PQ05DZ51/11 Series / PQ3DZ53/13

Transcription

1 PQDZ/ Series / PQDZ/ PQDZ/ Series / PQDZ/.A/.A Output, General Purpose, Surface Mount Type Low Power-Loss Voltage Regulator Features Low power-loss (Dropout voltage : MAX..V) Surface mount package (equivalent to SC-) Available.V, V, V, V output type Output current (.A : PQDZ series/pqdz) Output voltage precision : ±.% (.A : PQDZ series/pqdz) Built-in ON/OFF control function Low dissipation current at OFF-state (Iqs : MAX. µa) Built-in overcurrent protection, overheat protection function, ASO protection function Available tape-packaged products (ømm reel : pcs., PQDZU/U series, PQDZU/U) Applications Personal computers CD-ROM drives Power supplies for various OA equipment Model Line-ups.V output.v output.v output.v output.a output.a output PQDZ PQDZ PQDZ PQDZ PQDZ PQDZ PQDZ PQDZ Outline Dimensions. MAX... ±. MIN.. MAX..±. DZ Internal connection diagram.±.. (. ) Epoxy resin. ±. (. ) (. ) (. ) (. ) DC input(vin) ON/OFF control terminal(vc) DC output(vo) Specific IC NC GND Heat sink is common to terminal (Unit : mm) (Vo) Absolute Maximum Ratings Parameter Input voltage ON/OFF control terminal voltage Output current Power dissipation Junction temperature Operating temperature Storage temperature Soldering temperature Symbol All are open except GND and applicable terminals. PD : With infinite heat sink VIN Vc Io PD Overheat protection may operate at <=Tj<= C Tj Topr Tstg Tsol Rating PQDZ series PQDZ series PQDZ PQDZ.. - to + - to + (for s) (Ta= C) Unit V V A W C C C C Please refer to the chapter " Handling Precautions ". Notice In the absence of confirmation by device specification sheets,sharp takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs,data books,etc.contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Internet Internet address for Electronic Components Group

2 PQDZ/ Series / PQDZ/ Electrical Characteristics (Unless otherwise specified, conditions shall be Vc=.V, Io=.A[PQDZ series/pqdz], Io=.A[PQDZ series/pqdz], Ta= C) Parameter Symbol Conditions MIN. TYP. MAX. Unit PQDZ/PQDZ... Output voltage PQDZ/PQDZ... Vo PQDZ/PQDZ... V PQDZ/PQDZ... PQDZ series Io=mA to.a, Load regulation RegL PQDZ series Io=mA to.a,.. % Line regulation RegI, Io=mA.. % Temperature coefficient of output voltage TcVo Tj= to C, Io=mA, ±. %/ C Ripple rejection RR Refer to Fig. db PQDZ series/pqdz, Io=.A Dropout voltage Vi-o PQDZ series/pqdz, Io=.A.. V ON-state voltage for control Vc(ON). V ON-state current for control OFF-state voltage for control Ic(ON) Vc(OFF) Io=A,. µa V OFF-state current for control Ic(OFF) VC=.V, Io=A, µa Quiescent current Iq Io=A, ma Output OFF-state consumption current Iqs Vc=.V, Io=A, µa PQDZ/PQDZ:VIN=V, PQDZ/:VIN =V, PQDZ/:VIN =V, PQDZ/: VIN =V PQDZ/:VIN= to V, PQDZ/:VIN = to V, PQDZ/:VIN = to V, PQDZ/: VIN = to V Input voltage shall be the value when output voltage is % in comparison with the initial value. PQDZ/:VIN=.V In case of opening control terminal, output voltage turns off. Applied only to PQDZ/ series. PQDZ/PQDZ:±. Fig. Test Circuit Fig. Test Circuit of Ripple Rejection VIN.µF Vc A A Iq Ic µf Vo A Io + V RL ei VIN.µF µf.v + Io + f=hz(sine wave) ei(rms)=.v VIN=V(PQDZ/) RL V eo V(PQDZ/) V(PQDZ/) V(PQDZ/) Io=.A RR= log(ei(rms)/eo(rms)) Fig. Power dissipation PD (W) Power Dissipation vs. Ambient Temperature PD PD:With infinite heat sink Ambient temperature Ta ( C) Note) Oblique line portion : Overheat protection may operate in this area. Fig. Overcurrent Protection Characteristics (Typical Value) (PQDZ) Vi-O=.V Vi-O=V Vi-O=V Vi-O=V Vi-O=V Vi-O=V....

