Penchem s Profile. Penchem General Electronics Materials

Size: px
Start display at page:

Download "Penchem s Profile. Penchem General Electronics Materials"

Transcription

1 Penchem s Profile Founded: 1 OCTOBER 1999 Address: BUKIT MINYAK INDUSTRIAL PARK, PENANG, MALAYSIA Nature of Business: DESIGN, MANUFACTURE and SUPPLY of ADVANCED POLYMER and COMPOSITE MATERIALS for ELECTRONICS and MEDICALS Penchem General Electronics Materials Customer Applications Product Category Product Code Applications Special Features Chip On Board Epoxy (COB) EN453 EN485 EN525 EN690 Chip-On-Board Dam & Fill Encap and protect components and bonded wires Good mechanical and adhesion strength Low stress Good thermal-mechanical properties Good weather resistance Die Attach / SMT Epoxy / Silver Epoxy / Under Fill CB625 CB643 DA669 AG806 CB626 CB648 AG803 Bonding chip and component on PCB Die attach (Electrically & nonelectrically conductive) Under-fill Good mechanical and adhesion strength Non sagging/smearing No bleeding and tailing High electrical conductivity (silver epoxy) Epoxy Sealant EN690 GL172 GL174 GL440 GL616 Relays & Contactors Fiber optic Lens Low thermal-mechanical stress High thermal and moisture resistance Good chemicals resistance Epoxy Potting / Silicone Potting PT365 PT497 PT638 PT910 Transformer Sensor Low stress Good thermal-mechanical properties Good weather resistance Good flow & self-leveling UV Epoxy UV367 UV379-1 UV405 UV702 Bonding Fiber optic Bonding Lens Tacking Coils Coating High Refractive index (RI=1.4 to 1.5) Good mechanical and adhesion strength Fast curing 1

2 Penchem Thermal Interface Materials (TIM) Customer Applications Product Category Product Code Applications Special Features Silicone Pad TH933 TH936-1 Very good thermal conductivity up to 7.1W/mK 2 types of Pad: (a)non-sticky and (b)oneside sticky Can die cut to specific size and dimensions Wide range of thickness (0.2mm up to 5mm) Silicone Putty / Grease TH931-2 TH932-2 Heat sink for Power devices High power IC for PC, Notebook, & Server Heat sink for high power LED and controller Heat sink for automobile and heat exchangers Excellent outdoor performance with good stability & reliability Ease of use by dispensing or screen printing Silicone Potting TH934 2-Part RTV potting compound Good adhesion and weather resistance Good flow and self-leveling Thermal Conductive Epoxy TH Part heat curable epoxy Excellent adhesion and good mechanical strength Good thermal conductivity Penchem Optoelectronics Materials Customer Applications Product Category Product Code Applications Special Features Casting Epoxy OP590 OP692 OP589 Automobile lighting Turn signal bulbs Electronic signs Signboards Backlighting Traffic signal lights Through-hole LED (3mm, 5mm, Oval, Flat-top, etc.) Super Flux Snap LED Outstanding performance for outdoor application Pass TMCL -55 C/100 C, -40 C/120 C Meet MSL specifications Low Iv degradation (<10%) Comply to REACH & RoHS requirements Halogen free Encapsulation Silicone OP955 UV923 Commercial lighting Architectural lighting Outdoor lighting High power LED Low thermal-mechanical stress High thermal & radiation resistance Low gas permeability Refractive index 1.41 & 1.55 Comply to REACH & RoHS requirements Encapsulation Epoxy / Silicone OP589 Backlighting for signage, LCD panel (TV, hand phone, tablet, etc.) Architectural Lighting Automotive Accent Lighting Good heat & UV resistance Meet MSL specification Comply to REACH & RoHS requirements SMD LED Potting Epoxy OP281 OP577 S4 (seven Segment Display) for clocks, watches, digital instruments, and many household appliances Low stress pass TMCL Comply to REACH & RoHS requirements 2

3 Innovations Customers seek us for engineering solutions 1 Penchem low surface energy ring barrier Penchem UV silicone by needle dispense The finished High Brightness LED product Conventional Compression Mold Self dome-forming silicone process replaced conventional Molding Process. Saved customer 1 million USD per mold. Automatic dispenser from syringe needle Microwave Fibre Optics Microwave (Aeroplanes) Penchem advanced epoxies with no shifting at high-low temperatures for fiber optics and microwave devices. Replaced expensive brands with excellent engineering support. Innovations Customers seek us for engineering solutions 5 Penchem develop a one part silver conductive epoxy with high peel strength, low out-gassing and exceptionally low volume resistivity. This has help the customer to save process cost with replacement of two-part system 3 6 MEMS Microphone Penchem UV and heat curable epoxies that meet HDD cleanliness requirement. Extremely stable with low shrinkage and no micro-movement or migration at high-low temperatures and humidity test. Successfully replace expensive brands. Hard Disk Drive 3

4 Developing 3D Printer Technology & Materials Labs are opened on weekends for ideas Epoxy Technology Roadmap Markets Silver DA & SMT Epoxies 2001 Custom Formulations 1999 COB & Relay Sealants 2003 LED Epoxies & UV Cure Adhesives 2006 Fibre Optics 2010 Silicone Epoxy Hybrids 2013 Medical Devices 2014 Aerospace & Composites 2015 Electronics Automotive Solar Medical Aerospace 4

5 Penchem Analytical Capability Exploring Possibilities, Developing Solutions GPC Reaction progress Sub-amb. TMA CTE DMA Modulus & flexibility Silicone synthesis TGA-DTA - Hi. temp. stability Pyrolizer GC-MS Purity & rev. eng. UV Conveyor Oven UV polymers Tensile Tester Material strength Micro-FTIR Correct product Sub-ambient DSC - % cure Thermal Conductivitimeter - TIM Spectrophotometer color & % T High resolution NMR Silicone structure detn & QC Applications Lab Simulate customers process conditions Help customers resolve material & process issues Develop semiconductor packaging technology Build prototypes Color Check Light Box Die-Attach Machine Wire Bond Machine Solder Reflow with Real Time Video Record Integrating Sphere Light Measurement Humidity Chamber 5

