sig T_Shock_ Sig Humidity 68_ Sig Humidity 336_ Sig Humidity _ XHD Group 2 - Sample Dust, Thermal Shock, and Humidity - Ground Contacts GND 2X_ GND Dust_ GND T_Shock_ GND Humidity 68_ GND Humidity 336_ GND Humidity _ Figure : Group 2 sample - Dust, thermal shock, and humidity results for signal and ground contacts. XHD Group 2 - Sample 2 Dust, Thermal Shock, and Humidity - Signal Contacts Sig 2X_2 Sig Dust_2 Sig T_Shock_2 Sig Humidity 68_2 Sig Humidity 336_2 Sig Humidity _2 XHD Group 2 - Sample 2 Dust, Thermal Shock, and Humidity - Ground Contacts GND 2X_ GND Dust_ GND T_Shock_ GND Humidity 68_ GND Humidity 336_ GND Humidity _ Figure 6: Group 2 sample 2 - Dust, thermal shock, and humidity results for signal and ground contacts. Copyright Amphenol Corporation 23 All rights reserved Page of 2

11 XHD Group 2 - Sample 3 Dust, Thermal Shock, and Humidity - Signal Contacts Sig 2X_3 Sig Dust_3 Sig T_Shock_3 Sig Humidity 68_3 Sig Humidity 336_3 Sig Humidity _3 XHD Group 2 - Sample 3 Dust, Thermal Shock, and Humidity - Ground Contacts GND 2X_3 GND Dust_3 GND T_Shock_3 GND Humidity 68_3 GND Humidity 336_3 GND Humidity _ Figure 7: Group 2 sample 3 - Dust, thermal shock, and humidity results for signal and ground contacts. 6.3 Group 3: Temperature life 6.3. Two test boards were exposed to C for hours (22 signals and 2 ground contacts were monitored for ), see Figure 8 and Figure 9 for the test results. XHD Group 3 - Sample Temperature Life - Signal Contacts XHD Group 3 - Sample Temperature Life - Ground Contacts 68hrs_SIG_ 336hrs._SIG_ hrs._sig_ Mate/Unmate_SIG_ 672hrs_SIG_ 84hrs_SIG_ hrs_sig_ Mate/Unamte_F_SIG_ 68hrs_GND_ 336hrs._GND_ hrs._gnd_ Mate/Unmate_GND_ 672hrs_GND_ 84hrs_GND_ hrs_gnd_ Mate/Unamte_F_GND_ Figure 8: Group 3 sample -Temperature life results for signal and ground contacts. XHD Group 3 - Sample 2 Temperature Life - Signal Contacts 68hrs_SIG_2 336hrs._SIG_2 hrs._sig_2 Mate/Unmate_SIG_2 672hrs_SIG_2 84hrs_SIG_2 hrs_sig_2 Mate/Unamte_F_SIG_2 XHD Group 3 - Sample 2 Temperature Life - Ground Contacts 68hrs_GND_2 336hrs._GND_2 hrs._gnd_2 Mate/Unmate_GND_2 672hrs_GND_2 84hrs_GND_2 hrs_gnd_2 Mate/Unamte_F_GND_ Figure 9: Group 3 sample 2 -Temperature life results for signal and ground contacts. Copyright Amphenol Corporation 23 All rights reserved Page of 2