3 PQDZ/ Series / PQDZ/ Fig. Overcurrent Protection Characteristics (Typical Value) (PQDZ) Vi-O=V Vi-O=.V Vi-O=V Vi-O=V Vi-O=V Vi-O=V.... Fig. Overcurrent Protection Characteristics (Typical Value) (PQDZ) Vi-O=.V Vi-O=V Vi-O=V Vi-O=V Vi-O=V Vi-O=V.... Fig. Overcurrent Protection Characteristics (Typical Value)(PQDZ)..... Vi-o=V Vi-o=V Vi-o=.V Vi-o=V Vi-o=V Vi-o=V.... Fig. Fig. Overcurrent Protection Characteristics (Typical Value) (PQDZ) Vi-O=V Vi-O=.V Vi-O=V Vi-O=V Vi-O=V Vi-O=V.... Overcurrent Protection Characteristics (Typical Value) (PQDZ) Vi-O=V Vi-O=.V Vi-O=V Vi-O=V Vi-O=V Vi-O=V.... Fig. Overcurrent Protection Characteristics (Typical Value)(PQDZ).. Vi-o=V Vi-o=V. Vi-o=.V Vi-o=V Vi-o=V.... Vi-o=V

4 PQDZ/ Series / PQDZ/ Fig. Overcurrent Protection characteristics (Typical Value)(PQDZ) Vi-o=V Vi-o=V Vi-o=V Vi-o=V Vi-o=V Vi-o=.V.... Fig. Power Dissipation vs. Ambient Temperature (Typical Value) Power dissipation PD (W) Cu area mm Cu area mm Cu area mm Cu area mm Cu area mm PWB PWB Cu Material : Glass-cloth epoxy resin Size : x x.mm Cu thickness : µm Fig. Output Voltage Deviation vs. Junction Temperature (PQDZ/) Output voltage deviation Vo (mv) Ambient temperature Ta ( C) VIN=V, Io=.A, Vc=.V (PQDZ) VIN=V, Io=.A, Vc=.V (PQDZ) PQDZ PQDZ Fig. Output Voltage Deviation vs. Junction Temperature (PQDZ/) Output voltage deviation Vo (mv) VIN=V, Io=.A, Vc=.V (PQDZ) VIN=V, Io=.A, Vc=.V (PQDZ) PQDZ PQDZ

5 PQDZ/ Series / PQDZ/ Fig. Output Voltage Deviation vs. Junction Temperature (PQDZ/) Fig. Output Voltage Deviation vs. Junction Temperature (PQDZ/) Output voltage deviation Vo (mv) VIN=V, Io=.A, Vc=.V (PQDZ) VIN=V, Io=.A, Vc=.V (PQDZ) PQDZ PQDZ Output voltage deviation Vo(mV) VIN=V, Io=.A, Vc=.V (PQDZ) VIN=V, Io=.A, Vc=.V (PQDZ) PQDZ PQDZ Fig. Output Voltage vs. Input Voltage (Typical Value) (PQDZ) Vc=.V, Ci=.µF, Co=µF Fig. Output Voltage vs. Input Voltage (Typical Value) (PQDZ) Vc=.V, Ci=.µF, Co=µF RL=Ω RL=.Ω RL=.Ω RL=Ω Fig. Output Voltage vs. Input Voltage (Typical Value) (PQDZ) Vc=.V, Ci=.µF, Co=µF Tj= C RL=Ω RL=Ω Fig. Output Voltage vs. Input Voltage (Typical Value) (PQDZ) Vc=.V, Ci=.µF, Co=µF Tj= C RL=Ω RL=Ω

6 PQDZ/ Series / PQDZ/ Fig. Output Voltage vs. Input Voltage (Typical Value) (PQDZ) Vc=.V, Ci=.µF, Co=µF Tj= C RL=.Ω RL=.Ω Fig. Output Voltage vs. Input Voltage (Typical Value) (PQDZ) Vc=.V, Ci=.µF, Co=µF Tj= C RL=Ω RL=Ω Fig. Output Voltage vs. Input Voltage (Typical Value) (PQDZ) Vc=.V, Ci=.µF, Co=µF Tj= C RL=Ω RL=Ω Fig. Output Voltage vs. Input Voltage (Typical Value) (PQDZ) Vc=.V, Ci=.µF, Co=µF Tj= C RL=Ω RL=Ω Fig. Circuit Operating Current vs. Input Voltage (PQDZ) Vc=.V, Ci=.µF, Co=µF RL=.Ω RL=Ω Fig. Circuit Operating Current vs. Input Voltage (PQDZ) Vc=.V, Ci=.µF, Co=µF RL=Ω RL=.Ω