6 Research Collaborations 1. UKM 2014: Graphenes & conductive ceramics to enhance thermal conductivity 2. Kannur University, India 2014: Silicone chemistry & technology 3. USM 2013: Carbon nanotube composites for high power ICs 4. USM 2012: Synthesis of silicones of useful functional groups 5. USM 2011: Synthesis of POSS silicones 6. USM 2010: Nano-silver adhesives, enhanced electrical conductivity 7. USM 2007: Synthesis of silicone resins Meets Global Global Standard Penchem Certifications and Compliances ISO 9001:2008 Quality Management ISO/TS 16949:2009 Automotive Quality ISO 14001:2004 Environmental Large multi-nationals are confident buying from us. ISO Medical 6

7 Global Footprint France California New York Germany China Japan Thailand Taiwan Malaysia Why Penchem Products Some key reasons: Wide range of high quality and performance products Custom formulations and solutions Cost effective alternative Synthesis of own key raw materials Industry leading price and performance Small Minimum Order Quantity, MOQ Strong and comprehensive technical support Provide competitors evaluations, incorporate with professional system/equipment manufacturer to provide total solutions, materials failure analysis and process trouble shooting RoHS compliant (test report issue by SGS and accredited test labs) 7

8 Winning Together Penchem won Most Innovative SME Award June 2012 Most Innovative SME Award 2012 with RM 1 Million Prize 2012 SME Innovation Award, Manufacturing Category Learning, Exposure & Employee s Ownership Penchem won Quality Management Excellence Award October

9 Continuous Learning and Benchmarking Penchem Won 2013 Enterprise 50 Award Penchem was among top 10 winners of 2013 Enterprise 50 Award 15 November 2013 Contact Information Company Address: Penchem Technologies Sdn. Bhd. 1015, Jalan Perindustrian Bukit Minyak 7, Kawasan Perindustrian Bukit Minyak, Penang, Malaysia. Tel: , 77, 78 Fax: Website: Contact persons: KG Wong Pierre Tham 9

Meeting the Thermal Management Needs of Evolving Electronics Applications

Meeting the Thermal Management Needs of Evolving Electronics Applications Meeting the Thermal Management Needs of Evolving Electronics Applications Dr. Glenn Mitchell / August 2015 Agenda Introduction Thermal Industry Trends TIM Challenges, Needs & Criteria TIM Industry Solutions

More information

EVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet High Power LED 1W (Preliminary)

EVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet High Power LED 1W (Preliminary) Technical Data Sheet High Power LED 1W (Preliminary) Features Feature of the device: small package with high efficiency Typical view angle: 150. Typical light flux output: 30 lm @ 350mA. ESD protection.

More information

SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY CREATING TOMORROW S SOLUTIONS

SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY CREATING TOMORROW S SOLUTIONS SILICONE PRODUCTS FOR THE ELECTRONICS INDUSTRY CREATING TOMORROW S SOLUTIONS BONDING, SEALING, COATING, ENCAPSULATION: PROCESSES IN THE ELECTRONICS INDUSTRY BOLTING, SOLDERING, RIVETING: WHY NOT JUST BOND?

More information

Thermal Adhesives Ther-O-Bond 1500

Thermal Adhesives Ther-O-Bond 1500 Products / Interface Materials / Adhesives Adhesives Bond 1500 Epoxy casting system for potting and encapsulation Bond 1600 Two part epoxy for bonding Bond 2000 Rapid cure acrylic adhesive bond High strength

More information

50W EdiStar. Approved By Customer. Designer Checker Approval. Ultra High Power LED

50W EdiStar. Approved By Customer. Designer Checker Approval. Ultra High Power LED Ultra High Power LED 50W EdiStar EdiStar Emitter Approved By Customer Designer Checker Approval Date:2006/12/04 Version:Preliminary V0.1 4F, No. 800, Chung-Cheng Rd, Chung-Ho, Taipei 235, Taiwan Tel: 886-2-8227-6996

More information

Amphenol Sincere. Electronic Integration & Flexible Printed Circuits. Aerospace. Health Care. Heavy Equipment HEV. Industrial

Amphenol Sincere. Electronic Integration & Flexible Printed Circuits. Aerospace. Health Care. Heavy Equipment HEV. Industrial Amphenol Sincere Health Care Aerospace Heavy Equipment HEV Industrial Electronic Integration & Flexible Printed Circuits About Amphenol The second largest manufacturers of interconnect products 87 worldwide

More information

DOMINANT. Opto Technologies Innovating Illumination. 150 InGaN Warm White : NAF-BSG DATA SHEET : Primax TM. Features: Applications:

DOMINANT. Opto Technologies Innovating Illumination. 150 InGaN Warm White : NAF-BSG DATA SHEET : Primax TM. Features: Applications: DATA SHEET : Primax TM 150 InGaN Warm White : NAF-BSG Primax TM Synonymous with function and performance, enter the Primax, the new era of high intensity illumination in LED. With its high flux output

More information

DOMINANT. Opto Technologies Innovating Illumination. InGaN White S-Spice : SSW-SLD DATA SHEET: SpiceLED TM. Features: Applications:

DOMINANT. Opto Technologies Innovating Illumination. InGaN White S-Spice : SSW-SLD DATA SHEET: SpiceLED TM. Features: Applications: DATA SHEET: SpiceLED TM SpiceLED TM Like spice, its diminutive size is a stark contrast to its standout performance in terms of brightness, durability and reliability. Despite being the smallest in size

More information

Good Boards = Results

Good Boards = Results Section 2: Printed Circuit Board Fabrication & Solderability Good Boards = Results Board fabrication is one aspect of the electronics production industry that SMT assembly engineers often know little about.

