AXCELIS FUSION GEMINI GES

Transcription

1 AXCELIS FUSION GEMINI GES Tool ID M9EGE201 OEM/Model AXCELIS FUSION GEMINI GES Serial Number GES0014 Process ETCH - ASHING Vintage January, 2005 Wafer Size 200 mm AG Semiconductor Services sales@agsemiconductor.com 1

2 1. System Configurations System Configuration Left Process Control Module Right Process Control Module Chamber/ System Type 220 GES Radiant Strip 220ES Wafer Handling Configuration Model Axcelis Dual Arm Build Configuration Number of Cooling Stations 1 Model:Gemini P/N: ; S/N:GC3G035F Robot Build Configuration P/N: S/N: 6A0479N Robot blade A: Aluminium Robot blade B: Ceramic Number of Load Ports 2 AG Semiconductor Services sales@agsemiconductor.com 2

3 2. System Options Bolt-On-SMIF Yes / No Built-In SMI Yes / No Integrated AGV Yes / No SECS/GEM Yes / No UPS Installed? Light Tower? Yes, 4 colors-r/y/g/b EndPoint detector? Yes Vacuum Pump Control No Secondary Display remote control Yes Gas Distribution Panel Integrate in gas box Heat Exchanger Calibration Tools Local control Rear side One gas for two chambers Earthquake Mount Assemblies 3. Process gas The following gases are approved for use with GES 220 ashing chambers: Oxygen (O2) Nitrogen (N2) Nitrous oxide (N2O) N2H2 (max. 3% hydrogen concentration) The following gases are approved for use with the GES 220 Clean chamber: Helium (He) Nitrogen (N2) Nitrogen trifluoride (NF3) Oxygen (O2) Tetrafluoromethane (CF4) AG Semiconductor Services sales@agsemiconductor.com 3

4 4. Left Module Details Model Radiant Strip Build Configuration Source and Process Kit Type Standard Quartz / Sapphire Heat Lamps Standard/ 12 lamps Standard Process Kits HV power supply maker/model Thermocouple status Standard/ Good Axcelis Good Microwave Generator Maker & Model Microwave Generator Max Power (W) Microwave Filament/Magnetron Hours W Left Module Gas Box Configuration Gas Line # Gas Flow (sccm) MFC Mfgr. MFC Model. 1 O UNIT UFC %H2N UNIT UFC CF4 500 UNIT UFC CF4 20 UNIT UFC AG Semiconductor Services sales@agsemiconductor.com 4

5 5. Right Module Details Model Radiant Strip Build Configuration Source and Process Kit Type Standard Quartz / Sapphire Heat Lamps Standard/ 12 lamps Standard Process Kits HV power supply maker/model Thermocouple status Standard/ Good Axcelis Good Microwave Generator Maker & Model Microwave Generator Max Power (W) Microwave Filament/ Magnetron Hours 2000W 0 Right Module Gas Box Configuration Gas Line # Gas Flow (sccm) MFC Mfgr. MFC Model. 1 O UNIT UFC %H2N UNIT UFC CF4 500 UNIT UFC CF4 20 UNIT UFC AG Semiconductor Services sales@agsemiconductor.com 5

6 6. Pressure Controls Pressure Controls Module Left Chamber Right Chamber TYPE: MKS TYPE 153 TYPE: MKS TYPE 153 Throttle Valve & Controller P/N: Rev.A P/N: Rev.A Gate valve type TYPE: MKS P/N: Rev.A TYPE: MKS P/N: Rev.A Model: Model: 626A11TAE Manometer S/N: S/N: VACUUM & PUMP & Chiller Module Left Chamber Right Chamber Comment Module Pump model Code No:A S/N: Code No:A S/N: Edwards ih600 Chiller model Chiller Serial number 8. SYSTEM OPRATIONS Auto Clear Deck Function Interlocks Temperature Control Gas Flow Check Pressure Control (mt) AG Semiconductor Services 6

7 9. Microwave Configuration Left Chamber Right Chamber Comment HV Power Supply module P/N: S/N: P/N: S/N: Magnetron Head Type: Hitachi H3862 Type: Hitachi H3862 S/N: S/N: 10. System Performance Module Left Chamber Right Chamber Comment Chamber Base pressure (mt) 30mT 40mT <20mTorr (Idle for a long time- no pumping down) Foreline base pressure 30mT 40mT (Idle for a long time- no pumping down) Chamber ROR 20mT/Min 20mT/Min <10mTorr (Idle for a long time- no pumping down) Chamber + Gas box ROR 20mT/Min 20mT/Min Lamp Temperature turn on test Microwave Power standby test O2 gas flow 2500 (sccm) N2 gas flow 100 (sccm) N2H2 gas flow (sccm) Pressure Control (mt) Throttle Vale Angle Microwave Forward Power (w) Asher rate Wafer Cycling Test AG Semiconductor Services sales@agsemiconductor.com 7

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