12 6.4 Group 4: Mixed flowing gas 6.4. Three mated connectors per group were exposed to a four gas mixed flowing gas (MFG) test per Telcordia GR-27-CORE Central Office requirements (38 signal and 8 ground contacts were monitored for for each group), see Figure -Figure 2 for test results. The MFG groups included test samples with NiS plated contacts (3 µin gold minimum samples) and APP plated contacts ( µin gold minimum samples). Refer to section.2 and Table 2 for the test matrix. XHD Group 4 Sample - MFG - APP DC to APP BMA Signal Contacts Sig 3 Hr Temp_ Sig X Dur_ Sig MFG D _ Sig MFG D _ Sig MFG D Mated_ Sig MFG D _ Sig X Mate_ Sig Disturb_ Sig X Dur Fin_ XHD Group 4 Sample - MFG - APP DC to APP BMA Ground Contacts GND 3 Hr Temp_ GND X Dur_ GND MFG D _ GND MFG D _ GND MFG D Mated_ GND MFG D _ GND X Mate_ GND Disturb_ GND X Dur Fin_ Figure : Group 4 APP DC to APP BMA sample - MFG results for signal and ground contacts. XHD Group 4 Sample 2 - MFG - APP DC to APP BMA Signal Contacts Sig 3 Hr Temp_2 Sig X Dur_2 Sig MFG D _2 Sig MFG D _2 Sig MFG D Mated_2 Sig MFG D _2 Sig X Mate_2 Sig Disturb_2 Sig X Dur Fin_2 XHD Group 4 Sample 2 - MFG - APP DC to APP BMA Ground Contacts GND 3 Hr Temp_2 GND X Dur_2 GND MFG D _2 GND MFG D _2 GND MFG D Mated_2 GND MFG D _2 GND X Mate_2 GND Disturb_2 GND X Dur Fin_ Figure : Group 4 APP DC to APP BMA sample 2 - MFG results for signal and ground contacts. Copyright Amphenol Corporation 23 All rights reserved Page 2 of 2

13 XHD Group 4 Sample 3 - MFG - APP DC to APP BMA Signal Contacts Sig 3 Hr Temp_3 Sig X Dur_3 Sig MFG D _3 Sig MFG D _3 Sig MFG D Mated_3 Sig MFG D _3 Sig X Mate_3 Sig Disturb_3 Sig X Dur Fin_3 XHD Group 4 Sample 3 - MFG - APP DC to APP BMA Ground Contacts GND 3 Hr Temp_3 GND X Dur_3 GND MFG D _3 GND MFG D _3 GND MFG D Mated_3 GND MFG D _3 GND X Mate_3 GND Disturb_3 GND X Dur Fin_ Figure 2: Group 4 APP DC to APP BMA sample 3 - MFG results for signal and ground contacts. XHD Group 4 Sample - MFG - APP DC to NiS BMA Signal Contacts Sig 3 Hr Temp_ Sig X Dur_ Sig MFG D _ Sig MFG D _ Sig MFG D Mated_ Sig MFG D _ Sig X Mate_ Sig Disturb_ Sig X Dur Fin_ XHD Group 4 Sample - MFG - APP DC to NiS BMA Ground Contacts GND 3 Hr Temp_ GND X Dur_ GND MFG D _ GND MFG D _ GND MFG D Mated_ GND MFG D _ GND X Mate_ GND Disturb_ GND X Dur Fin_ Figure 3: Group 4 APP DC to NiS BMA sample - MFG results for signal and ground contacts. XHD Group 4 Sample 2 - MFG - APP DC to NiS BMA Signal Contacts Sig 3 Hr Temp_2 Sig X Dur_2 Sig MFG D _2 Sig MFG D _2 Sig MFG D Mated_2 Sig MFG D _2 Sig X Mate_2 Sig Disturb_2 Sig X Dur Fin_2 XHD Group 4 Sample 2 - MFG - APP DC to NiS BMA Ground Contacts GND 3 Hr Temp_2 GND X Dur_2 GND MFG D _2 GND MFG D _2 GND MFG D Mated_2 GND MFG D _2 GND X Mate_2 GND Disturb_2 GND X Dur Fin_ Figure 4: Group 4 APP DC to NiS BMA sample 2 - MFG results for signal and ground contacts. 9 9 Copyright Amphenol Corporation 23 All rights reserved Page 3 of 2