More information

Würth Elektronik ibe Automotive solutions

Würth Elektronik ibe Automotive solutions Würth Elektronik ibe Automotive solutions July 2016 Page 1 The Würth Group The Würth Group Over 69,000 employees, 11 billion sales More than 400 companies In more than 80 countries The Würth Elektronik

More information

Low Pressure Molding Solutions

Low Pressure Molding Solutions Low Pressure Molding Solutions PROCESS TRADITIONAL POTTING PROCESS FLOW MOLD CASE PALLETIZE INSERT ELECTRONICS PRE-HEAT ENCAPSULATE SETTLING OR VACUUM CURE TEST LOW PRESSURE PROCESS FLOW INSERT ELECTRONICS

More information

SLLP-5630-150-G PRODUCT DATASHEET. RoHS Compliant

SLLP-5630-150-G PRODUCT DATASHEET. RoHS Compliant PRODUCT DATASHEET SLLP-5630-150-G Table of Contents Features... 1 Applications 1 Characteristics.. 1 Typical Electro optical Characteristics Curves... 3 Mechanical Dimensions... 4 Carrier Tape Dimensions.....

More information

Product Sheet. Silicone Adhesive Sealants. RTV Silicone Adhesive Sealants

Product Sheet. Silicone Adhesive Sealants. RTV Silicone Adhesive Sealants Product Sheet Silicone Adhesive Sealants Adhesives come in a wide array of chemistries each having its specialist properties and applications. In this context silicones are often referred to as sealants

More information

CHARACTERIZATION OF POLYMERS BY TMA. W.J. Sichina, National Marketing Manager

CHARACTERIZATION OF POLYMERS BY TMA. W.J. Sichina, National Marketing Manager PERKIN ELMER Polymers technical note CHARACTERIZATION OF POLYMERS BY W.J. Sichina, National Marketing Manager Thermomechanical analysis () is one of the important characterization techniques in the field

More information

HL-A-3528H308W-S1-13. Description. Applications. Recommended Soldering. Package Dimensions

HL-A-3528H308W-S1-13. Description. Applications. Recommended Soldering. Package Dimensions RoHS Specification Client Name: Client P/N: Factory P/N: HL-A-3528H308W-S1-13 OF-SMD3528WN Sending Date: Client approval Hong li approval Approval Audit Confirmation Approval Audit Confirmation 殷 小 平 王

More information

DM6030 Series HIGH THERMAL CONDUCTIVITY EPOXY ADHESIVE PASTES DM6030Hk / DM6030Hk-PT / DM6030SF

DM6030 Series HIGH THERMAL CONDUCTIVITY EPOXY ADHESIVE PASTES DM6030Hk / DM6030Hk-PT / DM6030SF DM6030 Series HIGH THERMAL CONDUCTIVITY EPOXY ADHESIVE PASTES DM6030Hk / DM6030Hk-PT / DM6030SF PRODUCT DATA SHEET I. DESCRIPTION The DM6030 products are silver-loaded epoxy adhesives with high thermal

More information

Surface Mount 905 nm Pulsed Semiconductor Lasers High Power Laser-Diode Family for Commercial Range Finding

Surface Mount 905 nm Pulsed Semiconductor Lasers High Power Laser-Diode Family for Commercial Range Finding Preliminary DATASHEET Photon Detection Surface Mount 5 nm Pulsed Semiconductor Lasers Near field profile Excelitas pulsed semiconductor laser produces very high peak optical pulses centered at a wavelength

More information

Neal O Hara. Business Development Manager

Neal O Hara. Business Development Manager Neal O Hara Business Development Manager PCS OFFERING User Interface Flex Circuit Solutions Sensor Systems Multilayer Copper Flex Circuits LED Lighting 2 VERTICAL INTEGRATION FPC Connector Picoflex on

More information

Figure 1 Wafer with Notch

Figure 1 Wafer with Notch Glass Wafer 2 SCHOTT is an international technology group with more than 125 years of experience in the areas of specialty glasses, materials and advanced technologies. With our high-quality products and

More information

Self Qualification Results

Self Qualification Results (ATO) Divisional Philips Semiconductors Philips Internal Report No.: RNR- 8 3-03/RdH/RdH- 2 0 3 6 QTS Report Database No.: 030692 Self Qualification Results NiPdAu lead- free solution of SO14/16/20 Products

More information

DATA SHEET PART NO. : L-314YD REV : A / 4

DATA SHEET PART NO. : L-314YD REV : A / 4 PARA LIGHT ELECTRONICS CO., LTD. 4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan, R.O.C. Tel: 886-2-2225-3733 Fax: 886-2-2225-4800 E-mail: para@para.com.tw http://www.para.com.tw DATA SHEET

More information

Surface Mount LEDs - Applications Application Note

Surface Mount LEDs - Applications Application Note Surface Mount LEDs - Applications Application Note Introduction SMT Replaces Through Hole Technology The use of SMT-TOPLED varies greatly from the use of traditional through hole LEDs. Historically through

More information

1W High Power Purple LED Technical Data Sheet. Part No.: LL-HP60MUVA

1W High Power Purple LED Technical Data Sheet. Part No.: LL-HP60MUVA 1W High Power Purple LED Technical Data Sheet Part No.: LL-HP60MUVA Spec No.: HP60M Rev No.: V.2 Date: Aug./18/2009 Page: 1 OF 8 Features: Luckylight High power LED type. Lead frame type package (Heat

