Alenica Technologies Symposium& Expo July Thermal Spot Curing of Adhesives with Photonic Energy Ruben Burga

Transcription

1 Alenica Technologies Symposium& Expo July 2011 Thermal Spot Curing of Adhesives with Photonic Energy Ruben Burga

2 IRphotonics Inc. Montreal CONFIDENTIAL & PROPRIETARY

3 IRphotonics provides Mid IR Fibers for Scientific Industry Spectroscopy Fiber lasers Laser Delivery Aerospace & Defence CONFIDENTIAL & PROPRIETARY

4 and with the icure provides Clean Thermal Energy from Light We can harvest the power of the sun or we can generate it from an arc source.

5 Medical Devices (today) Common thread is that devices are made of multiple components and use epoxy or other joining techniques this is where thermal spot curing and thermal welding provides versatility!!!

6 MicroElectronics Common thread is that devices are made of multiple components and use epoxy or other joining techniques this is where thermal spot curing and thermal welding provides versatility!!!

7 Microelectronics Medical Device Optoelectronics

8 Heat Curing of Adhesive in Precision Assembly Industriesy: Static Oven (convection heating) Reflow or Conveyor Oven (convection) Hot plate (conduction heating) Hot Air/Gas (convection heating) Variable Frequency Microwave (VFM) (radiant heating) Photonic heating (radiant heating)

9 Thermal Spot Curing with Photonic Radiant Energy: How it works.

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11 Thermal Spot Curing: Putting the power of photonics into Industrial Applications

12 icure Energy Distribution 42% 13% 100% 45% Rule of Thumb: EVERY INCREASE IN TEMP BY 10C DOUBLES REACTION SPEED

13 How Thermal Spot Heating with Light works Transmission (T) Absorption (A) Reflection (R) Basics of Light Radiation => The coefficients T+A+R=1 A Ideal for solder pastes, plastic welding, low-melting glass! R T Objective= Maximize A

14 Example of Photonic Transmission/Absorption of Silicon

15 icure Bonding Board Material FR4 Polyimide Glass Ceramic Metal Chip Material Ceramic Silicon Thermosets Glass Adhesive Heat-cure Epoxy Acrylates Heat-cure silicones

16 icure Potting Material Fiber Tube Glass Wire Potting Compound Heat curing epoxy Heat curing silicone Conductive epoxy polyurethane Material Thermoset Stainless Aluminum Plastic Glass

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18 Glue Curing Process A. Initiation B. Gel Region C. Final Cure % Cure Target is to go from y to x x y Viscosity A B C Time Note that viscosity decreases as glue heats up until it begins to kick over, when it then increases in viscosity to its cured state. Target is to minimize time at lowest viscosity and freeze adhesive before it contaminates other parts.

19 Infrared Absorption of Typical Epoxy Adhesive EPO-TEK - 353ND Transmittance (%) ,25 1,75 2,25 2,75 3,25 3,75 4,25 Wavelength (um)

20 icure Bonding Material Stainless Aluminum Glass Ceramic Polymer tubes Silicone Material Stainless Aluminum Thermosets Glass Silicone Adhesive Heat-cure Epoxy Polyurethane Acrylates Heat-cure silicones

21 Relationship between Adhesive and Substrate 1. Identify the substrates & reaction to icure 2. Identify the glue, absorption & curing mechanism 3. Identify current requirements: process & performance

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23 icure Plastic Tube Welding Materials Thermoplastics Polyurethante Pebax Pvc -> to same or metal tube

24 5W, 30s DL No Adhesive PEBAX welding to stainless steel tube

25 Tube Potting Compound Potting Application with precise control of heating ramp.

26 Lowers energy costs! One-piece work flow! Versatile heating tool icure Benefits

27 Parameters to Establishing Proper Curing of Adhesives with Thermal Spot Curing

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29 Beam Distribution from Output of Spot Thermal Heating - icure Light Guide Lens Holder Focal Distance=14mm

30 Main Display

31 Creating a Profile to Allow Stressfree Curing

32 Determining Degree of Cure via DSC: Establishing a Reference

33 Comparison of Convection vs Radiant (icure) heating Samples Curing Conditions Residual Exotherm (J/g) Ref. Epotek 1 Oven 120 C 1 hr Ref. Epotek 1 Oven 120 C 2 hr Ref. IRphotonics A1 2 DSC 120 C 1 hr Ref. IRphotonics A2 2 DSC 120 C 2 hr Ref. IRphotonics B1 2 icure 3W 30 s Ref. IRphotonics B2 2 icure 3W 30 s Percentage Cure (%)

34 Use of Spot Heating for Electrically Conductive Joints with adhesives and solders

35 Solder/Heating Process Courtesy of John Vivari of EFD Inc. First Principles of Solder Reflow fig 4 - icure is ideal for reflow of leaded and lead-free solder pastes as they need reflow temperatures of 220C 280C in very small areas on solder pads. Reflow time can vary from 3-8 s depending on size of solder pad; time may be accelerated if there is excellent IR absorption from solder components or substrates.

36 Photonic Absorption of Metal Elements in Solder

37 MicroCuring of Adhesive and MicroSoldering

38 Tracing Electrically Conductive Path and Determining Cure for Silver-filled Glue

39 Creating a low stress cure of H20E in PEEK tubing % Power Cycle Time (s)

40 Final Tips

41 Final Tips on Optimizing Thermal Spot Curing/Heating Where will it work best? Absorbing substrates Low thermal mass On or between opaque surfaces. Where will it be a struggle? High Reflectivity or Transmissivity. High thermal mass or high thermal conductivity. Slow thermal cures.

42 Contact Information Ruben Burga (o) (m)