5W HI-POWER LED SPECIFICATION

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1 5W HI-POWER LED SPECIFICATION HPG8b-495xWHCx Drawn by Checked by Approved by RoHS Conformity DATE:2013/4/9 REV:A

2 HUEY JANN High Power 5W LED is made of GaInN chips with precise package technique which makes excellent heat dissipation to reach the advantages of high luminous efficiency, low decay, and long endurance. Now we have these colors available: red, green, blue, white, yellow and infrared. FEATERUS Instant light Long operating life Superior ESD defense Low voltage DC operated More energy efficient than incandescent and most halogen lamps TYPICAL APPLICATIONS Architectural detail lighting Portable flashlight Medical applications Beacon lights Decoration lights Spotlight TEL: FAX:

3 PACAGE DIMENSIONS: Emitter Type LED Dice Cathode Mark Slug 7.25 Star Type Cathode Mark LED Dice ± 0.3 NOTE: 1.All dimensions are in millimeter. 2.Lead spacing in measured where the lead emerge from the package. 3.prodruded resin under flange is 1.5mm max. 4.specifications are subject to change without notice. 5.Tolerance is +/-0.3mm unless otherwise noted. 6.Driving LED without heat sinking device is forbidden. 7.It is strongly recommended that the temperature of lead be not higher than 55 o C. 8.Proper current derating must be observed to maintain junction temperature below the maximum. 9.LEDs are not designed to be driven in reserve bias. TEL: FAX:

4 DEVICES Item Lens Color Dice Source Color Temperature Typ ( o ) HPG8b-495WHC HPG8b-495WHC/WPCB 6000 HPG8b-495YWHC(4000 o ) HPG8b-495YWHC(4000 o )/WPCB HPG8b-495YWHC(4000 o )/CRI 90 HPG8b-495YWHC(4000 o )/CRI 90/WPCB Water Clear GaInN/GaN 4000 HPG8b-495YWHC HPG8b-495YWHC/WPCB HPG8b-495YWHC/CRI HPG8b-495YWHC/CRI 90/WPCB 3

5 ABSOLUTE MAXIMUM RATINGS TA=25 C PARAMETER SYMBOL MAX. RATING UNIT Continuous Forward Current IF 1400 ma Peak Forward Current *1 IFM 1500 ma Electrostatic Discharge(HBM) ESD 4000 V LED Junction Temperature Tj 135 C Operating Temperature Topr -40 ~ +110 C Storage Temperature Tstg -40 ~ +120 C Reflow Soldering (preheat C sec, soldering temp 260 C 10sec) *1.Duty Ratio=0.1%,Pulse Width=10us. *2.Iron soldering high temperature will not cause damage to the dice. But be aware of the high temperature will not only make the epoxy soften but also cause the lead moving and the gold wire broken and even open. So before returning to the normal temperatures PLEASE AVOID any serious pressure on the top of epoxy and lead. 4

6 ELECTRIC-OPTICAL CHARACTERISTICS IN COMMON TA=25 C Parameter Symbol Test Condition Typ Max Unit View Angle of Half Power 2 1/2 45 deg Forward Voltage VF V Thermal Resistance Junction To Case Rθ J-C IF=1400mA 8 Thermal Resistance Junction To Case With Star Type Heat Sink Rθ J-C 11 o C/W o C/W Temperature Coefficient Of Forward Voltage V F / T -2 mv/ o C ELECTRIC-OPTICAL CHARACTERISTICS TO BE INDEPENDENT IF=1400mA TA=25 C HPG8b-495WHC Item HPG8b-495WHC/WPCB CCT ( o ) CRI (Ra) Brightness (lm) Typical HPG8b-495YWHC(4000 o ) HPG8b-495YWHC(4000 o )/WPCB HPG8b-495YWHC(4000 o )/CRI 90 HPG8b-495YWHC(4000 o )/CRI 90/WPCB HPG8b-495YWHC HPG8b-495YWHC/WPCB HPG8b-495YWHC/CRI 90 HPG8b-495YWHC/CRI 90/WPCB