More information

FABRICATION 2011 SERVICES TECHNOLOGIES CAPABILITIES INDUSTRY

FABRICATION 2011 SERVICES TECHNOLOGIES CAPABILITIES INDUSTRY FABRICATION 2011 SERVICES 24HRS - 5 DAYS ON QUICK TURN PROTOTYPE Dear Customer, We would like to take this opportunity to welcome you and thank you for looking to ASA PCB as your Printed Circuit Manufacturing

More information

The BASA Guide to the ISO 11600 Classification of Sealants for Building Construction

The BASA Guide to the ISO 11600 Classification of Sealants for Building Construction The BASA Guide to the ISO 11600 Classification of Sealants for Building Construction SEALANTS IN BUILDING AND CONSTRUCTION Glazing Sealants (G) Construction Sealants (F) Class 25 Class 25LM Class 25 Class

More information

RoHS-Compliant Through-Hole VI Chip Soldering Recommendations

RoHS-Compliant Through-Hole VI Chip Soldering Recommendations APPLICATION NOTE AN:017 RoHS-Compliant Through-Hole VI Chip Soldering Recommendations Ankur Patel Associate Product Line Engineer Contents Page Introduction 1 Wave Soldering 1 Hand Soldering 4 Pin/Lead

More information

How do you create a RoHS Compliancy-Lead-free Roadmap?

How do you create a RoHS Compliancy-Lead-free Roadmap? How do you create a RoHS Compliancy-Lead-free Roadmap? When a company begins the transition to lead-free it impacts the whole organization. The cost of transition will vary and depends on the number of

More information

How To Make An Led Lamphead

How To Make An Led Lamphead LED Design Guide 2 Henkel LED Design Guide Henkel LED Design Guide 3 Pages Pages 4-5 8-9 Roadway and Parking Lot Lighting Consumer / Residential Lighting Pages Pages 6-7 Industrial and Commercial Lighting

More information

Material Requirements For 3D IC and Packaging Presented by: W. R. Bottoms

Material Requirements For 3D IC and Packaging Presented by: W. R. Bottoms Material Requirements For 3D IC and Packaging Presented by: W. R. Bottoms Frontiers of Characterization and Metrology for Nanoelectronics Hilton Dresden April 14-16, 2015 Industry Needs Are Changing Moore

More information

PRODUCT SPECIFICATION

PRODUCT SPECIFICATION PRODUCT SPECIFICTION SMD Type Size (mm):3.2*1.6*1.1 Emitting Color:White SMT package Suitable for all SMT assembly and soldering method Pb-free Reflow soldering application RoHS Compliant Features: Light

More information

Direct Attach DA700 LEDs CxxxDA700-Sxx000

Direct Attach DA700 LEDs CxxxDA700-Sxx000 Direct Attach DA7 LEDs CxxxDA7-Sxx Data Sheet Cree s Direct Attach DA7 LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree s proprietary device

More information

Polyimide labels for Printed Circuit Boards

Polyimide labels for Printed Circuit Boards Polyimide labels for Printed Circuit Boards The right match for any PCB labelling application Labels on Printed Circuit Boards Matching product performance with application needs Printed Circuit Boards

More information

Effects of Tg and CTE on Semiconductor Encapsulants

Effects of Tg and CTE on Semiconductor Encapsulants Effects of Tg and CTE on Semiconductor Encapsulants Dr. Mark M. Konarski Loctite Corporation www.loctite.com Abstract As the role of direct-chip-attachment increases in the electronics industry, the reliability

More information

Development of an innovative bio-based structural adhesive

Development of an innovative bio-based structural adhesive Development of an innovative bio-based structural adhesive Blanca Palomo, R&D Engineer blanca.palomo@rescoll.fr RESCOLL Independent research company located in Pessac (33) specialized in technologic innovation

More information

TAIYO PSR-4000 AUS703

TAIYO PSR-4000 AUS703 TAIYO PSR-4000 AUS703 LIQUID PHOTOIMAGEABLE SOLDER MASK Designed for Flip Chip Packaging Applications Halogen-Free (300ppm) Excellent Thermal and Crack Resistance Low Water Absorption RoHS Compliant Excellent

More information

LED A Leading Light. Engineering superior performance in any environment

LED A Leading Light. Engineering superior performance in any environment LED A Leading Light Engineering superior performance in any environment Committed to Improving Performance Since 1941 we have been developing solutions to advance engineering and enhance technological

More information

How To Power A Power Control Microprocessor (Power Control) Microprocessor 2 (Power) (Power Power) (Control) (Repower) Microcontroller (Power/Reflow) (Mini) (Microprocessor) (Wired) (Wire

How To Power A Power Control Microprocessor (Power Control) Microprocessor 2 (Power) (Power Power) (Control) (Repower) Microcontroller (Power/Reflow) (Mini) (Microprocessor) (Wired) (Wire PTC NTC for Surface Mounting Application What is a Thermistor? Thermally Sensitive Resistor Thermistor Positive Temperature Coefficient PTC Negative Temperature Coefficient NTC Characteristics of Thermistors

More information

Specification MBT801-S

Specification MBT801-S Specification MBT801S Drawn SSC Approval 고객명 Approval.com MBT801S 1. Features 2. Absolute Maximum Ratings 3. Electro Characteristics 4. Optical characteristics 5. Outline Dimension 6. Packing 7. Soldering

More information

RJR Polymers Reliability Qualification Report RQFN55-24-A and RQFN44-12-A

RJR Polymers Reliability Qualification Report RQFN55-24-A and RQFN44-12-A Reliability Qualification Report RQFN55-24-A and RQFN44-12-A Package Qualification September 14, 2011 RJR Polymers Reliability Qualification Report RQFN55-24-A and RQFN44-12-A Table of Contents Purpose.3

