74F Bit Undershoot Overshoot Clamp and ESD Protection Device

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1 74F Bit Undershoot Overshoot Clamp and ESD Protection Device General Description The F1071 is an 18-bit undershoot overshoot clamp which is designed to limit bus voltages and also to protect more sensitive devices from electrical overstress due to electrostatic discharge (ESD) The inputs of the device aggressively clamp voltage excursions nominally at 0 5V below and 7V above ground Commercial Package Number Features 18-bit array structure in 20-pin package Fast bipolar voltage clamping action Dual center pin grounds for min inductance Robust design for ESD protection Low input capacitance Optimum voltage clamping for 5V CMOS TTL applications Package Description 74F1071SC (Note 1) M20B 20-Lead Molded Small Outline JEDEC 74F1071MSA (Note 1) MSA20 20-Lead Molded Shrink Small Outline EIAJ Type II 74F1071MTC (Notes 1 2) MTC20 20-Lead Molded Thin Shrink Small Outline JEDEC Note 1 Devices also available in 13 reel Use suffix e SCX and MSAX or MTCX respectively Note 2 Consult National Semiconductor Customer Support Center for availability Connection Diagram Pin Assignment for SOIC SSOP and TSSOP Packages August F Bit Undershoot Overshoot Clamp and ESD Protection Device Note Simplified Component Representation TL F C1995 National Semiconductor Corporation TL F RRD-B30M115 Printed in U S A

2 Absolute Maximum Ratings (Note 1) Storage Temperature b65 Ctoa150 C Ambient Temperature under Bias b65 Ctoa125 C Junction Temperature under Bias Ceramic Package b65 Ctoa175 C Plastic Package b65 Ctoa150 C Input Voltage (Note 2) b0 5V to a6v Input Current (Note 2) b200 ma to a50 ma ESD (Note 3) Human Body Model (MIL-STD-883D method ) g10 kv IEC g6kv Machine Model (EIAJIC ) g2kv DC Latchup Source Current (JEDEC Method 17) g500 ma Package Power Dissipation a70 C SOIC Package 800 mw Electrical Characteristics Symbol Parameter 74F1071 T A ea25 C Recommended Operating Conditions Free Air Ambient Temperature Commercial Reverse Bias Voltage Commercial Thermal Resistance (i JA in Free Air) SOIC Package SSOP Package 0 Ctoa70 C 0V to 5 25 V DC 100 C W 110 C W Note 1 Absolute maximum ratings are DC values beyond which the device may be damaged or have its useful life impaired Functional operation under these conditions is not implied Note 2 Voltage ratings may be exceeded if current ratings and junction temperature and power consumption ratings are not exceeded Note 3 ESD Rating for Direct contact discharge using ESD Simulation Tester Higher rating may be realized in the actual application 74F1071 T A e 0 Ctoa70 C Min Typ Max Min Max Units Conditions I IH Input High Current V ma IN e 5 25V Untested Input GND V IN e 5 5V Untested Input GND V Z Reverse Voltage I V Z e 1 ma Untested Inputs GND I Z e 50 ma Untested Inputs GND V F Forward Voltage b0 3 b0 6 b0 9 b0 3 b0 9 I V F eb18 ma Untested Inputs 5V b0 5 b1 1 b1 5 b0 5 b1 5 I F eb200 ma Untested Inputs 5V I CT Adjacent Input Crosstalk 3 % C IN Input Capacitance 25 V pf BIAS e 0V DC (small signal 1 MHz) 13 V BIAS e 5V DC 2

3 Electrical Characteristics (Continued) Typical Forward and Reverse V I Characteristics TL F Typical Reverse Conduction Characteristics Typical Forward Conduction Characteristics TL F TL F

4 Electrical Characteristics (Continued) TL F ESD Network CZ RZ Human Body Model 100 pf 1500X IEC pf 330X Simulated ESD Voltage Clamping Test Circuit Unclamped a 1 KV ESD Voltage Clamped a 1 KV ESD Voltage Unclamped b 1 KV ESD Voltage Clamped b 1 KV ESD Voltage TL F

5 Typical Application 74F1071 ESD Protection of ASIC on User Port TL F Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows Temperature Range Family 74F e Commercial Device Type Package Code S e Small Outline (SOIC) JEDEC MSA e Shrink Small Outline EIA Type II (SSOP) 74F 1071 S C X Special Variations X e Devices shipped in 13 reels Temperature Range C e Commercial (0 Ctoa70 C) Note This character not required for MSA Package Code Physical Dimensions inches (millimeters) 20-Lead Small Outline Package JEDEC (S) NS Package Number M20B 5

6 Physical Dimensions inches (millimeters) (Continued) 20-Lead Molded Shrink Small Outline Package EIAJ Type II NS Package Number MSA20 LIFE SUPPORT POLIC NATIONAL S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 Life support devices or systems are devices or 2 A critical component is any component of a life systems which (a) are intended for surgical implant support device or system whose failure to perform can into the body or (b) support or sustain life and whose be reasonably expected to cause the failure of the life failure to perform when properly used in accordance support device or system or to affect its safety or with instructions for use provided in the labeling can effectiveness be reasonably expected to result in a significant injury to the user National Semiconductor National Semiconductor National Semiconductor National Semiconductor Corporation Europe Hong Kong Ltd Japan Ltd 1111 West Bardin Road Fax (a49) th Floor Straight Block Tel Arlington TX cnjwge tevm2 nsc com Ocean Centre 5 Canton Rd Fax Tel 1(800) Deutsch Tel (a49) Tsimshatsui Kowloon Fax 1(800) English Tel (a49) Hong Kong Fran ais Tel (a49) Tel (852) Italiano Tel (a49) Fax (852) National does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications

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