7 RELIABILITY TEST Endurance Test Test Item Reference Standard Test Conditions Result Operation Life MIL-STD-750:1026 MIL-STD-883:1005 Connect with a power if=1400ma Ta=Under room temperature 0/22 JIS-C-7021 :B-1 Test Time=1,000hrs High Ta=+85 o C+/-5 o C Temperature MIL-STD-202:103B RH=80% ~ 85% High Humidity JIS-C-7021 :B-11 Test Time=1,000hrs Storage 0/22 High MIL-STD-883:1008 High Ta=+120 o C+/-5 o C Temperature JIS-C-7021 :B-10 Test Time=1,000hrs Storage 0/22 Low Low Ta=-40 o C+/-5 o C Temperature JIS-C-7021 :B-12 Test Time=1,000hrs Storage 0/22 *Failure Criteria: 1. VF arise 10% 2. IV decline 30% 3. A failure is an LED that is open or shorted 6

8 RELIABILITY TEST Environmental Test Test Item Reference Standard Test Conditions Result MIL-STD-202:107D -40 o C ~ +25 o C ~ +85 o C ~ +25 o C Temperature MIL-STD-750: min 20min 60min 20min Cycling MIL-STD-883:1010 Test Time=200cycle JIS-C-7021 :A-4 0/22 MIL-STD-202:107D -40 o C+/-5 o C ~ +110 o C+/-5 o C Thermal MIL-STD-750: min 20min Shock MIL-STD-883:1010 Test Time=200cycle 0/22 *Failure Criteria: 1. VF arise 10% 2. IV decline 30% 3. A failure is an LED that is open or shorted 7

9 TYPICAL ELECTRICAL OPTICAL CHARACTERISTICS CURVES FORWARD CURRENT (ma) FORWARD VOLTAGE (V) FORWARD CURRENT (ma) R R θ R θ R θ θ J-A J-A J-A J-A o =60 C/W o =50 C/W o =40 C/W o =30 C/W O AMBIENT TEMPERATURE( C) Relative luminousity Forward current (ma) Relative luminousity Ambient temperature( OC) 8

10 TYPICAL ELECTRICAL OPTICAL CHARACTERISTICS CURVES Chromaticity Coordinate Cx Cy Forward Current Ta=25 O C Chromaticity Coordinate o Ambient Temperature( C) /2 POWER VIEW ANGLETa=25 O C

11 TYPICAL ELECTRICAL OPTICAL CHARACTERISTICS CURVES RELATIVE RADIANT INTENSITY o o 6000 Ta=25 C WAVELENGTH (nm) RELATIVE RADIANT INTENSITY o o 4000 Ta=25 C WAVELENGTH (nm) RELATIVE RADIANT INTENSITY o o 3300 Ta=25 C WAVELENGTH (nm) 10

12 LED VF Bin Selec tion IF=1400mA BIN CODE Minimum Forward Voltage Maximum p q r Brightness Bin Selection Item BIN CODE IF=1400mA Brightness in lm Minimum Maximum HPG8b-495WHCx R HPG8b-495YWHC(4000 o )x R HPG8b-495YWHC(4000 o )/CRI 90x Q HPG8b-495YWHCx R HPG8b-495YWHC/CRI 90x Q

13 Pure White Color Bin Selection Bin C C T ( ) T Y P T T T T T T T T T T T T T T T Chromaticity Coordinates x y x y x y x y x y x y x y x y x y x y x y x y x y x y x y

14 Pure White Color Bin Selection CIE Light Color Chart o o 8000 o T T2 T o T4 T5 T T7 o 5650 T8 T9 T o T11 T12 T o T14 T

15 Nature White Color Bin Selection Bin C C T ( ) T Y P N N N N N N N N N N N N Chromaticity Coordinates x y x y x y x y x y x y x y x y x y x y x y x y

16 Nature White Color Bin Selection CIE Light Color Chart N4 N3 N2 N N8 N7 N6 N5 N N11 N10 N

17 Warm White Color Bin Selection Bin C C T ( ) T Y P C C C C C C C C C Chromaticity Coordinates x y x y x y x y x y x y x y x y x y

18 DEVICE NO:HPG8b-495xWHCx Warm White Color Bin Selection CIE Light Color Chart C12 C14 C C13 C C16 C C18 C

19 Package Dimension For Emitter Type NOTE: 1. Dimensions are specified as follows: mm. 2. Tolerance is +/-0.3mm unless otherwise noted pcs emitters per tube tubes per inside box inside box per outside box. 18

20 Package Dimension For Star Type NOTE: 1. Dimensions are specified as follows: mm. 2. Tolerance is +/-0.3mm unless otherwise noted pcs star per tray trays per box. 19