More information

www.pdffactory.com The T-lam System

www.pdffactory.com The T-lam System The T-lam System T-lam..Where It All Begins.. T-preg The Heart of the T-lam System Three Main Functions Conducts Heat Insulate Electrically Adhesive Bonding Layer The T-lam System T-Preg Thermally Conductive

More information

SILICONE RUBBER: THE DEFINITIVE GUIDE WHITE PAPER

SILICONE RUBBER: THE DEFINITIVE GUIDE WHITE PAPER SILICONE RUBBER: THE DEFINITIVE GUIDE WHITE PAPER February 2014 Executive Summary J-Flex has created this comprehensive Guide to Silicone Rubber to be used as a valuable resource for all those working

More information

Thermal Management Solutions for Printed Circuit Boards used in Digital and RF Power Electronics and LED assemblies

Thermal Management Solutions for Printed Circuit Boards used in Digital and RF Power Electronics and LED assemblies Thermal Management Solutions for Printed Circuit Boards used in Digital and RF Power Electronics and LED assemblies Sandy Kumar, Ph.D. Director of Technology American Standard Circuits, Inc 3615 Wolf Road

More information

Chip-on-board Technology

Chip-on-board Technology Hybrid Technology The trend in electronics is to continue to integrate more and more functions and numbers of components into a single, smaller assembly. Hybrid circuit technology is a key method of increasing

More information

Specializing in Open Cavity Packages & Complete IC Assembly Services ISO 9001:2008 Certified and ITAR Registered

Specializing in Open Cavity Packages & Complete IC Assembly Services ISO 9001:2008 Certified and ITAR Registered TowerJazz Global Symposium Specializing in Open Cavity Packages & Complete IC Assembly Services and TowerJazz Global Symposium Quik-Pak a division of Delphon Industries 2011 Gold Sponsor and TowerJazz

More information

Measuring of the Temperature Profile during the Reflow Solder Process Application Note

Measuring of the Temperature Profile during the Reflow Solder Process Application Note Measuring of the Temperature Profile during the Reflow Solder Process Application Note Abstract With reference to the application note Further Details on lead free reflow soldering of LEDs the present

More information

Auditing Contract Manufacturing Processes

Auditing Contract Manufacturing Processes Auditing Contract Manufacturing Processes Greg Caswell and Cheryl Tulkoff Introduction DfR has investigated multiple situations where an OEM is experiencing quality issues. In some cases, the problem occurs

More information

PRODUCT DATASHEET. Confidex Ironside Micro CONTENTS

PRODUCT DATASHEET. Confidex Ironside Micro CONTENTS Confidex 2010 1 (6) PRODUCT DATASHEET Confidex Ironside Micro CONTENTS 1. PRODUCT DESCRIPTION... 2 1.1 SPECIFICATION DATA... 2 1.2 DIMENSIONS... 2 1.3 ELECTRICAL PERFORMANCE... 3 1.4 RESISTANCE AGAINST

More information

SMD Power Elements Design Guide. 50 A SMD Technology Small Size High Current

SMD Power Elements Design Guide. 50 A SMD Technology Small Size High Current SMD Power Elements Design Guide 50 A SMD Technology Small Size High Current Contents Surface Mount Technology & Assembly Surface Pad Geometry & Stencil Technical Data Qualification Reliability Test 2 www.we-online.com

More information

Cree PLCC6 3 in 1 SMD LED CLY6C-FKC

Cree PLCC6 3 in 1 SMD LED CLY6C-FKC Cree PLCC6 3 in 1 SMD LED PRODUCT FAMILY DATA SHEET CLD-CT1323.005 PRODUCT DESCRIPTION This SMD LED features an IPx8 water resistant rating in a PLCC6 package. These high performance tricolor SMT LEDs

More information

CHM-27 COB Arrays White LED

CHM-27 COB Arrays White LED CHM-27 COB Arrays White LED Features: Table of Contents Technology Overview...2 Test Specifications...2 Chromaticity Bins...3 Product Ordering & Shipping Part Numbers...4 Product Typical Flux Range. 5

More information

3M Products for Solar Energy. Designed for efficiency. Built to last.

3M Products for Solar Energy. Designed for efficiency. Built to last. 3M Products for Solar Energy Designed for efficiency. Built to last. 2 3M Products for Solar Energy From factory to field, 3M is with you. Every step of the way. Making solar power more efficient. More

More information

Features. Typical Applications G9. ProLight PEA2-3FVE 3W Warm White AC LED Technical Datasheet Version: 1.7 1 DS-0042

Features. Typical Applications G9. ProLight PEA2-3FVE 3W Warm White AC LED Technical Datasheet Version: 1.7 1 DS-0042 ProLight PEA2-3FVE 3W Warm White AC LED Technical Datasheet Version: 1.7 Features High Color rendering index Follow ANSI C78.788.2008 Chromaticity co-ordinates High flux per LED Good color uniformity Industry

More information

Flip Chip Package Qualification of RF-IC Packages

Flip Chip Package Qualification of RF-IC Packages Flip Chip Package Qualification of RF-IC Packages Mumtaz Y. Bora Peregrine Semiconductor San Diego, Ca. 92121 mbora@psemi.com Abstract Quad Flat Pack No Leads (QFNs) are thermally enhanced plastic packages

More information

0.45mm Height 0402 Package Pure Green Chip LED Technical Data Sheet. Part No.: LL-S160PGC-G5-1B

0.45mm Height 0402 Package Pure Green Chip LED Technical Data Sheet. Part No.: LL-S160PGC-G5-1B .45mm Height 42 Package Pure Green Chip LED Technical Data Sheet Part No.: LL-S16PGC-G5-1B Spec No.: S16 Rev No.: V.2 Date: Dec./6/25 Page: 1 OF 9 Features: Package in 8mm tape on 7" diameter reel. Compatible