14 XHD Group 4 Sample 3 - MFG - APP DC to NiS BMA Signal Contacts Sig 3 Hr Temp_3 Sig X Dur_3 Sig MFG D _3 Sig MFG D _3 Sig MFG D Mated_3 Sig MFG D _3 Sig X Mate_3 Sig Disturb_3 Sig X Dur Fin_3 XHD Group 4 Sample 3 - MFG - APP DC to NiS BMA Ground Contacts GND 3 Hr Temp_3 GND X Dur_3 GND MFG D _3 GND MFG D _3 GND MFG D Mated_3 GND MFG D _3 GND X Mate_3 GND Disturb_3 GND X Dur Fin_ Figure : Group 4 APP DC to NiS BMA sample 3 - MFG results for signal and ground contacts. XHD Group 4 Sample - MFG - NiS DC to APP BMA Signal Contacts Sig 3 Hr Temp_ Sig X Dur_ Sig MFG D _ Sig MFG D _ Sig MFG D Mated_ Sig MFG D _ Sig X Mate_ Sig Disturb_ Sig X Dur Fin_ XHD Group 4 Sample - MFG - NiS DC to APP BMA Ground Contacts GND 3 Hr Temp_ GND X Dur_ GND MFG D _ GND MFG D _ GND MFG D Mated_ GND MFG D _ GND X Mate_ GND Disturb_ GND X Dur Fin_ Figure 6: Group 4 NiS DC to APP BMA sample - MFG results for signal and ground contacts. 9 9 XHD Group 4 Sample 2 - MFG - NiS DC to APP BMA Signal Contacts Sig 3 Hr Temp_2 Sig X Dur_2 Sig MFG D _2 Sig MFG D _2 Sig MFG D Mated_2 Sig MFG D _2 Sig X Mate_2 Sig Disturb_2 Sig X Dur Fin_2 XHD Group 4 Sample 2 - MFG - NiS DC to APP BMA Ground Contacts GND 3 Hr Temp_2 GND X Dur_2 GND MFG D _2 GND MFG D _2 GND MFG D Mated_2 GND MFG D _2 GND X Mate_2 GND Disturb_2 GND X Dur Fin_ Figure 7: Group 4 NiS DC to APP BMA sample 2 - MFG results for signal and ground contacts. Copyright Amphenol Corporation 23 All rights reserved Page 4 of 2

15 XHD Group 4 Sample 3 - MFG - NiS DC to APP BMA Signal Contacts Sig 3 Hr Temp_3 Sig X Dur_3 Sig MFG D _3 Sig MFG D _3 Sig MFG D Mated_3 Sig MFG D _3 Sig X Mate_3 Sig Disturb_3 Sig X Dur Fin_3 XHD Group 4 Sample 3 - MFG - NiS DC to APP BMA Ground Contacts GND 3 Hr Temp_3 GND X Dur_3 GND MFG D _3 GND MFG D _3 GND MFG D Mated_3 GND MFG D _3 GND X Mate_3 GND Disturb_3 GND X Dur Fin_ Figure 8: Group 4 NiS DC to APP BMA sample 3 - MFG results for signal and ground contacts. XHD Group 4 Sample - MFG - NiS DC to NiS BMA Signal Contacts Sig 3 Hr Temp_ Sig X Dur_ Sig MFG D _ Sig MFG D _ Sig MFG D Mated_ Sig MFG D _ Sig X Mate_ Sig Disturb_ Sig X Dur Fin_ XHD Group 4 Sample - MFG - NiS DC to NiS BMA Ground Contacts GND 3 Hr Temp_ GND X Dur_ GND MFG D _ GND MFG D _ GND MFG D Mated_ GND MFG D _ GND X Mate_ GND Disturb_ GND X Dur Fin_ Figure 9: Group 4 NiS DC to NiS BMA sample - MFG results for signal and ground contacts. XHD Group 4 Sample 2 - MFG - NiS DC to NiS BMA Signal Contacts Sig 3 Hr Temp_2 Sig X Dur_2 Sig MFG D _2 Sig MFG D _2 Sig MFG D Mated_2 Sig MFG D _2 Sig X Mate_2 Sig Disturb_2 Sig X Dur Fin_2 XHD Group 4 Sample 2 - MFG - NiS DC to NiS BMA Ground Contacts GND 3 Hr Temp_2 GND X Dur_2 GND MFG D _2 GND MFG D _2 GND MFG D Mated_2 GND MFG D _2 GND X Mate_2 GND Disturb_2 GND X Dur Fin_ Figure 2: Group 4 NiS DC to NiS BMA sample 2 - MFG results for signal and ground contacts. Copyright Amphenol Corporation 23 All rights reserved Page of 2