21 Requirements to user For Emitter Type The LED products by HUEY-JANN is designed, manufactured, and sold aiming at high standard quality and reliability, however, reliability of electronic apparatus is seen as a product of reliability superior to HUEY-JANN and using status at users. From this point, HUEY-JANN requests user s for following things. Recommended Solder Pad Design For Emitter Type Slug Independent Solder Pad Solder Mark ψ Note: 1.All dimensions are in millimeters. 2.Electrical isolation is required between Slug and Solder Pad

22 Heat Plate Soldering Condition For Emitter Type a. Soldering Process for Solder Paste solder paste Heat conduction rubber PCB Use Solder Mask to print Solder Place Emitter on PCB. Heat Plate Put PCB on Heat Plate until Paste on PCB. 1.The Solder Paste sould be melted within 10 seconds. 2.Take out PCB out from Heat Plate within 15 seconds. Solder Paste melt. b. Soldering Process for Solder Wire solder paste Heat conduction rubber Heat Plate PCB Heat Plate Solder Wire Heat Plate Put PCB on Heat Plate. Place Solder Wire to the solder pad of PCB. Put Emitter on PCB. Take the PCB out from Heat Plate within 10 seconds. NOTE: 1.Heat plate temperature: 230 o C max for Lead Solder and 260 o C max for Lead-Free Solder. 2.When soldering, do not put stress on the LEDs during heating. 3.After soldering, do not warp the circuit board. 21

23 Soldering Process For Hot Bar For Emitter Type solder paste Heat conduction rubber Hot Bar Thermal Conductive Glue Dispensing PCB Put Emitter on the PCB. Hot Bar soldering of High Power Emitter NOTE: 1.Hot Bar temperature: 230 o C max for Lead Solder and 260 o C max for Lead-Free Solder. 2.When soldering, do not put stress on the LEDs during heating. 3.After soldering, do not warp the circuit board. Manual Hand Soldering For Emitter Type PCB Thermal Conductive Glue Heat conduction rubber solder paste Solder Wire Soldering Lron Place Thermal Conductive Glue on the PCB. Place Emitter on the PCB. Use Soldering Iron to solder the leads of Emitter within 5 seconds. 1.Solder tip temperature: 230 o C max for Lead Solder and 260 o C max for Lead-Free Solder. 2.Avoiding damage to the emitter or to the PCB dielectric layer. Damage to the epoxy layer can cause 3.Do not let the solder contact from solder pad to back-side of PCB. This one will cause a short circuit and damage emitter. TEL: FAX:

24 Conclusion Huey Jann provide simple comparison table for High Power LED, you could find your request heat dissipation area from the following table. Free Convection Horizontal Flat Heat Dissipation-Set-up ( Area Require mm 2 ) Free Convection Vertical Flat Heat Dissipation-Set-up ( Area Require mm 2 ) Free Convection Finned Heat Dissipation-Set-up ( Area Require mm 2 ) 5W 9,000 7,500 12,000 *TAB in this table is according to highest operating temperature 65 o C. *Different materials of second heat dissipation device, the surface area of heat sink will be different. Thus, this document is for reference only. TEL: FAX:

25 TAB Temperature - Life Characteristics Curves High Power LED TAB(Board Ambient Temperature) Tboard second heat dissipation apparatus Tboard second heat dissipation apparatus Star Type Emitter Type Life (hrs)-light Hold Out 70% o Board Ambient Temperature( C ) *Board Ambient Temperature Tolerance +/-5 o C. *TAB in this table is according to highest operating temperature 65 o C. *The TAB is the stable testing value for the product lighted 100% after one hour. *Different materials of second heat dissipation device, the surface area of heat sink will be different. Thus, this document is for reference only. 24

26 Remarks: 1. Brightness values are measured during a current pulse of typical 25 ms, the brightness tolerance is +/-15%. 2. Chromaticity coordinates are measured during a current pulse of typical 200 ms, the chromaticity tolerance is +/ Forward voltage are measured during a current pulse of typical 5 ms, the VF tolerance is +/-0.15V. 4. Dimensions are specified as follows: mm. 5. Related technical parameters of LED are average value resulted from statistic. The actual parameters of LED could be slightly different from average and characteristic curve. 6. The average value of LED will be changed by technical improvement and elevation, and subject to change without prior notice. 7. Hi-Power LED can not be operated without second heat dissipating structure. 8. Poor or damaged second heat dissipating structure could lead to defective electrical characteristic of High Power LED, CCT(Wavelength) escalation, brightness drop, lifetime shortening or burn out. Following instructions of Huey Jann Hi-Power LED series document can avoid LED burn out and electrical defectiveness due to improper usage, and maintain normal performance of the products. 25

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