More information

C4246 120W COB Series

C4246 120W COB Series High Performance LED Module SemiLEDs C4246 120W COB is a high performance LED module with high thermal conductivity and reliability for demanding lighting applications. It is an easy to assemble light

More information

Quality Assurance Concepts. Outline

Quality Assurance Concepts. Outline Quality Assurance Concepts Peter C. Taylor Outline What is quality? Who cares? How do we get it? What is the important stuff? 1 Defining Quality Simple Definition (Philip Crosby) Quality: Conformance to

More information

PRODUCT SPECIFICATION

PRODUCT SPECIFICATION DATE: October 2012 DESCRIPTION: ARB Intensity LED Lights APPLICATION: Auxiliary Driving Light PART NO. : AR32F - Flood beam AR32S - Spot beam RETAIL: $763.26 each AVAILABILITY DATE: December 2012 PRODUCT

More information

Q&A. Contract Manufacturing Q&A. Q&A for those involved in Contract Manufacturing using Nelco Electronic Materials

Q&A. Contract Manufacturing Q&A. Q&A for those involved in Contract Manufacturing using Nelco Electronic Materials Q&A Q&A for those involved in Contract Manufacturing using Nelco Electronic Materials 1. Do Nelco laminates have any discoloration effects or staining issues after multiple high temperature exposures?

More information

Valuetronics Holdings Limited. A pictorial tour of our Daya Bay facility

Valuetronics Holdings Limited. A pictorial tour of our Daya Bay facility Valuetronics Holdings Limited A pictorial tour of our Daya Bay facility In early 2006, we acquired the land use rights to a 110,200 sqm land parcel in the Daya Bay Technology District, Huizhou City, Guangdong

More information

Construction. 3-part thixotropic epoxy patching mortar. Product Description. Tests

Construction. 3-part thixotropic epoxy patching mortar. Product Description. Tests Product Data Sheet Edition 05/12/2014 Identification no: 020204030010000044 Sikadur -41 CF Rapid 3-part thixotropic epoxy patching mortar Construction Product Description Uses Characteristics / Advantages

More information

No. 3, Gongye E. 3rd Road, Hsinchu Science Park, Hsinchu 30075, Taiwan TEL:886-3-565-8800. Lextar.com 50W-100W COB LED. Updated on 2012/010/11

No. 3, Gongye E. 3rd Road, Hsinchu Science Park, Hsinchu 30075, Taiwan TEL:886-3-565-8800. Lextar.com 50W-100W COB LED. Updated on 2012/010/11 Lextar.com 50W-100W COB LED Updated on 2012/010/11 Approval Sheet 50W COB LED Product Specification Product COB Part Number PB50H01 Customer Issue Date 2012/10 Feature LED COB Dice Technology : InGaN High

More information

Redux Film Adhesives, Foaming Films, Primers and Liquid Shims. About HEXCEL

Redux Film Adhesives, Foaming Films, Primers and Liquid Shims. About HEXCEL About HEXCEL Hexcel is the largest US producer of carbon fibre; the world s largest weaver of structural fabrics; the number one producer of composite materials such as prepregs, film adhesives and honeycomb;

More information

White Paper Product Quality Fujitsu ESPRIMO PCs, Fujitsu CELSIUS workstations, Fujitsu FUTRO thin clients

White Paper Product Quality Fujitsu ESPRIMO PCs, Fujitsu CELSIUS workstations, Fujitsu FUTRO thin clients White Paper Product Quality Fujitsu ESPRIMO PCs, Fujitsu CELSIUS workstations, Fujitsu FUTRO thin clients Quality from beginning to end is the principle that guides Fujitsu from the design and planning

More information

A SELECTIVE ENCAPSULATION SOLUTION FOR PACKAGING AN OPTICAL MICROELECTROMECHANICAL SYSTEM

A SELECTIVE ENCAPSULATION SOLUTION FOR PACKAGING AN OPTICAL MICROELECTROMECHANICAL SYSTEM A SELECTIVE ENCAPSULATION SOLUTION FOR PACKAGING AN OPTICAL MICROELECTROMECHANICAL SYSTEM by Amy Catherine Bowman A Thesis Submitted to the Faculty of the WORCESTER POLYTECHNIC INSTITUTE in partial fulfillment

More information

C1919 15W COB Series

C1919 15W COB Series High Performance LED Module SemiLEDs C1919 15W COB is a high performance LED module with high thermal conductivity and reliability for demanding lighting applications. It is an easy to assemble light source

More information

Retail Price List 2015

Retail Price List 2015 Retail Price List 2015 SETTING MORTARS SERVOFLEX TRIO SUPER TEC Flexible Full Transfer Thin Set and Medium Bed Mortar 20 KG Flexible, cement-based thin set and medium bed mortar with polymer additive for

More information

3 Thermal Transfer Acrylate Label Material 3921

3 Thermal Transfer Acrylate Label Material 3921 3 Thermal Transfer Acrylate Label Material Technical Data April, 2008 Product Description 3M Thermal Transfer Acrylate Label Material consists of a non-topcoated acrylate facestock designed for thermal

More information

Molded. By July. A chip scale. and Omega. Guidelines. layer on the silicon chip. of mold. aluminum or. Bottom view. Rev. 1.