16 XHD Group 4 Sample 3 - MFG - NiS DC to NiS BMA Signal Contacts Sig 3 Hr Temp_3 Sig X Dur_3 Sig MFG D _3 Sig MFG D _3 Sig MFG D Mated_3 Sig MFG D _3 Sig X Mate_3 Sig Disturb_3 Sig X Dur Fin_3 XHD Group 4 Sample 3 - MFG - NiS DC to NiS BMA Ground Contacts GND 3 Hr Temp_3 GND X Dur_3 GND MFG D _3 GND MFG D _3 GND MFG D Mated_3 GND MFG D _3 GND X Mate_3 GND Disturb_3 GND X Dur Fin_ Figure 2: Group 4 NiS DC to NiS BMA sample 3 - MFG results for signal and ground contacts. 6. Group : Compliant pin insertion and retention force with temperature life 6.. Compliant pins plated with the APP plating system were evaluated for insertion and retention force. The compliant pin area has the same APP barrier layer (nanocrystalline) thickness of 2µin to 4µin, along with µin to 6µin thick of matte tin plating. After the third insertion the compliant pins were exposed to C for hours and then pushed out to determine the retention force after temperature exposure, see Figure 22 and Figure 23 for the test results. XCede HD Group - Nano Compliant Pin Maximum FHS Single Pin Insertion and Retention Force (lbs) Pin Number st Insertion st Retention 2nd Insertion 2nd Retention 3rd Insertion 3rd Retention Minimum Retention Spec Figure 22: Group - Nano compliant pin insertion and retention force in maximum diameter (.8 ) plated through holes. Copyright Amphenol Corporation 23 All rights reserved Page 6 of 2

17 XCede HD Group - Nano Compliant Pin Minimum FHS Single Pin Insertion and Retention. 4. Force (lbs) Pin Number st Insertion st Retention 2nd Insertion 2nd Retention 3rd Insertion 3rd Retention Minimum Retention Spec Figure 23: Group - Nano compliant pin insertion and retention force in minimum diameter (.24 ) plated through holes. 6.6 Group 7: Plating evaluation 6.6. The qualification test samples plating thicknesses were measured using an X-R-F analyzer. Refer to Table 3 and Table 4for the thickness measurements. Copyright Amphenol Corporation 23 All rights reserved Page 7 of 2

18 Daughtercard XRF Measurements Au (µ") APP Nickel (µ") Max Min Average Table 3: APP Au and APP nickel plating thickness measurements for daughtercard. Copyright Amphenol Corporation 23 All rights reserved Page 8 of 2

19 Grounds Au (u'') APP Nickel (u'') Signals Au (u'') APP Nickel (u'') Max Max Min Min Average Average Table 4: Au and APP nickel plating thickness measurements for backplane Porosity was evaluated using nitric acid vapor per TB 227. Refer to Table 4 for the NAV results. Sample # # of contacts # of Blooms # of Pores Test results summary and discussions 7. Group : Mechanical shock and random vibration 7.. The XCede HD test samples with the APP plating on the daughtercard and backplane contacts passed the Telcordia GR-27-CORE C.O. requirements for mechanical shock and random vibration. The maximum signal contact delta low level contact resistance measured 8.6 milli-ohms and occurred after the final durability cycles. The maximum ground Copyright Amphenol Corporation 23 All rights reserved Page 9 of 2