7 PQDZ/ Series / PQDZ/ Fig. Circuit Operating Current vs. Input Voltage (PQDZ) Vc=.V, Ci=.µF, Co=µF Fig. Circuit Operating Current vs. Input Voltage (PQDZ) Fig. Circuit Operating Current vs. Input Voltage (PQDZ) Vc=.V, Ci=.µF, Co=µF Vc=.V, Ci=.µF, Co=µF RL=Ω RL=Ω RL=.Ω RL=.Ω RL=Ω RL=Ω Fig. Circuit Operating Current vs. Input Voltage (PQDZ) Vc=.V, Ci=.µF, Co=µF Fig. Circuit Operating Current vs. Input Voltage (PQDZ) Fig. Circuit Operating Current vs. Input Voltage (PQDZ) Vc=.V, Ci=.µF, Co=µF Vc=.V, Ci=.µF, Co=µF RL=Ω RL=Ω RL=Ω RL=Ω RL=Ω RL=Ω

8 PQDZ/ Series / PQDZ/ Fig. Dropout Voltage vs. Junction Temperature (PQDZseries/PQDZ). PODZ:VIN=.V, Io=.A, Vc=.V. PODZ:VIN=.V, Io=.A, Vc=.V. PODZ:VIN=.V, Io=.A, Vc=.V PODZ:VIN=.V, Io=.A, Vc=.V. PQDZ. PQDZ PQDZ. PQDZ. Dropout voltage Vi O (V) Fig. Quiescent Current vs. Junction Temperature (PQDZseries/PQDZ) PQDZ Quiescent current Iq (ma) Fig. Ripple Rejection vs. Input Ripple Frequency (PQDZseries/PQDZ) PQDZ PQDZ Ripple rejection RR (db) PQDZ PQDZ VIN=V (PQDZ) VIN=V (PQDZ) VIN=V (PQDZ) VIN=V (PQDZ) Io=A Vc=.V PQDZ PQDZ VIN =V (PQDZ) =V (PQDZ) =V (PQDZ) =V (PQDZ) Io=.A, Tj= C ei(rms)=.v(sine wave) PQDZ RR= log(ei(rms)/eo(rms)). Input ripple frequency f (khz) Fig. Dropout Voltage vs. Junction Temperature (PQDZseries/PQDZ). PODZ:VIN=.V, Io=.A, Vc=.V Dropout voltage Vi O (V) Fig. Quiescent Current vs. Junction Temperature (PQDZseries/PQDZ). VIN=V (PQDZ) VIN=V (PQDZ) VIN=V (PQDZ). VIN=V (PQDZ) Io=A PQDZ Vc=.V. Quiescent current Iq (ma) Fig. Ripple Rejection vs. Input Ripple Frequency (PQDZseries/PQDZ) PQDZ PQDZ Ripple rejection RR (db) PODZ:VIN=.V, Io=.A, Vc=.V PODZ:VIN=.V, Io=.A, Vc=.V PODZ:VIN=.V, Io=.A, Vc=.V PQDZ PQDZ PQDZ PQDZ PQDZ PQDZ PQDZ PQDZ VIN =V (PQDZ) =V (PQDZ) =V (PQDZ) =V (PQDZ) Io=.A, Tj= C ei(rms)=.v(sine wave) PQDZ RR= log(ei(rms)/eo(rms)). Input ripple frequency f (khz)

9 PQDZ/ Series / PQDZ/ Fig. Ripple Rejection vs. Output Current (PQDZseries/PQDZ) PQDZ PQDZ PQDZ PQDZ Ripple rejection RR (db) Tj= C VIN =V (PQDZ) =V (PQDZ) =V (PQDZ) =V (PQDZ) ei(rms)=.v f=hz (sine wave)..... Fig. Ripple Rejection vs. Output Current (PQDZseries/PQDZ) PQDZ PQDZ PQDZ Tj= C VIN =V (PQDZ) PQDZ =V (PQDZ) =V (PQDZ) =V (PQDZ) ei(rms)=.v f=hz (sine wave).. Ripple rejection RR (db) Typical Application DC input Vo VIN CIN + CO Load ON/OFF signal High : Output ON Low or Open: Output OFF Model Line-ups for Tape-packaged Products Output current Sleeve-packaged products Tape-packaged products.a output.a output PQDZ PQDZ PQDZ PQDZ PQDZ PQDZ PQDZ PQDZ PQDZU PQDZU PQDZU PQDZU PQDZU PQDZU PQDZU PQDZU

10 NOTICE The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii)sharp devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). Contact a SHARP representative in advance when intending to use SHARP devices for any "specific" applications other than those recommended by SHARP or when it is unclear which category mentioned above controls the intended use. If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export such SHARP devices. This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. Contact and consult with a SHARP representative if there are any questions about the contents of this publication.