Molded. By July. A chip scale. and Omega. Guidelines. layer on the silicon chip. of mold. aluminum or. Bottom view.  Rev. 1. Application Note PAC-006 By J. Lu, Y. Ding, S. Liu, J. Gong, C. Yue July 2012 Molded Chip Scale Package Assembly Guidelines Introduction to Molded Chip Scale Package A chip scale package (CSP) has direct

More information

HFM Heat Flow Meter Thermal Conductivity Analyzer

HFM Heat Flow Meter Thermal Conductivity Analyzer HFM Heat Flow Meter Thermal Conductivity Analyzer Introduction An insulating material is a material with low thermal conductivity, which in the construction industry, equipment manufacturing, or the production

More information

P2N LED. High Power LED PRODUCT DATASHEET. Introduction. RoHS Compliant

P2N LED. High Power LED PRODUCT DATASHEET. Introduction. RoHS Compliant PRODUCT DATASHEET P2N LED High Power LED Introduction The P2N LED brings industry leading technology to the solid state lighting market with its high quality and performance. With a silicone lens, P2N

More information

Assembly of LPCC Packages AN-0001

Assembly of LPCC Packages AN-0001 Assembly of LPCC Packages AN-0001 Surface Mount Assembly and Handling of ANADIGICS LPCC Packages 1.0 Overview ANADIGICS power amplifiers are typically packaged in a Leadless Plastic Chip Carrier (LPCC)

More information

ENVIRONMENTAL EFFECTS ON COATINGS

ENVIRONMENTAL EFFECTS ON COATINGS ENVIRONMENTAL EFFECTS ON COATINGS Surfaces exposed to the environment, may be damaged by elements such as water, snow, ice, heat, dirt, smog, humidity, brake dust, grime, salts, chemical attack, and acid

More information

For the modifications listed below, the Qualification Approval tests in IEC 61215 and IEC 61646, shall be used as a guideline by the assessor:

For the modifications listed below, the Qualification Approval tests in IEC 61215 and IEC 61646, shall be used as a guideline by the assessor: Product or Process Modifications Requiring Limited CBTL Retesting to Maintain Certification This document sets forth a uniform approach to maintain the certification of products that have, or will, undergo

More information

Applications and Benefits of Multi-Walled Carbon Nanotubes (MWCNT)

Applications and Benefits of Multi-Walled Carbon Nanotubes (MWCNT) I Applications and Benefits of Multi-Walled Carbon Nanotubes (MWCNT) Table of Content 1 Introduction...1 2 Improved Properties...1 3 Potential Applications...1 3.1 Current / short-term applications...3

More information

WCAP-CSGP Ceramic Capacitors

WCAP-CSGP Ceramic Capacitors A Dimensions: [mm] B Recommended land pattern: [mm] D1 Electrical Properties: Properties Test conditions Value Unit Tol. Capacitance 1±0.2 Vrms, 1 khz ±10% C 15000 pf ± 10% Rated voltage Dissipation factor

More information

Advanced Technologies and Equipment for 3D-Packaging

Advanced Technologies and Equipment for 3D-Packaging Advanced Technologies and Equipment for 3D-Packaging Thomas Oppert Semicon Russia 15 th May 2014 Outline Short Company Introduction Electroless Plating on Wafer Level Ultra-SB 2 - Wafer Level Solder Balling

More information

Electroluminescent Materials

Electroluminescent Materials Electroluminescent Materials Electroluminescent Materials Overview. Product Range. GEM s products are based on a unique curing process that results in the low temperature formation of a thermosetting polymer

More information

Thermal Management For LEDApplications

Thermal Management For LEDApplications Thermal Solutions For Long-Term Reliability Of Power LEDs Thermal Management For LEDApplications SOLUTIONS GUIDE Light Emitting Diodes (LEDs) have been around for years, primarily concentrated in such

More information

LZC-00MC40. LedEngin, Inc. High Luminous Efficacy RGB LED Emitter. Key Features. Typical Applications. Description

LZC-00MC40. LedEngin, Inc. High Luminous Efficacy RGB LED Emitter. Key Features. Typical Applications. Description Key Features High Luminous Efficacy RGB LED Emitter LZC-MC4 Ultra-bright, Ultra-compact 4W RGB LED Full spectrum of brilliant colors with superior color mixing Small high density foot print 9.mm x 9.mm

More information

PRODUCT INFORMATION : ADHESIVES DELIVERING THE FUTURE OF COMPOSITE SOLUTIONS ADHESIVES. contact@gurit.com www.gurit.com

PRODUCT INFORMATION : ADHESIVES DELIVERING THE FUTURE OF COMPOSITE SOLUTIONS ADHESIVES. contact@gurit.com www.gurit.com PRODUCT INFORMATION : ADHESIVES DELIVERING THE FUTURE OF COMPOSITE SOLUTIONS ADHESIVES contact@gurit.com Gurit is a technical leader in the formulation of advanced epoxy resins, and offers a range of two

More information

RTV162. Electronic Grade Silicone Adhesive Sealant

RTV162. Electronic Grade Silicone Adhesive Sealant RTV162 Product Description Electronic Grade Silicone Adhesive Sealant RTV162 adhesive sealant from GE Silicones is one-component, readyto-use electronic grade silicone sealant. It cures to a tough, resilient

More information

High-Performance Polymers for. Automotive E/E Systems SPECIALTY

High-Performance Polymers for. Automotive E/E Systems SPECIALTY High-Performance Polymers for Automotive E/E Systems SPECIALTY POLYMERS Get Connected with Solvay Solvay offers the industry s broadest selection of high-performance plastics for automotive electrical/electronic

More information

1.50mm Height 2220 Package Top View Full Color Chip LEDs Technical Data Sheet. Part No.: LL-R5050RGBC-001

1.50mm Height 2220 Package Top View Full Color Chip LEDs Technical Data Sheet. Part No.: LL-R5050RGBC-001 .5mm Height 222 Package Top View Full Color Chip LEDs Technical Data Sheet Part No.: LL-R55RGBC- Spec No.: R55 Rev No.: V.2 Date: Mar./6/26 Page: OF 2 Features: P-LCC-6 package. White package. Optical

More information

Electronic Board Assembly

Electronic Board Assembly Electronic Board Assembly ERNI Systems Technology Systems Solutions - a one stop shop - www.erni.com Contents ERNI Systems Technology Soldering Technologies SMT soldering THR soldering THT soldering -