20 contact delta low level contact resistance measured 4.9 milli-ohms and after exposure to the Z-axis random vibration test. The mechanical shock and random vibration test results summary are shown in Table and Table 6. X M.Shock Z Axis M.Shock X Axis M.Shock Y Axis Vibration Y Axis Vibration X Axis Vibration Z Axis X Max Min Average Std Deviation Table : Mechanical shock and vibration test results - Signals X M.Shock Z Axis M.Shock X Axis M.Shock Y Axis Vibration Y Axis Vibration X Axis Vibration Z Axis X Max Min Average Std Deviation Table 6: Mechanical shock and vibration test results Grounds 7.2 Group 2: Thermal shock, durability, dust, and humidity cycling ( this group also includes dielectric withstanding voltage and insulation resistance) 7.2. The XCede HD test samples with the APP plating on the daughtercard and backplane contacts passed the Telcordia GR-27-CORE C.O. requirements for thermal shock, durability, dust, and humidity cycling. The maximum signal contact delta low level contact resistance measured 6.3 milli-ohms and occurred after the 2 durability cycles. The maximum ground contact delta low level contact resistance measured.8 milli-ohms and occurred after the 2 durability cycles. The Thermal shock, durability, dust, and humidity cycling test results summary are shown in Table 7 and Table 8. Cycling Humidity 68hrs Cycling Humidity 336hrs Cycling Humidity hrs 2X Dust T- Shock Max Min Average Std Deviation Table 7: Thermal shock, durability, dust, and humidity cycling test results summary - Signals Copyright Amphenol Corporation 23 All rights reserved Page 2 of 2

21 Cycling Humidity 68hrs Cycling Humidity 336hrs Cycling Humidity hrs 2X Dust T- Shock Max Min Average Std Deviation Table 8: Thermal shock, durability, dust, and humidity cycling test results summary Grounds 7.3 Group 3: Temperature life 7.3. The XCede HD test samples with the APP plating on the daughtercard and backplane contacts passed the Telcordia GR-27-CORE C.O. requirements for temperature life. The samples were exposed to C for hours which exceeds the Telcordia requirement of 8 C for hours for Central Office environments. The maximum signal contact delta low level contact resistance measured 9.4 milli-ohms after exposure to the temperature life environment. The maximum ground contact delta low level contact resistance measured 9.2 milli-ohms after exposure to the temperature life environment. The temperature life summarized test results is shown in Table 9 and Table. T-Life hrs. T-Life hrs Mate/Unmate Mate/Unmate Max Min Average Std Deviation Table 9: Temperature life test results summary Signals T-Life T-Life hrs. Mate/Unmate hrs Mate/Unmate Max Min Average Std Deviation Table : Temperature life test results summary Grounds Copyright Amphenol Corporation 23 All rights reserved Page 2 of 2

22 7.4 Group 4: Mixed flowing gas 7.4. The XCede HD test samples with the APP plating on the daughtercard and backplane contacts passed the Telcordia GR-27-CORE C.O. requirements for the four gas MFG test The results for the test samples plated with APP on the daughtercard and backplane contacts show that the maximum delta resistance change measured was 9.9 milli-ohms for the signal contact after days of unmated MFG. And the maximum delta resistance change for the ground contact measured was 6.9 milli-ohms after the 3 hours of temperature preconditioning. The APP daughtercard to APP backplane MFG results are summarized in Table and Table 2. T-Life 3 hrs. X Days days days Mated days Mated Mate/Unmate Disturbance X Max Min Average Std Deviation Table : APP daughtercard and APP backplane MFG results summary - Signals T-Life 3 hrs. X Days days days Mated days Mated Mate/Unmate Disturbance X Max Min Average Std Deviation Table 2: APP daughtercard and APP backplane MFG results summary - Grounds The results for the test samples plated with NiS on the daughtercard and backplane contacts show that the maximum delta resistance change measured was.6 milli-ohms for the signal contact after the first set of durability cycles. The maximum delta resistance change for the ground contact measured was 2.6 milli-ohms which also was measured after the first set of durability cycles. The NiS daughtercard and backplane MFG results are summarized in Table 3 and Table 4 below. Copyright Amphenol Corporation 23 All rights reserved Page 22 of 2