More information

Polymer Termination. Mechanical Cracking 2. The reason for polymer termination. What is Polymer Termination? 3

Polymer Termination. Mechanical Cracking 2. The reason for polymer termination. What is Polymer Termination? 3 Polymer Termination An alternative termination material specifically designed to absorb greater levels of mechanical stress thereby reducing capacitor failures associated with mechanical cracking Mechanical

More information

Rapid Prototyping Technologies. May, 2016

Rapid Prototyping Technologies. May, 2016 Rapid Prototyping Technologies May, 2016 WE HAVE ALL THE NECESSARY TOOLS TO ENSURE THE FINAL SUCCESS OF YOUR PROTOTYPE. Andaltec can help you in all the steps, from the design to fully finished prototype

More information

FM 300-2 FILM ADHESIVE

FM 300-2 FILM ADHESIVE FM 3002 FILM ADHESIVE DESCRIPTION FM 3002 film adhesive is a cure version of Cytec Engineered Materials widely used FM 300 film adhesive. It delivers the same superior high temperature performance, toughness

More information

EVERLIGHT ELECTRONICS CO.,LTD.

EVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet 0603 Package Chip LED (0.8 mm Height) Features Package in 8mm tape on 7 diameter reel. Compatible with automatic placement equipment. Compatible with infrared and vapor phase reflow

More information

Investigation of Components Attachment onto Low Temperature Flex Circuit

Investigation of Components Attachment onto Low Temperature Flex Circuit Investigation of Components Attachment onto Low Temperature Flex Circuit July 2013 Q. Chu, N. Ghalib, H. Ly Agenda Introduction to MIRA Initiative MIRA Manufacturing Platforms Areas of Development Multiphase

More information

P2O LED. High Power LED PRODUCT DATASHEET. Introduction. RoHS Compliant

P2O LED. High Power LED PRODUCT DATASHEET. Introduction. RoHS Compliant P2O LED High Power LED Introduction The P2O LEDs from SemiLEDs utilize innovative MvpLED technology which delivers superior levels of optical performance and reliability. Use of state of the art silicone

More information

LUXEON 3030 2D and LUXEON 3030 HV

LUXEON 3030 2D and LUXEON 3030 HV ILLUMINATION LUXEON 3030 2D and LUXEON 3030 HV Assembly and Handling Information Introduction This application brief addresses the recommended assembly and handling guidelines for LUXEON 3030 2D and LUXEON

More information

SOLAR SOLUTIONS BONDED MOUNTING TECHNOLOGY. DURABLE BONDING OF PV MODULES TO MOUNTING SYSTEMS WITH Sikasil

SOLAR SOLUTIONS BONDED MOUNTING TECHNOLOGY. DURABLE BONDING OF PV MODULES TO MOUNTING SYSTEMS WITH Sikasil SOLAR BONDED MOUNTING TECHNOLOGY DURABLE BONDING OF PV MODULES TO MOUNTING SYSTEMS WITH Sikasil ADDED VALUE BY BONDING OF MODULES TO MOUNTING SYSTEMS SUITABLE IN PRODUCTION AND ON-SITE NOWADAYS PHOTOVOLTAIC

More information

SP-06 SinkPAD-II Rebel 25mm Round LED Assembly

SP-06 SinkPAD-II Rebel 25mm Round LED Assembly The SP-06 series of high brightness (HB) LED assemblies include a single Rebel LED soldered to a 25mm Round SinkPAD-II board. The SinkPAD-II features second-generation technology that minimizes thermal

More information

Characterization of Electronic Materials Using Thermal Analysis

Characterization of Electronic Materials Using Thermal Analysis application Note Thermal Analysis Characterization of Electronic Materials Using Thermal Analysis Thermal analysis comprises a series of powerful techniques for the characterization of the thermal, physical,

More information

3mm Photodiode,T-1 PD204-6C/L3

3mm Photodiode,T-1 PD204-6C/L3 3mm Photodiode,T-1 Features Fast response time High photo sensitivity Small junction capacitance Pb free This product itself will remain within RoHS compliant version. Description is a high speed and high

More information

SILASTIC 9161 RTV Silicone Elastomer

SILASTIC 9161 RTV Silicone Elastomer Product Information SILASTIC 9161 RTV Silicone Elastomer FEATURES Room temperature cure Usable at temperatures from -50 C to +250 C Excellent dielectric properties Highly resistant to moisture, oxidation

More information

Thermal Management Solutions. Created to perform when the heat is on

Thermal Management Solutions. Created to perform when the heat is on Thermal Management Solutions Created to perform when the heat is on Thermal Management Solutions Non-Silicone Pastes Silicone Pastes Encapsulation Resins 0.9 to 3.4W/m.K RTVs and Bonding Products During

More information

Soldering And Staking OEpic TOSA/ROSA Flex Circuits To PWBs.

Soldering And Staking OEpic TOSA/ROSA Flex Circuits To PWBs. APP-000010 Rev 03 This application note is intended to give a person involved in the manufacturing engineering of a typical XFP module an overview of the procedures and requirements for soldering an OEpic

More information

EOSINT P and FORMIGA P materials for plastic laser-sintering systems

EOSINT P and FORMIGA P materials for plastic laser-sintering systems EOSINT P and FORMIGA P materials for plastic laser-sintering systems Contents Pages Material data overview ALUMIDE CarbonMide PA 2200/2201 PA 2210 FR PA 3200 GF PEEK HP3 PrimeCast 101 PrimePart DC 3 6

More information

EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 0805 Package Chip LED Preliminary

EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 0805 Package Chip LED Preliminary Feature RoHS compliant. This is a preliminary specification Chip LED package. intended for design purposes and Colorless clear resin. Wide viewing angle 130 o. subject to change without prior Brightness:

More information