23 T-Life 3 hrs. X Days days days Mated days Mated Mate/Unmate Disturbance X Max Min Average Std Deviation Table 3: NiS daughtercard and NiS backplane MFG results summary - Signals T-Life 3 hrs. X Days days days Mated days Mated Mate/Unmate Disturbance X Max Min Average Std Deviation Table 4: NiS daughtercard and NiS backplane MFG results summary - Grounds T-Life 3 hrs The results for the test samples plated with APP on the daughtercard and NiS on the backplane contacts show that the maximum delta resistance change measured was 7.2 milli-ohms for the signal contact after the final durability cycles. The maximum delta resistance change for the ground contact measured was 3. milli-ohms after the post MFG durability cycles. The APP daughtercard and NiS backplane results are summarized in Table and Table 6 below. days Mated Mate/Unmate Disturbance X Days days days Mated X Max Min Average Std Deviation Table : APP daughtercard and NiS backplane MFG results summary - Signals T-Life 3 hrs. days Mated Mate/Unmate Disturbance X Days days days Mated X Max Min Average Std Deviation Table 6: APP daughtercard and NiS backplane MFG results summary - Grounds Copyright Amphenol Corporation 23 All rights reserved Page 23 of 2

24 7.4. The results for the test samples plated with NiS on the daughtercard and APP on the backplane contacts show that the maximum delta resistance change measured was 9.6 milli-ohms for the signal contact after days unmated MFG exposure. And the maximum delta resistance change for the ground contact measured was 8. milli-ohms after 3 hours of temperature preconditioning. The NiS daughtercard and APP backplane results are summarized in Table 7 and Table 8 below. T-Life 3 hrs. days Mated Mate/Unmate Disturbance X Days days days Mated X Max Min Average Std Deviation Table 7: NiS daughtercard and APP backplane MFG results summary Signals T-Life 3 hrs. X Days days days Mated days Mated Mate/Unmate Disturbance X Max Min Average Std Deviation Table 8: NiS daughtercard and APP backplane MFG results summary Grounds 7. Group : Compliant pin insertion and retention force with temperature life 7.. The compliant pin test samples with the APP nickel plating passed the Telcordia GR-27-CORE C.O. and EIA-364-TS2 requirements. The test results also show that the retention force met the.8 lbs minimum requirement after temperature life. 7.6 Group 6: Plating evaluation 7.6. The gold plating thickness for all of the test samples met the µin minimum thickness. The gold plating thickness averaged 8.4 µin for the daughtercard contacts. The gold plating thickness averaged 2.4 µin for the backplane signal contacts and 2. µin for the backplane ground contacts. Copyright Amphenol Corporation 23 All rights reserved Page 24 of 2

25 7.6.2 The APP nickel plating thickness for the test samples did not all meet the 2 µin to 4 µin thickness requirement. The daughtercard contacts averaged 2. µin of the nickel plating for the APP plated contacts. Some of the contacts had less than 2 µin, and still passed all the other test groups. The backplane signal contacts averaged 24.7 µin of APP plating and the backplane ground contacts averaged 3.8 µin of APP plating thickness The porosity evaluation of both daughtercard and backplane contacts showed less than the % of contact surfaces contained pores, which is the maximum allowable specification. The daughtercard showed 2.% of the contacts had corrosion blooms, although no pores were observed. For the backplane contacts, no pores were observed. 8. Conclusions 8. The Telcordia qualification test results for the XCede HD 4 Pair connector plated with the APP plating system show that it passed all of the Telcordia GR-27-CORE C.O. qualification requirements. As part of the qualification testing, Nickel Sulfamate plated components were also included in the mixed flowing gas sequence as a control group to compare the results to the APP nickel plated components. The results of the testing show that the APP nickel test samples performed well and pass the qualification requirements. 8.2 The inter-mateability tests show that APP nickel and Nickel Sulfamate plating systems performed well and passed all of the Telcordia GR-27-CORE C.O. requirements. Based on the test results, current connectors in the field plated with Nickel Sulfamate can be inter-mated with connectors plated with the APP nickel. 8.3 Based on these test results, 2 µin to 4 µin of APP nickel plating with µin minimum gold is considered an equivalent qualified inter-mateable alternative for the µin to µin Nickel Sulfamate plating with 3 µin minimum gold. Copyright Amphenol Corporation 23 All rights reserved Page 2 of 2